HCA10009 Data Sheet 100MHz, Single and Dual Low Noise, Precision Operational Amplifier The HCA10009 is a high performance dielectrically isolated, op amp, featuring precision DC characteristics while providing excellent AC characteristics. Designed for audio, video, and other demanding applications, noise (3.4nV/√Hz at 1kHz), total harmonic distortion (<0.005%), and DC errors are kept to a minimum. The precision performance is shown by low offset voltage (0.3mV), low bias currents (40nA), low offset currents (15nA), and high open loop gain (128dB). The combination of these excellent DC characteristics with the fast settling time (0.4µs) make the HCA10009 ideally suited for precision signal conditioning. The unique design of the HCA10009 gives it outstanding AC characteristics not normally associated with precision op amps, high unity gain bandwidth (35MHz) and high slew rate (25V/µs). Other key specifications include high CMRR (95dB) and high PSRR (100dB). The combination of these specifications will allow the HCA10009 to be used in RF signal conditioning as well as video amplifiers. Pinout August 1999 Features • Gain Bandwidth Product. . . . . . . . . . . . . . . . . . . . 100MHz • Unity Gain Bandwidth. . . . . . . . . . . . . . . . . . . . . . . 25MHz • Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V/µs • Low Offset Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 0.3mV • High Open Loop Gain. . . . . . . . . . . . . . . . . . . . . . . 128dB • Channel Separation at 10kHz . . . . . . . . . . . . . . . . 110dB • Low Noise Voltage at 1kHz. . . . . . . . . . . . . . . . 3.4nV/√Hz • High Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 56mA • Low Supply Current per Amplifier. . . . . . . . . . . . . . . . 8mA Applications • Precision Test Systems • Active Filtering • Small Signal Video • Accurate Signal Processing • RF Signal Conditioning PART NUMBER (BRAND) HCA10009 -IN V- TEMP. RANGE (oC) 0 to 75 PACKAGE 8 Ld SOIC PKG. NO. M8.15 8 +BAL 2 +IN 3 4771 Ordering Information HCA10009 (SOIC) TOP VIEW -BAL 1 File Number 7 V+ + 4 6 OUT 5 NC 4-1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 HCA10009 Absolute Maximum Ratings Thermal Information Supply Voltage Between V+ and V- Terminals. . . . . . . . . . . . . . 35V Differential Input Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . 5V Output Current Short Circuit Duration . . . . . . . . . . . . . . . . Indefinite Thermal Resistance (Typical, Note 2) θJA (oC/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 157 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HCA10009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Input is protected by back-to-back zener diodes. See applications section. 2. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VSUPPLY = ±15V, Unless Otherwise Specified HCA10009 TEMP. (oC) MIN TYP MAX UNITS 25 - 0.30 0.75 mV Full - 0.35 1.5 mV Average Offset Voltage Drift Full - 0.5 - µV/oC Input Bias Current 25 - 40 100 nA Full - 70 200 nA 25 - 15 100 nA Full - 30 150 nA 25 - 400 750 µV Full - - 1500 µV Common Mode Range 25 ±12 - - V Differential Input Resistance 25 - 70 - kΩ PARAMETER TEST CONDITIONS INPUT CHARACTERISTICS Input Offset Voltage Input Offset