IDT72401 IDT72403 CMOS PARALLEL FIFO 64 x 4 and 64 x 5 FEATURES: • • • • • • • • • • • • • • • • has an Output Enable (OE) pin. The FlFOs accept 4-bit data at the data input (D0-D3). The stored data stack up on a first-in/first-out basis. A Shift Out (SO) signal causes the data at the next to last word to be shifted to the output while all other data shifts down one location in the stack. The Input Ready (IR) signal acts like a flag to indicate when the input is ready for new data (IR = HIGH) or to signal when the FIFO is full (IR = LOW). The IR signal can also be used to cascade multiple devices together. The Output Ready (OR) signal is a flag to indicate that the output remains valid data (OR = HIGH) or to indicate that the FIFO is empty (OR = LOW). The OR can also be used to cascade multiple devices together. Width expansion is accomplished by logically ANDing the IR and OR signals to form composite signals. Depth expansion is accomplished by tying the data inputs of one device to the data outputs of the previous device. The IR pin of the receiving device is connected to the SO pin of the sending device and the OR pin of the sending device is connected to the Shift In (SI) pin of the receiving device. Reading and writing operations are completely asynchronous allowing the FIFO to be used as a buffer between two digital machines of widely varying operating frequencies. The 45MHz speed makes these FlFOs ideal for highspeed communication and controller applications. Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B. First-ln/First-Out Dual-Port memory 64 x 4 organization (IDT72401/72403) RAM-based FIFO with low falI-through time Low-power consumption — Active: 175mW (typ.) Maximum shift rate — 45MHz High data output drive capability Asynchronous and simultaneous read and write Fully expandable by bit width Fully expandable by word depth IDT72403 have Output Enable pin to enable output data High-speed data communications applications High-performance CMOS technology Available in CERDIP, plastic DIP and SOIC Military product compliant to MlL-STD-883, Class B Standard Military Drawing #5962-86846 and 5962-89523 is listed on this function. Industrial temperature range (–40°°C to +85°°C) is available (plastic packages only) DESCRIPTION: The IDT72401 and IDT72403 are asynchronous high-performance First-ln/First-Out memories organized 64 words by 4 bits. The IDT72403 also FUNCTIONAL BLOCK DIAGRAM SI IR INPUT CONTROL LOGIC D0-3 DATA IN MR MASTER RESET WRITE POINTER WRITE MULTIPLEXER OUTPUT ENABLE OE (IDT72403 only) MEMORY ARRAY DATA IN Q0-3 READ MULTIPLEXER READ POINTER MASTER RESET SO OR 2747 drw01 IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. FAST is a trademark of National Semiconductor, Inc. MILITARY AND COMMERCIAL TEMPERATURE RANGES OCTOBER 2005 1 © 2005 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. DSC-2747/10 IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 MILITARY AND COMMERCIAL TEMPERATURE RANGES PIN CONFIGURATIONS IDT72401/IDT72403 NC/OE(1) IR SI D0 D1 D2 D3 GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 9 8 Vcc SO OR Q0 Q1 Q2 Q3 MR 2747 drw 02 PLASTIC DIP (P16-1, ORDER CODE: P) CERDIP (D16-1, ORDER CODE: D) SOIC (SO16-1, ORDER CODE: SO) TOP VIEW NOTE: 1. Pin 1: NC - No Connection IDT72401, OE - IDT72403 RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS(1) Symbol Parameter Min. Typ. Max. Unit 4.5 5.0 5.5 V 0 0 0 V Input High Voltage 2.0 — — V Input High Voltage — — 0.8 V Operating Temperature Commercial Operating Temperature Military 0 –55 — — 70 125 °C °C Symbol Rating Commercial Military Unit VCC Supply Voltage Commercial/Military VTERM Terminal Voltage with Respect to GND –0.5 to +7.0 –0.5 to +7.0 V GND Supply Voltage TSTG IOUT Storage Temp. DC Output Current –55 to +125 –50 to +50 –65 to +150 –50 to +50 °C mA VIH VIL(1) TA TA NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. NOTE: 1. 