ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E ® Data Sheet September 19, 2007 ±16.5kV ESD Protected, +125°C, 3.0V to 5.5V, SOT-23/TDFN Packaged, Low Power, RS-485/RS-422 Transmitters The Intersil ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV IEC61000 contact), 3.0V to 5.5V powered, single transmitters for balanced communication using the RS-485 and RS-422 standards. These drivers have very low bus currents (±40mA), so they present less than a “1/8 unit load” to the RS-485 bus. This allows more than 256 transmitters on the network without violating the RS-485 specification’s 32 unit load maximum, and without using repeaters. Hot Plug circuitry ensures that the Tx outputs remain in a high impedance state while the power supply stabilizes. The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or from unterminated stubs in multidrop and multipoint applications. Drivers on the ISL3295E and ISL3298E are not limited, so they can achieve the 20Mbps data rate. All versions are offered in Industrial and Extended Industrial (-40°C to +125°C) temperature ranges. A 26% smaller footprint is available with the ISL3296E, ISL3297E, ISL3298E’s TDFN package. These devices also feature a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E data sheet. FN6544.0 Features • High ESD Protection on RS-485 Outputs . . ±16.5kV HBM - IEC61000-4-2 Contact Test Method . . . . . . . . . . . . ±7kV - Class 3 ESD Level on all Other Pins . . . . . . >8kV HBM • Specified for +125°C Operation (VCC ≤ 3.6V Only) • Logic Supply Pin (VL) Eases Operation in Mixed Supply Systems (ISL3296E through ISL3298E Only) • Hot Plug - Tx Outputs Remain Three-state During Power-up • Low Tx Leakage Allows >256 Devices on the Bus • High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 20Mbps • Low Quiescent Supply Current . . . . . . . . . . .150µA (Max) - Very Low Shutdown Supply Current . . . . . . . 1µA (Max) • -7V to +12V Common Mode Output Voltage Range (VCC ≤ 3.6V Only) • Current Limiting and Thermal Shutdown for Driver Overload Protection (VCC ≤ 3.6V Only) • Tri-statable Tx Outputs • 5V Tolerant Logic Inputs When VCC ≤5V • Pb-Free (RoHS Compliant) Applications • Clock Distribution • High Node Count Systems • Space Constrained Systems • Security Camera Networks • Building Environmental Control/Lighting Systems • Industrial/Process Control Networks TABLE 1. SUMMARY OF FEATURES VL PIN? TX ENABLE? (Note 10) MAXIMUM QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT YES NO YES 150 YES 6 Ld SOT YES YES NO YES 150 YES 6 Ld SOT 20 NO YES NO YES 150 YES 6 Ld SOT 1 Tx 0.25 YES YES YES YES 150 YES 8 Ld TDFN ISL3297E 1 Tx 0.5 YES YES YES YES 150 YES 8 Ld TDFN ISL3298E 1 Tx 20 NO YES YES YES 150 YES 8 Ld TDFN PART NUMBER DATA RATE SLEW-RATE (Mbps) LIMITED? HOT PLUG? FUNCTION ISL3293E 1 Tx 0.25 YES ISL3294E 1 Tx 0.5 ISL3295E 1 Tx ISL3296E 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Pinouts ISL3296E, ISL3297E, ISL3298E (8 LD TDFN) TOP VIEW ISL3293E, ISL3294E, ISL3295E (6 LD SOT-23) TOP VIEW DI 1 VCC D 2 DE 3 6 Y 5 GND 4 Z VL 1 DE 2 DI 3 GND 4 D 8 VCC 7 Z 6 Y 5 GND NOTE: BOTH GND PINS MUST BE CONNECTED Ordering Information PART PART NUMBER MARKING (Note 3) (Notes 1, 2) TEMP. RANGE (°C) Truth Tables PACKAGE (Tape and Reel) PKG. (Pb-Free) DWG. # TRANSMITTING INPUTS OUTPUTS ISL3293EFHZ-T 293F -40 to +125 6 Ld SOT-23 P6.064 DE (Note 10) DI Z Y ISL3293EIHZ-T 293I -40 to +85 6 Ld SOT-23 P6.064 1 1 0 1 ISL3294EFHZ-T 294F -40 to +125 6 Ld SOT-23 P6.064 1 0 1 0 ISL3294EIHZ-T 294I -40 to +85 6 Ld SOT-23 P6.064 0 X High-Z * High-Z * ISL3295EFHZ-T 295F -40 to +125 6 Ld SOT-23 P6.064 ISL3295EIHZ-T 295I -40 to +85 6 Ld SOT-23 P6.064 -40 to +125 8 Ld TDFN L8.2x3A ISL3296EFRTZ-T 96F ISL3296EIRTZ-T 