ETC HIN206CB-T

HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
®
Data Sheet
May 2002
+5V Powered RS-232
Transmitters/Receivers with 0.1Microfarad
External Capacitors
FN3980.13
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1µF or Greater External Capacitors
The HIN202-HIN213 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28
specifications, and are particularly suited for those
applications where ±12V is not available. They require a
single +5V power supply and feature onboard charge pump
voltage converters which generate +10V and -10V supplies
from the 5V supply The family of devices offers a wide
variety of RS-232 transmitter/receiver combinations to
accommodate various applications (see Selection Table).
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
The HIN206, HIN211 and HIN213 feature a low power
shutdown mode to conserve energy in battery powered
applications. In addition, the HIN213 provides two active
receivers in shutdown mode allowing for easy “wakeup”
capability.
• Multiple Drivers
- ±10V Output Swing for +5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V input, and have a 3kΩ
to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Applications
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
NUMBER OF
0.1µF
EXTERNAL
CAPACITORS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
RECEIVERS
ACTIVE IN
SHUTDOWN
HIN202
+5V
2
2
4 Capacitors
No/No
0
HIN206
+5V
4
3
4 Capacitors
Yes/Yes
0
HIN207
+5V
5
3
4 Capacitors
No/No
0
HIN208
5V
4
4
4 Capacitors
No/No
0
HIN211
+5V
4
5
4 Capacitors
Yes/Yes
0
HIN213
+5V
4
5
4 Capacitors
Yes/Yes
2
PART
NUMBER
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
HIN202 thru HIN213
Ordering Information (Continued)
Ordering Information
TEMP.
RANGE (oC)
PART NO.
PACKAGE
PART NO.
PKG. NO.
TEMP.
RANGE (oC)
PACKAGE
PKG. NO.
HIN208CA
0 to 70
24 Ld SSOP
M24.209
HIN208IA
-40 to 85
24 Ld SSOP
M24.209
HIN208CB
0 to 70
24 Ld SOIC
M24.3
HIN208CB-T
0 to 70
Tape and Reel
M16.3
HIN208CP
0 to 70
24 Ld PDIP (N)
E24.3
16 Ld PDIP
E16.3
HIN211CA
0 to 70
28 Ld SSOP
M28.209
0 to 70
24 Ld SOIC
M24.3
HIN211CA-T
0 to 70
Tape and Reel
0 to 70
Tape and Reel
HIN202CBN
0 to 70
16 Ld SOIC (N)
HIN202CBN-T
0 to 70
Tape and Reel
HIN202CB
0 to 70
16 Ld SOIC (W)
HIN202CB-T
0 to 70
Tape and Reel
HIN202IB
-40 to 85
16 Ld SOIC (W)
HIN202CP
0 to 70
HIN206CB
HIN206CB-T
M16.15
M16.3
HIN211IA
-40 to 85
28 Ld SSOP
Tape and Reel
HIN206IB
-40 to 85
24 Ld SOIC
M24.3
HIN211IA-T
-40 to 85
HIN207CA
0 to 70
24 Ld SSOP
M24.209
HIN211CB
0 to 70
28 Ld SOIC
HIN207CB
0 to 70
24 Ld SOIC
M24.3
HIN211CB-T
0 to 70
Tape and Reel
HIN207CB-T
0 to 70
Tape and Reel
HIN213CA
0 to 70
28 Ld SSOP
HIN213CA-T
0 to 70
Tape and Reel
HIN207IB
-40 to 85
HIN207CP
0 to 70
24 Ld SOIC
M24.3
24 Ld PDIP (N)
E24.3
M28.209
M28.3
M28.209
Pin Descriptions
PIN
VCC
V+
V-
FUNCTION
Power Supply Input 5V ±10%, (5V ±5% HIN207).
Internally generated positive supply (+10V nominal).
Internally generated negative supply (-10V nominal).
GND
Ground Lead. Connect to 0V.
C1+
External capacitor (+ terminal) is connected to this lead.
C1-
External capacitor (- terminal) is connected to this lead.
C2+
External capacitor (+ terminal) is connected to this lead.
C2-
External capacitor (- terminal) is connected to this lead.
TIN
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
TOUT
RIN
ROUT
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
EN, EN
Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, (HIN213 EN = 0V), the outputs are placed
in a high impedance state.