1.5V undershoots are allowed for 10ns once per cycle. DC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C) IDT72401 IDT72403 Commercial fIN = 45, 35, 25, 15, 10 MHz Symbol IIL IIH VOL VOH IOS(1) IHZ(2) ILZ(2) ICC(3,4) Parameter Low-Level Input Current High-Level Input Current Low-Level Output Voltage High-Level Output Voltage Output Short-Circuit Current HIGH Impedance Output Current LOW Impedance Output Current Active Supply Current Test Conditions VCC = Max., GND ≤ VI ≤ VCC VCC= Max., GND ≤ VI ≤ VCC VCC= Min., IOL = 8mA VCC= Min., IOH = –4mA VCC= Max., VO = GND VCC= Max., VO = 2.4V VCC= Max., VO = 0.4V VCC= Max., f = 10MHz Min. –10 — — 2.4 –20 — –20 — Max. — 10 0.4 — –110 20 — 35 IDT72401 IDT72403(5) Military fIN = 35, 25, 15, 10 MHz Min. –10 — — 2.4 –20 — –20 — NOTES: 1. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second. Guaranteed but not tested. 2. IDT72403 only. 3. Tested with outputs open (IOUT = 0). OE is HIGH for IDT72403. 4. For frequencies greater than 10MHz, ICC = 35mA + (1.5mA x [f –10MHz]) commercial, and ICC = 45mA + (1.5mA x [f –10MHz]) military. 5. Military availability for IDT72403 is 10MHz, 35MHz. IDT72401 is available for all MHz. 2 Max. — 10 0.4 — –110 20 — 45 Unit µA µA V V mA µA µA mA MILITARY AND COMMERCIAL TEMPERATURE RANGES IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 OPERATING CONDITIONS (Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C) Symbol t SIH (1) Parameter Shift in HIGH Time Figure 2 Commercial IDT72401L45 IDT72403L45 Min. Max. 9 — IDT72401L35 IDT72403L35 Min. Max. 9 — Commercial and Military(5) IDT72401L25 IDT72401L15 IDT72403L25 IDT72403L15 Min. Max. Min. Max. 11 — 11 — IDT72401L10 IDT72403L10 Min. Max. 11 — Unit ns tSIL tIDS Shift in LOW TIme Input Data Set-up 2 2 11 0 — — 17 0 — — 24 0 — — 25 0 — — 30 0 — — ns ns tIDH t SOH (1) Input Data Hold Time Shift Out HIGH Time 2 5 13 9 — — 15 9 — — 20 11 — — 30 11 — — 40 11 — — ns ns t SOL tMRW Shift Out LOW Time Master Reset Pulse 5 8 11 20 — — 17 25 — — 24 25 — — 25 25 — — 25 30 — — ns ns tMRS tSIR Master Reset Pulse to SI Data Set-up to IR 8 4 10 3 — — 10 3 — — 10 5 — — 25 5 — — 35 5 — — ns ns tHIR t SOR (4) Data Hold from IR Data Set-up to OR HIGH 4 7 13 0 — — 15 0 — — 20 0 — — 30 0 — — 30 0 — — ns ns AC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 5.0V ± 10%, TA = 0°C to +70°C; Military: VCC = 5.0V ± 10%, TA = –55°C to +125°C) Symbol f IN Parameter Figure Commercial IDT72401L45 IDT72403L45 Min. Max. IDT72401L35 IDT72403L35 Min. Max. Commercial and Military(5) IDT72401L25 IDT72401L15 IDT72403L25 IDT72403L15 Min. Max. Min. Max. IDT72401L10 IDT72403L10 Min. Max. Unit Shift In Rate 2 — 45 — 35 — 25 — 15 — 10 MHz (1) Shift In to Input Ready LOW 2 — 18 — 18 — 21 — 35 — 40 ns (1) Shift In to Input Ready HIGH 2 — 18 — 20 — 28 — 40 — 45 ns Shift Out Rate 5 — 45 — 35 — 25 — 15 — 10 MHz Shift Out to Output Ready LOW 5 — 18 — 18 — 19 — 35 — 40 ns Shift Out to Output Ready HIGH 5 — 19 — 20 — 34 — 40 — 55 ns tODH Output Data Hold (Previous Word) 5 5 — 5 — 5 — 5 — 5 — ns tODS Output Data Shift (Next Word) t PT Data Throughput or "Fall-Through" tMRORL t IRL t IRH f OUT t ORL (1) (1) t ORH 5 — 19 — 20 — 34 — 40 — 55 ns 4, 7 — 30 — 34 — 40 — 65 — 65 ns Master Reset to OR LOW 8 — 25 — 28 — 35 — 35 — 40 ns tMRIRH Master Reset to IR HIGH 8 — 25 — 28 — 35 — 35 — 40 ns tMRQ Master Reset to Data Output LOW 8 — 20 — 20 — 25 — 35 — 40 ns Output Valid from OE LOW 9 — 12 — 15 — 20 — 30 — 35 ns Output High-Z from OE HIGH 9 — 12 — 12 — 15 — 25 — 30 ns Input Ready Pulse HIGH 