96I -40 to +85 8 Ld TDFN L8.2x3A ISL3297EFRTZ-T 97F -40 to +125 8 Ld TDFN L8.2x3A ISL3297EIRTZ-T 97I -40 to +85 8 Ld TDFN L8.2x3A ISL3298EFRTZ-T 98F -40 to +125 8 Ld TDFN L8.2x3A ISL3298EIRTZ-T 98I -40 to +85 8 Ld TDFN L8.2x3A NOTE: *Shutdown Mode NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pbfree material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. SOT-23 “PART MARKING” is branded on the bottom side. 2 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Pin Descriptions PIN FUNCTION DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. This is also the potential of the TDFN thermal pad. Y ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, noninverting transmitter output. Z ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, inverting transmitter output. VCC VL System power supply input (3.0V to 5.5V). On devices with a VL pin, power-up VCC first. Logic-Level supply which sets the VIL/VIH levels for the DI and DE pins (ISL3296E, ISL3297E, ISL3298E only). Power-up this supply after VCC, and keep VL ≤ VCC. 3 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Operating Circuits NETWORK WITH ENABLES +3.3V TO 5V +3.3V + 1 VCC 0.1µF 0.1µF + 2 VCC ISL3281E 3 RO R ISL329xE A 6 B 4 RT 6 Y 4 Z D 5 RE DI 1 DE 3 GND GND 2 5 NETWORK WITHOUT ENABLE +3.3V TO 5V +3.3V + 1 VCC 0.1µF 0.1µF 2 R 3 VCC ISL3280E 3 RO 1kΩ TO 3kΩ (NOTE 10) + ISL329xE A 5 B 4 RT 6 Y 4 Z DE D GND GND 2 5 DI 1 NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES 2.5V +3.3V TO 5V +3.3V + 4 VCC 6 VCC LOGIC DEVICE (µP, ASIC, UART) VL 0.1µF 0.1µF 8 R 1 VL VCC ISL3282E 1 RO 1.8V + ISL3298E A 5 B 8 RT 6 Y 7 Z D 7 RE DI 3 VCC LOGIC DEVICE (µP, ASIC, UART) DE 2 GND 2 4 GND 4, 5 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Absolute Maximum Ratings Thermal Information VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V VL to GND (ISL3296E thru ISL3298E Only) . . -0.3V to (VCC +0.3V) Input Voltages DI, DE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V Y, Z (VCC > 3.6V) . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V Short Circuit Duration Y, Z (VCC ≤ 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Y, Z (VCC > 3.6V, Note 12) . . . . . . . . . . . . . . . . . . . 1s at <300mA ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 6 Ld SOT-23 Package (Note 4) . . . . . . 177 N/A 8 Ld TDFN Package (Notes 5, 6). . . . . 65 8 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range F Suffix (VCC ≤ 3.6V Only). . . . . . . . . . . . . . . . . .-40°C to +125°C I Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications PARAMETER Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 11) TYP (Note 13) MAX (Note 11) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD ΔVOD Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT VOC RL = 100Ω (RS-422) (Figure 1A) VCC ≥ 3.15V Full 2 2.3 - V VCC ≥ 4.5V Full 3 3.8 - V RL = 54Ω (RS-485) (Figure 1A) VCC ≥ 3.0V Full 1.5 2 VCC V VCC ≥ 4.5V Full 2.5 3.4 VCC V No Load Full - - VCC RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2, 3.4 - V RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V VCC ≤ 3.6V Full - 2 3 V VCC ≤ 5.5V RL = 54Ω or 100Ω (Figure 1A) Full - - 3.2 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V Input High Voltage (DI, DE) VIH1 VL = VCC if ISL3296E, VCC ≤ 3.6V ISL3297E, ISL3298E VCC ≤ 5.5V Full 2.2 - - V Full 3 - - V VIH2 5 VIH3 2.7V ≤ VL < 3.0V (ISL3296E, ISL3297E, ISL3298E only) Full 2 - - V VIH4 2.3V ≤ VL < 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full 1.65 - - V VIH5 1.6V ≤ VL < 2.3V (ISL3296E, ISL3297E, ISL3298E only) Full 0.7*VL - - V VIH6 1.35V ≤ VL < 1.6V (ISL3296E, ISL3297E, ISL3298E only) 25 - 0.5*VL - V FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Electrical