55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206L-Y Description Features !3.2mmx1.6mm !LOW The Super Bright Yellow source color devices are SMT LED, 1.8mm THICKNESS. made with DH InGaAlP on GaAs substrate Light POWER CONSUMPTION. Emitting Diode. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND !PACKAGE : LENS TYPES AVAILABLE. 3.2x1.6mm SMD CHIP LED LAMP 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE: JAN/25/2003 PAGE: 1 OF 4 Selection Guide Part No P Pa a art rt N No. o.. S UPER BRIGHTYELLOW (InGaAlP) GHB-1206L-Y IIv ((mcd m c dd) v (mcd) @ 20 mA Lens Typ L e ens nss T Typ Tyy pe Dice iic ce W ATER CLEAR V Viewin Viiewing i ew i n g Angle in. Miin n. T Typ Tyyyp pp.. 110 300 50 Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbol ymbo mb o l P Pa a aramete r a m e t er De evic ev ic e peak P eak Wavelength Super Bright Yellow D D ominate Wavelength 1/2 TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Cond o n d iition t io nss 590 nm I F =20mA Super Bright Yellow 588 nm I F =20mA Spectral Line Half-width Super Bright Yellow 28 nm I F =20mA C Capacitance Super Bright Yellow 25 pF VF =0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V I F =20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at TA=25 C P Paramete Pa a arameter r a m e t er S Su up u uper per er Bri B Br Brigh Br igh g ht Yellow Y Ye Yello Yello w Un nit its 125 W 30 A 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Power dissipation DC Forward Current Peak Forward Current [1] Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.3 DATE: JAN/25/2003 PAGE: 2 OF 4 REV NO: V.3 DATE: JAN/25/2003 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE: JAN/25/2003 PAGE: 4 OF 4