IP4251/52/53/54 Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4 Rev. 03 — 6 May 2009 Product data sheet 1. Product profile 1.1 General description The IP425x family consists of 4-, 6- and 8-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, the IP425x family incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV. The IP425x family is fabricated using monolithic silicon technology and integrates up to 8 resistors and 16 diodes in a 0.4 mm pitch 8-, 12- or 16-pin MicroPak (compatible with QFN) lead-free plastic package with a height of 0.5 mm only. 1.2 Features n Pb-free, Restriction of the use of certain Hazardous Substances (RoHS) and dark green compliant n 4-, 6- and 8-channel integrated π-type RC filter network n IP4251CZ8/CZ12/CZ16: 100 Ω channel series resistance, 10 pF (at 2.5 V DC) channel capacitance n IP4252CZ8/CZ12/CZ16: 40 Ω channel series resistance, 12 pF (at 2.5 V DC) channel capacitance n IP4253CZ8/CZ12/CZ16: 200 Ω channel series resistance, 30 pF (at 2.5 V DC) channel capacitance n IP4254CZ8/CZ12/CZ16: 100 Ω channel series resistance, 30 pF (at 2.5 V DC) channel capacitance n ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 standard far exceeding level 4 n MicroPak (QFN compatible) plastic package with 0.4 mm pitch 1.3 Applications n General purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: u Cellular and Personal Communication System (PCS) mobile handsets u Cordless telephones u Wireless data (WAN/LAN) systems u PDAs IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 2. Pinning information Table 1. Pin Pinning IP425xCZx Description Simplified outline Symbol CZ8 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground 8 Rs(ch) 5 1, 2, 3, 4 5, 6, 7, 8 Cch 2 1 4 Transparent top view Cch 2 GND 001aaf978 CZ12 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 filter channel 4 5 and 8 filter channel 5 6 and 7 filter channel 6 ground pad ground 12 Rs(ch) 7 1, 2, 3, 4, 5, 6 1 Cch 2 Cch 2 7, 8, 9, 10, 11, 12 6 Transparent top view GND 001aaf979 CZ16 1 and 16 filter channel 1 2 and 15 filter channel 2 3 and 14 filter channel 3 4 and 13 filter channel 4 5 and 12 filter channel 5 6 and 11 filter channel 6 7 and 10 filter channel 7 8 and 9 filter channel 8 ground pad ground 16 1, 2, 3, 4, 5, 6, 7, 8 1 Cch 2 Cch 2 9, 10, 11, 12, 13, 14, 15, 16 8 Transparent top view IP4251_52_53_54_3 Product data sheet Rs(ch) 9 GND 001aaf980 © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 2 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 3. Ordering information Table 2. Ordering information Type number Package Name Description Version HXSON8U plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm SOT983-1 IP4251CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm SOT984-1 IP4251CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm SOT985-1 IP4252CZ8-4 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm SOT983-1 IP4252CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm SOT984-1 IP4252CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm SOT985-1 IP4253CZ8-4 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm SOT983-1 IP4253CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm SOT984-1 IP4253CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm SOT985-1 IP4254CZ8-4 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm SOT983-1 IP4254CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm SOT984-1 IP4254CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm SOT985-1 IP4251CZ8-4 HXSON8U HXSON8U HXSON8U IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 3 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage Vesd electrostatic discharge voltage Min Max Unit −0.5 +5.6 V all pins to ground contact discharge IP4251 and IP4252 [1][3] −15 +15 kV IP4253 and IP4254 [2][3] −30 +30 kV [2][3] −30 +30 kV