4 9 — 9 — 11 — 11 — 11 — ns Output Ready Pulse HIGH 7 9 — 9 — 11 — 11 — 11 — ns t OOE (3) t HZOE t IPH (3,4) (2,4) t OPH (2,4) NOTES: 1. Since the FIFO is a very high-speed device, care must be excercised in the design of the hardware and timing utilized within the design. Device grounding and decoupling are crucial to correct operation as the FIFO will respond to very small glitches due to long reflective lines, high capacitances and/or poor supply decoupling and grounding. A monolithic ceramic capacitor of 0.1µF directly between VCC and GND with very short lead length is recommended. 2. This parameter applies to FIFOs communicating with each other in a cascaded mode. IDT FIFOs are guaranteed to cascade with other IDT FIFOs of like speed grades. 3. IDT72403 only. 4. Guaranteed by design but not currently tested. 5. Military availability for IDT72403 is 10MHz, 35MHz. IDT72401 is available for all MHz. 3 IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 MILITARY AND COMMERCIAL TEMPERATURE RANGES ALL INPUT PULSES: AC TEST CONDITIONS Input Pulse Levels GND to 3.0V Input Rise/Fall Times 3.0V 3ns Input Timing Reference Levels 1.5V Output Reference Levels 90% GND 1.5V Output Load 90% 10% 10% <3ns <3ns See Figure 1 2747 drw 04 5V 1.1KΩ CAPACITANCE OUTPUT (TA = +25°C, f = 1.0MHz) Symbol Parameter Conditions Max. Unit CIN Input Capacitance VIN = 0V 5 pF COUT Output Capacitance VOUT = 0V 7 pF 560Ω 30pF* 2747 drw 05 NOTE: 1. Characterized values, not currently tested. or equivalent circuit Figure 1. AC Test Load *Including scope and jig SIGNAL DESCRIPTIONS INPUT READY (IR) When Input Ready is HIGH, the FIFO is ready for new input data to be written to it. When IR is LOW the FIFO is unavailable for new input data. IR is also used to cascade many FlFOs together, as shown in Figures 10 and 11. INPUTS: DATA INPUT (D0-3) Data input lines. The IDT72401 and IDT72403 have a 4-bit data input. OUTPUT READY (OR) When Output Ready is HIGH, the output (Q0-3) contains valid data. When OR is LOW, the FIFO is unavailable for new output data. OR is also used to cascade many FlFOs together, as shown in Figures 10 and 11. CONTROLS: SHIFT IN (SI) Shift In controls the input of the data into the FIFO. When SI is HIGH, data can be written to the FIFO via the D0-3 lines. OUTPUT ENABLE (OE) (IDT72403 ONLY) Output enable is used to read FIFO data onto a bus. OE is active LOW. SHIFT OUT (SO) Shift Out controls the output of data of the FIFO. When SO is HIGH, data can be read from the FIFO via the Data Output (Q0-3) lines. OUTPUTS: DATA OUTPUT (Q0-3) Data Output lines. The IDT72401 and IDT72403 have a 4-bit data output. MASTER RESET (MR) Master Reset clears the FIFO of any data stored within. Upon power up, the FIFO should be cleared with a MR. MR is active LOW. 4 MILITARY AND COMMERCIAL TEMPERATURE RANGES IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 FUNCTIONAL DESCRIPTION DATA OUTPUT Data is shifted out on the HlGH-to-LOW transition of Shift Out (SO). This causes the internal read pointer to be advanced to the next word location. If data is present, valid data will appear on the outputs and Output Ready (OR) will go HIGH. If data is not present, OR will stay LOW indicating the FIFO is empty. The last valid word read from the FIFO will remain at the FlFOs output when it is empty. When the FIFO is not empty, OR goes LOW on the LOW-to-HIGH transition of SO. Previous data remains on the output until the HIGH-to-LOW transition of SO). FALL THROUGH MODE The FIFO operates in a fall-through mode when data gets shifted into an empty FIFO. After a fall-through delay the data propagates to the output. When the data reaches the output, the Output Ready (OR) goes HIGH. Fall-through mode