HSMx-A4xx-xxxxx SMT LED Surface Mount LED Indicator Data Sheet Description Avago Power PLCC-4 is an extension of our PLCC-2 SMT LEDs. The package can be driven at higher current due to its superior package design. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. Features • Industry standard PLCC-4 These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environmental conditions. This higher reliability makes them suitable for use under harsh environment and conditions like automotive. In addition, they are also suitable to be used in electronic signs and signals. • Available in full selection of colors To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin (except for red color), to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-thewave soldering process. There are a variety of colors and various viewing angles (30°, 60° and 120°) available in these SMT LEDs. Ideally, the 30° parts are suitable for light piping where focused intensities are required. As for the 60° and 120°, they are most suitable for automotive interior and exterior lighting and electronic signs applications. • High reliability LED package • High brightness using AlInGaP and InGaN dice technologies • High optical efficiency • Higher ambient temperature at the same current possible compared to PLCC-2 • Super wide viewing angle at 120˚ • Available in 8mm carrier tape on 7-inch reel • Compatible with both IR and TTW soldering process JEDEC MSL 2a Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting • Exterior automotive – Turn signals – CHMSL – Rear combination lamp – Puddle light • Electronic signs and signals – Interior full color sign – Variable message sign • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 0.8 ± 0.1 0.1 TYP. A C 3.2 ± 0.2 3.5 ± 0.2 0.8 ± 0.3 C C 0.5 ± 0.1 0.7 ± 0.1 CATHODE MARKING NOTES: ALL DIMENSIONS IN mm. ELECTRICAL CONNECTION BETWEEN ALL CATHODES IS RECOMMENDED. Device Selection Guide Color Red Red Orange Orange Amber Emerald Green Green Cyan Blue Part Number HSMC-A400-S30M1 HSMC-A401-T40M1 HSMC-A401-T80M1 HSMZ-A400-U80M1 HSMJ-A401-T40M1 HSMJ-A401-U40M1 HSMV-A400-U80M1 HSML-A401-U40M1 HSMA-A400-T35M1 HSMA-A401-U45M1 HSMU-A400-U85M1 HSME-A401-P4PM1 HSMM-A401-R7YM2 HSMM-A401-S4YM2 HSMM-A401-S7YM2 HSMM-A400-T8YM2 HSMK-A401-R40M2 HSMK-A400-T80M2 HSMN-A401-P4QM2 Min. IV (mcd) 180.00 285.00 355.00 560.00 285.00 450.00 560.00 450.00 285.00 450.00 560.00 45.00 140.00 180.00 224.00 355.00 112.50 355.00 45.00 Max. IV (mcd) 355.00 715.00 900.00 1400.00 715.00 1125.00 1400.00 1125.00 560.00 1125.00 1400.00 112.50 285.00 450.00 450.00 900.00 285.00 900.00 112.50 Test Current (mA) 50 50 50 50 50 50 50 50 50 50 50 50 30 30 30 30 30 30 30 Dice Technology AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP InGaN InGaN InGaN InGaN InGaN InGaN InGaN HSMN-A401-P7QM2 HSMN-A400-Q8QM2 56.00 90.00 112.50 224.00 30 30 InGaN InGaN Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV tolerance = ±12 %. 2 Part Numbering System HSM x1 – A x2 x3x4 – x5x6 x7 x8x9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N DC Forward Current[1] 70 mA[3,4] 70 mA[3,4] 30 mA Peak Forward Current [2] 200 mA 200 mA 90 mA Power Dissipation 180 mW 240 mW 114 mW Reverse Voltage 5V Junction Temperature 110°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C Notes: 1. Derate linearly as shown in figure 5. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 70 mA is recommended for best long-term performance. 4. Operation at currents below 5 mA is not recommended. 