AVAGO HSMC-A100

HSMx-A10x-xxxxx
PLCC-2, Surface Mount LED Indicator
Data Sheet
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-2 package. These SMT LEDs have high
reliability performance and are designed to work under
a wide range of environmental conditions. This high
reliability feature makes them ideally suited to be used
under harsh interior automotive as well as interior signs
application conditions.
• Industry standard PLCC-2 package
To facilitate easy pick & place assembly, the LEDs
are packed in EIA-compliant tape and reel. Every reel will
be shipped in single intensity and color bin, except red
color, to provide close uniformity.
• Available in 8 mm carrier tape on 7 inch reel (2000
pieces)
These LEDs are compatible with IR solder reflow process.
Due to the high reliability feature of these products, they
can also be mounted using through-the-wave soldering
process.
The super wide viewing angle at 120˚ makes these
LEDs ideally suited for panel, push button, or general
backlighting in automotive interior, office equipment,
industrial equipment, and home appliances. The flat
top emitting surface makes it easy for these LEDs
to mate with light pipes. With the built-in reflector
pushing up the intensity of the light output, these LEDs
are also suitable to be used as LED pixels in interior electronic signs.
• High reliability LED package
• High brightness using AlInGaP and InGaN dice technologies
• Available in full selection of colors
• Super wide viewing angle at 120˚
• Compatible with both IR and TTW soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
2.2 ± 0.2
3.2 ± 0.2
1.9 ± 0.2
0.1 TYP.
0.8 ± 0.1
3.5 ± 0.2
0.8 ± 0.3
0.5 ± 0.1
CATHODE MARKING
(ANODE MARKING FOR AlGaAs DEVICES)
TOP MOUNT
2.8 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
5.2 ± 0.2
3.2 ± 0.2
0.1 TYP.
CATHODE MARKING
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
2
0.5 ± 0.1
Table 1. Device Selection Guide
Red
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMS-A100-J00J1
4.50
15.00
-
20
GaP
HSMS-A100-L00J1
11.20
15.00
-
20
GaP
HSMS-A100-H70J2
3.55
-
7.20
10
GaP
HSMS-A100-J80J2
5.60
-
14.00
10
GaP
HSMH-A100-L00J1
11.20
15.00
-
20
AlGaAs
HSMH-A100-N00J1
28.50
50.00
-
20
AlGaAs
HSMH-A100-M80J2
22.40
-
56.00
10
AlGaAs
HSMC-A100-Q00J1
71.50
100.00
-
20
AlInGaP
HSMC-A100-R00J1
112.50
140.00
-
20
AlInGaP
HSMC-A101-S00J1
180.00
220.00
-
20
AlInGaP
HSMZ-A100-T00J1
285.00
350.00
-
20
AlInGaP
HSMC-A100-P30J1
45.00
-
90.00
20
AlInGaP
Red Orange
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMJ-A100-Q00J1
71.50
100.00
-
20
AlInGaP
HSMJ-A101-S00J1
180.00
200.00
-
20
AlInGaP
HSMV-A100-T00J1
285.00
350.00
-
20
AlInGaP
HSMJ-A100-R40J1
112.50
-
285.00
20
AlInGaP
HSMV-A100-S80J1
224.00
-
560.00
20
AlInGaP
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
Orange
Part Number
HSMD-A100-J00J1
4.50
15.00
-
20
GaP
HSMD-A100-L00J1
11.20
15.00
-
20
GaP
HSMD-A100-K4PJ2
7.20
-
18.00
10
GaP
HSML-A100-Q00J1
71.50
100.00
-
20
AlInGaP
HSML-A101-S00J1
180.00
220.00
-
20
AlInGaP
3
Yellow / Amber
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMY-A100-J00J1
4.50
12.00
-
