IC76 Series Shrink Dual Inline Package (SDIP) Specifications Part Number (Details) 1,000M W min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 20m W max. at 10mA/20mV max. Contact Resistance: 1A max. Current Rating: Operating Temperature Range: –40°C to +150°C cont. (IC7612) –40°C to +170°C cont. (IC7620) Mating Cycles: 25,000 to 50,000 insertions ** - 40 06 - G 4 IC76 MF Series No. Housing Material (12=PSF, 20= PES) No. of Contact Pins Materials and Finish Row Space (06 = 0.6 inches) Housing: Polysulphone (PSF), glass-filled - UL94V-0 rated Polyethersulphone (PES), glass-filled - UL94V-0 rated Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Contact Plating (G = Gold Plating) Straight, Through Hole Type Features MF = Flanged Unmarked = Not Flanged í Shrink pitch (1.778mm) sockets for high-density mounting í Dual wipe contacts ensure high reliability Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 3.2 2- Æ3.2 2- Æ3.2 Spot facing (Æ6.2, 3.0 deep) G K Pin Count Æ0.7 1.5 J J 1.2 B H G E 4.0 F D (Contact pos.) 0.4 1.778 C A B H 2- Æ3.2 14.5 K 3.0 0.5 1.778 2- Æ3.2 0.3 Part Number Pin Count A B C D IC76**-2003-G4 ** IC76**-2006-G4 ** IC76**-2203-G4 ** IC76**-2403-G4 ** IC76**-2804-G4 ** IC76**-3004-G4 ** IC76**-4006-G4 ** IC76**-4206-G4 ** IC76**-4806-G4 ** IC76**-5206-G4 ** IC76**-64075-G4** 20 20 22 24 28 30 40 42 48 52 64 20.0 19.5 22.0 24.0 27.5 29.0 38.0 39.5 45.0 48.5 59.5 1.778 x 9 = 16.002 1.778 x 9 = 16.002 1.778 x 10 = 17.78 1.778 x 11 = 19.558 1.778 x 13 = 23.114 1.778 x 14 = 24.892 1.778 x 19 = 33.782 1.778 x 20 = 35.56 1.778 x 23 = 40.894 1.778 x 25 = 44.45 1.778 x 31 = 55.118 17.0 24.6 17.0 17.0 19.5 19.5 24.6 24.6 24.6 24.6 28.4 8.3 15.9 8.3 8.3 10.8 10.8 15.9 15.9 15.9 15.9 19.7 Test & Burn-In E 2.0 8.0 2.0 2.0 2.9 2.9 8.0 8.0 8.0 8.0 11.8 F 7.5 10.3 7.5 7.5 8.0 8.0 10.3 10.3 10.3 10.3 13.7 G H J K 11.4 19.0 11.4 11.4 13.9 13.9 19.0 19.0 19.0 19.0 22.8 – – – – – – 25.5 25.5 26.0 28.0 29.5 23.0 30.6 23.0 23.0 25.5 25.5 30.6 30.6 30.6 30.6 38.2 11.0 11.0 11.0 13.0 16.5 16.5 25.5 25.5 26.0 28.0 29.5 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER IC121 Series Shrink Dual Inline Package (SDIP) Specifications Part Number (Details) 1,000M Wmin. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 20m W max. at 10mA max. Contact Resistance: 1A max. Current Rating: Operating Temperature Range: –40°C to +150°C Mating Cycles: 25,000 to 50,000 insertions - 52 IC121 06 - G 4 L MF Series No. No. of Contact Pins Row Space (06 = 0.6 inches) Materials and Finish Contact Plating (G = Gold Plating) Housing: Polyetherimide (PEI), glass-filled - UL94V-0 rated Contacts: Copper Alloy Plating: Gold over Nickel Straight Solder Dip Terminal Terminal Length Option: L = 5mm Unmarked = 3mm Features í Shrink pitch (1.778mm) sockets for high-density mounting í Dual wipe contacts ensure high reliability í Two terminal lengths (3mm / 5mm) available. The 5mm type can be used as a piggy-back socket MF = Flanged Unmarked = Not Flanged Outline Socket Dimensions Recommended PC Board Layout Top View from Socket A B 20 1.778 R 3.5 30 J ±0.1 D E J C G F D ±0.1 13.5 H ±0.1 4.0 H K B ±0.1 Æ3.3 Hole Æ3.3 1.778 ±0.05 1.2 3.0 5.0 Æ0.8 0.5 Part Number IC121-24055-G4 ** IC121-2403-G4 ** IC121-2804-G4 ** IC121-4006-G4 ** IC121-4206-G4 ** IC121-4806-G4 ** IC121-5206-G4 ** IC121-5606-G4 ** IC121-64075-G4 ** IC121-9009-G4 ** Pin Count A B 24 24 28 40 42 48 52 56 64 90 24.50 24.00 27.50 38.20 40.00 45.50 49.00 52.50 60.00 83.54 19.558 19.558 23.111 33.782 35.56 40.894 44.45 48.006 55.188 78.232 C 22.80 15.00 17.0 22.8 22.8 22.8 22.8 22.8 26.8 32.2 D E F G H J K 14.86 8.30 10.60 16.54 16.54 16.54 16.54 16.54 19.80 23.50 7.27 2.00 3.00 9.27 9.27 9.27 9.27 9.27 11.40 15.60 14.86 8.30 10.60 16.54 16.54 16.54 16.54 16.54 19.80 23.50 16.46 10.10 12.20 18.14 18.14 18.14 18.14 18.14 21.40 25.10 12.0 12.0 16.0 26.0 20.0 26.0 36.0 36.6 40.0 52.0 29.0 21.0 23.0 29.0 29.0 29.0 29.0 29.0 32.4 38.2 – – – 5.5 5.5 5.5 5.5 5.5 9.4 13.6 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Test & Burn-In