Specifications PARAMETER Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 11) TYP (Note 13) MAX (Note 11) UNITS VIL1 VL = VCC if ISL3296E, ISL3297E, ISL3298E Full - - 0.8 V VIL2 VL ≥ 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.8 V VIL3 2.3V ≤ VL < 2.7V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.65 V VIL4 1.6V ≤ VL < 2.3V (ISL3296E, ISL3297E, ISL3298E only) Full - - 0.22*VL V VIL5 1.35V ≤ VL < 1.6V (ISL3296E, ISL3297E, ISL3298E only) 25 - 0.3*VL - V Full -2 - 2 µA VIN = 12V Full - 0.1 40 µA VIN = -7V Full -40 -10 - µA DE = VCC, -7V ≤ VO ≤ 12V, VCC ≤ 3.6V Full - - ±250 mA DE = VCC, 0V ≤ VO ≤ VCC, VCC > 3.6V (Note 12) Full - - ±450 mA Full - 160 - °C Full - 120 150 µA DE = 0V, DI = 0V or VCC Full - 0.01 1 µA Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV IEC61000 Contact, From Bus Pins to GND 25 - ±7 - kV HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - ±400 - V Input Low Voltage (DI, DE) Logic Input Current IIN DI = DE = 0V or VCC (Note 10) Output Leakage Current (Y, Z, Note 10) IOZ DE = 0V, VCC = 0V, 3.6V, or 5.5V IOSD1 Driver Short-Circuit Current, VO = High or Low (Note 8) Thermal Shutdown Threshold TSD SUPPLY CURRENT No-Load Supply Current ICC Shutdown Supply Current ISHDN DI = 0V or VCC DE = VCC ESD PERFORMANCE RS-485 Pins (Y, Z) All Pins DRIVER SWITCHING CHARACTERISTICS (ISL3293E, ISL3296E, 250kbps) Maximum Data Rate Driver Single Ended Output Delay Part-to-Part Output Delay Skew fMAX VOD = ±1.5V, CD = 820pF (Figure 4) Full 250 - - kbps tSD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 400 1350 1700 ns RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 900 ns tSKPP Driver Single Ended Output Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 600 750 ns Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 400 1100 1500 ns Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 4, 1 30 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CD = 50pF (Figure 2) VCC ≤ 3.6V Full 400 960 1500 ns VCC = 5V 25 - 1300 - ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns 6 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Electrical Specifications PARAMETER Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 11) TYP (Note 13) MAX (Note 11) UNITS DRIVER SWITCHING CHARACTERISTICS (ISL3294E, ISL3297E, 500kbps) Maximum Data Rate Driver Single Ended Output Delay Part-to-Part Output Delay Skew fMAX VOD = ±1.5V, CD = 820pF (Figure 4) Full 500 - - kbps tSD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 340 500 ns RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 300 ns tSKPP Driver Single Ended Output Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 30, 80 150 ns Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 345 500 ns Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 2 30 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 350 800 ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns VOD = ±1.5V, CD = 360pF (Figure 4) Full 20 - - Mbps RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC Full 15 29, 23 42 ns VL ≥ 1.8V 25 - 32 - ns VL = 1.5V 25 - 36 - ns DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps) Maximum Data Rate fMAX Driver Single Ended Output Delay tSD VL = 1.35V Part-to-Part Output Delay Skew tSKPP Driver Single Ended Output Skew tSSK Driver Differential Output Delay tDD Driver Differential Output Skew tDSK 25 - 40 - ns RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 25 ns RDIFF = 54Ω, CD = 50pF (Figure 2) VL = VCC Full - 3 7 ns VL ≥ 1.8V 25 - 3 - ns VL = 1.5V 25 - 4 - ns VL = 1.35V 25 - 5 - ns VL = VCC Full - 29, 22 42 ns VL ≥ 1.8V 25 - 32 - ns RDIFF = 54Ω, CD = 50pF (Figure 2) RDIFF = 54Ω, CD = 50pF (Figure 2) 25 - 36 - ns VL = 1.35V 25 - 