HD49338NP/HNP CDS/PGA & 12-bit A/D Converter REJ03F0113-0200 Rev.2.00 May 20, 2005 Description The HD49338NP/HNP is a CMOS IC that provides CDS-PGA analog processing (CDS/PGA) suitable for CCD camera digital signal processing systems together with a 12-bit A/D converter in a single chip. Functions • • • • • • • Correlated double sampling PGA Offset compensation Serial interface control 12-bit ADC Operates using only the 3 V voltage Corresponds to switching mode of power dissipation and operating frequency Power dissipation: 150 mW (Typ), maximum frequency: 36 MHz Power dissipation: 100 mW (Typ), maximum frequency: 25 MHz • ADC direct input mode • Y-IN direct input mode • QFP 48-pin package Features • Suppresses low-frequency noise output from CCD by the S/H type correlated double sampling. • The S/H response frequency characteristics for the reference level can be adjusted using values of external parts and registers. • High sensitivity is achieved due to the high S/N ratio and a wide coverage provided by a PG amplifier. • Feedback is used to compensate and reduce the DC offsets including the output DC offset due to PGA gain change and the CCD offset in the CDS (correlated double sampling) amplifier input. • PGA, standby mode, etc., is achieved via a serial interface. • High precision is provided by a 12-bit-resolution A/D converter. Rev.2.00 May 20, 2005 page 1 of 22 HD49338NP/HNP ADCIN AVSS Y IN AVDD BIAS BLKC CDSIN BLKFB BLKSH AVDD AVSS AVSS Pin Arrangement 36 35 34 33 32 31 30 29 28 27 26 25 37 24 23 38 39 22 40 21 41 20 42 19 43 18 44 17 45 16 46 15 47 14 48 13 1 2 3 4 5 6 7 8 9 10 11 12 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK (Top view) Pin Description I/O Analog(A) or Digital(D) Digital output (LSB) Digital output O O D D D11 DRDVDD Digital output (MSB) Output buffer power supply (3 V) O — D D 14 15 DVSS DVSS Digital ground (0 V) Digital ground (0 V) — — D D 16 17 ADCLK DVDD ADC conversion clock input pin Digital power supply (3 V) I — D D 18 19 DVDD PBLK Digital power supply (3 V) Preblanking input pin — I D D 20 21 OBP SPBLK Optical black pulse input pin Black level sampling clock input pin I I D D 22 23 SPSIG NC Signal level sampling clock input pin No connection pin I — D — 24 25 DVDD AVSS Output power supply (3 V) Analog ground (0 V) — — D A 26 27 AVSS AVDD Analog ground (0 V) Analog power supply (3 V) — — A A 28 29 BLKSH BLKFB Black level S/H pin Black level FB pin — — A A 30 31 CDSIN BLKC CDS input pin Black level C pin I — A A 32 BIAS Internal bias pin Connect a 33 kΩ resistor between BIAS and AVSS. — A Pin No. Symbol 1 2 to 11 D0 D1 to D10 12 13 Description Rev.2.00 May 20, 2005 page 2 of 22 HD49338NP/HNP Pin Description (cont.) Pin No. Symbol Description I/O Analog(A) or Digital(D) 33 34 AVDD Y IN Analog power supply (3 V) Y input pin — — A A 35 36 AVSS ADCIN Analog ground (0 V) ADC input pin — — A A 37 VRM — A 38 VRT Reference voltage pin 1 Connect a 0.1 µF ceramic capacitor between VRM and AVSS. Reference voltage pin 3 Connect a 0.1 µF ceramic capacitor between VRT and AVSS. — A 39 VRB — A 40 DVDD Reference voltage pin 2 Connect a 0.1 µF ceramic capacitor between VRB and AVSS. Digital power supply (3 V) — D 41 42 DVSS 1 OEB * Digital ground (0 V) Digital output enable pin — — D D 43 44 DVDD DVDD Digital power supply (3 V) Digital power supply (3 V) — — D D 45 46 DVSS CS Digital ground (0 V) Serial interface control input pin — I D D 47 48 SDATA SCK Serial data input pin Serial clock input pin I I D D Note: 1. With pull-down resistor. Rev.2.00 May 20, 2005 page 3 of 22 HD49338NP/HNP Input/Output Equivalent Circuit Digital output Pin Name D0 to D11 Equivalent Circuit DVDD DIN Digital output STBY Digital input DVDD ADCLK, OBP, SPBLK, SPSIG, CS, SCK, SDATA, PBLK, OEB Digital input *1 Note: Only OEB is pulled down to about 70 kΩ. Analog CDSIN Internally connected to VRT AVDD CDSIN ADCIN AVDD Internally connected to VRM ADCIN Y IN AVDD Y IN + − BLKSH, BLKFB AVDD + − BLKFB VRT, VRM, VRB VRT VRM + − VRB AVDD + − BIAS AVDD BIAS Rev.2.00 May 20, 2005 page 4 of 22 BLKSH HD49338NP/HNP 16 18 19 DVSS AVSS DRDVDD DVDD AVDD SPSIG SPBLK ADCLK Block Diagram 31 16 18 19 19 42 OEB ADCIN 27 Y IN 26 Timing generator 11 D11 10 D10 PBLK 26 BLKSH 28 CDS 9 D9 12 bit ADC PGA Output latch circuit CDSIN 26 BLKC 28 BLKFB 29 DC offset compensation circuit Serial interface Bias generator 8 D8 7 D7 6 D6 5 D5 4 D4 3 D3 2 D2 D1 SCK BIAS VRT Rev.2.00 May 20, 2005 page 5 of 22 VRB 32 34 33 VRM 35 CS 44 