Current Input Offset Voltage Match Input Noise Voltage f = 0.1Hz to 10Hz 25 - 0.25 - µVP-P Input Noise Voltage f = 10Hz 25 - 6.2 10 nV/√Hz Density (Notes 3, 12) f = 100Hz 25 - 3.6 6 nV/√Hz f = 1000Hz 25 - 3.4 4.0 nV/√Hz Input Noise Current f = 10Hz 25 - 4.7 8.0 pA/√Hz Density (Notes 3, 12) f = 100Hz 25 - 1.8 2.8 pA/√Hz f = 1000Hz 25 - 0.97 1.8 pA/√Hz Note 4 25 - <0.005 - % Note 5 25 106 128 - dB Full 100 120 - dB THD+N TRANSFER CHARACTERISTICS Large Signal Voltage Gain CMRR VCM = ±10V Full 86 95 - dB Unity Gain Bandwidth -3dB 25 - 35 - MHz Gain Bandwidth Product 1kHz to 400kHz 25 - 100 - MHz Full 1 - - V/V Minimum Stable Gain 4-2 HCA10009 Electrical Specifications VSUPPLY = ±15V, Unless Otherwise Specified (Continued) HCA10009 TEMP. (oC) MIN TYP MAX UNITS RL = 333Ω Full ±10 - - V RL = 1kΩ 25 ±12 ±12.5 - V RL = 1kΩ Full ±11.5 ±12.1 - V VOUT = ±10V Full ±30 ±56 - mA 25 - 10 - Ω Note 6 25 239 398 - kHz Slew Rate Notes 7, 11 Full 15 25 - V/µs Rise Time Notes 8, 11 Full - 13 20 ns Overshoot Notes 8, 11 Full - 28 50 % Settling Time (Note 9) 0.1% 25 - 0.4 - µs 0.01% 25 - 1.5 - µs VS = ±10V to ±20V Full 86 100 - dB Full - 8 11 mA/Op Amp PARAMETER TEST CONDITIONS OUTPUT CHARACTERISTICS Output Voltage Swing Output Current Output Resistance Full Power Bandwidth TRANSIENT RESPONSE (Note 10) POWER SUPPLY PSRR Supply Current NOTES: 3. Refer to typical performance curve in data sheet. 4. AVCL = 10, fO = 1kHz, VO = 5VRMS, RL = 600Ω, 10Hz to 100kHz, Minimum resolution of test equipment is 0.005%. 5. VOUT = 0 to ±10V, RL = 1kΩ, CL = 50pF. Slew Rate 6. Full Power Bandwidth is calculated by: FPBW = ---------------------------, V PEAK = 10V . 2πV PEAK 7. VOUT = ±2.5V, RL = 1kΩ, CL = 50pF. 8. VOUT = ±100mV, RL = 1kΩ, CL = 50pF. 9. Settling time is specified for a 10V step and AV = -1. 10. See Test Circuits. 11. Guaranteed by characterization. 4-3 HCA10009 Test Circuits and Waveforms VIN + VOUT - 1kΩ 50pF FIGURE 1. TRANSIENT RESPONSE TEST CIRCUIT 100mV 2.5V VIN 0V 0V -100mV -2.5V 2.5V 100mV VOUT 0V 0V -100mV -2.5V VOUT = 2.5V Vertical Scale = 2V/Div., Horizontal Scale = 200ns/Div. VOUT = ±100mV Vertical Scale = 100mV/Div., Horizontal Scale = 200ns/Div. FIGURE 2. LARGE SIGNAL RESPONSE FIGURE 3. SMALL SIGNAL RESPONSE VSETTLE 5K 5K 2K 2K VIN + VOUT NOTES: 12. AV = -1. 13. Feedback and summing resistors must be matched (0.1%). 14. HP5082-2810 clipping diodes recommended. 15. Tektronix P6201 FET probe used at settling point. FIGURE 4. SETTLING TIME TEST CIRCUIT 4-4 HCA10009 Application Information Operation at Various Supply Voltages Saturation Recovery The HCA10009 operates over a wide range of supply voltages with little variation in performance. The supplies may be varied from ±5V to ±15V. See Typical Performance Curves for variations in supply current, slew rate and output voltage swing. When an op amp is over driven, output devices can saturate and sometimes take a long time to recover. By clamping the input, output saturation can be avoided. If output saturation can not be avoided, the maximum recovery time when overdriven into the positive rail is 10.6µs. When driven into the negative rail the maximum recovery time is 3.8µs. Offset Adjustment The following diagram shows