FPF1013 / FPF1014 IntelliMAX™ 1V-Rated Advanced Load Management Products Features Description The FPF1013/14 IntelliMAX™ advanced slew rate load switch offers very low operating voltage and a 17mΩ Nchannel MOSFET that supports an input voltage up to 2.0V. This slew-rate device control the switch turn-on and prevent excessive inrush current from supply rails. The input voltage range operates from 0.8V to 1.8V to fulfill today's lowest mobile device supply requirements. Switch control is via a logic input (ON) capable of interfacing directly with low-voltage control signals. 0.8V to 1.8V Input Voltage Range Typical RDS(ON) = 17mΩ at VON - VIN = 2.0V Output Discharge Function Internal Pull-Down at ON Pin Accurate Slew Rate Controlled Turn-on Time Low < 1μA Quiescent Current ESD Protected, above 8kV HBM, 2kV CDM The FPF1014 has an on-chip pull-down, allowing for quick and controlled output discharge when the switch is turned off. The FPF10131/4 is available in a spacesaving six-lead 1mm x 1.5mm Wafer-Level Chip-Scale Package (WLCSP). Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Notebook Computers Figure 1. WLCSP Bump Configuration (Top & Bottom) Figure 2. Typical Application Ordering Information Part Number Switch Turn-On Time Output Discharge ON Pin Activity Package FPF1013 17mΩ, NMOS 43μs N/A Active HIGH FPF1014 17mΩ, NMOS 43μs 60Ω Active HIGH WLCSP 1x1.5mm (950µm ±30µm x 1450µm ±30µm x 225µm x 225µm, see Figure 24) © 2009 Fairchild Semiconductor Corporation FPF1014 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products May 2011 Figure 3. Functional Block Diagram Pin Configuration Figure 4. Pin Configuration Pin Definitions Pin Name A2, B2 VIN Supply Input: Input to the power switch and the supply voltage for the IC Description ON Control Input C2 ON A1, B1 VOUT Switch Output: Output of the power switch C1 GND Ground © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 2 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Functional Block Diagram Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Units VIN, VOUT, to GND -0.3 2.0 V VON to GND -0.3 4.2 V ISW Maximum Continuous Switch Current 1.5 A PD Power Dissipation at TA = 25°C(1) 1.2 W TA Operating Temperature Range -40 +85 °C TSTG Storage Temperature -65 +150 °C ΘJA Thermal Resistance, Junction to Ambient 85 °C/W ESD Electrostatic Discharge Protection Human Body Model 8000 V Charged Device Model 2000 V Note: 1. Package power dissipation on one-square-inch pad, two-ounce copper board. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Units VIN Supply Voltage 0.8 1.8 V TA Ambient Operating Temperature -40 +85 °C © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 3 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Absolute Maximum Ratings VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN =1.8V and TA = 25°C. Symbol Parameter Condition Min. Typ. Max. Units Basic Operation VIN VON(MIN) VON(MAX) Operating Voltage ON Input Voltage 0.8 VIN = 0.8V (2) VIN = 1.8V 1.8 V 1.8 2.8 4.0 V 2.8 3.8 4.0 V ICC Operating Current VIN = 1V, VON = 3.3V, VOUT = Open 1 μA IQ Quiescent Current VIN = 1V, VON = GND, VOUT = Open 2 μA ISWOFF Off Switch Current VIN = 1.8V, VON = GND, VOUT = GND 2 μA VIN = 1V, VON = 3V, IOUT = 1A, TA = 25C 17 27 VIN = 1V, VON = 2.3V, IOUT = 1A, TA = 25°C 25 38 Output Pull-Down Resistance VIN = 1V, VON = 0V, IOUT = 1mA, TA = 25°C, FPF1014 60 120 VIL ON Input Logic Low Voltage VIN = 0.8V, RL = 1KΩ 0.3 VIN = 1.8V, RL = 1KΩ 0.8 ION On Input Leakage VON = VIN or GND RON On-Resistance RPD 1 mΩ Ω V μA Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C) tR VOUT Rise Time tON Turn-On Time tF VOUT Fall Time tOFF Turn-Off Time RL = 500Ω, CL = 0.1μF 28 RL = 3.3Ω, CL = 10μF 38 RL = 500Ω, CL = 0.1μF 43 RL = 3.3Ω, CL = 10μF 58 FPF1014, RL = 500Ω, CL = 0.1μF 14 FPF1014, RL = 3.3Ω, CL = 10μF 76 FPF1014, RL = 500Ω, CL = 0.1μF 50 FPF1014, RL = 3.3Ω, CL = 10μF 96 μs μs μs μs Note: 2. VON(MAX) is limited by the Absolute Maximum Rating. © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 4 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Electrical Characteristics Figure 5. Figure 7. Supply Current vs. VIN Figure 6. Operating Current vs. Temperature Figure 9. Figure 8. RON vs. Temperature © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 Off Quiescent Current vs. Temperature Off Switch Current vs. Temperature Figure 10. RON vs. VON-VIN www.fairchildsemi.com 5 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Typical Performance Characteristics Figure 11. VIL vs. VIN Figure 12. VIL