contact discharge −8 +8 kV air discharge −15 +15 kV air discharge IP4253 and IP4254 IEC 61000-4-2, level 4; all pins to ground Pch channel power dissipation Tamb = 85 °C - 60 mW Ptot total power dissipation Tamb = 85 °C - 200 mW Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C [1] Device is qualified using contact discharges at ±15 kV according IEC 61000-4-2 model, far exceeding level 4. [2] Device is qualified using contact discharges at ±30 kV according IEC 61000-4-2 model, far exceeding level 4. [3] A special robust test is performed stressing the devices with ≥ 1000 contact discharges according IEC 61000-4-2 model. All devices far exceed IEC 61000-4-2, level 4. 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Rth(j-pcb) [1] Conditions thermal resistance from junction to 2 layer printed-circuit printed-circuit board board Unit 120[1] K/W Depends on layout details. IP4251_52_53_54_3 Product data sheet Typ © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 4 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 6. Characteristics Table 5. Channel resistance Tamb = 25 °C unless otherwise specified. Symbol Parameter Rs(ch) Conditions Min Typ Max Unit channel series resistance IP4251CZ8/CZ12/CZ16 80 100 120 Ω IP4252CZ8/CZ12/CZ16 32 40 48 Ω IP4253CZ8/CZ12/CZ16 160 200 240 Ω IP4254CZ8/CZ12/CZ16 80 100 120 Ω Min Typ Max Unit IP4251 - 10 - pF IP4252 - 12 - pF IP4253 and IP4254 - 30 - pF Table 6. Channel characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Cch channel capacitance for the total channel; f = 100 kHz Vbias(DC) = 2.5 V Vbias(DC) = 0 V IP4251 [1] - 15 - pF IP4252 [1] - 18 - pF IP4253 and IP4254 [1] - 45 - pF ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 µA VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V VF forward voltage negative clamp; IF = 1 mA 0.4 - 1.5 V [1] Guaranteed by design. IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 5 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network Table 7. Frequency characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 800 MHz < f < 3 GHz - 16 - dB f = 1 GHz - 20 - dB - 30 - dB IP4251CZ8/CZ12/CZ16 αil αct Rsource = 50 Ω; RL = 50 Ω insertion loss crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz IP4252CZ8/CZ12/CZ16 αil αct Rsource = 50 Ω; RL = 50 Ω insertion loss crosstalk attenuation 800 MHz < f < 3 GHz - 12 - dB f = 1 GHz - 14 - dB - 40 - dB 800 MHz < f < 3 GHz - 33 - dB f = 1 GHz 35 - - dB - 30 - dB Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz IP4253CZ8/CZ12/CZ16 αil αct Rsource = 50 Ω; RL = 50 Ω insertion loss crosstalk attenuation Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz IP4254CZ8/CZ12/CZ16 αil αct Rsource = 50 Ω; RL = 50 Ω insertion loss crosstalk attenuation 800 MHz < f < 3 GHz - 28 - dB f = 1 GHz 30 - - dB - 30 - dB Rsource = 50 Ω; RL = 50 Ω; 800 MHz < f < 3 GHz 7. Application information 7.1 Insertion loss The IP425x family is mainly designed as EMI/RFI filters for multi-channel interfaces. The measured insertion loss in a 50 Ω system for IP4251, IP4253 and IP4254 and the simulated insertion loss for IP4252 is depicted in Figure 2. The insertion loss was measured using the test set-up as depicted in Figure 1. IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 6 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 001aaj308 0 S21 (dB) −10 (1) (2) (3) (4) −20 −30 IN OUT DUT 50 Ω 50 Ω −40 Vgen −50 10−1 1 10 102 001aag218 103 104 f (MHz) (1) IP4252CZ16 - ch1 to ch16 (2) IP4251CZ16 - ch1 to ch16 (3) IP4254CZ16 - ch1 to ch16 (4) IP4253CZ16 - ch1 to ch16 Fig 1. Frequency response set-up Fig 2. 