42 - ns VL = VCC ≤ 3.6V Full - 0.5 3 ns VL = VCC = 5V 25 - 2 - ns VL ≥ 1.8V 25 - 0.5, 1 - ns VL ≥ 1.5V 25 - 1, 2 - ns VL = 1.35V 25 - 2, 4 - ns VL = VCC Full - 9 15 ns Driver Differential Rise or Fall Time tR, tF 25 - 9 - ns Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns 7 RDIFF = 54Ω, CD = 50pF (Figure 2) VL = 1.5V VL ≥ 1.35V FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at TA = +25°C; Unless Otherwise Specified. (Note 7) (Continued) SYMBOL TEST CONDITIONS TEMP (°C) MIN (Note 11) TYP (Note 13) MAX (Note 11) UNITS Driver Disable from Output High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns PARAMETER NOTES: 7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 8. Applies to peak current. See “Typical Performance Curves” on page 12 for more information. 9. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 10. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. 11. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. 12. Due to the high short circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To prevent excessive power dissipation that may damage the output, the short circuit current should be limited to ≤ 300mA during testing. It is best to use an external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output. 13. Typicals are measured at VCC = 3.3V for parameters specified with 3V ≤ VCC ≤ 3.6V, and are measured at VCC = 5V for parameters specified with 4.5V ≤ VCC ≤ 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a comma refer to VCC = 3.3V and 5V, respectively. Test Circuits and Waveforms VCC OR VL RL/2 DE 375Ω VCC OR VL Z DI Z DI VOD D DE Y Y RL/2 FIGURE 1A. VOD AND VOC VOC VCM VOD D RL = 60Ω -7V TO +12V 375Ω FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 8 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Test Circuits and Waveforms (Continued) 3V OR VL DI 50% 50% 0V VCC OR VL tSD2 tSD1 DE VOH OUT (Z) Z DI RDIFF D 50% CD 50% VOL OUT (Y) Y tDDLH SIGNAL GENERATOR DIFF OUT (Y - Z) tDDHL 90% 50% 10% tR -VOD tF tDSK = |tDDLH - tDDHL| tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)| FIGURE 2A. TEST CIRCUIT +VOD 90% 50% 10% FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 500Ω VCC D SIGNAL GENERATOR SW Y 3V OR VL DE 50% 50% GND 0V 50pF tZH tHZ OUTPUT HIGH VOH - 0.25V PARAMETER OUTPUT DI SW tHZ Y/Z 1/0 GND tLZ Y/Z 0/1 VCC tZH Y/Z 1/0 GND tZL Y/Z 0/1 VCC VOH 50% OUT (Y, Z) 0V tZL tLZ VCC OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW FIGURE 3A. TEST CIRCUIT OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES VCC OR VL 3V OR VL DE + Z DI 54Ω D CD Y DI 0V VOD - SIGNAL GENERATOR +VOD DIFF OUT (Y - Z) -VOD 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE 9 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transmitters and receivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 specification requires that drivers must handle bus contention without sustaining any damage. VCC = +3.3V VCC = +2V VIH ≥ 2V DI DE GND VOH ≤ 2V VIH ≥ 2V VOH ≤ 2V ISL3293E Driver Features All drivers are tri-statable via the active high DE input. If the Tx enable function isn’t needed, tie DE to VCC (or VL) through a 1kΩ to 3kΩ resistor. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL3295E and ISL3298E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps. Wide Supply Range The ISL3293E through ISL3298E are optimized for 3.3V operation, but can be operated with supply voltages as high as 5.5V. These devices meet the RS-422 and RS-485 specifications for supply voltages less than 4V, and are RS-422 and RS-485 compatible for supplies greater than 4V. Operation at +125°C requires VCC ≤ 3.6V, while 5V operation requires adding output current limiting resistors (as described in the “Driver Overload Protection” on page 11) if output short circuits (e.g., from bus contention) are a possibility. 