vs. Temperature Figure 13. tRISE / tFALL vs. Temperature Figure 14. tON / tOFF vs. Temperature Figure 15. Turn-On Response Figure 16. FPF1014 Turn-Off Response © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 6 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Typical Performance Characteristics Figure 17. Turn On Response Figure 18. FPF1014 Turn-Off Response Figure 19. FPF1014 Output Pull-Down Response © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 7 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Typical Performance Characteristics FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Operational Description The FPF1013/4 are low-RDS(ON) N-channel load switches with controlled turn-on. The core of each device is a 17mΩ (VIN = 1V, VON = 3V) N-channel MOSFET and is customized for a low-input operating range of 0.8V to 1.8V. The ON pin controls the state of the switch. The FPF1014 contains a 60Ω (typical) on-chip resistor, which is connected internally from VOUT to GND for quick output discharge when the switch is turned off. On / Off Control The ON pin is active HIGH and controls the state of the switch. Applying a continuous HIGH signal holds the switch in the ON state. To minimize the switch on resistance, the ON pin voltage should exceed the input voltage by 2V. This device is compatible with a GPIO (General-Purpose Input / Output) port, where the logic voltage level can be configured to 4V ≥ VON ≥ VIN + 2V and power consumed is less than 1μA in steady state. Figure 20. Timing Diagram where: tdON tR tON tdOFF tF tOFF = = = = = = Delay On Time VOUT Rise Time Turn-On Time Delay Off Time VOUT Fall Time Turn-Off Time Figure 21. Typical Application © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 8 Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on, a capacitor must be placed between VIN and GND. For minimized voltage drop, especially when the operating voltage approaches 1V a 10μF ceramic capacitor should be placed close to the VIN pins. Higher values of CIN can be used to further reduce the voltage drop during higher current modes of operation. Output Capacitor A 0.1μF capacitor, CL, should be placed between VOUT and GND. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch turns off. If the application has a capacitive load, the FPF1014 can be used to discharge that load through an on-chip output discharge path. Figure 22. Proper Layout of Output, Input, and Ground Copper Area Demonstration Board Layout Board Layout FPF1013/4 demonstration board has the components and circuitry to demonstrate the load switches functions. Thermal performance is improved using techniques recommended in the layout recommendations section of datasheet. For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) helps minimize the parasitic electrical effects along with minimizing the case-toambient thermal impedance. Improving Thermal Performance Improper layout can result in higher junction temperature. This applies when continuous operation current is set to maximum allowed current and switch turns into a large capacitive load that introduces high inrush current in the transient. Since FPF1013/14 does not have thermal shutdown feature, proper layout can essentially reduce power dissipation of the switch in transient and prevents the switch exceeding the maximum absolute power dissipation of 1.2W. Figure 23. Demonstration Board Layout The VIN, VOUT, and GND pins dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 22 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The ON pin trace may be laid out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 9 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Application Information 0.03 C E 2X F A B A1 Ø0.20 Cu Pad 1.00 BALL A1 INDEX AREA D 0.50 Ø0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.625 0.547 0.05 C C 0.378±0.018 0.208±0.021 E SEATING PLANE D SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 C A B Ø0.260±0.02 6X 0.50 C 1.00 B A 0.50 (Y) ±0.018 1 2 F B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. (X) ±0.018 BOTTOM VIEW FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products Physical Dimensions G. DRAWING FILNAME: MKT-UC006AIrev1. Figure 24. Wafer-Level Chip-Scale Package (WLCSP) 1 x 1.5mm E D X Y 950µm ±30µm 1450µm ±30µm 225µm 225µm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 10 FPF1013 / FPF1014 — IntelliMAX™ 1V-Rated Advanced Load management Products © 2009 Fairchild Semiconductor Corporation FPF1013 / FPF1014 • Rev. 1.0.8 www.fairchildsemi.com 11