epc101 Light-Curtain Device with 2-Wire Bus Interface General Description Feature The epc10x chip set is a general purpose CMOS integrated circuit for light-curtain applications. epc100 is used on the receiver side (Rx) whereas epc 101 is on the emitter side (Tx). Up to 1023 devices may be connected to two respectively four wires in parallel. Each device can be individually addressed by an epc100 chip which acts as the interface between a microcontroller and the 2wire bus. It manages the bus traffic between the microcontroller and the individual Rx and Tx elements. Programmable fuses i.e. for the address, sensitivity, LED light pulse width, etc. allow the device to be parametrized in the final system (OTP memory). Light pulse transmitter Universal LED controller Scan period down to 30 µs integrated clock generator CSP10 package with very small footprint and standard QFN16 pack age available Applications Each chip can be put into 'standby mode' or 'operating mode' to re- duce power consumption. During 'standby mode', power consump- tion is reduced and the photo diode is shorted. Light barriers ranging from millimeters to tens of meters Light curtains Smoke detectors Liquid detectors Refer to the separate Data Sheet of the epc100 receiver chip and to the Reference Manual epc10x for implementation, usage and configuration information. Functional Block Diagram VDD VLED 2-wire COM Interface Parameter Memory LED SCK VDD33 Voltage Regulator VDD18 LED Processor SPI Controller GND © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice CS Signal Processor PD SO SI 1 Datasheet epc101 - V2.1 www.espros.ch epc101 Absolute Maximum Ratings (Notes 1, 2) Recommended Operating Conditions Voltage to any pin except V DD -0.3V to VDD+0.3 V Min. Max. Units Supply Voltage on 2-wire bus V DD -0.3V to +8.0V Operating Voltage on 2-wire bus V DD 4.5 5.5 V Programming Voltage on 2-wire bus V DD -0.3V to +8.0V Programming Voltage on V DD 7.0 8.0 V Input current at any pin except LED -6mA to +6 mA Power consumption with maximum load 125mW Storage Temperature Range (T S) -55°C to +155°C Operating Temperature (T O) -40° +85 °C Lead Temperature solder, 4 sec. (T L) +260°C Relative Humidity (non-condensing) +5 +95 % Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions indic ate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifica tions and test conditions, see Electrical Characteristics. Note 2: This device is a highly sensitive CMOS ac current amplifier with an ESD rating of JEDEC HBM class 0 (<250V). Handling and assembly of this device should only be done at ESD protected workstations. Electrical Characteristics VDD = 5.0 V, -40°C < T A < +85°C, if not otherwise specified Symbol Parameter VPP Ripple on supply voltage, peak to peak Conditions/Comments Values Min. in idle mode IDD_OP in operation mode I PD = 0 mA Vdet Detection level for 2-wire interface IMOD Modulation current for 2-wire interface Tpulse LED pulse length configurable fclk Reference clock Internal oscillator dfclk Temperature drift of the oscillator VPUP Power-up Threshold Voltage VIH VIL ILEAKD Max. 2-wire interface V det IDD_IDLE Current consumption Current consumption Typ. Units 50mV 25 mV 100mV 50 mV 200mV 100 mV 1.4 mA 2 mA 80 120 mV 6.4 9.8 mA 1 8 1 7 The voltage at VDD33 when the device starts up µs MHz % 2.4 3 V High level input voltage 0.7 *VDD VDD V Low level input voltage GND 0.3 *VDD V 10 µA Input leakage current VOH Output high voltage @ 4mA sink except pin SCK/LED VOL Output low voltage @ 4mA source ISCK/LED Source current @ PIN SCK / LED VDD- 0.5 0.7 VHist Schmitt Trigger Hysteresis 0.1 RPU Pull-Up Resistor 30 © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 2 V 0.5 V 1.3 V 200 kΩ V Datasheet epc101 - V2.1 www.espros.ch epc101 Connection Diagrams 12 OUTN/ SO 8 LED/S CK 11 6 10 7 EN/ SI 13 8 9 9 VDD33 7 14 OUTH Top View 5 6 Top View 15 VDD18 10 5 16 VDD GND PD CS 1 2 3 4 1 10-Pin Chip Scale Package (CSP) PIN Name Type 2 3 4 16 Pin QFN Package 10-Pin CSP 16-Pin QFN Description 1 9 VDD Power supply Positive power supply for regulator and positive terminal of the 2-wire interface. 2 7 GND Power supply Negative power supply pin. 3 6 PD Analog Input Photo diode input. 4 4 CS Digital Input SPI Interface: Chip Select. Active low, with pull up 5 2 AOUT OUTH Analog Out Digital Out Amplified and filtered signal of the photo diode (push-pull) or light reserve output (open drain) with 50 % threshold voltage above the threshold of the OUT output. 6 1 SO Digital Output SPI Interface: Serial out 7 15 SI Digital Output SPI Interface: Serial input 8 14 SCK Digital In / Out SPI Interface: Shift Clock 9 12 VDD33 Power supply Decoupling Positive power supply for analog and digital circuitry. If the the device is supplied by V DD33, a power supply filter capacitor is connected to this pin. This is not a supply pin for external com ponents → for test purpose only!! 10 10 VDD18 Analog Out 1.8 V regulator output → This is not a supply pin for external components. For test purpose only! n/a 3 NC Not connected. Connect this pin with VSS. n/a 5 NC Not connected. Connect this pin with VSS. n/a 8 NC Not connected. Connect this pin with VSS. n/a 11 NC Not connected. Connect this pin with VSS. n/a 13 NC Not connected. Connect this pin with VSS. n/a 16 NC PIN Connections QFN16-VEEDNot