45 43 SDATA 17 OBP D0 HD49338NP/HNP Internal Functions Functional Description • CDS input CCD low-frequency noise is suppressed by CDS (correlated double sampling). The signal level is clamped at 56 LSB to 304 LSB by resister during the OB period. Gain can be adjusted using 10 bits of register (0.033 dB steps) within the range from –2.36 dB to 31.40 dB. *1 • ADC input The center level of the input signal is clamped at 2048 LSB (Typ). Gain can be adjusted using 10 bits of register (0.00446 times steps) within the range from 0.57 times (–4.86 dB) to 5.14 times (14.22 dB). *1 • Y-IN input The input signal is clamped at 280 LSB (Typ) by SYNC Tip clamp. • Automatic offset calibration of PGA and ADC • DC offset compensation feedback for CCD and CDS • Pre-blanking CDS input operation is protected by separating it from the large input signal. Digital output is fixed at 32 LSB. • Digital output enable function Note: 1. Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Operating Description Figure 1 shows CDS/PGA + ADC function block. ADCIN PG AMP CDS AMP C2 CDSIN SH AMP C1 Gain setting (register) Current DAC VRT BLKFB BLKSH D0 to D11 12-bit ADC DAC Offset calibration logic Clamp data (register) DC offset feedback logic BLKC C4 OBP C3 Figure 1 HD49338NP/HNP Functional Block Diagram 1. CDS (Correlated Double Sampling) Circuit The CDS circuit extracts the voltage differential between the black level and a signal including the black level. The black level is directly sampled at C1 by using the SPBLK pulse, buffered by the SHAMP, then provided to the CDSAMP. The signal level is directly sampled at C2 by using the SPSIG pulse, and provided to CDSAMP (see figure 1). The difference between these two signal levels is extracted by the CDSAMP, which also operates as a programmable gain amplifier at the previous stage. The CDS input is biased with VRT (2 V) during the SPBLK pulse validation period. During the PBLK period, the above sampling and bias operation are paused. 2. PGA Circuit The PGAMP is the programmable gain amplifier for the latter stage. The PGAMP and the CDSAMP set the gain using 10 bits of register. The equation below shows how the gain changes when register value N is from 0 to 1023. In CDSIN mode: Gain = (–2.36 dB + 0.033 dB) × N (LOG linear). In ADCIN mode: Gain = (0.57 times + 0.00446 times) × N (linear). Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Rev.2.00 May 20, 2005 page 6 of 22 HD49338NP/HNP 3. Automatic Offset Calibration Function and Black-Level Clamp Data Setting The DAC DC voltage added to the output of the PGAMP is adjusted by automatic offset calibration. The data, which cancels the output offset of the PGAMP and the input offset of the ADC, and the clamp data (56 LSB to 304 LSB) set by register are added and input to the DAC. The automatic offset calibration starts automatically after the RESET mode set by register 1 is cancelled and terminates after 40000 clock cycles (when fclk = 20 MHz, 2 ms). 4. DC Offset Compensation Feedback Function Feedback is done to set the black signal level input during the OB period to the DC standard, and all offsets (including the CCD offset and the CDSAMP offset) are compensated for. The offset from the ADC output is calculated during the OB period, and SHAMP feedback capacitor C3 is charged by the current DAC (see figure 1). The open-loop differential gain (∆Gain/∆H) per 1 H of the feedback loop is given by the following equation. 1H is the one cycle of the OBP. ∆Gain/∆H = 0.078/(fclk × C3) (fclk: ADCLK frequency, C3: SHAMP external feedback capacitor) Example: When fclk = 20 MHz and C3 = 1.0 µF, ∆Gain/∆H = 0.0039 When the PGAMP gain setting is changed, the high-speed lead-in operation state is entered, and the feedback loop gain is increased by a multiple of N. Loop gain multiplication factor N can be selected from 2 times, 4 times, 8 times, or 16 times by changing the register settings (see table 1). Note that the open-loop differential gain (∆Gain/∆H) must be one or lower. If it is two or more, oscillation occurs. The time from the termination of high-speed lead-in operation to the return of normal loop gain operation can be selected from 1 H, 2 H, 4 H, or 8 H. If the offset error is over 64 LSB, the high-speed lead-in operation continues, and when the offset error is 64 LSB or less, the operation returns to the normal loop-gain operation after 1 H, 2 H, 4 H, or 8 H depending on the register settings. See table 2. Table 1 Loop Gain Multiplication