GILWAY GHB-1104R-DR

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1104R-DR
Features
Description
!3.0mmx1.0mm
!LOW
!WIDE
!IDEAL
SMT LED, 2.0mm THICKNESS.
The Super Bright Red source color devices are
POWER CONSUMPTION.
made with Gallium Aluminum Arsenide Red Light
VIEWING ANGLE.
Emitting Diode.
FOR BACKLIGHT AND INDICATOR.
3.0x1.0 mm SMD CHIP LED LAMP
!VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.2
DATE: DEC/11/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No.
No
o..
SUPER BRIGHT RED(GaAIAs)
GHB-1104R-DR
IIv
v ((mc
(mcd)
m c dd)
@ 20 mA
Lens
Typ
L
e
ens
nss T
Tyy p e
D iic
ce
WATER CLEAR
V
Viewin
Viiiew
ew iin
ng
Angle
in.
Miin
n.
T
Typ
Tyyyp
pp..
18
60
120°
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r am et er
De
evic
ev ic e
TTyyyp
pp..
Ma
ax
xx..
Un
nit
its
T
Test
e
est
ss t C
Conditio
o n d it io nss
peak
P eak Wavelength
S uper Bright Red
660
nm
I F =20mA
D
D ominate Wavelength
S uper Bright Red
640
nm
I F =20mA
S pectral Line Half-width S uper Bright Red
20
nm
I F =20mA
pF
VF=0V;f=1MHz
2.5
V
I F =20mA
10
uA
VR = 5V
1/2
C
C apacitance
S uper Bright Red
45
VF
Forward Voltage
S uper Bright Red
1.85
IR
Reverse Current
S uper Bright Red
Absolute Maximum Ratings at TA=25 C
ed
B
Br ig h
S
Su
u
uper
uper
p er Br
Bright
Brig
htt R
Re
Red
n
its
U
Unit
nit
Power dissipation
100
mW
DC Forward Current
30
mA
Peak Forward Current [1]
155
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
r a m e t er
P
Paramete
Pa
a
arameter
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE: DEC/11/2002
PAGE: 2 OF 4
REV NO: V.2
DATE: DEC/11/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE: DEC/11/2002
PAGE: 4 OF 4