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Table 4:
Table 5:
Absolute Maximum Ratings
(Packaged Parts)(1)
Condition
Value
Condition
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(Packaged Parts)
r9WR9
Value
&RPPHUFLDORSHUDWLQJ
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Table 6: DC Parameters (Packaged Parts)
Symbol
Min(2)
Parameters
9,/
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9,+
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92/
Typ (1)
Max(2)
Units
Conditions
9&&[
9
9
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9
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5$&,172XWSXW/RZ9ROWDJH
9
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Table 6: DC Parameters (Packaged Parts)
Symbol
Min(2)
Parameters
Typ (1)
Max(2)
Units
5$1$,1
$1$,1,QSXW5HVLVWDQFH
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5$1$,1
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Table 7: AC Parameters (Packaged Parts)
Symbol
)6
)&)
10
Characteristic
6DPSOLQJ
)UHTXHQF\
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Min(2)
Typ(1)
Max(2)
Units
Conditions
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Table 7: AC Parameters (Packaged Parts)
Symbol
Characteristic
Min(2)
Typ(1)
Max(2)
Units
Conditions
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Table 7: AC Parameters (Packaged Parts)
Symbol
Min(2)
Characteristic
Typ(1)
Max(2)
Units
Conditions
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Table 8:
Absolute Maximum Ratings (Die)
Condition
Operating Conditions (Die)
Value
Condition
-XQFWLRQWHPSHUDWXUH
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6WRUDJHWHPSHUDWXUHUDQJH
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9
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9&&r966
Table 9:
Value
&RPPHUFLDORSHUDWLQJ
WHPSHUDWXUHUDQJH
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6XSSO\YROWDJH9&&
9WR9
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966 966$ 966'
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Table 10: DC Parameters (Die)
Symbol
Parameters
9,/
,QSXW/RZ9ROWDJH
9,+
,QSXW+LJK9ROWDJH
92/
Min(2)
Typ(1)
Max(2)
Units
Conditions
9&& [ 9
9
2XWSXW/RZ9ROWDJH
9
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92/
5$&,172XWSXW/RZ9ROWDJH
9
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92+
2XWSXW+LJK9ROWDJH
9
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9&&&XUUHQW2SHUDWLQJ
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P$
P$
5(;7 ∞
5(;7 ∞
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13
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Table 10: DC Parameters (Die)
Symbol
Min(2)
Parameters
Typ(1)
Max(2)
Units
5$1$,1
$1$,1,QSXW5HVLVWDQFH
.Ω
5$1$,1
$1$,1r,QSXW5HVLVWDQFH
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$$53
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G%
Conditions
7\SLFDOYDOXHV#7$ ƒ&DQG9
$OOPLQPD[OLPLWVDUHJXDUDQWHHGE\,6'YLDHOHFWULFDOWHVWLQJRUFKDUDFWHUL]DWLRQ1RWDOOVSHFLILFDWLRQVDUH
SHUFHQWWHVWHG
:KHQGULYHQE\DYROWPLFURFRQWUROOHUWKHPD[LPXP9,+IRUWKH026,6&/.DQG66SLQVLV YROWV
9&&$DQG9&&'FRQQHFWHGWRJHWKHU
66 9&&$ 9&&';&/. 026, 966$ 966'DQGDOORWKHUSLQVIORDWLQJ
0HDVXUHGZLWK$XWR0XWHIHDWXUHGLVDEOHG
Table 11: AC Parameters (Die)
Symbol
)6
Characteristic
6DPSOLQJ
)UHTXHQF\
Min(2)
Typ (1)
Max(2)
Units
Conditions
,6'
,6'
,6'
,6'
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.+]
.+]
.+]
.+]
.+]
.+]
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G%5ROO2II3RLQW
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Table 11: AC Parameters (Die)
Symbol
75$&/2
Characteristic
5$&&ORFN/RZ
7LPH
Min(2)
Typ (1)
Max(2)
Units
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,6'
PVHF
PVHF
PVHF
PVHF
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Table 12: SPI AC Parameters(1)
Symbol
Characteristics
Min
Max
Units
7666
666HWXS7LPH
QVHF
766+
66+ROG7LPH
QVHF
7',6
'DWDLQ6HWXS7LPH
QVHF
7',+
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QVHF
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QVHF
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2XWSXW'HOD\WRKL=
QVHF
766PLQ
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76&.KL
6&/.+LJK7LPH
QVHF
76&.ORZ
6&/./RZ7LPH
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Figure 5: Timing Diagram
Figure 6: 8-Bit Command Format
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Figure 7: 16-Bit Command Format
Figure 8: Playback/Record and Stop Cycle
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Figure 9: Application Example Using SPI
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Figure 10: Application Example Using Microwire
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Figure 11: Application Example Using SPI Port on Microcontroller
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Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type I (E)
Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions
INCHES
Min
Nom
Max
Min
Nom
Max
$
%
&
'
(
)
*
+
Š
Š
Š
Š
Š
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,
-
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Figure 13: 28-Lead 0.600-Inch Plastic Dual Inline Package (PDIP) (P)
Table 14: Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
$
Min
Nom
Max
Min
Nom
Max
%
%
&
&
'
'
(
)
*
+
22
MILLIMETERS
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Figure 14: 28-Lead 0.300-Inch Plastic Small Outline Integrated Circuit (SOIC) (S)
Table 15: Plastic Small Outline Integrated Circuit (SOIC) (S) Dimensions
INCHES
Min
Nom
Max
Min
Nom
Max
$
%
&
'
(
)
*
+
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Figure 15: ISD33060/075/090/120-4 Products Bonding Physical Layout(1) (Unpackaged Die)
966'
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Table 16: ISD33060/075/090/120-4 Devices PIN/PAD Designations,
with Respect to Die Center (µm)
Pin
Pin Name
X Axis
Y Axis
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Part Number
Part Number
Part Number
Part Number
,6'(
,6'(
,6'(
,6'3
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,6'('
,6'('
,6';
,6'(,
,6'(,
,6'(,
,6'3
,6'3
,6'3
,6'3'
,6'3'
,6'3'
,6'3,
,6'3,
,6'3,
,6'6
,6'6
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