D a t a S h e e t , V 1. 1 , M ay 2 00 8 SMM310 S i l i c on M E M S M i c r op h o n e S m a l l S i g n a l D i s c r et e s Edition 2008-05-28 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. SMM310 SMM310 Revision History: 2008-05-28, V1.1 Previous Version: 2007-08-31, V1.0 Page Subjects (major changes since last revision) 4 Halogen-free package 9 Typical measurement of output impedance added 11 Marking layout example removed Data Sheet 3 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Silicon MEMS Microphone Features • SMD MEMS microphone for automated surface mount assembly • Reflow soldering up to 260 °C (lead free) • High long-term temperature stability • Stable sensitivity over power supply range of 1.5 - 3.3 V • Low current consumption of 80 µA • Excellent power supply rejection of -55 dB • High integrated immunity to EMI • RoHS-compliant, halogen-free package with small footprint and low height of 1.25 mm Applications The SMM310 is designed for • • • • Mobile Phones (Handsets, Headsets) Consumer (Game Consoles, PDA’s) Computer (Personal Computers, Notebooks) Cameras (Digital Still Cameras, Video Cameras) Product Description Miniature Silicon MEMS (Micro Electro Mechanical System) omni-directional Microphone with single-ended analog interface designed for automated reflow soldering assembly as SMD (Surface Mounted Device) component. It is an alternative to conventional ECMs (Electret Condenser Microphones). Due to its robust design with a metallic lid and monolithic integrated EMI-blocking capacitors and utilization of Silicon MEMS technology, the SMM310 shows high immunity to EMI (Electromagnetic Interference) and heat. The capped Chip-On-Board package solution contains the micromechanical sensor chip and an amplifier chip. The RoHS-compliant halogen-free device has a size of 4.72 x 3.76 x 1.25 mm3. VDD (4) OUT (1) GND (2,3) Figure 1 Block Diagram Type Package Marking SMM310 HG-MMA-4-2 S310 Data Sheet 4 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Pin Definition and Function Table 1 Pin Definition and Function Pin No. Symbol Function 1 OUT GND GND VDD Output TSTG TA VDD -40 °C - 125 °C 2 3 4 Ground Ground Power Maximum Ratings Table 2 Maximum Ratings Storage Temperature Operating Temperature Range Operating Voltage Range -40 °C - 85 °C 1.5 V - 3.3 V ESD robustness Table 3 Typical robustness to electrostatic discharge ESD capability all pins (HBM, JESD22-A114) ESD capability all pins (MM, JESD22-A115) ± 4 kV VESD_HBM VESD_MM ± 400 V Acoustical and Electrical Characteristics Table 4 Unless otherwise noted, typical test conditions are TA = 23 °C, VDD = 2.1 V and R.H. = 50 % measured in a pressure chamber test setup. All voltages refer to GND node Parameter Symbol Sensitivity 1 kHz S1kHz ∆S4kHz ∆S240Hz ENL Relative Sensitivity 4 kHz Relative Sensitivity 240 Hz Equivalent Noise Level Signal-to-Noise Ratio SNR THD ICC Power Supply Rejection Ratio PSRR Values Unit Note / Test Condition Min. Typ. Max. -45 -42 -39 dB(V/Pa) 1 kHz, 94 dB SPL -1 +4 dB Relative to sensitivity 1 kHz -1 +1 dB Relative to sensitivity 1 kHz 32.5 dB(pso) CCITT-weighted1) 35 dB(A) A-weighted2) 64.5 dB(pso) CCITT-weighted 59 dB(A) A-weighted 29.5 61.5 Total Harmonic Distortion 0.1 0.5 % 104 dB SPL, 1 kHz Current Consumption 80 140 µA VDD = 2.1 V -55 -40 dBr 100 mV superimposed on VDD = 2.1 V, 1 kHz 1.2 V DC Voltage at Pin 1 7 Ω 1 kHz DC Output Voltage Output Impedance VOUT ZOUT 1) Psophometrically weighted noise measurement with CCITT-filter (ITU-T Rec. P.53) 2) Noise measurement with A-weighting filter (IEC 651) Data Sheet 5 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Typical Measurements Results 10 Sensitivity relative to 1kHz [dB] 8 6 +4 4 +1 2 0 -1 -1 -2 -4 -6 -8 -10 100 10000 Typical frequency response curve relative to the sensitivity at a frequency of 1 kHz 