5.5V Tolerant Logic Pins GND VCC = +2V VL DI DE GND These RS-485/RS-422 drivers are differential output devices that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. DEN UART/PROCESSOR VCC = +3.3V Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. TXD ISL3296E VIH = 1.4V TXD VOH ≤ 2V VIH = 1.4V VOH ≤ 2V DEN GND UART/PROCESSOR FIGURE 5. USING VL PIN TO ADJUST LOGIC LEVELS Logic Supply (VL Pin, ISL3296E through ISL3298E) Note: Power-up VCC before powering up the VL supply. The ISL3296E through ISL3298E include a VL pin that powers the logic inputs (DI and DE). These pins interface with “logic” devices such as UARTs, ASICs, and µcontrollers, and today most of these devices use power supplies significantly lower than 3.3V. Thus, the logic device’s low VOH might not exceed the VIH of a 3.3V or 5V powered DI or DE input. Connecting the VL pin to the power supply of the logic device (as shown in Figure 5) reduces the DI and DE input switching points to values compatible with the logic device’s output levels. Tailoring the logic pin input switching points and output levels to the supply voltage of the UART, ASIC, or µcontroller eliminates the need for a level shifter/translator between the two ICs. VL can be anywhere from VCC down to 1.35V, but the input switching points may not provide enough noise margin, and 20Mbps data rates may not be achievable, when VL < 1.5V. Table 2 indicates typical VIH and VIL values for various VL settings so the user can ascertain whether or not a particular VL voltage meets his needs. Logic input pins (DI, DE) contain no ESD nor parasitic diodes to VCC (nor to VL), so they withstand input voltages exceeding 5.5V regardless of the VCC and VL voltages. 10 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V VL (V) VIH (V) VIL (V) 1.35 0.7 0.4 1.5 0.8 0.5 1.8 0.9 0.7 2.3 1.1 1.0 2.7 1.3 1.1 3.3 1.5 1.4 5.0 (i.e., VCC) 2.7 2.3 The VL supply current (IL) is typically much less than 20µA, as shown in Figure 9, when DE and DI are above/below VIH/VIL. Hot Plug Function When a piece of equipment powers-up, there is a period of time where the processor or ASIC driving the RS-485 control line (DE) is unable to ensure that the RS-485 Tx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL329xE family incorporates a “Hot Plug” function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of DE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. ESD Protection All pins on these devices include class 3 (8kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs) incorporate advanced structures allowing them to survive ESD events in excess of ±16.5kV HBM and ±7kV to the IEC61000 contact test method. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. Data Rate, Cables, and Terminations RS-485/RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100’, while the 250kbps versions can operate at full data rates with lengths of several 1000’. 11 Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transmitter or receiver to the main cable should be kept as short as possible. Driver Overload Protection As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. These drivers meet this requirement, for VCC ≤ 3.6V, via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 specification, for VCC ≤ 3.6V, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either VCC or GND. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about +20°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. At VCC > 3.6V, the instantaneous short circuit current is high enough that output stage damage may occur during short circuit conditions to voltages outside of GND to VCC, before the short circuit limiting and thermal shutdown activate. For VCC = 5V operation, if output short circuits are a possibility (e.g., due to bus contention), it is recommended that a 5Ω resistor be inserted in series with each output. This resistor limits the instantaneous current below levels that can cause damage. The driver VOD at VCC = 5V is so large that this small added resistance has little impact. FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E High Temperature Operation Low Power Shutdown Mode Due to power dissipation and instantaneous output short circuit current levels at VCC = 5V, these transmitters may not be operated at +125°C with VCC > 3.6V. These BiCMOS transmitters all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 1µA trickle. These devices enter shutdown whenever the driver disables (DE = GND). At VCC = 3.6V, even the SOT-23 versions may be operated at +125°C, while driving a 100’, double terminated, CAT 5 cable at 20Mbps, without triggering the thermal SHDN circuit. Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified 2.4 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 110 100 90 +85°C 80 +25°C 70 +125°C 60 50 40 30 20 10 +25°C 0 0 0.5 1.0 1.5 2.0 2.5 3.0 DIFFERENTIAL OUTPUT VOLTAGE (V) RDIFF = 100Ω 2.2 2.1 2.0 RDIFF = 54Ω 1.9 1.8 1.7 1.6 1.5 -40 3.5 FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE 2.3 10 -15 60 35 TEMPERATURE (°C) 110 125 85 FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 100 40 90 35 VCC = 3.3V VL = 3.3V 80 30 25 60 IL (µA) ICC (µA) 70 50 40 20 15 VL = 2.5V 30 10 20 5 10 VL ≤ 2V DE = VCC = VL 0 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 8. SUPPLY CURRENT vs TEMPERATURE 12 0 0 1 2 3 4 5 6 7 7.5 DI VOLTAGE (V) FIGURE 9. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 1250 700 VL = 1.35V TO VCC tDDLH 600 tSSK 1200 500 tDDHL 1175 SKEW (ns) PROPAGATION DELAY (ns) 1225 1150 1125 400 VL = 1.35V TO VCC 300 200 1100 100 1075 tDSK 1050 -40 0 10 -15 35 60 85 110 125 -40 -15 10 TEMPERATURE (°C) FIGURE 10. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3293E, ISL3296E) 60 85 110 125 FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL3293E, ISL3296E) 60 390 VL = 1.35V to VCC VL = 1.35V TO VCC 380 50 370 40 SKEW (ns) PROPAGATION DELAY (ns) 35 TEMPERATURE (°C) 360 tSSK 30 20 350 tDDHL 10 340 tDDLH 330 -40 -15 tDSK 10 35 60 85 0 -40 110 125 -15 10 35 60 85 110 125 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3294E, ISL3297E) FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL3294E, ISL3297E) 4.5 50 4.0 40 VL = 1.35V, tDDLH 3.5 VL = 1.35V, tDDHL 3.0 VL = 1.5V, tDDLH, tDDHL SKEW (ns) PROPAGATION DELAY (ns) 45 35 30 VL = 1.8V, tDDLH, tDDHL VL = 1.35V 2.5 2.0 1.5 VL = 1.5V 1.0 25 20 -40 VL = VCC, tDDLH, tDDHL -15 10 VL ≥ 1.8V 0.5 35 60 85 110 125 TEMPERATURE (°C) FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL3295E, ISL3298E) 13 0 -40 -15 10 35 60 85 110 125 TEMPERATURE (°C) FIGURE 15. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL3295E, ISL3298E) FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 200 6 ISL3295E/ISL3298E VL = 1.35V 150 5 VL = 1.5V 3 VL ≥ 1.8V 2 1 Y OR Z = LOW 50 0 -50 Y OR Z = HIGH -100 -150 -15 10 35 60 85 ISL329xE -7 -6 110 125 -4 -2 TEMPERATURE (°C) 0 1.5 Z Y 0 DRIVER OUTPUT (V) 3 2 1 Y-Z 0 -1 -2 -3 0 3.0 Y 1.5 Z 0 3 2 1 0 Y-Z -1 -2 -3 TIME (400ns/DIV) 3 0 1.5 Z Y 0 3 2 1 0 RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) FIGURE 19. DRIVER WAVEFORMS, HIGH TO LOW (ISL3293E, ISL3296E) DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) FIGURE 18. DRIVER WAVEFORMS, LOW TO HIGH (ISL3293E, ISL3296E) 3.0 Y-Z -1 -2 -3 TIME (200ns/DIV) FIGURE 20. DRIVER WAVEFORMS, LOW TO HIGH (ISL3294E, ISL3297E) 14 12 3 