001aaj608 0 IP425x family frequency response curves 001aaj609 0 S21 (dB) S21 (dB) −10 −10 (1) (2) −20 −20 −30 −30 −40 −40 −50 10−1 1 10 102 103 104 f (MHz) (1) (2) −50 10−1 1 10 102 (1) IP4251CZ16 - ch1 to ch16 (1) IP4252CZ16 - ch1 to ch16 (2) IP4251CZ16 - ch4 to ch13 (2) IP4252CZ16 - ch4 to ch13 Fig 3. IP4251 frequency response curves Fig 4. IP4251_52_53_54_3 Product data sheet 103 104 f (MHz) IP4252 frequency response curves © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 7 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 001aaj610 0 001aaj611 0 S21 (dB) S21 (dB) −10 −10 −20 −20 −30 (1) (2) −30 (1) (2) −40 −40 −50 10−1 1 10 102 103 104 f (MHz) −50 10−1 1 10 102 (1) IP4253CZ16 - ch1 to ch16 (1) IP4254CZ16 - ch4 to ch13 (2) IP4253CZ16 - ch4 to ch13 (2) IP4254CZ16 - ch1 to ch16 Fig 5. IP4253 frequency response curves Fig 6. 103 104 f (MHz) IP4254 frequency response curves Due to the optimized silicon dice and package design, all channels in a single package show a very good matching performance as the insertion loss for a channel at the package side (e.g. ch1 to ch16) is nearly identical with the center channels (e.g. ch4 to ch13). Typical measurements results are shown in Figure 3 to Figure 6 for the different devices. 7.2 Selection The IP425x family is mainly designed as EMI/RFI filters for multi-channel interfaces. The selection of one of the filter devices has to be performed dependent on the maximum clock frequency, driver strength, capacitive load of the sink, and also the maximum applicable rise and fall times. 7.2.1 SD(HC) and MMC memory interface The Secure Digital High Capacity (SDHC) memory card interface standard specification and the MultiMediaCard (MMC) (JESD 84A43) standard specification recommend a rise and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input signal of the receiving interface side. Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and approximately 4 pF to 7 pF for the PCB and the card holder, IP4252CZ12-6 (6 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) is a matching selection to filter and protect all relevant interface pins such as CLK, CMD, and DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation of the IP4252 in an SD(HC) card interface. In case additional channels such as write-protect or a mechanical card detection switch are used, the IP4252CZ16-8 (8 channels, Rs(ch) = 40 Ω, Cch = 12 pF at Vbias(DC) = 2.5 V) offers two additional channels. IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 8 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network to HOST INTERFACE VCC(VSD) DAT3/CD pull-up 10 kΩ − 100 kΩ pull-up resistors 10 kΩ − 100 kΩ IP4252CZ12-6 (IP4252CZ16-8) DAT1 DAT1 DAT0 DAT0 CLK GND CMD CLK VCC(VSD) DAT3/CD CMD DAT2 DAT3/CD pull-up >270 kΩ exact value depends on required logic levels CD DAT3/CD WP DAT2 SD MEMORY CARD SET_CLR_ CARD_DETECT (ACMD42) 10 kΩ − 90 kΩ optional: 2-additional channels of IP4252CZ16-8 optional: electrical card detect CD WP optional: card detect switch optional: write protect switch Fig 7. 001aaj310 Example of IP4252 in an SD(HC) card interface The capacitance values specified for the signal channels of the MMC interface differ from the SD(HC) specification. The MMC card side interface is specified to have an intrinsic capacitance of 12 pF to 18 pF and the total channel is limited according the specification to 30 pF only. Therefore, any filter device capacitance is limited to a maximum of up to 18 pF, including the card holder and PCB traces. Please refer to Figure 8 for a general example of the implementation of the IP4252 in a MultiMediaCard interface application. IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 9 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network VCC(VMMC) CMD pull-up 4.7 kΩ - 100 kΩ pull-up resistors 50 kΩ - 100 kΩ IP4252CZ12-6 DAT1 DAT1 DAT0 DAT0 DAT7 DAT7 DAT6 VSS2 CLK DAT6 C7 C13 C6 C12 CLK C5 VCC(VMMC) C4 DAT5 HOST INTERFACE VSS1 DAT5 CMD CMD DAT4 DAT4 DAT3 DAT3 DAT2 DAT2 IP4252CZ8-4 Fig 8. C8 e.g. RSMMC C3 C11 C2 C10 C1 C9 001aaj309 Example of IP4252 in an MMC interface To generate SDHC- and MMC-compliant digital signals, the driver strength should not significantly undercut 8 mA. 7.2.2 LCD interfaces, medium-speed interfaces For digital interfaces such as LCD display interfaces running at clock speeds between 10 MHz and 25 MHz or more, IP4251, IP4252, or IP4254 can be used in dependency of the sink load, clock speed, driver strength and rise and fall time requirements. Also the minimum EMI filter requirements may be a decision-making factor. 