also occurs when the FIFO is completely full. When data is shifted out of the full FIFO, a location is available for new data. After a fall-through delay, the Input Ready (IR) goes HIGH. If Shift In (SI) is HIGH, the new data can be written to the FIFO. Since these FlFOs are based on an internal dual-port RAM architecture with separate read and write pointers, the fall-through time (tPT) is one cycle long. A word may be written into the FIFO on a clock cycle and can be accessed on the next clock cycle. The 64 x 4 FIFO is designed using a dual port RAM architecture as opposed to the traditional shift register approach. This FIFO architecture has a write pointer, a read pointer and control logic, which allow simultaneous read and write operations. The write pointer is incremented by the falling edge of the Shift In (Sl) control; the read pointer is incremented by the falling edge of the Shift Out (SO). The Input Ready (IR) signals when the FIFO has an available memory location; Output Ready (OR) signals when there is valid data on the output. Output Enable (OE) provides the capability of three-stating the FIFO outputs. FIFO RESET The FIFO must be reset upon power up using the Master Reset (MR) signal. This causes the FlFO to enter an empty state, signified by Output Ready (OR) being LOW and Input Ready (IR) being HIGH. In this state, the data outputs (Q0-3) will be LOW. DATA INPUT Data is shifted in on the LOW-to-HlGH transition of Shift In (Sl). This loads input data into the first word location of the FIFO and causes Input Ready (IR) to go LOW. On the HlGH-to-LOW transition of SI, the write pointer is moved to the next word position and IR goes HIGH, indicating the readiness to accept new data. If the FIFO is full, IR will remain LOW until a word of data is shifted out. 1/fIN tSIH 1/fIN tSIL SI tIRH IR tIDS tIRL tIDH INPUT DATA 2747 drw 06 Figure 2. Input Timing SI (7) (2) (4) (1) INPUT DATA (5) (3) IR (6) STABLE DATA 2747 drw 07 NOTES: 1. IR HIGH indicates space is available and a SI pulse may be applied. 2. Input Data is loaded into the first word. 3. IR goes LOW indicating the first word is full. 4. The write pointer is incremented. 5. The FIFO is ready for the next word. 6. If the FIFO is full then the IR remains LOW. 7. SI pulses applied while IR is LOW will be ignored (see Figure 4). Figure 3. The Mechanism of Shifting Data Into the FIFO 5 IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 MILITARY AND COMMERCIAL TEMPERATURE RANGES (2) SO (3) SI (5) tIPH tPT (4) IR (1) tSIR tHIR STABLE DATA INPUT DATA 2747 drw 08 NOTES: 1. FIFO is initially full. 2. SO pulse is applied. 3. SI is held HIGH. 4. As soon as IR becomes HIGH the Input Data is loaded into the FIFO. 5. The write pointer is incremented. SI should not go LOW until (t PT + t IPH ). Figure 4. Data is Shifted In Whenever Shift In and Input Ready are Both HIGH 1/fOUT tSOH 1/fOUT tSOL SO (2) tORH OR (1) tORL tODS tODH A-DATA OUTPUT DATA B-DATA C-DATA 2747 drw 09 NOTES: 1. This data is loaded consecutively A, B, C. 2. Data is shifted out when SO makes a HIGH to LOW transition. Figure 5. Output TIming (7) (2) SO (4) (1) OR (5) (3) (6) A or B OUTPUT DATA A- DATA B- DATA 2747 drw 10 NOTES: 1. OR HIGH indicates that data is available and a SO pulse may be applied. 2. SO goes HIGH causing the next step. 3. OR goes LOW. 4. The read pointer is incremented. 5. OR goes HIGH indicating that new data (B) is now available at the FIFO outputs. 6. If the FIFO has only one word loaded (A DATA) then OR stays LOW and the A DATA remains unchanged at the outputs. 