SD, SD
Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state
(except R4 and R5 of HIN213) and the transmitters are shut off.
NC
No Connect. No connections are made to these leads.
2
HIN202 thru HIN213
Pinouts
HIN202 (PDIP, SOIC, SSOP)
TOP VIEW
C1+ 1
16 VCC
V+ 2
15 GND
HIN206 (PDIP, SOIC, SSOP)
TOP VIEW
C1- 3
14 T1OUT
C2+ 4
13 R1IN
C2- 5
12 R1OUT
T3OUT
1
24 T4OUT
T1OUT
2
23 R2IN
T2OUT
3
22 R2OUT
R1IN
4
21 SD
R1OUT
5
20 EN
19 T4IN
T2IN
6
6
11 T1IN
T1IN
7
18 T3IN
T2OUT 7
10 T2IN
GND
8
17 R3OUT
VCC
9
16 R3IN
V-
9 R2OUT
R2IN 8
C1+ 10
15 V-
V+ 11
14 C2-
C1- 12
13 C2+
+5V
+5V
9
16
0.1µF
1
0.1µF
+
3
4
0.1µF
T1IN
T2IN
+
5
11
10
VCC
C1+
C1C2+
C2-
+5V TO 10V
VOLTAGE INVERTER V+
+10V TO -10V
VOLTAGE INVERTER
+5V
400kΩ
+5V
400kΩ
2
+
0.1µF
0.1µF
T1IN
V- 6
+
14
T1OUT
T3IN
T2
7
12
T2OUT
+10V TO -10V
VOLTAGE INVERTER
V- 15
T2
+5V
400kΩ
18
T3
+5V
400kΩ
T4
19
R1IN
2
3
1
24
R2OUT
R2IN
T4OUT
R2IN
16
R3IN
R3OUT
20
5kΩ
R3
21
SD
EN
GND
8
3
T3OUT
5kΩ
R2
15
T2OUT
23
17
GND
T1OUT
5kΩ
R2OUT
5kΩ
R2
0.1µF
R1IN
R1OUT
R1
8
0.1µF
4
22
9
+
+
+5V
400kΩ
5kΩ
R1
+5V TO 10V
VOLTAGE DOUBLER
T1
6
11
V+
5
13
R1OUT
T4IN
VCC
+5V
400kΩ
7
0.1µF
T2IN
T1
10
C1+
+
12
C113
C2+
+
14
C2-
HIN202 thru HIN213
Pinouts
(Continued)
HIN207 (PDIP, SOIC, SSOP)
TOP VIEW
HIN208 (PDIP, SOIC, SSOP)
TOP VIEW
T3OUT
1
24 T4OUT
T2OUT
1
24 T3OUT
T1OUT
2
23 R2IN
T1OUT
2
23 R3IN
T2OUT
3
22 R2OUT
R2IN
3
22 R3OUT
R2OUT
4
21 T4IN
T1IN
5
20 T4OUT
R1OUT
6
19 T3IN
R1IN 4
R1OUT
21 T5IN
20 T5OUT
5
T2IN 6
19 T4IN
T1IN 7
18 T3IN
R1IN
7
18 T2IN
GND
8
17 R3OUT
GND
8
17 R4OUT
VCC
9
16 R3IN
VCC
9
16 R4IN
15 V-
C1+ 10
C1+ 10
14 C2-
V+ 11
14 C2-
C1- 12
13 C2+
C1- 12
13 C2+
+5V
+5V
9
0.1µF
0.1µF
T1IN
T2IN
T3IN
T4IN
T5IN
15 V-
V+ 11
10
C1+
+
12
C113
C2+
+
14
C2-
VCC
11
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+5V
400kΩ
7
+5V
400kΩ
6
+5V
400kΩ
18
9
0.1µF
+
0.1µF
+
T1
2
0.1µF
T1OUT
0.1µF
T1IN
10
C1+
+
12
C113
C2+
+
14
C2-
3
T3
+5V
400kΩ
19
T4
+5V
400kΩ
21
T5
1
24
20
5
T2OUT
T3OUT
T4OUT
T2IN
T3IN
T4IN
V+
+10V TO -10V
VOLTAGE INVERTER
V- 15
+
+
T1
+5V
400kΩ
T2
18
19
+5V
400kΩ
T3
+5V
400kΩ
21
T4
2
1
24
20
6
T5OUT
11
+5V TO 10V
VOLTAGE DOUBLER
+5V
400kΩ
5
T2
0.1µF
VCC
0.1µF
T1OUT
T2OUT
T3OUT
T4OUT
7
R1IN
R1OUT
5kΩ
R1
4
R1IN
R1OUT
4
5kΩ
R1
22
R2IN
R2IN
R2OUT
5kΩ
17
22
R3IN
5kΩ
5kΩ
R3
R3IN
R3
23
R3OUT
16
R3OUT
5kΩ
R2
23
R2
3
R2OUT
17
16
R4IN
R4OUT
5kΩ
R4
GND
8
GND
8
4
HIN202 thru HIN213
Pinouts
(Continued)
HIN211 (SOIC, SSOP)
TOP VIEW
HIN213 (SOIC, SSOP)
TOP VIEW
T3OUT 1
28 T4OUT
T3OUT 1
28 T4OUT
T1OUT 2
27 R3IN
T1OUT 2
27 R3IN
T2OUT 3
26 R3OUT
T2OUT 3
26 R3OUT
R2IN 4
25 SD
R2IN 4
25 SD
R2OUT 5
24 EN
R2OUT 5
24 EN
T2IN 6
23 R4IN
T2IN 6
23 R4IN
T1IN 7
22 R4OUT
T1IN 7
22 R4OUT
R1OUT 8
21 T4IN
R1OUT 8
21 T4IN
R1IN 9
20 T3IN
R1IN 9
20 T3IN
GND 10
19 R5OUT
GND 10
19 R5OUT
VCC 11
18 R5IN
VCC 11
18 R5IN
C1+ 12
17 V-
C1+ 12
17 V-
V+ 13
16 C2-
V+ 13
16 C2-
C1- 14
15 C2+
C1- 14
