ITAxxB1 Bidirectional Transil™ array for data line protection Features ■ High surge capability Transil array: IPP = 40 A (8/20 µs) ■ Peak pulse power: 300 W (8/20 µs) ■ Up to 5 bidirectional Transil functions ■ Low clamping factor (VCL / VBR) at high current level ■ Low leakage current ■ ESD protection up to 15 kV SO-8 Figure 1. Functional diagram Complies with the following standards I/O1 1 8 GND ■ I/O2 2 7 I/O3 3 6 I/O4 4 5 GND ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) MIL STD 883G- Method 3015-7: class 3B – 25 kV (human body model) Applications Differential data transmission line protection, such as: ■ RS-232 ■ RS-423 ■ RS-422 ■ RS-485 Description Transil diode arrays provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS technology and low voltage supplied IC’s. The ITA series combines high surge capability against energetic pulses with high voltage performance against ESD. TM: Transil is a trademark of STMicroelectronics November 2007 Rev 2 1/7 www.st.com 7 Characteristics ITAxxB1 1 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol PPP IPP Parameter Peak pulse power (8/20 µs)(1) Peak pulse current (8/20 µs) Unit Tj initial = Tamb 300 W Tj initial = Tamb 40 A 2 I t Wire I t value 0.6 A2s Tj Maximum operating junction temperature 125 °C -55 to +150 °C 260 °C Tstg TL 2 (1) Value (1) Storage temperature range Maximum lead temperature for soldering during 10 s at 5 mm for case 1. For surges greater than the specified maximum value, the I/O will first present a short-circuit and after an open circuit caused by the wire melting. Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameter I IPP VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current αT Voltage temperature coefficient C Capacitance VBR Order code IRM VRM V VBR @ IR IRM @ VRM VCL min. max. (1) @ IPP VCL 8/20 µs max. (1) IPP αT C 8/20 µs max. max. @ (1) (2) V mA µA V V A V A 10-4/ °C pF ITA6V5B1 6.5 1 10 5 10 10 12 25 4 750 ITA10B1 10 1 4 8 15 10 19 25 8 570 ITA18B1 18 1 4 15 25 10 28 25 9 350 ITA25B1 25 1 4 24 33 10 38 25 12 300 1. Betwenn I/O pin and ground. 2. Between two input pins at 0 V Bias, F = 1 MHz. 2/7 VCL ITAxxB1 Characteristics Figure 2. Pulse waveform Figure 3. Typical peak pulse power versus exponential pulse duration PPP(W) %IPP 1E+04 Tj initial=25°C 8 µs 100 ITA25B1 ITA18B1 1E+03 Pulse waveform 8/20 µs 50 ITA6V5B1 ITA10B1 1E+02 0 t 20 µs tP(ms) expo 1E+01 1E-03 Figure 4. Clamping voltage versus peak pulse current (exponential waveform 8/20 µs) Figure 5. VCL(V) 1E-02 1E-01 1E+00 1E+01 1E+02 Peak current IDC inducing open circuit of the wire for one input/output versus pulse duration (typical values) IDC(A) 1E+03 1E+03 %IPP Tj initial=25°C Exponential waveform 100 50 0 1E+02 tr t tp 1E+02 ITA25B1 ITA18B1 1E+01 1E+01 ITA6V5B1 ITA10B1 IPP(A) 1E+00 1E-01 Figure 6. 1E+00 tP(ms) 1E+00 1E+01 1E-02 1E+02 Junction capacitance versus reverse applied voltage for one input/output (typical values) Figure 7. C(pF) Tj=25°C F=1MHz 1E+00 1E+01 Relative variation of leakage current versus junction temperature IR(Tj) IR(Tj=25°C) 1E+03 ITA6V5B1 1E-01 5E+3 VR=VRM 1E+3 1E+2 ITA10B1 1E+1 ITA18B1 1E+0 ITA25B1 Tj(°C) VR(V) 1E+02 1E-1 0 1E+00 1E+01 25 50 75 100 125 150 1E+02 3/7 Application information 2 ITAxxB1 Application information This monolithic Transil Array is based on 6 unidirectional Transils with a common cathode and can be configurated to offer up to 5 bidirectional functions. This imposes a maximum differential voltage between 2 input pins (see Table 3). Table 3. Maximum differential voltages Order code Maximum differential voltage between two input pins at 25 °C ITA6V5B1 ± 3.5 V ITA10B1 ± 5.0 V ITA18B1 ± 9.0 V ITA25B1 ± 12.5 V Figure 8. RS-232 junction (typical application) TX RX RTS CTS GND 3 Ordering information scheme Figure 9. Ordering information scheme ITA Integrated Transil Array Breakdown Voltage (min) 25 = 25 Volt Type of lines protected B = Bidirectional Package 1 = SO-8 Packaging RL = Tape & reel Blank = Tube 4/7 25 B 1 RL ITAxxB1 4 Package information Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4. SO-8 dimensions Dimensions ccc C Ref. A2 e b C (Seating Plane) A Millimeters Min. Typ. A A1 Inches Max. Min. Typ. 1.75 A1 0.1 0.25 A2 1.25 Max. 0.069 0.004 0.010 h x 45° 0.25mm (Gage Plane) C L k L1 D b 0.28 0.48 0.011 0.019 C 0.17 0.23 0.007 0.009 D 4.80 4.90 5.00 0.189 0.193 0.197 E 5.80 6.00 6.20 0.228 0.236 0.244 E1 3.80 3.90 4.00 0.150 0.154 0.157 e 8 5 E1 E 1.27 4 0.050 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 8 0 L1 1 0.049 k° 1.04 0 ccc 0.041 0.10 8 0.004 Figure 10. SO-8 footprint (dimensions in mm) 6.7 0.54 4.03 1.27 1.335 5/7 Ordering Information 5 Ordering Information Table 5. 6 Ordering information Order code Marking Base qty Delivery mode ITA6V5B1 6V5B1 2000 Ammopack ITA6V5B1RL 6V5B1 2500 Tape and reel ITA10B1 10B1 2000 Ammopack ITA18B1 18B1 2000 Ammopack ITA18B1RL 18B1 2500 Tape and reel ITA25B1 25B1 2000 Ammopack ITA25B1RL 25B1 2500 Tape and reel Package SO-8 Weight 0.08 g Revision history Table 6. 6/7 ITAxxB1 Document revision history Date Revision Description of changes 13-Dec-2004 1 First issue. 15-Nov-2007 2 Reformatted to current standards. SO-8 package dimensions update. Updated pulse waveform parameters in Figure 2. ITAxxB1 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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