Factor during High-Speed Lead-In Operation HGain-Nsel (register settings) [0] [1] L L H L L H H H Multiplication Factor N 4 8 16 32 Table 2 High-Speed Lead-In Operation Cancellation Time HGstop-Hsel (register settings) [0] [1] L L H L L H H H Cancellation Time 1H 2H 4H 8H 5. Pre-Blanking Function During the PBLK input period, the CSD input operation is separated and protected from the large input signal. The ADC digital output is fixed to clamp data (56 to 304 LSB). Rev.2.00 May 20, 2005 page 7 of 22 HD49338NP/HNP PBLK MINV LINV TEST1 TEST0 OEB STBY 6. ADC Digital Output Control Function The ADC digital output includes the functions output enable, code conversion, and test mode. Tables 3, 4 and 5 show the output functions and the codes. Table 3 ADC Digital Output Functions ADC Digital Output D11 D10 D9 D8 D7 D6 D5 D4 D3 H X X X X X X Hi-Z L H X X X X X Hi-Z L L L L L H Same as in table 4. L H H D11 is inverted in table 4. H L H D10 to D0 are inverted in table 4. H H H D11 to D0 are inverted in table 4. X X L Output code is set up to Clamp Level. H L L H Same as in table 5. L H H D11 is inverted in table 5. H L H D10 to D0 are inverted in table 5. H H H D11 to D0 are inverted in table 5. X X L Output code is set up to Clamp Level. H L H L H L H L H H X L L X L L H L H L H L H L H X H H L H L H L H L H L X L H L H L H L H L H H X Notes: 1. STBY, TEST, LINV, and MINV are set by register. 2. Mode setting for the OEB and the PBLK are done by external input pins. 3. The polarity of the PBLK pin when the register setting is SPinv is low. Table 4 D1 D0 Operating Mode Low-power wait state Output Hi-Z Normal operation Pre-blanking Normal operation L L H H H H L L L L H H Pre-blanking Test mode ADC Output Code Output Pin Output Steps codes Table 5 D2 D11 L L L L L L L D10 L L L L L L L D9 L L L L L L L D8 L L L L L L L D7 L L L L L L L D6 L L L L L L L D5 L L L L L L L D4 L L L L L L L D3 L L L L L L L D2 L L L L H H H D1 L L H H L L H D0 L H L H L H L 2047 2048 L H H L H L H L H L H L H L H L H L H L H L H L 4092 4093 4094 4095 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H L L H H L H L H 0 1 2 3 4 5 6 ADC Output Code (TEST1) Output Pin Output Steps codes D11 L L L L L L L D10 L L L L L L L D9 L L L L L L L D8 L L L L L L L D7 L L L L L L L D6 L L L L L L L D5 L L L L L L L D4 L L L L L L L D3 L L L L L L L D2 L L L L H H H D1 L L H H H H L D0 L H H L L H H 2047 2048 L H H H L L L L L L L L L L L L L L L L L L L L 4092 4093 4094 4095 H H H H L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L H H L L L H H L 0 1 2 3 4 5 6 Rev.2.00 May 20, 2005 page 8 of 22 HD49338NP/HNP 7. Adjustment of Black-Level S/H Response Frequency Characteristics The CR time constant that is used for sampling/hold (S/H) at the black level can be adjusted by changing the register settings, as shown in table 6. Table 6 SHSW CR Time Constant Setting SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L L H L L L L H L L H H L L L L H L H L H L L H H L H H H L 2.20 nsec 2.30 nsec 2.51 nsec 2.64 nsec 2.93 nsec 3.11 nsec 3.52 nsec 3.77 nsec CR Time Constant (Typ) (cutoff frequency conversion) (72 MHz) (69 MHz) (63 MHz) (60 MHz) (54 MHz) (51 MHz) (45 MHz) (42 MHz) SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L H H L L H L H L H H H L H L L H H H L H H L H H H H H H H 4.40 nsec 4.80 nsec 5.87 nsec 6.60 nsec 8.80 nsec 10.6 nsec 17.6 nsec 26.4 nsec CR Time Constant (Typ) (cutoff frequency conversion) (36 MHz) (33 MHz) (27 MHz) (24 MHz) (18 MHz) (15 MHz) (9 MHz) (6 MHz) 8. The SHAMP frequency characteristics can be adjusted by changing the register settings and the C4 value of the external 31st pin. The settings are shown in table 7. Values other than those shown in the table 7 cannot be used. Table 7 BLKC 31 C4 SHAMP Frequency Characteristics Setting LoPwr (Register setting) "Lo" [0] H [1] L SHA-fsel (Register setting) [0] [1] L H 75 MHz 13000 pF (300 pF) 32 MHz 22000 pF (750 pF) 116 MHz 10000 pF (270 pF) 49 MHz "Hi" 15000 pF (620 pF) Note: Upper line : SHAMP cutoff frequency (Typ) Middle line : Standard value of C4 (maximum value is not defined) Lower line : Minimum value of C4 (do not set below this value) Rev.2.00 May 20, 2005 page 9 of 22 [0] H [1] H 56 MHz 18000 pF (360 pF) 24 MHz 27000 pF (820 pF) HD49338NP/HNP Timing Chart Figure 2 shows the timing chart when CDSIN and ADCIN input modes are used. 0 1 2 ~ 11 12 13 • When CDSIN input mode is used N CDSIN N+1 N+2 N+11 N+12 N+13 SPBLK SPSIG ADCLK D0 to D11 N−12 N−11 