15 C2+
NOTE: R4 and R5 active in shutdown.
+5V
+5V
11
0.1µF
0.1µF
T1IN
T2IN
T3IN
T4IN
R1OUT
12
C1+
+
14
C115
C2+
+
16
C2-
VCC
13
+5V TO 10V
VOLTAGE DOUBLER
V+
+10V TO -10V
VOLTAGE INVERTER
V- 17
+
0.1µF
0.1µF
+
+5V
400kΩ
7
T1
+5V
400kΩ
T2
6
20
+5V
400kΩ
T3
21
+5V
400kΩ
T4
2
3
1
28
9
8
0.1µF
T1OUT
T1IN
T2OUT
T2IN
T3OUT
T3IN
T4OUT
T4IN
R1IN
R1OUT
5
4
R2IN
26
R3IN
+5V
400kΩ
T2
6
20
+5V
400kΩ
T3
21
+5V
400kΩ
T4
R4IN
SD
R1IN
5kΩ
4
5kΩ
27
R3IN
5kΩ
22
23
R4IN
R4OUT
5kΩ
19
18
R5IN
R5OUT
24
5kΩ
R5
25
EN
GND
10
T4OUT
9
26
25
GND
28
R2IN
5kΩ
EN
T3OUT
R3OUT
18
R5
T2OUT
1
R4
R5IN
T1OUT
3
8
5kΩ
R5OUT
0.1µF
2
5
23
19
+
R3
R4OUT
R4
V- 17
T1
5kΩ
22
+10V TO -10V
VOLTAGE INVERTER
+
R2OUT
27
R3
V+
R2
R3OUT
13
+5V TO 10V
VOLTAGE DOUBLER
+5V
400kΩ
7
5kΩ
R2
0.1µF
VCC
R1
R2OUT
5
12
C1+
+
14
C115
C2+
+
16
C2-
5kΩ
R1
24
11
0.1µF
10
SD
HIN202 thru HIN213
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
115
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
100
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
135
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC and SSOP - Lead Tips Only)
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY CURRENTS
Power Supply Current, ICC
No Load,
TA = 25oC
HIN202
-
8
15
mA
HIN206 - HIN213
-
11
20
mA
Shutdown Supply Current, ICC(SD)
TA = 25oC
HIN206, HIN211
-
1
10
µA
HIN213
-
15
50
µA
-
-
0.8
V
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL
TIN , EN, SD, EN, SD
Input Logic High, VlH
TIN
2.0
-
-
V
EN, SD, EN, SD
2.4
-
-
V
Transmitter Input Pullup Current, IP
TIN = 0V
-
15
200
µA
TTL/CMOS Receiver Output Voltage Low, VOL
IOUT = 1.6mA
(HIN202, IOUT = 3.2mA)
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, VOH
IOUT = -1mA
3.5
4.6
-
V
TTL/CMOS Receiver Output Leakage
EN = VCC , EN = 0, 0V < ROUT < VCC
-
0.05
±10
µA
-30
-
+30
V
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN
Receiver Input Impedance, RIN
TA = 25oC, VIN = ±3V
3.0
5.0
7.0
kΩ
Receiver Input Low Threshold, VIN (H-L)
VCC = 5V,
TA = 25oC
Active Mode
0.8
1.2
-
V
Shutdown Mode
HIN213 R4 and R5
0.6
1.5
-
V
VCC = 5V,
TA = 25oC
Active Mode
-
1.7
2.4
V
Shutdown Mode
HIN213 R4 and R5
-
1.5
2.4
V
Receiver Input High Threshold, VIN (L-H)
6
HIN202 thru HIN213
Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range (Continued)
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC = 5V
No Hysteresis in Shutdown Mode
0.2
0.5
1.0
V
Baud Rate
1 Transmitter
Switching
120
-
-
kbps
Output Enable Time, tEN
HIN206, HIN211, HIN213
-
400
-
ns
Output Disable Time, tDIS
HIN206, HIN211, HIN213
-
200
-
ns
Transmitter, Receiver Propagation Delay, tPD
HIN213 SD = 0V, R4, R5
-
0.5
40
µs
HIN213 SD = VCC , R1 - R5
-
0.5
10
µs
HIN202 - HIN211
-
0.5
10
µs
RL = 3kΩ, CL = 2500pF Measured from
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
3
-
30
V/µs
Output Voltage Swing, TOUT
Transmitter Outputs, 3kΩ to Ground