connected. Connect this pin with VSS. 1VN4 ... LST 19.10.2010 Page 1 File: This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 3 Datasheet epc101 - V2.1 www.espros.ch epc101 Overview Functional Description Light Curtain – Transmitter Figure 1 shows a typical schematic circuit of a light curtain emitter edge. A microcontroller manages the transmitters in the edge via an inter face chip (epc100) to the 2-wire power and communication bus. Since the LEDs draw a very high peak current when enabled, huge noise on he 2-wire bus would interfere with the communication protocol on the bus. Thus, the LEDs are connected to a separate 2-wire power bus. + ILED VDD VDD epc100 VDD µC SI SO SCK CS µC VDD VDD epc101 epc101 VDD33 IF VDD33 VDD epc101 T1 VDD33 VDD18 PD C1 GND C2 T2 VDD33 VDD18 LED PD C1 GND LED C2 Tn VDD18 PD C1 GND RLED LED C2 GND RLED RLED GND - ILED Figure 1: Light curtain transmitter with up to 300mA pulse current through the LED The feedback LED voltage to the PD input is to allocate the physical location of the transmitter node to the unique chip ID during production. In this mode the the LED is used as a receiver. For configuration please refer to the Reference Manual epc10x. In Figure 1, the LED current is defined by a common current source. The resistor R LED, which is typically 2.2 Ohms, is not needed in nonsafety applications. If this resistor is inserted, a failure mode will be detected if more than one LED is active due to a short circuit or a failure in the epc101. It is also possible to have a common voltage supply and to control the LED current by a series resistor. In order to allow a stable operation of the transmitter nodes, two voltage supply decoupling capacitors are needed: C1 should be of 100nF and C2 4.7nF, both ceramic types. For long range applications, a LED current of up to 1A is needed. Such a high pulse current can be achieved by using a darlington stage ac cording to Figure 2. Resistor R LED is typically 2.7 Ohms, resistor R approx. 1 kOhm. Possible transistors are for T1 BC846B and for T2 BC80740. + ILED VDD VDD epc100 VDD µC VDD33 µC SI SO SCK CS IF VDD VDD VDD epc101 epc101 epc101 T1n PD VDD33 LED VDD33 T2 VDD18 GND GND C1 C2 T2n PD T1 LED R C1 RLED C2 LED VDD33 T2 VDD18 GND Tn PD T1 T1 T2 VDD18 R GND C1 RLED C2 De R RLED Ap Sc GND - ILED Pa Part Name Figure 2: Light curtain transmitter with more then 300mA pulse current through the LED <Partname> File: Unbenannt © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 4 Datasheet epc101 - V2.1 www.espros.ch ) CSP-10 Package Mechanical Dimensions Layout Recommendations 1.9 +0.0/-0.1 0.15 This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . Layout Information (all measures in mm, epc101 Bottom View ∅ 0.12 Designed <Name> Approved <Name> <Data> Scale M 1:1 DIN A4 Page Part Name 26.02.2009 1 Part No. <x000 000> <Partname> 0.1524 ∅ 0.3 0.5 0.5 Pin 1 Solder balls Sn97.5Ag2.5 0.5 0.11 ±0.01 0.5 0.3 0.15 2.0 0.5 1.4 +0.0/-0.1 0.5 File: Unbenannt 0.5 2.5 no solder mask inside this area QFN-16 Package Top view 1.9 2.9 - 3.1 1.9 Bottom View 18.05.2011 0.25 <name> <Title> Page 1 e: s document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission . 0.02 0.9 0.1-0.2 0.5 2.9 - 3.1 0.25 LST Mechanical dimension QFN16 Package 0.3 20.12.2011 Page 1 File: This document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 5 Datasheet epc101 - V2.1 www.espros.ch epc101 CSP6 Tape QFN16 Tape Pin 1 Reflow Solder Profile Pin 1 Packaging Information 12 8 For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec. (all measures in mm) Tape & Reel Information The devices are mounted on embossed tape for2 automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13 inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the tape sizes for various package types. Further tape-and-reel specifications can be found in the8 Electronic Industries Association (EIA) standard 481-1, 481-2, 481-3. CSP6 Tape QFN16 Tape Pin 1 12 8 Pin 1 4 8 epc does not guarantee that there are no empty cavities. Thus, the pick-and-place machine should do check the presence of a chip during picking. Order Information Part Number Package RoHS compliance Packaging Method epc100-CSP10 CSP10 Yes Reel epc100-QFN16 QFN16 Yes Reel epc101-CSP10 CSP10 Yes Reel epc101-QFN16 QFN16 Yes Reel © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 6 Datasheet epc101 - V2.1 www.espros.ch epc101 IMPORTANT NOTICE ESPROS Photonics AG and its subsidiaries (epc) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to epc’s terms and conditions of sale supplied at the time of order acknowledgment. epc warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with epc’s standard war ranty. Testing and other quality control techniques are used to the extent epc deems necessary to support this warranty. Except where man dated by government requirements, testing of all parameters of each product is not necessarily performed. epc assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using epc components. 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Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, epc will not be responsible for any failure to meet such requirements. © 2011 ESPROS Photonics Corporation Characteristics subject to change without notice 7 Datasheet epc101 - V2.1 www.espros.ch