N−10 N−1 N • When ADCIN input mode is used N+1 N ADCIN N+13 N+12 N+2 N+11 N+10 ADCLK D0 to D11 N−11 N−10 N−1 N N+1 Note: The phases of SPBLK and SPSIG are those when the serial data SPinv bit is set to low. Figure 2 Output Timing Chart when CDSIN and ADCIN Input Modes are Used • The ADC output (D0 to D11) is output at the rising edge of the ADCLK in both modes. • Pipe-line delay is twelve clock cycles when CDSIN is used and eleven when ADCIN is used. • In ADCIN input mode, the input signal is sampled at the rising edge of the ADCLK. Rev.2.00 May 20, 2005 page 10 of 22 HD49338NP/HNP Detailed Timing Specifications Detailed Timing Specifications when CDSIN Input Mode is Used Figure 3 shows the detailed timing specifications when the CDSIN input mode is used, and table 8 shows each timing specification. Black level Signal level CDSIN (2) (3) (1) SPBLK Vth (5) (4) SPSIG Vth (6) (7) (8) ADCLK Vth (9) (10) D0 to D11 Note: 1. When serial data Spinv bit is set to low. (When the Spinv bit is set to high, the polarities of the SPBLK and the SPSIG are inverted.) Figure 3 Detailed Timing Chart when CDSIN Input Mode is Used Table 8 Timing Specifications when the CDSIN Input Mode is Used No. Timing Min Typ Max Unit (1) (2) Black-level signal fetch time 1 SPBLK low period * tCDS1 tCDS2 — Typ × 0.8 (1.5) 1/4fCLK — Typ × 1.2 ns ns (3) (4) Signal-level fetch time 1 SPSIG low period * tCDS3 tCDS4 — Typ × 0.8 (1.5) 1/4fCLK — Typ × 1.2 ns ns (5) (6) SPBLK rising to SPSIG rising time * 1 SPBLK rising to ADCLK rising inhibition time * tCDS5 tCDS6 Typ × 0.85 1 1/2fCLK × 0.90 5 Typ × 1.00 9 ns ns (7), (8) (9) ADCLK tWH min./tWL min. ADCLK rising to digital output hold time tCDS7, 8 tCHLD9 11 3 — 7 — — ns ns (10) ADCLK rising to digital output delay time tCOD10 — 16 24 ns Note: Symbol 1 1. SPBLK and SPSIG polarities when serial data Spinv bit is set to low. OBP Detailed Timing Specifications Figure 4 shows the OBP detailed timing specifications. The OB period is from the fifth to the twelfth clock cycle after the OB pulse is input. The average of the black signal level is taken for eight input cycles during the OB period and becomes the clamp level (DC standard). OB period *1 CDSIN N N+1 N+5 N+12 N+13 OBP OB pulse > 2 clock cycles This edge is used, when OBP pulse-width period is clamp-on. When serial data OBPinv bit is set to low (When the OBPinv is set to high, the polarity of the OBP is inverted.) Note: 1. Shifts ±1 clock cycle depending on the OBP input timing. Figure 4 OBP Detailed Timing Specifications Rev.2.00 May 20, 2005 page 11 of 22 HD49338NP/HNP Detailed Timing Specifications at Pre-Blanking Figure 5 shows the pre-blanking detailed timing specifications. PBLK Vth VOH Digital output (D0 to D11) ADC data ADC data Clamp level VOL ADCLK × 12 clocks (shifts one clock cycle depending on the PBLK input timing) When serial data SPinv bit is set to low (When the SPinv is set to high, the PBLK polarity is inverted.) tPBLK ADCLK × 2 clocks Figure 5 Detailed Timing Specifications at Pre-Blanking Detailed Timing Specifications when ADCIN Input Mode is Used Figure 6 shows the detailed timing chart when ADCIN input mode is used, and table 9 shows each timing specification. ADCIN (1) (2) (3) ADCLK Vth (4) (5) D0 to D11 VDD/2 Figure 6 Detailed Timing Chart when ADCIN Input Mode is Used Table 9 No. (1) Timing Specifications when ADCIN Input Mode is Used Signal fetch time Timing Symbol tADC1 (2), (3) (4) ADCLK tWH min./tWL min. ADCLK rising to digital output hold time tADC2, 3 tAHLD4 (5) ADCLK rising to digital output delay time tAOD5 Min — Typ (6) Max — Unit ns Typ × 0.85 10 1/2fADCLK 14.5 Typ × 1.15 — ns ns — 23.5 31.5 ns Detailed Timing Specifications for Digital Output-Enable Control Figure 7 shows the detailed timing specifications for digital output enable control. When the OEB pin is set to high, output disable mode is entered, and the output state becomes High-Z. tLZ, tZL measurement load DVDD OEB Vth DVDD 2 kΩ DVDD/2 Digital output (D0 to D11) tLZ tZL 10 pF VOL DVSS VOH tHZ, tZH measurement load DVDD/2 tHZ tZH 10 pF DVSS DVSS Figure 7 Detailed Timing Specifications for Digital Output Enable Control Rev.2.00 May 20, 2005 page 12 of 22 2 kΩ DVSS HD49338NP/HNP Serial Interface Specifications Table 10 Serial Data Function List Resister 0 Resister 1 Resister 2 Resister 3 Resister 4 to 7 Test Mode (can not be used) DI 00 (LSB) Low High Low High Low to High DI 01 Low Low High High Low to High DI 02 Low Low Low Low High DI 03 PGA