7. SO pulses applied when OR is LOW will be ignored. Figure 6. The Mechanism of Shifting Data Out of the FIFO 6 MILITARY AND COMMERCIAL TEMPERATURE RANGES IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 SI SO tOPH tPT OR (1) tSOR DATA VALID DATA OUTPUT 2747 drw 11 NOTE: 1. FIFO initially empty. Figure 7. tPT and tOPH Specification tMRW MR tMRIRH IR (1) tMRORL (1) OR tMRS SI tMRQ DATA OUTPUT 2747 drw 12 NOTE: 1. Worst case, FIFO initially full. Figure 8. Master Reset Timing OE tHZOE tOOE DATA OUT 2747 drw 13 NOTE: 1. High-Z transitions are referenced to the steady-state V OH –500mV and VOL +500mV levels on the output. tHZOE is tested with 5pF load capacitance instead of 30pF as shown in Figure 1. Figure 9. Output Enable Timing, IDT72403 Only SHIFT IN INPUT READY DATA IN SI IR D0 D1 D2 D3 MR OR SO Q0 Q1 Q2 Q3 SI IR D0 D1 D2 D3 MR OR SO Q0 Q1 Q2 Q3 OUTPUT READY SHIFT OUT DATA OUT 2747 drw 14 MR NOTE: 1. FIFOs can be easily cascaded to any desired path. The handshaking and associated timing between the FIFOs are handled by the inherent timing of the devices. Figure 10. 128 x 4 Depth Expansion 7 IDT72401/72403 CMOS PARALLEL FIFO 64 x 4, 64 x 5 IR SI D0 D1 D2 D3 COMPOSITE INPUT READY SHIFT IN IR SI D0 D1 D2 D3 IR SI D0 D1 D2 D3 MILITARY AND COMMERCIAL TEMPERATURE RANGES MR MR MR SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 MR MR MR SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 SO OR Q0 Q1 Q2 Q3 IR SI D0 D1 D2 D3 MR MR MR SO OR Q0 Q1 Q2 Q3 SO OR Q0 Q1 Q2 Q3 SHIFT OUT COMPOSITE OUTPUT READY SO OR Q0 Q1 Q2 Q3 MR 2747 drw 15 NOTES: 1. When the memory is empty, the last word will remain on the outputs until the MR is strobed or a new data word falls through to the output. However, OR will remain LOW, indicating data at the output is not valid. 2. When the output data changes as a result of a pulse on SO, the OR signal always goes LOW before there is any change in output data and stays LOW until the new data has appeared on the outputs. Anytime OR is HIGH, there is valid stable data on the outputs. 3. If SO is held HIGH while the memory is empty and a word is written into the input, that word will appear at the output after a fall-through time. OR will go HIGH for one internal cycle (at least tORL) and then go back LOW again. The stored word will remain on the outputs. If more words are written into the FIFO, they will line up behind the first word and will not appear on the outputs until SO has been brought LOW. 4. When the MR is brought LOW, the outputs are cleared to LOW, IR goes HIGH and OR goes LOW. If SI is HIGH when the MR goes HIGH, the data on the inputs will be written into the memory and IR will return to the LOW state until SI is brought LOW. If SI is LOW when the MR is ended, IR will go HIGH, but the data in the inputs will not enter the memory until SI goes HIGH. 5. FIFOs are expandable on depth and width. However, in forming wider words, two external gates are required to generate composite Input and OR flags. This is due to the variation of delays of the FIFOs. Figure 11. 192 x 12 Depth and Width Expansion 8 ORDERING INFORMATION IDT XXXXX X X X X Device Type Power Speed Package Process/ Temperature Range NOTE: 1. Industrial temperature range is available by special order. Blank B Commercial (0°C to+70°C) Military (-55°C to+125°C) Compliant to MIL-STD-883, Class B P D SO Plastic DIP 300 mil, P16-1 CERDIP 300 mil, D16-1 Small Outline IC SOIC, SO16-1 45 35 25 15 10 Commercial Only Commercial and Military Commercial and Military>72401 only Commercial and Military>72401 only Commercial and Military L Low Power 72401 72403 64 x 4 FIFO 64 x 4 FIFO Shift Frequency (fs) Speed in MHz 2747 drw 16 DATASHEET DOCUMENT HISTORY 07/10/2003 pgs. 2, 3, and 9. 10/27/2005 pgs. 1- 9. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 9 for Tech Support: 408-360-1753 email: [email protected]