the offset voltage adjustment configuration for the HCA10009. By moving the potentiometer wiper towards pin 8 (+BAL), the op amps output voltage will increase; towards pin 1 (-BAL) decreases the output voltage. A 20kΩ trim pot will allow an offset voltage adjustment of about 10mV. Input Protection The HCA10009 has built in back-to-back protection diodes which limit the maximum allowable differential input voltage to approximately 5V. If the HCA10009 will be used in circuits where the maximum differential voltage may be exceeded, then current limiting resistors must be used. The input current should be limited to a maximum of 10mA. RLIMIT 2 +15V ∆VIN 7 RP 1 8 2 6 PC Board Layout Guidelines + 4 -15V Capacitive Loading Considerations When driving capacitive loads >80pF, a small resistor, 50Ω to 100Ω, should be connected in series with the output and inside the feedback loop. Typical Performance Curves When designing with the HCA10009, good high frequency (RF) techniques should be used when building a PC board. Use of ground plane is recommended. Power supply decoupling is very important. A 0.01µF to 0.1µF high quality ceramic capacitor at each power supply pin with a 2.2µF to 10µF tantalum close by will provide excellent decoupling. Chip capacitors produce the best results due to ease of placement next to the op amp and basically no lead inductance. If leaded capacitors are used, the leads should be kept as short as possible to minimize lead inductance. VS = ±15V, TA = 25oC 12 RL = 1K, CL = 50pF 9 AV = +1, RL = 1K, CL = 50pF GAIN 60 40 20 180 0 135 PHASE 90 45 0 1K 10K 100K 1M 10M PHASE MARGIN (DEGREES) GAIN (dB) 100 100M FREQUENCY (Hz) FIGURE 5. OPEN LOOP GAIN AND PHASE vs FREQUENCY 4-5 GAIN (dB) 120 80 VOUT + 3 6 3 GAIN 0 -3 -6 180 PHASE 135 90 45 10K 100K 1M 10M 0 100M FREQUENCY (Hz) FIGURE 6. CLOSED LOOP GAIN vs FREQUENCY PHASE MARGIN (DEGREES) 3 6 RLIMIT HCA10009 AV = -1, RL = 1K, CL = 50pF 6 3 GAIN 0 180 PHASE 135 90 45 0 10K 10M 1M 60 40 20 AV = -1000 RL = 1K, CL = 50pF AV = -100 AV = -10 0 AV = -10 AV = -100 135 90 AV = -1000 45 0 10K 100M 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 7. CLOSED LOOP GAIN vs FREQUENCY FIGURE 8. VARIOUS CLOSED LOOP GAINS vs FREQUENCY AV = +1, RL = 1K AV = +1, RL = 1K 100 80 80 PSRR (dB) 100 60 40 20 0 -PSRR 60 40 20 +PSRR 0 10K 100K 1M 10M 100M 10K 100K 1M 10M 100M FREQUENCY (Hz) FREQUENCY (Hz) FIGURE 9. CMRR vs FREQUENCY FIGURE 10. PSRR vs FREQUENCY 20 300 RL = 1K 18 250 16 OFFSET VOLTAGE (µV) OPEN LOOP GAIN (V/µV) 180 FREQUENCY (Hz) 120 CMRR (dB) 100K 80 PHASE MARGIN (DEGREES) 9 CLOSED LOOP GAIN (dB) VS = ±15V, TA = 25oC (Continued) PHASE MARGIN (DEGREES) GAIN (dB) Typical Performance Curves 14 12 10 8 6 4 200 150 100 50 0 -50 2 0 -60 -40 -20 0 20 40 60 80 100 TEMPERATURE (oC) FIGURE 11. OPEN LOOP GAIN vs TEMPERATURE 4-6 120 -100 -60 -40 -20 0 20 40 60 80 100 TEMPERATURE (oC) FIGURE 12. OFFSET VOLTAGE vs TEMPERATURE (4 REPRESENTATIVE UNITS) 120 HCA10009 Typical Performance Curves VS = ±15V, TA = 25oC (Continued) 14 RL = 600Ω PEAK OUTPUT VOLTAGE (V) 13.5 BIAS CURRENT (nA) 160 140 120 100 80 60 40 20 13 12.5 12 11.5 11 10.5 0 -20 -40 -60 10 -40 -20 0 20 40 60 80 100 -60 120 -40 -20 0 TEMPERATURE (oC) 20 