DI TIME (400ns/DIV) DI 10 RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) 3 DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF 3.0 8 FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 16. DRIVER SINGLE ENDED SKEW vs TEMPERATURE (ISL3295E, ISL3298E) DI 0 2 4 6 OUTPUT VOLTAGE (V) DRIVER INPUT (V) 0 -40 3 DI 0 3.0 Y 1.5 DRIVER INPUT (V) SKEW (ns) 4 OUTPUT CURRENT (mA) OTHER ISL329xE 100 Z 0 3 2 1 0 -1 -2 -3 Y-Z TIME (200ns/DIV) FIGURE 21. DRIVER WAVEFORMS, HIGH TO LOW (ISL3294E, ISL3297E) FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E 0 3.0 1.5 Z Y 0 3 2 1 Y-Z 0 -1 -2 -3 0 3.0 1.5 Y Z 0 3 2 1 Y-Z 0 -1 -2 -3 TIME (10ns/DIV) TIME (10ns/DIV) DI 0 3.0 1.5 Z Y 0 3 2 1 0 Y-Z -1 -2 -3 TIME (10ns/DIV) FIGURE 24. DRIVER WAVEFORMS, LOW TO HIGH (ISL3295E, ISL3298E) DRIVER OUTPUT (V) 3 DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) FIGURE 23. DRIVER WAVEFORMS, HIGH TO LOW (ISL3295E, ISL3298E) FIGURE 22. DRIVER WAVEFORMS, LOW TO HIGH (ISL3295E, ISL3298E) VL = 1.35V 3 DI RDIFF = 54Ω, CD = 50pF VL = 1.35V 3 DI 0 3.0 1.5 Y DRIVER INPUT (V) DI RDIFF = 54Ω, CD = 50pF DRIVER OUTPUT (V) 3 DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 54Ω, CD = 50pF DRIVER INPUT (V) VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) DRIVER INPUT (V) Typical Performance Curves Z 0 3 2 1 0 -1 -2 -3 Y-Z TIME (10ns/DIV) FIGURE 25. DRIVER WAVEFORMS, HIGH TO LOW (ISL3295E, ISL3298E) Die Characteristics SUBSTRATE AND TDFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 516 PROCESS: Si Gate BiCMOS 15 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Small Outline Transistor Plastic Packages (SOT23-6) 0.20 (0.008) M P6.064 VIEW C C 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE CL INCHES e b SYMBOL 6 5 4 CL CL E1 E 1 2 3 e1 C D CL A A2 SEATING PLANE A1 -C- WITH b PLATING b1 c c1 MILLIMETERS MAX MIN MAX NOTES A 0.036 0.057 0.90 1.45 - A1 0.000 0.0059 0.00 0.15 - A2 0.036 0.051 0.90 1.30 - b 0.012 0.020 0.30 0.50 - b1 0.012 0.018 0.30 0.45 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.008 0.08 0.20 6 D 0.111 0.118 2.80 3.00 3 E 0.103 0.118 2.60 E1 0.060 0.068 1.50 3.00 - 1.75 3 e 0.0374 Ref 0.95 Ref - e1 0.0748 Ref 1.90 Ref - L 0.10 (0.004) C MIN 0.014 0.022 0.35 0.55 L1 0.024 Ref. 0.60 Ref. L2 0.010 Ref. 0.25 Ref. N 6 6 4 5 R 0.004 - 0.10 - R1 0.004 0.010 0.10 0.25 α 0o 8o 0o 8o Rev. 3 9/03 BASE METAL NOTES: 1. Dimensioning and tolerance per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 and JEDEC MO178AB. 4X θ1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. R 5. “N” is the number of terminal positions. GAUGE PLANE SEATING PLANE L C L1 α L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only 4X θ1 VIEW C 16 FN6544.0 September 19, 2007 ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E Thin Dual Flat No-Lead Plastic Package (TDFN) L8.2x3A 2X 0.15 C A A D 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE 2X MILLIMETERS 0.15 C B SYMBOL E MIN A 0.70 A1 - 6 A3 INDEX AREA b TOP VIEW D2 0.20 0.10 SIDE VIEW C SEATING PLANE D2 (DATUM B) 0.08 C A3 7 0.75 0.80 - - 0.05 - 0.25 0.32 1.50 1.65 1.75 1 7,8 3.00 BSC - 8 1.65 e 1.80 1.90 7,8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8 N 8 Nd 4 D2/2 6 INDEX AREA 5,8 C E2 A NOTES 2.00 BSC E // MAX 0.20 REF D B NOMINAL 2 3 Rev. 0 6/04 2 NX k NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. (DATUM A) E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. NX L 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. N N-1 NX b e 8 5 0.10 (Nd-1)Xe REF. M C A B 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. BOTTOM VIEW CL (A1) NX (b) L 5 SECTION "C-C" C C TERMINAL TIP e FOR EVEN TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 FN6544.0 September 19, 2007