)6 'XDO3//&ORFN*HQHUDWRU,& XT $GYDQFH,QIRUPDWLRQ March 2000 1.0 Features 2.0 • Dual phase-locked loop (PLL) device with three output clock frequencies • 3.3V supply voltage • Small circuit board footprint (8-pin 0.150″ SOIC) • Custom frequency selections available - contact your local AMI Sales Representative for more information XIN 2 XOUT 3 VDD FS6284 1 4 The FS6284 is a monolithic CMOS clock generator IC designed to minimize cost and component count in digital video/audio systems. All frequencies are ratiometrically derived from the crystal oscillator frequency. The locking of all the output frequencies together can eliminate unpredictable artifacts in video systems and reduce electromagnetic interference (EMI) due to frequency harmonic stacking. Table 1: Crystal / Output Frequencies Figure 1: Pin Configuration SEL Description 8 CLKA 7 CLKB 6 DEVICE SEL fXIN (MHz) 0 FS6284-01 VSS 14.31818 1 5 CLKC CLKA (MHz) CLKB (MHz) CLKC (MHz) 81.000 (fXIN* 198 / 35) 14.31818 48.000 (fXIN) (fXIN* 352 / 105) 70.000 (fXIN* 44 / 9) NOTE: Contact AMI for custom PLL frequencies 8-pin (0.150″) SOIC Figure 2: Block Diagram XIN CLKA CRYSTAL OSC. XOUT PLL DIVIDER ARRAY PLL CLKB CLKC SEL FS6284 This document contains information on a preproduction product. Specifications and information herein are subject to change without notice. ,62 3.28.00 )6 'XDO3//&ORFN*HQHUDWRU,& XT $GYDQFH,QIRUPDWLRQ March 2000 Table 2: Pin Descriptions Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin PIN 3.0 TYPE NAME U DESCRIPTION 1 DI SEL Select Input (see Table 1) 2 AI XIN Crystal Oscillator Drive / External Reference Input 3 AO XOUT 4 P VDD Power (+3.3 volts) 5 DO CLKC Clock Output C 6 P VSS 7 DO CLKB Clock Output B 8 DO CLKA Clock Output A Crystal Oscillator Feedback Ground Electrical Specifications Table 3: Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability. PARAMETER Supply Voltage (VSS = ground) SYMBOL MIN. MAX. UNITS VDD VSS-0.5 7 V Input Voltage, dc VI VSS-0.5 VDD+0.5 V Output Voltage, dc VO VSS-0.5 VDD+0.5 V Input Clamp Current, dc (VI < 0 or VI > VDD) IIK -50 50 mA Output Clamp Current, dc (VI < 0 or VI > VDD) IOK -50 50 mA Storage Temperature Range (non-condensing) TS -65 150 °C Ambient Temperature Range, Under Bias TA -55 Junction Temperature TJ Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) 125 °C 125 °C 260 °C 2 kV CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 4: Operating Conditions PARAMETER SYMBOL Supply Voltage VDD Ambient Operating Temperature Range TA ,62 CONDITIONS/DESCRIPTION 3.3V ± 10% MIN. TYP. MAX. 3.0 3.3 3.6 V 70 °C 0 UNITS 2 3.28.00 )6 'XDO3//&ORFN*HQHUDWRU,& XT $GYDQFH,QIRUPDWLRQ March 2000 4.0 Package Information Table 5: 8-pin SOIC (0.150") Package Dimensions 8 DIMENSIONS INCHES MIN. MAX. MILLIMETERS MIN. MAX. A 0.061 0.068 1.55 1.73 A1 0.004 0.0098 0.102 0.249 A2 0.055 0.061 1.40 1.55 B 0.013 0.019 0.33 0.49 C 0.0075 0.0098 0.191 0.249 D 0.189 0.196 4.80 4.98 E 0.150 0.157 3.81 3.99 e 0.050 BSC R E H XT 1 ALL RADII: 0.005" TO 0.01" h x 45° B 7° typ. e 1.27 BSC H 0.230 0.244 5.84 6.20 h 0.010 0.016 0.25 0.41 L 0.016 0.035 0.41 0.89 Θ 0° 8° 0° 8° A2 A D C A1 BASE PLANE L θ SEATING PLANE Table 6: 8-pin SOIC (0.150") Package Characteristics PARAMETER SYMBOL CONDITIONS/DESCRIPTION TYP. UNITS Air flow = 0 m/s 110 °C/W Corner lead 2.0 Center lead 1.6 Thermal Impedance, Junction to Free-Air 8-pin 0.150” SOIC ΘJA Lead Inductance, Self L11 Lead Inductance, Mutual L12 Any lead to any adjacent lead 0.4 nH Lead Capacitance, Bulk C11 Any lead to VSS 0.27 pF ,62 nH 3 3.28.00 )6 'XDO3//&ORFN*HQHUDWRU,& XT $GYDQFH,QIRUPDWLRQ 5.0 March 2000 Ordering Information ORDERING CODE DEVICE NUMBER PACKAGE TYPE OPERATING TEMPERATURE RANGE SHIPPING CONFIGURATION 11640-xxx FS6284-01 8-pin (0.150”) SOIC (Small Outline Package) 0°C to 70°C (Commercial) Tape and Reel 11640-xxx FS6284-01 8-pin (0.150”) SOIC (Small Outline Package) 0°C to 70°C (Commercial) Tubes Copyright © 2000 American Microsystems, Inc. Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI’s products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: [email protected] ,62 4 3.28.00