20
GaP
HSMY-A100-L00J1
11.20
12.00
-
20
GaP
HSMY-A100-J35J2
4.50
-
9.00
10
GaP
HSMA-A100-Q00J1
71.50
100.00
-
20
AlInGaP
HSMA-A101-S00J1
180.00
220.00
-
20
AlInGaP
HSMU-A100-S00J1
180.00
320.00
-
20
AlInGaP
HSMA-A101-R8WJ1
140.00
-
355.00
20
AlInGaP
HSMU-A100-S4WJ1
180.00
-
450.00
20
AlInGaP
Yellow Green
Part Number
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMG-A100-J02J1
4.50
18.00
-
20
GaP
HSMG-A100-K72J2
9.00
-
18.00
10
GaP
HSME-A100-M02J1
18.00
70.00
-
20
AlInGaP
HSME-A100-N82J1
35.50
-
90.00
20
AlInGaP
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
2.80
8.00
-
20
GaP
Emerald Green
Part Number
HSMG-A100-H01J1
HSMG-A100-H41J2
2.80
-
7.20
10
GaP
HSME-A100-L01J1
11.20
40.00
-
20
AlInGaP
HSME-A100-M3PJ1
18.00
-
35.50
20
AlInGaP
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMM-A101-R00J1
112.50
200.00
-
20
InGaN
HSMM-A100-S00J1
180.00
350.00
-
20
InGaN
HSMM-A100-U4PJ1
450.00
-
1125.00
20
InGaN
HSMM-A100-V7PJ1
900.00
-
1800.00
20
InGaN
Min IV (mcd)
Typ. IV (mcd)
Max. IV (mcd)
Test Current (mA)
Dice Technology
HSMN-A101-N00J1
28.50
50.00
-
20
InGaN
HSMN-A100-P00J1
45.00
70.00
-
20
InGaN
HSMN-A100-R4YJ1
112.50
-
285.00
20
InGaN
Green
Part Number
Blue
Part Number
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not
be aligned with this axis.
2. IV Tolerance = ±12%
4
Part Numbering System
HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMS/D/Y/G HSMH
HSMC/J/L/AHSME
HSMZ/V/U
HSMM/K/B/N
DC Forward Current[1]
30 mA
30 mA
30 mA[3,4]
20 mA[4]
30 mA[3,4]
30 mA
Peak Forward Current[2]
100 mA
100 mA
100 mA
100 mA
100 mA
100 mA
Power Dissipation
63 mW
60 mW
63 mW
48 mW
72 mW
114 mW
Reverse Voltage
5V
Junction Temperature
110°C
Operating Temperature
–55°C to +100°C
Storage Temperature
–55°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 30 mA is recommended for best long term performance.
4. Operation at current below 5 mA is not recommended.
5
Optical Characteristics (TA = 25˚C)
Viewing Luminous
Peak
Dominant Angle LuminousIntensity/
WavelengthWavelength[1]2 θ1/2[2]Efficacy ηv[3] Total Flux
Dice
λPEAK (nm)
λD (nm)
(Degrees) (lm/W)
Iv(mcd)/Φv(mlm)
Color
Part Number
Technology
Typ.
Typ.
Typ.
Typ.
Typ.
Red
HSMS-A100GaP
635
626
120
120
0.45
HSMH-A100AlGaAs 645
637
120
63
0.45
HSMC-A10xAlInGaP 635
626
120
150
0.45
HSMZ-A100AlInGaP 639
630
120
155
0.45
Red
Orange
HSMJ-A10xAlInGaP 621
615
120
240
0.45
HSMV-A100AlInGaP 623
617
120
263
0.45
Orange
HSMD-A100GaP
600
602
120
380
0.45
HSML-A10xAlInGaP 609
605
120
320
0.45
Amber
HSMY-A100GaP
583
585
120
520
0.45
HSMA-A10xAlInGaP 592
590
120
480
0.45
HSMU-A100AlInGaP 594
592
120
500
0.45
Yellow
Green
HSMG-A100GaP
565
569
120
590
0.45
HSME-A100AlInGaP 575
570
120
560
0.45
HSMG-A100
560
120
650
0.45
Emerald Green
GaP
558
HSME-A100AlInGaP 566
560
120
610
0.45
Green
HSMM-A10xInGaN
523
525
120
500
0.45
Cyan
HSMK-A10xInGaN
502
505
120
300
0.45
Blue
HSMB-A100GaN
HSMN-A10xInGaN
428
468
462
470
120
120
65
75
0.45
0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25˚C)
Forward Voltage
Reverse Voltage
Reverse Voltage
Thermal
VF (Volts) @ IF = 20 mA VR @ 100 µA
VR @ 10 µA
Resistance
Part Number
Typ.
Max.