gain setting (LSB) *5 SLP Low: Normal operation mode Clamp-level [0] (LSB) High: Sleep mode DI 04 PGA gain setting *5 STBY Low: Normal operation mode Clamp-level [1] High: Standby mode DI 05 PGA gain setting *5 Output mode setting (LINV) Clamp-level [2] Gray code [1] DI 06 PGA gain setting *5 Output mode setting (MINV) Clamp-level [3] Average4, 4 lines average DI 07 PGA gain setting *5 Output mode setting (TEST0) Clamp-level [4] (MSB) DI 08 PGA gain setting *5 SHA-fsel [0] (LSB) DI 09 PGA gain setting *5 SHA-fsel [1] (MSB) DI 10 PGA gain setting *5 DI 11 DI 12 DI 13 DI 14 SHAMP frequency HGstop-Hsel [0] characteristics HGstop-Hsel [1] switching YC-Bias off Gray code [0] (TEST1) Gray_test [0] High-speed Gray_test [1] lead-in cancellation Gray_test [2] time Cannot be used. *7 All low HGain-Nsel [0] High-speed lead-in SHSW gain PGA gain setting *5 SHSW-fsel [1] frequency HGain-Nsel [1] multiplication characteristics PGA gain setting (MSB) *5 SHSW-fsel [2] LoPwr Low: Normal mode High: Low power mode switching SPinv, SHSW-fsel [3] (MSB) X SPSIG/SPBLK/PBLK inversion Cannot be used. *8 Low YSEL Low: CDSIN input mode High: YIN input mode Cannot be used. *8 Low DI 15 (MSB) CSEL Low: CDSIN input mode High: YIN input mode CS SHSW-fsel [0] (LSB) Cannot be used. *7 All low Cannot be used. *8 High Cannot be used. *8 Low RESET Low: Reset mode Cannot be used. *8 High High: Normal operation mode Data is determined at CS rising edge Latches SDATA at SCK rising edge tINT1 OBPinv, OBP inversion Cannot be used. *8 Low fSCK tINT2 SCK tsu SDATA tho DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI DI 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 Figure 8 Serial Interface Timing Specifications 2 byte continuous communications. SDATA is latched at SCK rising edge. Insert 16 clocks of SCK while CS is low. Data is invalid if data transmission is aborted during transmission. The gain conversion table differs in the CDSIN input mode and the ADCIN input mode. STBY: Reference voltage generator circuit is in the operating state. SLP: All circuits are in the sleep state. 7. This bit is used for the IC testing, and cannot be used by the user. Please do not set up in addition to "ALL Low". 8. This bit is used for the IC testing, and cannot be used by the user. It is set to the state on the right of a column when RESET bit is set to low. The register 3 should transmit by setup on the right of a column. Notes: 1. 2. 3. 4. 5. 6. Rev.2.00 May 20, 2005 page 13 of 22 Timing Specifications Min Max fSCK 5 MHz tINT1, 2 50 ns tsu 50 ns 50 ns tho HD49338NP/HNP Explanation of Serial Data of CDS Part Serial data of CDS part has the following functions. • PGA gain (D5 to D12 of register 0) Details are referred to page 6 block diagram. At CDS_in mode: –2.36 dB + 0.132 dB × N (Log linear) At ADC_in mode: 0.57 times + 0.01784 times × N (Times linear) ∗: Full-scale digital output is defined as 0 dB when 1 V is input. Above PGA gain definition means input signal 1 Vp-p to CDS_in, and set N = 18 (correspond 2.36 dB), and then PGA outputs the 2 V full-range, and also ADC out puts the full code (1023). This mean offset gain of PGA has 6 dB – 2.36 dB = 3.64 dB, therefore it should be decided that how much dB add on. (1.0 V) (2.0 V) (1023) (1.0 V) CDS PGA ADC 0 dB when set N = 18 which correspond to 2.36 dB (1) Level dia explain 2V CDS PGA 1023 ADC (CDS = 0 dB) 3.64 dB + 0.132 dB × N (2) Level dia on the circuit Figure 9 Level Dia of PGA • CSEL (D15 of register 0) Data = 0: Select CDSIN Data = 1: Select ADCIN 0 1 STD1[7:0] (L) STD2[15:8] (H) D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 SLP 0 STBY Address 1 0 LINV 1 MINV 1 test0 1 test_I2 SHSW_fsel SHA_fsel • SLP and STBY (D3, D4 of register 1) SLP: Stop the all circuit. Consumption current of CDS part is less than 10 µA. Start up from offset calibration when recover is needed. STBY: Only the standard voltage generating circuit is operated. Consumption current of CDS part is about 3 mA. Allow 50 H time for feedback clamp is stabilized until recover. • Output mode (D5 to D7 of register 1 and D4 of register 3) It is a test mode. Combination details are table 3 to 5. Normally set to all 0. • SHA-fsel (D8 to D9 of register 1) It is a LPF switching of SH amplifier. Frequency characteristics are referred to page 9. To get rough idea, set the double cut off frequency point with using. • SHSW-fsel (D10 to D13 of register 1) It is a time constant which sampling the black level of SH amplifier. Frequency