ESDA25DB3 Application Specific Discretes A.S.D. TRANSIL ARRAY FOR ESD PROTECTION APPLICATIONS Where transient overvoltage protection in esd sensitive equipment is required, such as : - COMPUTERS - PRINTERS - COMMUNICATION SYSTEMS It is particulary recommended for RS232 I/O port protectionwhere the line interfacewithstands 2 kV, ESD surges. FEATURES SO20 18 BIDIRECTIONAL TRANSIL FUNCTIONS LOW CAPACITANCE : C = 30pF @ VRM 500 W peak pulse power (8/20 µs) DESCRIPTION FUNCTIONAL DIAGRAM The ESDA25DB3 is a dual monolithic voltage suppressor designed to protect componentswhich are connected to data and transmission lines against ESD. I/O 1 1 20 I/O 18 I/O 2 2 19 I/O 17 I/O 3 3 18 I/O 16 BENEFITS I/O 4 4 17 I/O 15 High ESD protection level : up to 25 kV High integration Suitable for high density boards I/O 5 5 16 I/O 14 I/O 6 6 15 I/O 13 I/O 7 7 14 I/O 12 COMPLIESWITHTHE FOLLOWINGSTANDARDS : I/O 8 8 13 IEC 1000-4-2 : level 4 I/O 9 9 12 I/O 10 GND 10 11 I/O 11 GND MIL STD 883C-Method 3015-6 : class 3 (human body model) January 1998 - Ed : 2 1/5 ESDA25DB3 ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameter Value Unit VPP Electrostatic discharge MIL STD 883C - Method 3015-6 25 kV PPP Peak pulse power (8/20µs) 500 W Tstg Tj Storage temperature range Maximum junction temperature - 55 to + 150 125 °C °C TL Maximum lead temperature for soldering during 10s 260 °C ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient C Capacitance Rd Dynamic resistance Types Rd αT C max. typ. max. typ. note1 note1 note 2 note 3 0V bias V V mA µA V Ω -4 10 /°C pF 25 30 1 2 24 0.5 9.7 50 VBR min. ESDA25DB3 @ IR max. note 1 : Betwenn any I/O pin Groung note 2 : Square pulse, Ipp = 25A, tp=2.5µs. note 3 : ∆ VBR = αT* (Tamb -25°C) * VBR (25°C) 2/5 IRM @ VRM ESDA25DB3 CALCULATION OF THE CLAMPING VOLTAGE USE OF THE DYNAMIC RESISTANCE The ESDA family has been designed to clamp fast spikes like ESD. Generally the PCB designers need to calculate easily the clamping voltage VCL. This is why we give the dynamic resistance in addition to the classical parameters. The voltage across the protection cell can be calculated with the following formula: VCL = VBR + Rd IPP As the value of the dynamic resistance remains stable for a surge duration lower than 20µs, the 2.5µs rectangular surge is well adapted. In addition both rise and fall times are optimized to avoid any parasitic phenomenon during the measurement of Rd. WhereIpp is the peakcurrent throughthe ESDAcell. DYNAMIC RESISTANCE MEASUREMENT The short duration of the ESD has led us to prefer a more adapted test wave, as below defined, to the classical 8/20µs and 10/1000µs surges. I Ipp t 2µs tp = 2.5µs 2.5µs duration measurement wave. 3/5 ESDA25DB3 Fig. 1 : Peak power dissipation versus initial junction tempearature. Fig. 2 : Peak pulse power versus exponential pulse duration (Tj initial = 25 °C). Ppp(W) Ppp[Tj initial]/Ppp[Tj initial=25°C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 5000 1000 tp(µs) Tj initial(°C) 0 25 50 75 100 125 150 Fig. 3 : Clamping voltage versus peak pulse current (Tj initial = 25 °C). Rectangular waveform tp = 2.5 µs. 100 1 10 100 Fig. 4 : Capacitance versus reverse applied voltage (typical values). Ipp(A) C(pF) 50.0 100 F=1MHz Vosc=30mV tp=2.5µs 10.0 50 1.0 20 VCL(V) 0.1 20 25 30 35 40 VR(V) 45 50 55 60 Fig. 5 : Relative variation of leakagecurrent versus junction temperature (typical values). IR[Tj] / IR[Tj=25°C] 200 100 10 Tj(°C) 1 25 50 75 100 125 4/5 10 1 2 5 10 30 ESDA25DB3 ORDER CODE ESDA 25 D B 3 RL PACKAGING: RL = Tape and reel = Tube ESD ARRAY Package: SO20 VBR min Bidirectionel MARKING : Logo, Date Code, E25DB3 PACKAGE MECHANICAL DATA SO20 Plastic DIMENSIONS REF. Millimetres Min. D Inches Typ. Max. Min. Typ. Max. hx45° A 2.65 0.104 A B e K A1 E A1 0.10 0.20 0.004 0.008 B 0.33 0.51 0.013 0.020 C 0.23 0.32 0.009 0.013 D 12.6 13.0 0.484 0.512 E 7.40 7.60 0.291 0.299 C L H e H 1.27 10.0 h L K 0.050 10.65 0.394 0.50 0.50 0.419 0.020 1.27 0.020 0.050 8° (max) Packaging : Preferred packaging is tape and reel. Weight : 0.55g. Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change withoutnotice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1998 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5