±5
±9
±10
V
Output Resistance, ROUT
VCC = V+ = V- = 0V, VOUT = ±2V
300
-
-
Ω
RS-232 Output Short Circuit Current, ISC
TOUT Shorted to GND
-
±10
-
mA
Receiver Input Hysteresis, VHYST
TIMING CHARACTERISTICS
Transition Region Slew Rate, SRT
RL = 3kΩ
TRANSMITTER OUTPUTS
NOTE:
2. Guaranteed by design.
VOLTAGE DOUBLER
S1
VOLTAGE INVERTER
S2
C1+
V+ = 2VCC
S5
C2+
S6
VCC
GND
+
GND
C1-
S3
+
C1
-
+
C3
VCC
S4
-
GND
S7
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
7
+
C2
C2-
C4
V- = - (V+)
S8
HIN202 thru HIN213
Detailed Description
Receivers
The HIN202 thru HIN213 family of RS-232
transmitters/receivers are powered by a single +5V power
supply feature low power consumption, and meet all ElA
RS232C and V.28 specifications. The circuit is divided into
three sections: The charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase, internally generated clock to
generate +10V and -10V. The nominal clock frequency is
125kHz. During phase one of the clock, capacitor C1 is
charged to VCC . During phase two, the voltage on C1 is
added to VCC , producing a signal across C3 equal to twice
VCC . During phase two, C2 is also charged to 2VCC , and
then during phase one, it is inverted with respect to ground
to produce a signal across C4 equal to -2VCC . The charge
pump accepts input voltages up to 5.5V. The output
impedance of the voltage doubler section (V+) is
approximately 200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 0.1µF capacitors for C1-C4, however, the
value is not critical. Increasing the values of C1 and C2 will
lower the output impedance of the voltage doubler and
inverter, increasing the values of the reservoir capacitors, C3
and C4, lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN206 and HIN211, SD = VCC ,
HIN213, SD = 0V) the charge pump is turned off, V+ is
pulled down to VCC , V- is pulled up to GND, and the supply
current is reduced to less than 10µA. The transmitter outputs
are disabled and the receiver outputs (except for HIN213,
R4 and R5) are placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic
1 at the input results in a voltage of between -5V and V- at
the output, and a logic 0 results in a voltage between +5V
and (V+ - 0.6V). Each transmitter input has an internal
400kΩ pullup resistor so any unused input can be left
unconnected and its output remains in its low state. The
output voltage swing meets the RS-232C specifications of
±5V minimum with the worst case conditions of: all
transmitters driving 3kΩ minimum load impedance, VCC =
4.5V, and maximum allowable operating temperature. The
transmitters have an internally limited output slew rate which
is less than 30V/µs. The outputs are short circuit protected
and can be shorted to ground indefinitely. The powered
down output impedance is a minimum of 300Ω with ±2V
applied to the outputs and VCC = 0V.
