I537/I538/I737/I738 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Product Features: Applications: Low Jitter, Non-PLL Based Output Available in Both Clipped Sinewave and HCMOS Output Levels Compatible with Leadfree Processing Frequency 3.20 Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 Fibre Channel 4 3 1 2 2.50 8.000 Mhz to 40 Mhz Output Level Clipped Sinewave HCMOS Output Load Clipped Sinewave HCMOS 1.2 Max. 0.8 V p-p Min. ‘0’=0.5 VDC Max., ‘1’=0.8Vcc Min. 0.10 20K Ohms / 10 pF 15pF Duty Cycle (HCMOS) 50% ±10% Rise / Fall Time (HCMOS) Frequency Stability Vs Temperature Vs Voltage Vs Load(5%) Frequency Tolerance @ 25 C 10 nS Max. See Frequency Stability Table 0.3 ppm Max. .0.2 ppm Max. 1.0 ppm Aging 1 ppm / Year Max. Supply Voltage See Supply Voltage Table , tolerance 5% Current 2.0 mA Max. (Clipped Sinewave) 1 2 4 3 0.60 0.10 Recommended Pad Layout 2.40 4 3 1 2 2.0 6.0 mA Max. (HCMOS) 1.5 VDC 1.0 VDC, 5.0 ppm Min. Voltage Control (I737/I738) Operating See Operating Temperature Table Storage -40 C to +85 C Phase Noise (Typ. @ 20 Mhz) -86 dBc/Hz @ 10 Hz -115 dBc/Hz @ 100 Hz -138 dBc/Hz @ 1KHz -146 dBc/Hz @ 10 Khz Package I537 (Clipped Sinewave TCXO) I538 (HCMOS TCXO) I737 (Clipped Sinewave TCVCXO) I738 (HCMOS TCVCXO) Part Number Guide Operating Temperature 7 = 0 C to +50 C 1.3 0.9 Pin 1 2 3 4 Connection Vcontrol / N.C. GND Output Vcc Dimension Units: mm Sample Part Number: I537-1Q3-20.000 Mhz FrequencyStability vs Temperature Supply Voltage **N = 1.0 ppm 3 = 3.3 V 1 = 0 C to +70 C **O = 1.5 ppm 7 = 3.0 V 3 = -20 C to +70 C **P = 2.0 ppm 2 = 2.7 V 2 = -40 C to +85 C Q = 2.5 ppm R = 3.0 ppm J = 5.0 ppm NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/11 _D 0.84 Specifications subject to change without notice Page 1 Frequency - 20.000 MHz I537/I538/I737/I738 Series 2.5 mm x 3.2 mm Ceramic Package SMD TCXO Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8 +/-.3 4 +/-.2 3.5 +/-.2 9 +/-1 or 12 +/-3 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I - Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/11 _D Specifications subject to change without notice Page 2