INFINEON IPU07N03L

IPD07N03L
IPU07N03L
OptiMOS Buck converter series
Product Summary
Feature
VDS
30
V
•Logic Level
RDS(on)
6.8
mΩ
•Low On-Resistance RDS(on)
ID
30
A
•N-Channel
•Excellent Gate Charge x R DS(on) product (FOM)
P- TO251 -3-1
P- TO252 -3-11
•Superior thermal resistance
•175°C operating temperature
•Avalanche rated
•dv/dt rated
•Ideal for fast switching buck converters
Type
Package
Ordering Code
Marking
IPD07N03L
P- TO252 -3-11
Q67042-S4029
07N03L
IPU07N03L
P- TO251 -3-1
Q67042-S4105
07N03L
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current1)
ID
Value
Unit
A
30
TC=25°C
30
Pulsed drain current
ID puls
120
TC=25°C
EAS
30
Repetitive avalanche energy, limited by Tjmax 2)
EAR
15
Reverse diode dv/dt
dv/dt
6
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
150
W
Avalanche energy, single pulse
mJ
ID=20A, V DD=25V, RGS=25Ω
kV/µs
IS=30A, VDS=24V, di/dt=200A/µs, Tjmax=175°C
TC=25°C
Operating and storage temperature
Tj , Tstg
IEC climatic category; DIN IEC 68-1
-55... +175
°C
55/175/56
Page 1
2003-01-17
IPD07N03L
IPU07N03L
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
0.68
1
Thermal resistance, junction - ambient, leaded
RthJA
-
-
100
SMD version, device on PCB:
RthJA
@ min. footprint
-
-
75
@ 6 cm2 cooling area 3)
-
-
50
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
30
-
-
VGS(th)
1.2
1.6
2
Static Characteristics
Drain-source breakdown voltage
V
VGS=0V, I D=1mA
Gate threshold voltage, V GS = VDS
ID = 80 µA
Zero gate voltage drain current
µA
IDSS
VDS=30V, V GS=0V, T j=25°C
-
0.01
1
VDS=30V, V GS=0V, T j=125°C
-
10
100
IGSS
-
1
100
nA
RDS(on)
-
7.7
9.9
mΩ
RDS(on)
-
5.7
6.8
Gate-source leakage current
VGS=20V, VDS=0V
Drain-source on-state resistance
VGS=4.5V, ID=30A
Drain-source on-state resistance
VGS=10V, ID=30A
1Current limited by bondwire ; with an RthJC = 1K/W the chip is able to carry ID= 116A at 25°C, for detailed
information see app.-note ANPS071E available at www.infineon.com/optimos
2Defined by design. Not subject to production test.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2003-01-17
IPD07N03L
IPU07N03L
Electrical Characteristics
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
29
58
-
S
pF
Dynamic Characteristics
Transconductance
gfs
VDS≥2*ID*RDS(on)max ,
ID=30A
Input capacitance
Ciss
VGS=0V, VDS =25V,
-
1900
2530
Output capacitance
Coss
f=1MHz
-
740
990
Reverse transfer capacitance
Crss
-
180
270
Gate resistance
RG
-
2.3
-
Ω
Turn-on delay time
t d(on)
VDD=15V, VGS=10V,
-
7.8
11.7
ns
Rise time
tr
ID=15A,
-
17
26
-
62
93
-
47
70
-
4.4
5.5
-
14.8
18.1
-
26.8
33.5
-
25.5
31.9
Turn-off delay time
t d(off)
Fall time
tf
RG =3.6Ω
Gate Charge Characteristics
Gate to source charge
Q gs
Gate to drain charge
Q gd
Gate charge total
Qg
VDD=15V, ID=15A
VDD=15V, ID=15A,
nC
VGS=0 to 5V
Output charge
Q oss
VDS=15V, ID =15A,
nC
VGS=0V
Gate plateau voltage
V(plateau)
VDD=15V, ID=15A
-
2.5
-
V
IS
TC=25°C
-
-
30
A
-
-
120
Reverse Diode