characteristics are referred to page 9. To get rough idea, set the double cut off frequency point with using. S/N changes by this data, so find the appropriate point with set data to up/down. Rev.2.00 May 20, 2005 page 14 of 22 HD49338NP/HNP • Clamp (D3 to D7 of register 2) Determine the OB part level with digital code of ADC output. Clamp level = setting data × 2 + 14 Default data is 9 = 32 LSB. • HGstop-Hsel, HGain-Nsel (D8 to D11 of register 2) Determine the lead-in speed of OB clamp. Details are referred to page 7. PGA gain need to be changed for switch the high speed leading mode. Transfer the gain +1/–1 to previous field, its switch to high speed leading mode. • Low_PWR (D12 of register 2) Switch circuit current and frequency characteristic. Data = 0: 36 MHz guarantee Data = 1: 25 MHz guarantee • SPinv (D13 of register 2) SPSIG/SPBLK/PBLK input signal inverted switching. Data = 1: Normal Data = 0: Inverted • Reset (D15 of register 2) Software reset. Data = 1: Normal Data = 0: Reset Offset calibration should be done when starting up with using this bit. Details are referred to page 19. • C_Bias_off (D3 of register 3) Center bias is turned off in ADCIN mode. Data = 0: Normally on Data = 1: Off • Ave_4H (D6 of register 3) Clamp detection data is averaged 4H. Data = 0: 1H Data = 1: Averaged 4H Differential Code and Gray Code (D4 to D5 and D7 to D9 of register 3) • Gray code (D4 to D5 of register 3) DC output code can be change to following type. Gray Code [1] 0 0 1 1 Gray Code [0] 0 1 0 1 Output Code Binary code Gray code Differential encoded binary Differential encoded gray • Serial data setting items (D7 to D9 of register 3) Setting Bit Gray_test[0] Gray_test[1] Gray_test[2] Setting Contents Standard data output timing control signal (Refer to the following table) ADCLK polar with OBP. (Lo→Positive edge, HI→Negative edge) • Standard data output timing Gray_test[1] Low Low High High Gray_test[0] Low High Low High Rev.2.00 May 20, 2005 page 15 of 22 Standard Data Output Timing Third and fourth Fourth and fifth Fifth and sixth Sixth and seventh HD49338NP/HNP Ripple (pseudo outline made by quantized error) occurres on the point which swithing the ADC output multiple bit in parallel. When switching the several of ADC output at the same time, ripple (pseudo outline caused by miss quantization) occurs to the image. Differential code and gray code are recommended for this countermeasure. Figure 10 indicates circuit block. When luminance signal changes are smoothly, the number of bit of switching digital output bit can be reduced and easily to reduce the ripple using this function. This function is especially effective for longer the settings of sensor more than clk = 30 kHz, and ADC output. Figure 11 indicates the timing specifications. 10 Differential SW(D5) ADC + − 2clk_DL Carry bit round Standard data control signal (D9,D8,D7) Gray SW(D4) Standard data selector 10-bit output Gray→Binary conversion Figure 10 Differential Code, Gray Code Circuit (In case of select the positive edge of ADCLK with D8) ADCLK OBP (In case of select the positive polar) (Beginning edge of OBP and standard edge of ADCLK should be exept ±5 ns) 1 Digital output Differential data 2 3 4 Standard data 5 6 7 8 9 10 Differential data Figure 11 Differential Code Timing Specifications To use differential code, complex circuit is necessary at DSP side. From ADC Gray → Binary D9 Carry bit round Standard data control signal Standard data selector 2clk_DL (1) Differential coded D8 D9 D8 D7 D7 D0 D0 (2) Gray → Binary conversion Figure 12 Complex Circuit Example Rev.2.00 May 20, 2005 page 16 of 22 11 HD49338NP/HNP Absolute Maximum Ratings (Ta = 25°C) Item Power supply voltage Symbol VDD(max) Ratings 4.1 Unit V Analog input voltage Digital input voltage VIN(max) VI(max) –0.3 to AVDD +0.3 –0.3 to DVDD +0.3 V V Operating temperature Power dissipation Topr Pt(max) –10 to +75 400 °C mW Storage temperature Power supply voltage range (HD49338HNP) Tstg Vopr –55 to +125 2.85 to 3.3 °C V Power supply voltage range (HD49338NP) 2.70 to 3.3 Notes: 1. VDD indicates AVDD and DVDD. 2. AVDD and DVDD must be commonly connected outside the IC. When they are separated by a noise filter, the potential difference must be 0.3 V or less at power on, and 0.1 V or less during operation. Electrical Characteristics (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items Common to CDSIN and ADCIN Input Modes Symbol Min Typ Max Unit Power supply voltage range