HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 1/7 H277 Complementary Output Hall Effect Sensor IC General Description H277 is designed to integrate Hall sensor with output driver together on the same chip. It is suitable for dual coils brush-less DC motors, dual coils brush-less DC fan, speed measurement, and revolution counting. It includes a band-gap reference voltage source, a Hall device, an amplifier, a hysteretic controller and an opencollector output drive capable of sinking up to 300mA current load. An on-chip protection diode is implemented to prevent reverse power fault. H277 has a control circuit to prevent “dead angle” from logic race condition in DC Fan. It has excellent characteristic of temperature compensation. The internal temperature compensated voltage source can let sensor to get uniform sensitivity in a wide temperature range. It is rated for operation over temperature rage from -20oC to +85oC and voltage ranges from 3.0V to 20V. Features • On-chip Hall sensor • 3.0V to 20V operating voltage • Internal Temperature compensation • Special design providing logic race condition immunity, shorter switching time, and good switch reliability • 300mA output sink current • Internal on-chip protection diode • SIP-4L Package Applications • Dual-coil Brush-less DC Motor • Dual-coil Brush-less DC Fan • Revolution Counting • Speed Measurement Typical Application Circuit (Brush-Less DC Fan) Fig.2 H277 Application Circuit H277 HSMC Product Specification HI-SINCERITY Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 2/7 MICROELECTRONICS CORP. Pin Configuration Name P/I/O Pin No. VCC P 1 Description Power Supply Input DO O 2 Output Pin DOB O 3 Output Pin GND P 4 Ground Block Diagram Vcc Temperature Compensation Vout1 Voltage Regulator GND Hall Effect Sensor Differential Amplifier Hysteresis Control Output Driver Vout2 Logic Control GND Fig.3 Functional Block Diagram of H277 Absolute Maximum Ratings (Ta=25oC) Characteristics Symbol Values Unit VCC 20 V VOUT(breakdown) 35 V Magnetic Flux Density B Unlimited Gauss Output Zener Breakdown VZ 28 V Output ON Current (continuous) IC 300 mA ICMAX 1 A Operating Temperature Range TA -20 to +85 ℃ Storage Temperature Range TStg -65 to +150 ℃ Package Power Dissipation PD 500 mW Maximum Junction Temperature TJ 150 ℃ Supply Voltage Output breakdown Voltage Maximum Output Current H277 HSMC Product Specification HI-SINCERITY Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 3/7 MICROELECTRONICS CORP. Electrical Characteristics (T=+25℃, VCC=3V~20V) Characteristic Supply Voltage Symbol Test Conditions Min. Typ. Max. Unit 3 - 20 V VCC=3V, IL=100mA - 200 - VCC=14V, IL=300mA - 300 600 VCC Output Saturation Voltage VCE(sat) mV Output Leakage Current Icex Vce=14V, VCC=14V - - 2 uA Supply Current Iccq VCC=20V, Output Open - 14 20 mA Output Rise Time Tr VCC=14V, RL=400Ω, CL=20pF - 1 5 uS Output Falling Time Tf VCC=14V, RL=400Ω, CL=20pF - 0.2 1.2 uS Magnetic Characteristics Characteristic H277A H277B H277C H277D Symbol Operate Point Bop - Release Point Brp -50 Operate Point Bop - Release Point Brp -70 Operate Point Bop - Release Point Brp Operate Point Release Point Max. Unit 50 Gauss - Gauss 70 Gauss - Gauss 90 Gauss -90 - Gauss Bop - 130 Gauss Brp -130 - Gauss Fig.4 VDO vs. Magnetic Flux Density H277 Min. Grade A B C D Fig.5 VDOB vs. Magnetic Flux Density HSMC Product Specification HI-SINCERITY Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 4/7 MICROELECTRONICS CORP. Characteristics Curve Supply Current & Temperature 13.4 13.3 Supply Current (mA)... 13.2 Test Conditions: VCC=20V Output Open, RL=∞ (Refer to Test Circuit) 13.1 13 12.9 12.8 12.7 12.6 12.5 12.4 0 20 40 60 o 80 100 120 Temperature ( C) Fig.6 ICC vs. VCC Fig.7 ICC vs. TA Hysteresis & Temperature 80 1400 70 1200 Test Conditions: VCC=14V, RL=400Ω CL=20pF (Refer to Test Circuit) 60 Hysteresis (G) Test Conditions: VCC=14V, TA =25o C IL=300mA~1200mA 1000 800 600 50 40 30 400 20 200 10 0 0 300 400 500 600 700 800 900 1000 0 20 40 60 o 80 100 120 Temperature ( C) Loading Current (mA) Fig.8 Vsat vs. IC Fig.9 Bhys vs. TA SIP-4L Power Dissipation & Temperature 600 550 Power Dissipation (mW) Output Saturation Voltage (mV)... Output Saturation Voltage & Loading Current 1600 500 450 400 350 300 250 200 0 20 40 60 80 o 100 120 Temperature ( C) Fig.10 PD vs. TA H277 HSMC Product Specification HI-SINCERITY Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 5/7 MICROELECTRONICS CORP. Brush-less DC Fan Output Current Curve Icoil 1 Current (mA) 180 12V, 0.24A Brush-Less DC Fan (Refer to Typical Application Circuit) Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm 90 0 Icoil 2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Time (uS) Fig.11 DC FAN Output Curve Brush-less DC Fan Output Voltage Curve Output Voltage (V) 20 18 12V, 0.24A Brush-Less DC Fan 16 Test Conditions: VCC=12V, C1=C2=2.2uF Rcoil1=Rcoil2=40ohm (Refer to Typical Application Circuit) 14 Vout 1 12 10 8 6 4 2 Vout 2 0 0 2 4 6 8 10 Time (mS) 12 14 16 18 20 Fig.12 DC FAN Output Curve Test Circuit Fig.13 Test Circuit H277 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 6/7 SIP-4L Dimension A B C 1 2 3 Marking: I J a1 a2 4 H D Note: Green label is used for Pb-free packing K Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND Hall Sensor Location: 2 .0 0 m m G a2 F E E To p V ie w Marking Site a1 1 .2 5 m m DIM A B C D E F G H I J K L a1 a2 Min. 5.12 4.10 3.55 0.43 0.35 1.24 3.78 1.32 1.45 0.93 13.00 o 3 o 5 Max. 5.32 4.30 3.75 0.49 0.41 1.30 3.84 1.52 1.65 1.13 15.50 o 5 o 7 *: Typical, Unit: mm L 4-Lead SIP-4L Plastic Package HSMC Package Code: AD Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office: • Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong Tel: +852-2755-7162 Fax: +852-2755- 7795 AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China Tel: +86(21) 61637118 Fax: +86(21)61637006 H277 HSMC Product Specification HI-SINCERITY Spec. No. : IC200907 Issued Date : 2009.04.03 Revised Date :2009.10.29 Page No. : 7/7 MICROELECTRONICS CORP. Soldering Methods for HSMC Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly <3 C/sec <3oC/sec - Temperature Min (Tsmin) 100oC 150oC - Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec <3oC/sec <3oC/sec 183oC 217oC Average ramp-up rate (TL to TP) o Preheat - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature o o 60~150 sec 240 C +0/-5 C 260oC +0/-5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 245oC ±5oC 5sec ±1sec 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. H277 o o 260 C +0/-5 C 5sec ±1sec HSMC Product Specification