5 4 4 Equivalent Noise Level relative to T A=23 °C [dB] 5 3 2 1 [dB] Sensitivity relative to TA=23 °C Figure 2 1000 Frequency [Hz] 0 -1 -2 -3 -4 -5 2 1 0 -1 -2 -3 -4 -5 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature / °C Temperature / °C Figure 3 3 Typical change of sensitivity at 1 kHz and equivalent noise level over temperature relative to TA = 23° C Data Sheet 6 V1.1, 2008-05-28 SMM310 32.5 90 -40 31.5 85 30.5 80 -41 -42 29.5 -43 28.5 Sensitivity ICC [µA] Equivalent Noise 65 -45 26.5 60 1.2 1.1 1 0.9 0.8 Current Consumption 2.3 2.6 2.9 3.2 0.7 0.6 0.5 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5 VDD [V] VDD [V] Figure 4 1.3 70 27.5 2 1.4 DC Output Voltage 75 -44 1.4 1.7 1.5 Vout [V] -39 ENL [dB(pso)] S [dBV/Pa] Silicon MEMS Microphone Typical measurement of sensitivity, equivalent noise level, current consumption and DC output voltage over power supply VDD 2 1.8 1.6 THD [%] 1.4 1.2 1 0.8 0.6 0.4 0.2 0 90 100 110 120 130 Sound Pressure [dB SPL] Figure 5 Data Sheet Typical total harmonic distortion over sound pressure level (1 kHz, VDD = 2.1 V) 7 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone 1000 0.5 Noise densitiy (nV/Hz ) A-weighted 100 CCITT-weighted 10 1 100 1000 10000 Frequency [Hz] Figure 6 Typical noise density measurement with A-weighting and CCITT-weighting filter -30 -35 PSRR [dBr] -40 -45 -50 -55 -60 -65 -70 10 100 1000 10000 100000 Frequency [Hz] Figure 7 Data Sheet Typical power supply rejection ratio (relative to 100 mV sinewave superimposed on the supply voltage VDD) 8 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Demodulated RF-signal relative to acoustical sensitivity [dB] -10 -20 -30 -40 -50 -60 WCDMA -70 -80 100 GSM850/900 300 500 700 900 GSM1800/1900 1100 1300 1500 1700 1900 2100 2300 2500 Frequency of RF disturbance [MHz] Figure 8 Typical RF demodulation relative to the microphone signal (1 kHz, 1 Pa). RF disturbance (100 MHz - 2.5 GHz, 80%-AM-modulated with 1 kHz) is directly injected in the power supply 100 Output Impedance [Ohm] 90 80 70 60 50 40 30 20 10 0 10 100 1000 10000 100000 Frequency [Hz] Figure 9 Data Sheet Typical output impedance measurement (VDD = 2.1 V) 9 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone 1.25 ±0.1 Package Outline 0.1 4x 3 1 1.32 ±0.2 4 2 1 0.15 TYP. 1) 3 2 0.15 TYP. 4.72 ±0.1 1.24 TYP. (2.22) 4 3.76 ±0.1 1.88 ±0.2 0.84 ±0.1 1.45 TYP. (2.97) 1) Area for acoustic seal diam. 1.64 mm typ. Figure 10 Package outline Table 5 Dimensions GHG01248 Item Dimension (mm) Tolerance (mm) Height 1.25 ± 0.1 Length 4.72 ± 0.1 Width 3.76 ± 0.1 Sound Port Diameter 0.84 ± 0.1 Recommended Customer Land Pattern 3.45 2.22 1.24 1.45 2.97 4.42 HLGF1250 Figure 11 Data Sheet Recommended customer land pattern 10 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Solder Reflow Table 6 Solder Reflow Conditions Solder Reflow Profile Compliant to J-STD-020-C Maximum Peak Temperature 260 °C Number of Reflow 3 times reflow soldering Board washing after Reflow Board washing can damage the microphone if the sound inlet hole is uncovered Moisture Sensitivity Level MSL 2 classified Recommended Vacuum Handling 0.5 mm MIN Figure 12 Data Sheet Recommended minimum distance between sound port hole and vacuum pick tool opening is 0.50 mm 11 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Tape Outline Figure 13 Tape Outline, 1) Cumulative tolerance of 10 sprocket holes is ±0.2 mm Table 7 Tape Dimensions (mm) W P0 P1 P2 D0 A0 B0 E1 12±0.3 4±0.1 8±0.1 2±0.05 1.5±0.1 4.1±0.1 5±0.1 1.75±0.1 E2 F D1 T T1 T2 G K0 10.25 MIN 5.5±0.05 1.5 MIN 0.3±0.05 0.05±0.015 2.1±0.2 1.95 NOM 1.75±0.1 Data Sheet 12 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Reel Outline Figure 14 Table 8 Reel Dimension (mm) and Quantity per Reel A W1 W2 N Quantity per Reel Ø 330 12.4±1.5 18.4 MAX Ø 100 4000 Data Sheet 13 V1.1, 2008-05-28