Item VDD 2.85 3.00 3.30 V LoPwr = low Conversion frequency fCLK low 5.5 — 25 MHz LoPwr = high — 36 MHz LoPwr = low VIH 25 DVDD 2.0 × 3.0 — DVDD V VIL 0 — DVDD 0.8 × 3.0 V Digital input pins other than CS, SCK and SDATA VIH2 DVDD 2.25 × 3.0 — DVDD V CS, SCK, SDATA VIL2 0 — DVDD 0.6 × 3.0 V VOH DVDD –0.5 — — V IOH = –1 mA VOL — — 0.5 V IOL = +1 mA IIH — — 50 µA VIH = 3.0 V IIH2 — — 250 µA VIH = 3.0 V IIL fCLK hi Digital input voltage Digital output voltage Digital input current Digital output current ADC resolution Test Conditions –50 — — µA VIL = 0 V IOZH — — 50 µA VOH = VDD IOZL –50 — — µA VOL = 0 V RES 12 12 12 bit Remarks ADC integral linearity INL — (8) — LSBp-p fCLK = 20 MHz ADC differential linearity+ DNL+ — 0.6 0.95 LSB fCLK = 20 MHz *1 ADC differential linearity– DNL– –0.95 –0.6 — LSB fCLK = 20 MHz *1 Sleep current ISLP –100 0 100 µA Digital input pin is set to 0 V, output pin is open Standby current ISTBY — 3 5 mA Digital I/O pin is set to 0 V Digital output Hi-Z delay time tHZ — — 100 ns tLZ — — 100 ns RL = 2 kΩ, CL = 10 pF tZH — — 100 ns tZL — — 100 ns Notes: 1. Differential linearity is the calculated difference in linearity errors between adjacent codes. 2. Values within parentheses ( ) are for reference. Rev.2.00 May 20, 2005 page 17 of 22 See figure 7 HD49338NP/HNP Electrical Characteristics (cont.) (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items for CDSIN Input Mode Min Typ Max Unit Consumption current (1) Item IDD1 — 57 68 mA LoPwr = low fCLK = 36 MHz Consumption current (2) IDD2 — 37 46 mA LoPwr = high fCLK = 250 MHz CCD offset tolerance range VCCD (–100) — (100) mV Timing specifications (1) tCDS1 — (1.5) — ns Timing specifications (2) tCDS2 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (3) tCDS3 — (1.5) — ns Timing specifications (4) tCDS4 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (5) tCDS5 Typ × 0.85 1/2fCLK × 0.90 Typ × 1.00 ns Timing specifications (6) tCDS6 1 5 9 ns Timing specifications (7) tCDS7 11 — — ns Timing specifications (8) tCDS8 11 — — ns Timing specifications (9) tCHLD9 3 7 — ns Timing specifications (10) tCOD10 — 16 24 ns Clamp level CLP(00) — (56) — LSB CLP(09) — (128) — LSB CLP(31) — (304) — LSB AGC(0) –4.4 –2.4 –0.4 dB AGC(256) 4.1 6.1 8.1 dB AGC(512) 12.5 14.5 16.5 dB AGC(768) 21.0 23.0 25.0 dB AGC(1023) 29.4 31.4 33.4 dB PGA gain at CDS input Symbol Test Conditions Remarks See table 8 CL = 10 pF Note : Values within parentheses ( ) are for reference. • Items for ADCIN Input Mode Min Typ Max Unit Consumption current (3) Item IDD3 Symbol — 39 49 mA LoPwr = low fCLK = 36 MHz Consumption current (4) IDD4 — 21 26 mA LoPwr = high fCLK = 20 MHz Timing specifications (11) tADC1 — (6) — ns Timing specifications (12) tADC2 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (13) tADC3 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (14) tAHLD4 — 14.5 — ns Timing specifications (15) tAOD5 — 23.5 31.5 ns Input current at ADC input IINCIN –110 — 110 µA Clamp level at ADC input OF2 — (2048) — LSB Clamp level at YIN input OF1 — (280) — LSB PGA gain at ADC input GSL(0) 0.45 0.57 0.72 Times GSL(256) 1.36 1.71 2.16 Times GSL(512) 2.27 2.86 3.60 Times GSL(768) 3.18 4.00 5.04 Times GSL(1023) 4.08 5.14 6.47 Times Note : Values within parentheses ( ) are for reference. Rev.2.00 May 20, 2005 page 18 of 22 Test Conditions Remarks See table 9 CL = 10 pF VIN = 1.0 V to 2.0 V HD49338NP/HNP Operation Sequence at Power On Must be stable within the operating power supply voltage range VDD SPBLK Start control SPSIG of TG and ADCLK camera DSP etc. 1 ms or more Prohibition period High-speed pulse is the right phase OBP is started within this period OBP is the right phase OBP 2 ms or more HD49338NP/HNP serial data transfer (1) Register 2 setting 0 ms or more (3) Registers 0 (2) Register 2 setting and 1 settings 2 ms or more RESET bit Automatic offset calibration RESET = "Low" (RESET mode) RESET = "High" (RESET cancellation) (4)Offset calibration (automatically starts after RESET cancellation) Ends after 40000 clock cycles The following describes the above serial data transfer. For details on registers 0, 1, and 2, refer to table 10. (1) Register 2 setting (2) Register 2 setting : Set all bits in register 2 to the usage condition, and set the RESET bit to low. : Cancel the RESET mode by setting the register 2 RESET bit to high. Do not change other register 2 settings. Offset calibration starts automatically. (3) Register 0 and 1 settings : After the offset calibration is terminated, set registers 0 and 1. (4) Please perform an offset calibration in the period which avoided PBLK of V. Rev.2.00 May 20, 2005 page 19 of 22 HD49338NP/HNP Notice for Use 1. Careful handling is necessary to prevent damage due to static electricity. 