Min.Min.RθJP (°C/W)
HSMS/D/Y/G 2.2 2.65
—
180
HSMH
1.9 2.65
—
180
HSMC/J/L/A/E1.9 2.4 5
—
280
HSMZ/V/U
2.2 2.65
—
280
HSMB
3.9 4.3—
5
280
HSMM/K/N
3.4 4.05—
5
280
6
0.9
RELATIVE INTENSITY
0.8
BLUE
EMERALD GREEN
CYAN
YELLOW GREEN
GREEN
0.7
35
30
FORWARD CURRENT – mA
1.0
AMBER
0.6
0.5
ORANGE
0.4
RED ORANGE
0.3
RED
0.2
HSMS/D/Y/G
HSMZ/V/U
25
20
HSMH
15
HSMC/J/L/A/E
HSMM/K/N
10
0.1
HSMB
5
0
380
430
480
530
630
580
680
730
780
0
WAVELENGTH – nm
1
0
2
4
3
5
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
0.8
RELATIVE INTENSITY
HSMx-A100 fig 1
GaP
EMERALD
GREEN
1.8
GaP
YELLOW
GREEN
0.6
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.0
GaP YELLOW
GaP ORANGE
GaN BLUE
0.4
GaP RED
0.2
0
380
430
480
530
580
680
630
730
1.6
Gap
AlInGaP
AlGaAs
1.4
GaN
1.0
0.8
0.6
0.4
0.2
0
780
5
0
WAVELENGTH – nm
10
25
CURRENT - mA
CURRENT - mA
HSMS/D/G/Y/H
HSMC/J/L/A
HSME
HSMM/K/B/N
5
5
100
120
Figure 4. Maximum forward current vs. ambient
temperature. Derated based on TJMAX = 110˚C,
RθJA = 500˚C/W.
7
HSMZ/V/U
HSME
15
10
40
60
80
TEMPERATURE (°C)
HSMC/J/L/A
20
10
20
DOMINANT WAVELENGTH – nm
HSMS/D/G/
Y/H/Z/V/U
0
30
35
540
30
30
0
25
HSMx-A100 fig 3
35
35
15
20
Figure 3. Relative intensity vs. forward current.
HSMx-A100 fig 1b
20
15
DC FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
25
InGaN
1.2
0
HSMM/K/N
HSMB
530
510
20
40
60
80
TEMPERATURE (°C)
100
120
Figure 4b. Maximum Forward Current Vs. Solder
Point Temperature. Derated based on TJMAX =
110°C, RθJP = 180°C/W or 280°C/W.
CYAN
500
490
480
BLUE
470
460
0
GREEN
520
0
5
10
15
20
25
30
CURRENT – mA
Figure 5. Dominant wavelength vs. forward
current – InGaN devices.
HSMx-A100 fig 5
35
1.0
0.4
0.3
NORMALIZED INTENSITY
DELTA VF (NORMALIZED AT 25°C)
0.5
0.2
0.1
GaP/AlGaAs/
AlInGaP
0
-0.1
-0.2
InGaN/GaN
-0.3
-100
-50
50
0
100
0.8
0.6
0.4
0.2
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
150
0
10 20 30
40 50
ANGULAR DISPLACEMENT – DEGREES
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
HSMx-A100 fig 6
TEMPERATURE
10 to 30 SEC.
255 - 260 C
3 C/SEC. MAX.
217 C
200 C
6 C/SEC. MAX.
150 C
3 C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free reflow soldering profile.
4.50
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
1.50
2.60
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
TEMPERATURE – C
250
200
150
FLUXING
100
BOTTOM SIDE
OF PC BOARD
50
30
TOP SIDE OF
PC BOARD
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
8
Figure 10. Recommended soldering pad pattern.
60 70
80 90
TRAILER
COMPONENT
LEADER
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape leader and trailer dimensions.
HSMx-A100 fig 8
4 ± 0.1
4 ± 0.1
2 ± 0.05
2.29 ± 0.1
1.75 ± 0.1
+0.1
Ø 1.5 –0
C
3.5 ± 0.05
+0.3
8 –0.1
3.81 ± 0.1
A
3.05 ± 0.1
+0.1
Ø1 –0
8°
0.229 ± 0.01
Figure 12. Tape dimensions.
HSMx-A100 fig 9
9
2 +0.5
–0
Ø 20.5 ± 0.3
62.5
180
+0
–2.5
Ø 13 ± 0.2
+1.50
8.4 –0.00 (MEASURED AT OUTER EDGE)
14.4 (MAX. MEASURED AT HUB)
LABEL AREA (111 mm x 57 mm)
WITH DEPRESSION (0.25 mm)
7.9 (MIN.)