7.2.3 Keypad, low-speed interfaces Especially for lower-speed interfaces such as keypads, low-speed serial interfaces (e.g. RS232) and low-speed control signals, IP4253 (Rs(ch) = 200 Ω, Cch = 30 pF at Vbias(DC) = 2.5 V) offers a very robust ESD protection and strong suppression of unwanted frequencies (EMI-filtering). IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 10 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 8. Package outline HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm SOT983-1 X B D A A E A1 terminal 1 index area detail X e1 1/2 e terminal 1 index area v w b e 1 L1 M M C C A B C y y1 C 4 L Eh 8 5 Dh 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D Dh E Eh e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 1.75 1.65 1.5 1.3 1.4 1.3 0.5 0.3 0.4 1.2 0.35 0.15 0.09 0.00 0.1 0.05 0.05 0.1 Fig 9. REFERENCES OUTLINE VERSION IEC SOT983-1 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-01-12 07-11-14 Package outline SOT983-1 (HXSON8U) IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 11 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm SOT984-1 X B D A A E A1 terminal 1 index area detail X e1 terminal 1 index area e v w b 1/2 e 1 L1 M M C C A B C y y1 C 6 L Eh 12 7 Dh 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D Dh E Eh e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 2.55 2.45 2.3 2.1 1.4 1.3 0.5 0.3 0.4 2 0.35 0.15 0.09 0.00 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT984-1 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-01-12 07-11-14 Fig 10. Package outline SOT984-1 (HXSON12U) IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 12 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm SOT985-1 X B D A A E A1 terminal 1 index area detail X e1 terminal 1 index area e v w b 1/2 e 1 L1 M M C C A B C y y1 C 8 L Eh 16 9 Dh 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D Dh E Eh e e1 L L1 v w y y1 mm 0.5 0.05 0.00 0.25 0.15 3.35 3.25 3.1 2.9 1.4 1.3 0.5 0.3 0.4 2.8 0.35 0.15 0.09 0.00 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT985-1 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-01-12 07-11-14 Fig 11. Package outline SOT985-1 (HXSON16U) IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 13 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4251_52_53_54_3 20090506 Product data sheet - IP4253_54_CZ8_CZ12_CZ16_2 Modifications: • • Added product types IP4251x and IP4252x. Added chapter Section 7 “Application information”. IP4253_54_CZ8_CZ12_CZ16_2 20071108 Product data sheet IP4253_54_CZ8_CZ12_CZ16_1 20070209 Objective data sheet - IP4251_52_53_54_3 Product data sheet - IP4253_54_CZ8_CZ12_CZ16_1 - © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 14 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4251_52_53_54_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 6 May 2009 15 of 16 IP4251/52/53/54 NXP Semiconductors Integrated 4-, 6- and 8-channel passive filter network 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.2.1 7.2.2 7.2.3 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SD(HC) and MMC memory interface . . . . . . . . 8 LCD interfaces, medium-speed interfaces . . . 10 Keypad, low-speed interfaces . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 6 May 2009 Document identifier: IP4251_52_53_54_3