GILWAY GHB-1206L-O

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1206L-O
Description
Features
!3.2mmx1.6mm
SMT LED, 1.8mm THICKNESS.
The Super Bright Orange source color devices are
!LOW
POWER CONSUMPTION.
made with DH InGaAlP
!WIDE
VIEWING ANGLE.
Emitting Diode.
!IDEAL
on GaAs substrate Light
FOR BACKLIGHT AND INDICATOR.
!PACKAGE :
3.2x1.6mm SMD CHIP LED LAMP
2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.1
DATE:DEC/05/2002
PAGE: 1 OF 4
Selection Guide
o..
P
Pa
a
art
rt N
No.
No
ce
D iic
SUPER BRIGHT ORANGE (InGaAlP)
GHB-1206L-O
IIv
v ((mcd
m c dd)
(mcd)
@ 20 mA
L
Lens
e
ens
nss T
Typ
Tyyp
pe
WATER CLEAR
V
Viewin
Viiiewing
ew i n g
Angle
in
n.
Miin.
T
Typ
Tyyyp
pp..
280
700
50 °
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
S
Syym
ymbo
ymbol
mb o l
P
Pa
a
aramete
r am et er
De
evic
ev ic e
TTyyyp
pp..
Ma
ax
xx...
Un
nit
itss
T
Test
e
est
sstt C
Conditio
o n d it io nsss
peak
P eak Wavelength
S uper Bright Orange
610
nm
I F =20mA
D
D ominate Wavelength
S uper Bright Orange
601
nm
I F =20mA
29
nm
I F =20mA
pF
VF =0V;f=1MHz
2.5
V
I F =20mA
10
uA
VR = 5V
1/2
S pectral Line Half-width S uper Bright Orange
C
C apacitance
S uper Bright Orange
15
VF
Forward Voltage
S uper Bright Orange
2.1
IR
Reverse Current
S uper Bright Orange
Absolute Maximum Ratings at TA=25 C
P
Paramet
Pa
a
arameter
r am e t er
S
Su
up
u
uper
p er
er Bri
B
Bright
B
Brr igh
g h t Orang
O
Orang
r an g e
U
Unit
n
nit
itss
Power dissipation
75
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 95
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.1
DATE:DEC/05/2002
PAGE: 2 OF 4
REV NO: V.1
DATE:DEC/05/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.1
DATE:DEC/05/2002
PAGE: 4 OF 4