40 60 80 100 120 TEMPERATURE (oC) FIGURE 13. BIAS CURRENT vs TEMPERATURE (4 REPRESENTATIVE UNITS) FIGURE 14. OUTPUT VOLTAGE SWING vs TEMPERATURE 70 AV = +1, RL = 1K, CL = 50pF 1.05 OFFSET VOLTAGE CHANGE (µV) SLEW RATE (NORMALIZED TO 1 AT 25oC) 1.1 1 0.95 0.9 0.85 0.8 -60 -40 -20 0 20 40 60 80 100 60 50 40 30 20 10 0 120 0 1 TEMPERATURE (oC) 2 3 4 5 TIME AFTER POWER UP (MINUTES) FIGURE 15. SLEW RATE vs TEMPERATURE FIGURE 16. OFFSET VOLTAGE WARM-UP DRIFT AV = +1, RL = 2K, CL = 50pF 34 32 +SLEW RATE 30 8.25 SLEW RATE (V/µs) SUPPLY CURRENT PER AMPLIFIER (mA) 36 8.5 8 28 26 24 -SLEW RATE 22 20 18 16 7.75 14 12 7.5 10 5 7 9 11 13 15 17 SUPPLY VOLTAGE (±V) FIGURE 17. SUPPLY CURRENT vs SUPPLY VOLTAGE 4-7 5 7 9 11 13 15 SUPPLY VOLTAGE (±V) FIGURE 18. SLEW RATE vs SUPPLY VOLTAGE 17 HCA10009 Typical Performance Curves VS = ±15V, TA = 25oC (Continued) 15 10 5 16 24 14 21 12 18 10 15 8 12 6 9 VOLTAGE NOISE 2 CURRENT NOISE 3 0 1K 10K 0 0 5 7 9 11 13 SUPPLY VOLTAGE (±V) 15 1 17 10 OFFSET CURRENT (nA) FIGURE 20. NOISE CHARACTERISTICS CMRR AND PSRR (dB) -40 -20 0 20 40 60 80 100 120 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 -60 +PSRR -PSRR CMRR -40 -20 TEMPERATURE (oC) 45 60 80 100 120 130 80 BANDWIDTH 30 60 25 40 20 20 15 0 100 1000 LOAD CAPACITANCE (pF) FIGURE 23. BANDWIDTH AND PHASE MARGIN vs LOAD CAPACITANCE OUTPUT CURRENT (mA) 35 PHASE MARGIN (DEGREE) BANDWIDTH (MHz) 100 4-8 40 AV = +1, RL = 1K 40 10 20 FIGURE 22. CMRR AND PSRR vs TEMPERATURE 120 1 0 TEMPERATURE (oC) FIGURE 21. OFFSET CURRENT vs TEMPERATURE (4 REPRESENTATIVE UNITS) PHASE MARGIN 100 FREQUENCY (Hz) FIGURE 19. OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE 100 90 80 70 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -60 6 4 CURRENT NOISE (pA/√Hz) RL = 600Ω VOLTAGE NOISE (nV/√Hz) PEAK OUTPUT VOLTAGE SWING (V) 20 110 90 70 50 0 1 2 3 4 TIME AFTER SHORT CIRCUIT (MINUTES) FIGURE 24. SHORT CIRCUIT OUTPUT CURRENT vs TIME 5 HCA10009 Typical Performance Curves VS = ±15V, TA = 25oC (Continued) Vertical Scale = 1mV/Div.; Horizontal Scale = 1s/Div. AV = +25,000; EN = 0.168µVP-P RTI Vertical Scale = 10mV/Div.; Horizontal Scale = 1s/Div. AV = +25,000; EN = 1.5µVP-P RTI FIGURE 25. 0.1Hz TO 10Hz NOISE 18 18 AV = +1, RL = 1K, CL = 15pF, THD ≤ 0.01% PEAK OUTPUT VOLTAGE (V) VS = ±18 14 12 VS = ±15 10 8 6 VS = ±10 4 2 VS = ±5 0 10K AV = +1, THD ≤ 0.01%, f = 1kHz 16 14 VS = ±18 VS = ±15 12 10 VS = ±10 8 6 4 VS = ±5 2 100K 1M 0 10 10M 100 FIGURE 27. OUTPUT VOLTAGE SWING vs FREQUENCY 10K FIGURE 28. OUTPUT VOLTAGE SWING vs LOAD RESISTANCE 10 9.5 9 8.5 8 7.5 7 6.5 6 -60 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (oC) FIGURE 29. SUPPLY CURRENT/AMPLIFIER vs TEMPERATURE 4-9 1K LOAD RESISTANCE (Ω) FREQUENCY (Hz) SUPPLY CURRENT PER AMPLIFIER (mA) PEAK OUTPUT VOLTAGE (V) 16 FIGURE 26. 0.1Hz TO 1MHz HCA10009 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- e α A1 B 0.25(0.010) M C C A M B S NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e 0.10(0.004) MILLIMETERS MIN H 0.050 BSC 1.27 BSC - 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α 8 0o 8 7 8o Rev. 0 12/93 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 4-10 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029