3 Optical Characteristics (TA = 25°C) Color Red Red Orange Orange Amber Yellow Green Emerald Green Green Cyan Blue Part Number HSMC Peak Wavelength λPEAK (nm) Typ. 635 Dominant Wavelength λD[1] (nm) Typ. 626 Viewing Angle 2θ1/2[2] (Degrees) Typ. 120 Luminous Efficacy ηv[3] (lm/W) Typ. 150 Luminous Intensity/ Total Flux Iv (mcd)/Φv (mlm) Typ. 0.45 HSMZ HSMJ HSMV HSML HSMA HSMU HSME HSME HSMM HSMK HSMN 639 621 623 609 592 594 576 568 518 502 468 630 615 617 605 590 592 575 567 525 505 470 120 120 120 120 120 120 120 120 120 120 120 155 240 263 320 480 500 560 610 500 300 75 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Notes: 1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25°C) Part Number Forward Voltage VF (Volts) @ IF = 50 mA Typ. Max. Reverse Voltage VR @ 100 µA Min. HSMC/J/L/A/E 2.2 2.5 5 HSMZ/V/U 2.8 3.4 Part Number Forward Voltage VF (Volts) @ IF = 30 mA Typ. Max. Reverse Voltage VR @ 10 µA Min. HSMM/K/N 3.8 5 5 4.6 1.0 RELATIVE INTENSITY 0.9 BLUE EMERALD GREEN CYAN YELLOW GREEN 0.8 0.7 GREEN AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE 0.3 RED 0.2 0.1 0 380 430 480 530 580 630 WAVELENGTH – nm Figure 1. Relative Intensity Vs. Wavelength. 4 680 730 780 70 1.2 60 HSMC/J/L/A/E HSMZ/V/U 50 40 30 20 10 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 30 mA) 1.4 RELATIVE INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT – mA 80 1.0 0.8 0.6 0.4 0.2 HSMM/K/N 0 0 1 2 3 4 5 80 70 50 300°C/W 40 470°C/W 30 20 10 0 0 20 40 60 80 20 30 40 50 100 120 300°C/W 350°C/W 20 470°C/W 15 10 5 0 0 20 60 40 80 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 -10 100 120 Figure 5b. Maximum Forward Current Vs. Ambient Temperature, Derated Based On TJmax = 110°C (InGaN). 0.1 10 ANGLE – DEGREES 5 0 5 0 30 10 15 20 30 25 35 Figure 4. Relative Intensity Vs. Forward Current (InGaN). 25 0.9 Figure 7. Radiation Pattern. 0.2 80 30 0.8 -30 0.4 540 1.0 -50 0.6 FORWARD CURRENT – mA AMBIENT TEMPERATURE – °C Figure 5a. Maximum Forward Current Vs. Ambient Temperature, Derated Based On TJmax = 110°C (AlInGaP). -70 70 35 AMBIENT TEMPERATURE – °C 0 -90 60 Figure 3. Relative Intensity Vs. Forward Current (AlInGaP). MAXIMUM FORWARD CURRENT – mA MAXIMUM FORWARD CURRENT – mA Figure 2. Forward Current Vs. Forward Voltage. 350°C/W 10 0.8 FORWARD CURRENT – mA FORWARD VOLTAGE – V 60 0 DOMINANT WAVELENGTH – nm 0 1.0 50 70 90 530 InGaN GREEN 520 510 500 InGaN CYAN 490 480 InGaN BLUE 470 460 0 5 10 15 20 25 30 35 CURRENT – mA Figure 6. Dominant Wavelength Vs. Forward Current – InGaN Devices. X X 2.60 (0.103) 0.40 (0.016) 1.10 (0.043) Y 0.50 (0.020) 4.50 (0.178) 1.50 (0.059) Y DIMENSIONS IN mm (INCHES). REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS SOLDER RESIST Figure 8a. Recommended Soldering Pad Pattern. X X 0.5 (0.020) 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079) 6.0 (0.236) 1.0 (0.039) 2.0 (0.079) 3.0 (0.118) Y DIMENSIONS IN mm (INCHES). REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS Thermal Resistance 300°C/W 350°C/W 470°C/W Solder Pad Area (xy) >16 mm2 >12 mm2 >8 mm2 10 to 20 SEC. Figure 8b. Recommended Soldering Pad Pattern (TTW). TEMPERATURE 217 °C TEMPERATURE 20 SEC. MAX. 240°C MAX. 3°C/SEC. MAX. 100-150°C 183°C 255 °C 3 °C/SEC. MAX. 125 °C ± 25 °C MAX. 120 SEC. * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. TIME Figure 9a. Recommended SnPb Reflow Soldering Profile. TEMPERATURE – °C BOTTOM SIDE OF PC BOARD 200 TOP SIDE OF PC BOARD 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA FLUXING 100 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 20 30 40 50 60 70 80 TIME – SECONDS Figure 10. Recommended Wave Soldering Profile. 