8
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC . The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN on HIN206 and
HIN211, EN on HIN213) when unasserted, disables the
receiver outputs, placing them in the high impedance mode.
The receiver outputs are also placed in the high impedance
state when in shutdown mode (except HIN213 R4 and R5).
V+
VCC
400kΩ
300Ω
TXIN
TOUT
GND < TXIN < VCC
V- < VTOUT < V+
V-
FIGURE 2. TRANSMITTER
VCC
RXIN
-30V < RXIN < +30V
ROUT
GND < VROUT < VCC
5kΩ
GND
FIGURE 3. RECEIVER
TIN
OR
RIN
TOUT
OR
ROUT
VOL
VOL
tPHL
tPLH
tPHL + tPLH
2
AVERAGE PROPAGATION DELAY =
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This
propagation delay may increase slightly during shutdown.
When entering shut down mode, receivers R4 and R5 are
not valid for 80µs after SD = VIL. When exiting shutdown
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is
typically less than 2ms when using 0.1µF capacitors.
HIN202 thru HIN213
Typical Performance Curves
12
0.1µF
SUPPLY VOLTAGE (|V|)
V- SUPPLY VOLTAGE (V)
12
10
8
6
4
10
V+ (VCC = 5V)
8
6
V+ (VCC = 4V)
V- (VCC = 4V)
4
TA = 25oC
2
2
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
0
5
10
VCC
FIGURE 5.
V- (VCC = 5V)
TRANSMITTER OUTPUTS
OPEN CIRCUIT
15
20
25
30
35
|ILOAD| (mA)
V- SUPPLY VOLTAGE vs VCC
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
Test Circuits (HIN202)
+4.5V TO
+5.5V INPUT
-
0.1µF
C3
0.1µF
C1
+
+
-
0.1µF +
C2 -
+
0.1µF C4
3kΩ
1 C1+
VCC 16
2 V+
GND 15
3kΩ
3 C1-
T1OUT 14
4 C2+
R1IN 13
RS-232 ±30V INPUT
5 C2-
R1OUT 12
TTL/CMOS OUTPUT
T1 OUTPUT
6 V-
T1IN 11
TTL/CMOS INPUT
7 T2OUT
T2IN 10
TTL/CMOS INPUT
8 R2IN
R2OUT 9
1 C1+
VCC 16
2 V+
GND 15
3 C1-
T1OUT 14
4 C2+
R1IN 13
5 C2-
R1OUT 12
6 V7 T2OUT
8 R2IN
ROUT = VIN /I
T1IN 11
T2IN 10
R2OUT 9
T2OUT
TTL/CMOS OUTPUT
T2
OUTPUT
T1OUT
VIN = ±2V
A
RS-232
±30V INPUT
FIGURE 7. GENERAL TEST CIRCUIT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
Application Information
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kW resistor
connected to V+.