2. This product has been developed for consumer applications, and should not be used in non-consumer applications. 3. As this IC is sensitive to power line noise, the ground impedance should be kept as small as possible. Also, to prevent latchup, a ceramic capacitor of 0.1 µF or more and an electrolytic capacitor of 10 µF or more should be inserted between the ground and power supply. 4. Common connection of AVDD and DVDD should be made off-chip. If AVDD and DVDD are isolated by a noise filter, the phase difference should be 0.3 V or less at power-on and 0.1 V or less during operation. 5. If a noise filter is necessary, make a common connection after passage through the filter, as shown in the figure below. Analog +3.0V Digital +3.0V Noise filter AVDD DVDD HD49338NP/HNP AVSS DVSS Noise filter DVDD Example of noise filter AVDD HD49338NP/HNP DVSS AVSS 100 µH 0.01 µF 0.01 µF 6. Connect AVSS and DVSS off-chip using a common ground. If there are separate analog system and digital system set grounds, connect to the analog system. 7. When VDD is specified in the data sheet, this indicates AVDD and DVDD. 8. No Connection (NC) pins are not connected inside the IC, but it is recommended that they be connected to power supply or ground pins or left open to prevent crosstalk in adjacent analog pins. 9. To ensure low thermal resistance of the package, a Cu-type lead material is used. As this material is less tolerant of bending than Fe-type lead material, careful handling is necessary. 10. The infrared reflow soldering method should be used to mount the chip. Note that general heating methods such as solder dipping cannot be used. 11. Serial communication should not be performed during the effective video period, since this will result in degraded picture quality. Also, use of dedicated ports is recommended for the SCK and SDATA signals used in the HD49330AF. If ports are to be shared with another IC, picture quality should first be thoroughly checked. 12. At power-on, automatic adjustment of the offset voltage generated from PGA, ADC, etc., must be implemented in accordance with the power-on operating sequence (see page 19). Rev.2.00 May 20, 2005 page 20 of 22 HD49338NP/HNP Example of Recommended External Circuit • At CDS Input R10 R11 R12 R13 R14 C13 0.1 100 100 100 100 100 from Timing generator C12 C11 0.1 0.1 C10 0.1 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD 24 23 22 21 20 19 18 17 16 15 14 13 25 AVSS 26 AVSS from CCD out C14 0.1 27 AVDD 28 BLKSH C1 2 1 µ C3* 1 µ 29 BLKFB C4*1 30 CDSIN 31 BLKC R15 33 k 32 BIAS C15 0.1 33 AVDD 34 Y IN HD49338NP/HNP (CDS/PGA+ADC) VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK 35 AVSS 36 ADCIN D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 12 11 10 9 8 6 5 4 3 2 1 L2 47 µ 37 38 39 40 41 42 43 44 45 46 47 48 C16 47/6 L1 47 µ to Camera signal processor 7 C21 47/6 C17 C18 C19 C20 0.1 0.1 0.1 0.1 GND C21 C22 0.1 0.1 Serial data input 3.0 V Notes: 1. For C4, see table 5. 2. For C3, see page 8 "DC Offset Compensation Feedback Function". • At ADC/Yin Input C13 0.1 from Timing generator C12 C11 0.1 0.1 DVDD (NC) SPSIG SPBLK OBP PBLK DVDD DVDD ADCLK DVSS DVSS DRDVDD 24 23 22 21 20 19 18 17 16 15 14 13 25 AVSS C14 0.1 26 AVSS 27 AVDD 28 BLKSH 29 BLKFB 30 CDSIN 31 BLKC R15 33 k 32 BIAS C15 0.1 33 AVDD 34 Y IN with Y input + − C23 0.47 HD49338NP/HNP (CDS/PGA+ADC) 35 AVSS VRM VRT VRB DVDD DVSS OEB DVDD DVDD DVSS CS SDATA SCK 36 ADCIN with ADC input C2 2.2/16 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 12 11 10 9 8 6 5 4 3 2 1 L2 47 µ 37 38 39 40 41 42 43 44 45 46 47 48 C16 47/6 L1 47 µ C21 47/6 C17 C18 C19 C20 0.1 0.1 0.1 0.1 GND C21 C22 0.1 0.1 3.0 V Note: External circuit is same as above except for ADC/Y input. Rev.2.00 May 20, 2005 page 21 of 22 to Camera signal processor 7 Serial data input Unit: R: Ω C: F HD49338NP/HNP Package Dimensions Unit: mm 7.0 ± 0.10 6.8 (4.40) 25 36 24 (4.40) 7.0 ± 0.10 6.8 37 Index 13 0.50 12 0.2 ± 0.06 0.05 Rev.2.00 May 20, 2005 page 22 of 22 0.80 max 1 0.20 ± 0.04 48 0.05 M 0.40 ± 0.1 Package Code JEDEC JEITA Mass (reference value) TNP-48TV — — 0.1 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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