High SPL Microphone with Bottom Port and Analog Output ADMP411 Data Sheet FUNCTIONAL BLOCK DIAGRAM 4.72 mm × 3.76 mm × 1.0 mm surface mount package 131 dB SPL acoustic overload point Sensitivity of −46 dBV ±2 dB sensitivity tolerance Omnidirectional response High SNR of 62 dBA Extended frequency response from 28 Hz to 20 kHz Low current consumption: <250 μA Single-ended analog output High PSR of −80 dBV Compatible with Sn/Pb and Pb-free solder processes RoHS/WEEE compliant OUTPUT AMPLIFIER ADMP411 OUTPUT POWER VDD GND 10913-001 FEATURES Figure 1. APPLICATIONS 10913-002 Fire and safety radios Safety masks Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras Studio microphones Bluetooth headsets Security and surveillance Figure 2. Isometric Views of Microphone Package GENERAL DESCRIPTION The ADMP4111 is a high performance, high SPL, low noise, low power, analog output bottom ported, omnidirectional MEMS microphone. The ADMP411 consists of a MEMS microphone element and an impedance converter amplifier. The ADMP411 sensitivity specification makes it an excellent choice for both near field and far field applications. The ADMP411 is pin compatible with the ADMP401 microphone, providing an easy upgrade path. 1 The ADMP411 has a linear response up to 131 dB SPL. It offers high SNR and extended wideband frequency response resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. The ADMP411 is available in a miniature 4.72 mm × 3.76 mm × 1.0 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADMP411 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Codec Connections .......................................................................7 Applications ....................................................................................... 1 Dynamic Range Considerations..................................................7 Functional Block Diagram .............................................................. 1 Supporting Documents ................................................................7 General Description ......................................................................... 1 Handling Instructions .......................................................................8 Revision History ............................................................................... 2 Pick and Place Equipment............................................................8 Specifications..................................................................................... 3 Reflow Solder .................................................................................8 Absolute Maximum Ratings ............................................................ 4 Board Wash ....................................................................................8 ESD Caution .................................................................................. 4 PCB Land Pattern Layout .................................................................9 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 10 Typical Performance Characteristics ............................................. 6 Ordering Guide .......................................................................... 10 Applications Information ................................................................ 7 REVISION HISTORY 4/13—Revision 0: Initial Version Rev. 0 | Page 2 of 12 Data Sheet ADMP411 SPECIFICATIONS TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not guaranteed. Table 1. Parameter PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Dynamic Range Frequency Response 1 Total Harmonic Distortion (THD) Power Supply Rejection (PSR) Power Supply Rejection Ratio (PSRR) Acoustic Overload Point POWER SUPPLY Supply Voltage (VDD) Supply Current (IS) OUTPUT CHARACTERISTICS Output Impedance (ZOUT) Output DC Offset Maximum Output Voltage Noise Floor 1 Test Conditions/Comments Min 1 kHz, 94 dB SPL 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 105 dB SPL 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V 1 kHz, 100 mV p-p sine wave superimposed on VDD = 1.8 V 10% THD −48 Typ Omni −46 62 32 99 28 >20 0.2 −80 −46 131 1.5 VDD = 1.8 V VDD = 3.3 V 180 210 131 dB SPL input 20 Hz to 20 kHz, A-weighted, rms 200 0.8 0.355 −108 See Figure 5 and Figure 6. Rev. 0 | Page 3 of 12 Max Unit −44 dBV dBA dBA SPL dB Hz kHz % dBV dB dB SPL 1 3.63 220 250 V µA µA Ω V V rms dBV ADMP411 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltage Sound Pressure Level (SPL) Mechanical Shock Vibration Storage Temperature Range Operating Temperature Range Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rating −0.3 V to +3.63 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +150°C −40°C to +85°C ESD CAUTION CRITICAL ZONE TL TO TP tP TP tL TSMAX TSMIN tS RAMP-DOWN PREHEAT 10913-003 TEMPERATURE RAMP-UP TL t25°C TO PEAK TIME Figure 3. Recommended Soldering Profile Limits Table 3. Recommended Soldering Profile Limits Profile Feature Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Maximum Temperature (TSMAX) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within 5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time 25°C to Peak Temperature Rev. 0 | Page 4 of 12 Sn63/Pb37 1.25°C/sec maximum Pb-Free 1.25°C/sec maximum 100°C 150°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 215°C + 3°C/−3°C 20 sec to 30 sec 3°C/sec maximum 5 minute maximum 150°C 200°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 260°C + 0°C/−5°C 20 sec to 30 sec 3°C/sec maximum 5 minute maximum Data Sheet ADMP411 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND 3 GND 6 VDD GND BOTTOM VIEW (Not to Scale) Figure 4. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 Mnemonic OUTPUT GND GND GND VDD GND Description Analog Output Signal Ground Ground Ground Power Supply Ground Rev. 0 | Page 5 of 12 10913-004 4 5 ADMP411 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 15 10 THD + N (%) 10 5 1 0 100 1k 10k 20k FREQUENCY (Hz) 0.1 90 120 130 140 130 140 Figure 8. THD + N vs. Input Level 0 10 –10 OUTPUT AMPLITUDE (dBV) 15 5 0 –5 –10 –20 –30 –40 –50 100 1k –60 90 10913-007 10k FREQUENCY (Hz) 100 110 120 INPUT AMPLITUDE (dB SPL) Figure 6. Typical Frequency Response (Measured) Figure 9. Linearity –40 1.2 128dB SPL 130dB SPL 132dB SPL 134dB SPL 136dB SPL 138dB SPL 140dB SPL –41 1.0 –42 OUTPUT (V) 0.8 –44 –45 –46 0.6 0.4 –47 –48 0.2 –49 –50 100 1k 10k FREQUENCY (Hz) 10913-006 PSRR (dB) –43 Figure 7. Typical Power Supply Rejection Ratio vs. Frequency 0 0 0.2 0.4 0.6 0.8 TIME (ms) Figure 10. Clipping Characteristics Rev. 0 | Page 6 of 12 1.0 10913-014 NORMALIZED FREQUENCY RESPONSE (dBV) 110 AMPLITUDE (dB SPL) Figure 5. Frequency Response Mask –15 10 100 10913-009 –10 10 10913-008 –5 10913-005 NORMALIZED AMPLITUDE (dB) 20 Data Sheet ADMP411 APPLICATIONS INFORMATION CODEC CONNECTIONS VREF The ADMP411 output can be connected to a dedicated codec microphone input (see Figure 11) or to a high input impedance gain stage (see Figure 12). A 0.1 µF ceramic capacitor placed close to the ADMP411 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A dc blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at fC = 1/(2π × C × R) A minimum value of 4.7 μF is recommended in Figure 11 because the ADAU1761/ADAU1361 input impedance can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at 17 Hz. Figure 12 shows the ADMP411 connected to an ADA4075-2 op amp configured as a noninverting preamplifier. The AN-1165 Application Note describes using op amps for microphone preamp circuits and includes a list of recommended Analog Devices, Inc., op amps. CM VOUT 10kΩ VREF 10913-011 OUTPUT GND Figure 12. ADMP411 Connected to the ADA4075-2 Op Amp To fully utilize the 99 dB dynamic range of the ADMP411 in a design, the preamp, ADC, or codec circuit following it must be chosen carefully. For example, the ADAU1761 has a 98 dB dynamic range with VDD = 3.3 V. To match the dynamic ranges between the microphone and the ADC input of the codec, some gain must be added to the ADMP411 output. For example, at the 131 dB SPL maximum acoustic input, the ADMP411 outputs a −13 dBV rms signal. The full-scale input voltage of the ADAU1761 ADC is 0 dBV; therefore, 13 dB of gain must be added to the signal to match the dynamic range of the microphone with the dynamic range of the codec. UG-445, EVAL-ADMP411Z-FLEX: Bottom-Ported Analog Output MEMS Microphone Evaluation Board LINN LINP ADA4075-2 1µF MINIMUM Evaluation Board User Guide ADAU1761 OR ADAU1361 10913-010 OUTPUT GND 4.7µF MINIMUM VDD ADMP411 SUPPORTING DOCUMENTS MICBIAS 0.1µF VDD 0.1µF DYNAMIC RANGE CONSIDERATIONS where R is the input impedance of the codec. ADMP411 GAIN = (R1 + R2)/R1 R1 R2 1.8V TO 3.3V Figure 11. ADMP411 Connected to the Analog Devices ADAU1761 or ADAU1361 Codec Application Notes AN-1003, Recommendations for Mounting and Connecting Analog Devices, Inc., Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing Analog Devices, Inc., Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming AN-1165, Op Amps for MEMS Microphone Preamp Circuits AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit Rev. 0 | Page 7 of 12 ADMP411 Data Sheet HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT REFLOW SOLDER The MEMS microphone can be handled using standard pick and place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. For more detailed recommendations, see the AN-1068 Application Note, Reflow Soldering of the MEMS Microphone. • • • • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out or blow air into the microphone port. Do not use excessive force to place the microphone on the PCB. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blowoff procedures and ultrasonic cleaning must not be used. Rev. 0 | Page 8 of 12 Data Sheet ADMP411 PCB LAND PATTERN LAYOUT pattern layout is shown in Figure 14. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. The recommended PCB land pattern for the ADMP411 is laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 13. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil 2.62 ø0.90 (3×) ø1.10 ø1.68 2.54 2.40 1.20 1.27 10913-012 ø0.70 (2×) 0.79 Figure 13. PCB Land Pattern Layout (Dimensions Shown in Millimeters) 1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4×) 0.649mm DIA. (2×) 0.85mm DIA. (3×) 2.4mm 2.54mm 1.2mm 2.62mm 3.41mm Figure 14. Suggested Solder Paste Stencil Pattern Layout Rev. 0 | Page 9 of 12 10913-013 1.27mm ADMP411 Data Sheet OUTLINE DIMENSIONS 4.82 4.72 4.62 PIN 1 3.14 REF 0.79 BSC 2.62 BSC 0.90 DIA. (PINS 1, 5, 6) 3.86 3.76 3.66 2.40 BSC 1 2 1.68 DIA. 3 1.10 DIA. 6 1.20 BSC 4 5 0.68 REF TOP VIEW 1.10 1.00 0.90 3.30 REF REFERENCE CORNER 4.10 REF BOTTOM VIEW 2.54 BSC 1.27 BSC 0.25 DIA. (THRU HOLE) 0.61 REF 0.70 DIA. (PINS 2, 4) SIDE VIEW 12-12-2011-C 0.73 REF 0.24 REF Figure 15. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 4.72 mm × 3.76 mm Body (CE-6-1) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADMP411ACEZ-RL ADMP411ACEZ-RL7 EVAL-ADMP411Z-FLEX 1 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 6-Terminal LGA_CAV, 13” Tape and Reel 6-Terminal LGA_CAV, 7” Tape and Reel Flex Evaluation Board Z = RoHS Compliant Part. Rev. 0 | Page 10 of 12 Package Option CE-6-1 CE-6-1 Ordering Quantity 4,500 1,000 Data Sheet ADMP411 NOTES Rev. 0 | Page 11 of 12 ADMP411 Data Sheet NOTES ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10913-0-4/13(0) Rev. 0 | Page 12 of 12