9
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
HIN202 thru HIN213
+5V
+
16
1
C1 +
0.1µF -
3
HIN202
6
4
C2 +
0.1µF -
5
TD
INPUTS
OUTPUTS
TTL/CMOS
CTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
SELECT
RTS
T1
11
14
T2
10
7
13
12
RD
CTS
+
R2
9
R1
8
15
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
1
C1 +
0.1µF TD
INPUTS
OUTPUTS
TTL/CMOS
RTS
4
HIN202
3
T1
11
-
14
T2
10
+ C2
0.1µF
5
12
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
RD
9
CTS
R2
R1
8
CTS (5) CLEAR TO SEND
15
VCC
16
2
-
C3
+
+
C4
6
V- V+
0.2µF
0.2µF
2
6
-
VCC
16
+5V
RS-232
INPUTS AND OUTPUTS
HIN202
C1 +
0.1µF DTR
INPUTS
OUTPUTS
TTL/CMOS
DSRS
1
4
3
5
T1
11
14
T2
10
7
13
12
DCD
R1
9
R2
R1
15
8
+ C2
0.1µF
-
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
10
HIN202 thru HIN213
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
160 mils x 140 mils
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
SUBSTRATE POTENTIAL
V+
TRANSISTOR COUNT:
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN211
SHD
EN
R4IN
R4OUT T4IN T3IN R5OUT
R5IN
R3OUT
V-
C2R3IN
T4OUT
C2+
T3OUT
C1T1OUT
V+
T2OUT
C1+
R2IN
VCC
R2OUT T2IN T1IN R1OUT
11
R1IN GND
HIN202 thru HIN213
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
C
D
0.735
0.775
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
eB
-
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.
L
0.115
N
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
12
5
E
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
0.355
19.68
D1
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
0.204
18.66
16
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
16
6
10.92
7
3.81
4
9
Rev. 0 12/93
HIN202 thru HIN213
Dual-In-Line Plastic Packages (PDIP)
E24.3 (JEDEC MS-001-AF ISSUE D)
N
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-
SYMBOL
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
13
MILLIMETERS
MIN
MAX
MIN
MAX
-
NOTES
A
-
0.210
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
0.204
0.355
-
D
1.230
1.280
31.24
D1
0.005
-
0.13
32.51
5
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
L
0.115
0.150
N
24
2.93
24
10.92
7
3.81
4
9
Rev. 0 12/93
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
µα
e
A1
B
0.25(0.010) M
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
C
B S
0.050 BSC
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
14
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
α
16
0o
16
8o
0o
7
8o
Rev. 0 12/93
HIN202 thru HIN213
Small Outline Plastic Packages (SSOP)
M16.209 (JEDEC MO-150-AC ISSUE B)
N
INDEX
AREA
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
H
0.25(0.010) M
2
SYMBOL
GAUGE
PLANE
3
0.25
0.010
SEATING PLANE
-A-
INCHES
E
-B-
1
B M
A
D
-C-
µα
e
A1
B
0.25(0.010) M
L
C
0.10(0.004)
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
15
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8o
0o
N
α
NOTES:
MAX
A1
e
A2
MILLIMETERS
MIN
16
0o
16
7
8o
Rev. 2
3/95
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.3977
0.4133
10.10
10.50
3
E
0.2914
0.2992
7.40
7.60
4
e
µα
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
16
0.050 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
16
0o
16
8o
0o
7
8o
Rev. 0 12/93
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
µα
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
17
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
24
0o
24
8o
0o
7
8o
Rev. 0 12/93
HIN202 thru HIN213
Shrink Small Outline Plastic Packages (SSOP)
M24.209 (JEDEC MO-150-AG ISSUE B)
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
GAUGE
PLANE
-B1
2
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
µα
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
0.05
-
-
0.072
1.65
1.85
-
A1
0.002
A2
0.065
B S
B
0.009
0.014
0.22
0.38
9
0.004
0.009
0.09
0.25
-
D
0.312
0.334
7.90
8.50
3
E
0.197
0.220
5.00
5.60
4
0.026 BSC
H
0.292
L
0.022
N
α
NOTES:
-
C
e
A2
A1
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
24
0o
-
8.20
-
0.95
6
24
8o
0o
7
8o
Rev. 1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
18
3/95
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
19
MILLIMETERS
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
0.05 BSC
10.00
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
8o
0o
28
0o
10.65
-
0.394
N
0.419
1.27 BSC
H
α
NOTES:
MAX
A1
e
µα
MIN
28
-
7
8o
Rev. 0 12/93
HIN202 thru HIN213
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
GAUGE
PLANE
-B1
2
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
µα
e
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
A2
A1
B S
0.026 BSC
H
0.292
L
0.022
N
α
NOTES:
MILLIMETERS
0.65 BSC
0.322
7.40
0.037
0.55
28
0o
-
0.95
6
28
8o
0o
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
-
8.20
7
8o
Rev. 1 3/95
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
20