Inverse diode continuous
forward current
Inv. diode direct current, pulsed
ISM
Inverse diode forward voltage
VSD
VGS =0V, IF =30A
-
0.9
1.3
V
Reverse recovery time
trr
VR =15V, IF =lS ,
-
41
51
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
46
58
nC
Page 3
2003-01-17
IPD07N03L
IPU07N03L
1 Power dissipation
2 Drain current
Ptot = f (TC)
ID = f (TC)
parameter: VGS≥ 10 V
IPD07N03L
32
W
A
120
24
ID
P tot
160
100
20
80
16
60
12
40
8
20
4
0
0
20
40
60
80
IPD07N03L
0
0
100 120 140 160 °C 190
20
40
60
80
100 120 140 160 °C 190
TC
TC
3 Safe operating area
4 Max. transient thermal impedance
ID = f ( VDS )
ZthJC = f (tp)
parameter : D = 0 , T C = 25 °C
parameter : D = tp/T
10 3
10 1
IPD07N03L
IPD07N03L
K/W
A
/I
D
10 0
=
ZthJC
V
DS
tp = 14.0µs
R
ID
DS
(on
)
10
2
10 -1
100 µs
D = 0.50
10
10
-2
0.20
1 ms
1
0.10
0.05
10 ms
DC
10 -3
0.02
single pulse
0.01
10 0 -1
10
10
0
10
1
V
10
2
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
tp
VDS
Page 4
2003-01-17
10
0
IPD07N03L
IPU07N03L
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS); Tj=25°C
parameter: t p = 80 µs
RDS(on) = f (ID)
A
IPD07N03L
Ptot = 150W
24
i h g
60
f
ID
55
50
45
e
40
35
30
b
2.8
c
3.0
d
3.2
e
3.4
f
3.6
g
3.8
h
4.5
i
10.0
d
e
f
20
18
16
14
g
12
10
d
h
8
25
20
6
c
15
5
VGS [V] =
2
a
0.5
1
1.5
2
2.5
3
3.5
i
4
b
10
0
0
IPD07N03L
Ω
VGS [V]
a
2.6
RDS(on)
75
parameter: VGS
4
V
d
3.2
0
0
5
e
f
3.4 3.6
10
g
3.8
20
h
i
4.5 10.0
30
40
50
A
65
ID
VDS
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); VDS ≥ 2 x ID x R DS(on)max
gfs = f(ID); Tj=25°C
parameter: t p = 80 µs
parameter: gfs
90
60
A
S
50
70
40
gfs
ID
45
35
60
50
30
40
25
30
20
15
20
10
10
5
0
0
0.5
1
1.5
2
2.5
3
4
V
VGS
Page 5
0
0
20
40
60
80
100
A 130
ID
2003-01-17
IPD07N03L
IPU07N03L
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
RDS(on) = f (Tj)
VGS(th) = f (Tj)
parameter : ID = 30 A, V GS = 10 V
parameter: VGS = VDS
16
IPD07N03L
2.5
Ω
1mA
12
V GS(th)
RDS(on)
V
10
1.5
98%
8
85µA
1
typ
6
4
0.5
2
0
-60
-20
20
60
100
140
°C
0
-60
200
-20
20
60
100
Tj
180
°C
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD )
parameter: VGS=0V, f=1 MHz
parameter: Tj , tp = 80 µs
10 4
10 3
IPD07N03L
A
pF
Ciss
C
IF
10 2
Coss
10 3
10 1
Tj = 25 °C typ
Tj = 175 °C typ
Crss
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 2
0
5
10
15
20
V
30
10 0
0
0.4
0.8
1.2
1.6
2
2.4 V
VSD
VDS
Page 6
2003-01-17
3
IPD07N03L
IPU07N03L
13 Typ. avalanche energy
15 Drain-source breakdown voltage
EAS = f (Tj)
V(BR)DSS = f (Tj)
par.: I D = 20 A, V DD = 25 V, RGS = 25 Ω
parameter: I D=10 mA
36
30
IPD07N03L
V
V(BR)DSS
E AS
mJ
20
34
33
32
15
31
30
10
29
5
28
0
25
45
65
85
105
125
145
°C 185
Tj
27
-60
-20
20
60
100
140
°C
Tj
14 Typ. gate charge
VGS = f (Q Gate)
parameter: I D = 15 A pulsed
16
IPD07N03L
V
VGS
12
10
8
6
4
0.2 VDS max
0.5 VDS max
2
0
0
0.8 VDS max
10
20
30
40
50
60 nC
75
Q Gate
Page 7
2003-01-17
200
IPD07N03L
IPU07N03L
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 8
2003-01-17