10.9 (MAX.)
Figure 13. Reel dimensions.
HSMx-A100 fig 10
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 14. Reeling orientation.
HSMx-A100 fig 11
10
Intensity Bin Select (X5X6)
Intensity Bin Limits
Individual reel will contain parts
from one half bin only.
X5 Min Iv Bin
Bin ID
X6
Min. (mcd)
Max. (mcd)
G11.80
2.24
G22.24
2.80
H12.80
3.55
H23.55
4.50
0
Full Distribution
J14.50 5.60
2
2 half bins starting from X51
J25.60 7.20
3
3 half bins starting from X51
K17.20 9.00
4
4 half bins starting from X51
K29.00 11.20
5
5 half bins starting from X51
L111.20 14.00
6
2 half bins starting from X52
L214.00 18.00
7
3 half bins starting from X52
M118.00 22.40
8
4 half bins starting from X52
M222.40 28.50
9
5 half bins starting from X52
N128.50 35.50
N235.50 45.00
P145.00 56.00
P256.00 71.50
Q171.50 90.00
Q290.00 112.50
R1112.50140.00
R2140.00180.00
S1180.00224.00
S2224.00285.00
T1285.00355.00
T2355.00450.00
U1450.00560.00
U2560.00715.00
V1715.00900.00
V2900.001125.00
W1 1125.001400.00
W2 1400.001800.00
X1 1800.002240.00
X2 2240.002850.00
Tolerance of each bin limit = ± 12%
11
Color Bin Select (X7)
Color Bin Limits
Individual reel will contain parts
from one full bin only.
X7
Blue
Min. (nm)
Color Bin Limits
Max. (nm)
Amber
Min. (nm)
Max. (nm)
A460.0 465.0
A582.0 584.5
B465.0 470.0
B584.5 587.0
0
Full Distribution
C470.0 475.0
C587.0 589.5
Z
A and B only
D475.0 480.0
D589.5 592.0
Y
B and C only
E592.0 594.5
W
C and D only
V
D and E only
Cyan
U
E and F only
B495.0 500.0
T
F and G only
C500.0 505.0
S
G and H only
D505.0 510.0
Q
A, B, and C only
B600.0 603.0
C603.0 606.0
P
B, C, and D only
N
C, D, and E only
M
D, E, and F only
L
E, F, and G only
K
F, G, and H only
1
A, B, C, and D only
2
E, F, G, and H only
3
B, C, D, and E only
4
C, D, E, and F only
5
A, B, C, D, and E only
6
B, C, D, E, and F only
Min. (nm)
Max. (nm)
A490.0 495.0
Green
Min. (nm)
Max. (nm)
A515.0 520.0
B520.0 525.0
C525.0 530.0
D530.0 535.0
Emerald
Green
Min. (nm)
Max. (nm)
A552.5 555.5
B555.5 558.5
C558.5 561.5
D561.5 564.5
Yellow
Green
Min. (nm)
Max. (nm)
E564.5 567.5
F567.5 570.5
G570.5 573.5
H573.5 576.5
12
F594.5 597.0
Orange
Min. (nm)
Max. (nm)
A597.0 600.0
D606.0 609.0
E609.0 612.0
Red Orange
Min. (nm)
Max. (nm)
A
611.0616.0
B
616.0620.0
Red Min. (nm)
Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm.
Moisture Sensitivity
Packaging Option (X8X9)
Option
Test Current
Package Type
Reel Size
J1
20 mA
Top Mount
7 inch
J4
20 mA
Top Mount
13 inch
H1
20 mA
Reverse Mount
7 inch
H4
20 mA
Reverse Mount
13 inch
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
J2
10 mA
Top Mount
7 inch
A. Storage before use
J5
10 mA
Top Mount
13 inch
H2
10 mA
Reverse Mount
7 inch
H5
10 mA
Reverse Mount
13 inch
L2
2 mA
Top Mount
7 inch
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored
in sealed MBB with desiccant or desiccator at
<5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need
to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded
their floor life of 672 hours.
E. Baking is required if:
- “10%” is Not blue and “5%” HIC indicator turns
pink.
- The LEDs are exposed to condition of >30°C / 60%
RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
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www.avagotech.com
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Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes AV01-0040EN
AV02-0198EN - July 5, 2013