6 Figure 9b. Recommended Pb-free Reflow Soldering Profile. Note: For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 10 60 to 150 SEC. TIME 120 SEC. MAX. 60-150 SEC. 0 6 °C/SEC. MAX. –6°C/SEC. MAX. 3°C/SEC. MAX. 50 30 +5 °C -0 °C 90 100 TRAILER COMPONENT LEADER 480 mm MIN. FOR ∅180 REEL. 960 mm MIN. FOR ∅330 REEL. 200 mm MIN. FOR ∅180 REEL. 200 mm MIN. FOR ∅330 REEL. C A USER FEED DIRECTION Figure 11. Tape Leader and Trailer Dimensions. +0.1 ∅1.5 –0 4 ± 0.1 2 ± 0.05 3.6 ± 0.1 B 1.75 ± 0.1 C C C A 5.5 ± 0.05 A A 3.8 ± 0.1 +0.3 12–0.1 ∅1 +0.1 –0 B 8 ± 0.1 0.229 ± 0.01 3.45 ± 0.1 VIEW B-B VIEW A-A ALL DIMENSIONS IN mm. Figure 12. Tape Dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling Orientation. 7 Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only. Color Bin Select (X7) Individual reel will contain parts from one full bin only. X5 X7 Min. Iv Bin X6 0 Full Distribution Z A and B only 0 Full Distribution Y B and C only 3 3 half bins starting from X51 W C and D only 4 4 half bins starting from X51 V D and E only 5 5 half bins starting from X51 U E and F only 7 3 half bins starting from X52 T F and G only 8 4 half bins starting from X52 S G and H only 9 5 half bins starting from X52 Q A, B and C only P B, C and D only N C, D and E only M D, E and F only L E, F and G only K F, G and H only 1 A, B, C and D only 2 E, F, G and H only 3 B, C, D and E only 4 C, D, E and F only 5 A, B, C, D and E only 6 B, C, D, E and F only Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) N1 28.50 35.50 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 Tolerance of each bin limit = ± 12% 8 Color Bin Limits Blue Min. (nm) A 460.0 B 465.0 C 470.0 D 475.0 Max. (nm) 465.0 470.0 475.0 480.0 Cyan A B C D Min. (nm) 490.0 495.0 500.0 505.0 Max. (nm) 495.0 500.0 505.0 510.0 Green A B C D Min. (nm) 515.0 520.0 525.0 530.0 Max. (nm) 520.0 525.0 530.0 535.0 Color Bin Limits Emerald Green Min. (nm) A 552.5 B 555.5 C 558.5 D 561.5 Max. (nm) 555.5 558.5 561.5 564.5 Yellow Green E F G H Min. (nm) 564.5 567.5 570.5 573.5 Max. (nm) 567.5 570.5 573.5 576.5 Amber/ Yellow A B C D E F Min. (nm) 582.0 584.5 587.0 589.5 592.0 594.5 Max. (nm) 584.5 587.0 589.5 592.0 594.5 597.0 Orange A B C D E Min. (nm) 597.0 600.0 603.0 606.0 609.0 Max. (nm) 600.0 603.0 606.0 609.0 612.0 Red Orange A B Min. (nm) 611.0 616.0 Max. (nm) 616.0 620.0 Red Min. (nm) Full Distribution Max. (nm) Tolerance of each bin limit = ± 1 nm Packaging Option (X8X9) Test Package Option Current Type M1 50 mA Top Mount M2 30 mA Top Mount Reel Size 7 inch 7 inch Forward Voltage Bin Table For HSMZ/V/U – A4xx-xxxxx only BIN VA VB VC VD VE MIN. 1.9 2.2 2.5 2.8 3.1 MAX. 2.2 2.5 2.8 3.1 3.4 Tolerance of each bin limit = ± 0.05 This product is qualified as Moisture Sensitive Level 2a per JEDEC JSTD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Refer to Avago Application Note AN 5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use – Unopen moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. – It is not recommended to open the MBB prior to assembly (e.g., for IQC). B. Control after opening the MBB – The humidity indicator card (HIC) shall be read immediately upon opening of MBB. – The LEDs must be kept at <30°C/60% RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. C. Control of unfinished reel – Unused LEDs need to be stored in sealed MBB with desiccant or in desiccator at <5% RH. D. Control of assembled boards – If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in sealed MBB with desiccant or in desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: – “10%” or “15%” HIC indicator turns pink. – The LEDs are exposed to conditions of >30°C/60% RH at any time. – The LEDs' floor life exceeds 672 hours. Recommended baking conditions: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0312EN AV02-0479EN June 20, 2007