The documentation process conversion measures necessary to comply with this revision shall be completed by 22 January 1998 INCH-POUND MIL-PRF-19500/622A 22 October 1997 SUPERSEDING MIL-S-19500/622 5 April 1993 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPE 2N7368 JAN, JANTX, JANTXV, AND JANS This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for NPN silicon, high-power transistor. Four levels of product assurance are provided as specified in MIL-PRF-19500. 1.2 Physical dimensions. See figure 1 (TO - 254). 1.3 Maximum ratings. 2N7368 PT 1/ TC = +25°C VCBO VCEO VEBO IB IC TJ and TSTG RθJC W V dc V dc V dc A dc A dc °C °C/W max 115 80 80 7.0 4.0 10 -65 to +200 1.5 1/ Derate linearly 0.657 W/°C above TC = +25°C. 1.4 Primary electrical characteristics. Min Max hFE2 1/ VBE(SAT)1 1/ VCE(SAT)1 1/ Cobo |hfe| VCE = 2.0 V dc IC = 3.0 A dc IC = 5.0 A dc IB = 0.5 A dc IC = 5.0 A dc IB = 0.5 A dc VCB = 10 V dc IE = 0 f = 100 kHz to 1 MHz VCE = 10 V dc IC = 0.5 A dc f = 1 MHz V dc V dc pF 1.5 1.0 500 30 140 4.0 20 1/ Pulsed (see 4.5.1). Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/622A 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.3). 3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in MIL-PRF-19500, and on figure 1 herein. Methods used for electrical isolation of the terminal feedthroughs shall employ materials that contain a minimum of 90 percent AL2O3 (ceramic). Examples of such construction techniques are metallized ceramic eyelets or ceramic walled packages. The US government's preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inchpound units shall take precedence. 3.3.1 Lead formation and finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish or formation is desired, it shall be specified in the acquisition requirements (see 6.2). When lead formation is performed, as a minimum, the vendor shall perform 100 percent hermetic seal in accordance with screen 14, of MIL-PRF-19500. 3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. 3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4 and table I herein. 3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3. 2 MIL-PRF-19500/622A Dimensions Ltr Inches Min Max Min Max BL .535 .545 13.59 13.89 CH .249 .260 6.32 6.60 LD .035 .045 0.89 1.43 LL .530 .550 13.46 13.97 LO .150 BSC 3.81 BSC LS .150 BSC 3.81 BSC MHD .139 .149 3.53 3.78 MHO .665 .685 16.89 17.40 TL .790 .800 20.07 20.32 TT .040 .050 1.02 1.27 TW .535 .545 13.59 13.89 Term 1 Base Term 2 Collector Term 3 Emitter NOTES: 1. Dimensions are in millimeters. 2. Inch equivalents are given for general information only. 3. All terminals are isolated from case. FIGURE 1. Dimensions and configuration (T0-254AA). 3 Millimeters MIL-PRF-19500/622A 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3) c. Conformance inspection (see 4.4). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. 4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of Screen (see appendix E, table IV of MIL-PRF-19500) Measurement JANS level JANTX and JANTXV levels 1/ Thermal impedance (see 4.3.2) Thermal impedance (see 4.3.2) 9 ICES1 and hFE2 Not applicable 11 Subgroup 2 of table I herein; ICES1 and hFE2; ∆ICES1 = 100 percent of initial value or 10 µA dc, whichever is greater. ∆hFE2 = ± 20 percent of initial value. ICES1 and hFE2 12 t = 160 hours t = 80 hours 13 Subgroup 2 and 3 of table I herein; ICES1 and hFE2; ∆ICES1 = 100 percent of initial value or 10 µA dc, whichever is greater. ∆hFE2 = ± 20 percent of initial value. Subgroup 2 of table I herein; ICES1 and hFE2; ∆ICES1 = 100 percent of initial value or 10 µA dc, whichever is greater. ∆hFE2 = ± 20 percent of initial value. 1/ May be performed anytime before screen 9. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = 187.5 ± 12.5°C, V CE ≥ 10 V dc, TA = 30 ± 5°C. 4.3.2 Thermal impedance ZθJX measurements for screening. The ZθJX measurements shall be performed in accordance with MIL-STD-750, method 3131. The maximum limit and conditions for ZθJX in screening (table II of MIL-PRF-19500) shall be derived by each vendor by means of process control of actual measurements which characterizes the die attach process. When three lot date codes have exhibited control, the data from these three lots will be used to establish a fixed screening limit (not to exceed the end point limit). Once a fixed limit has been established, monitor all future sealing lots using a sample from each lot to be plotted on the applicable X and R chart. 4.3.2.1 Thermal impedance (ZθJX measurements) for initial qualification. The ZθJX measurements shall be performed in accordance with MIL-STD-750. Method 3131 (read and record date ZθJX) derived conditions limits and thermal response curve shall be supplied to the qualifying activity on the qualification lot prior to qualification approval. 4 MIL-PRF-19500/622A 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500, and table I herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, tables VIa and VIb of MIL-PRF-19500. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table III herein. 4.4.2.1 Group B inspection, appendix E, table VIa (JANS) of MIL-PRF-19500. Subgroup 4: Condition for intermittent operation life are as follows: VCB ≥ 10 V dc. ∆TJ between cycles ≥ +100°C, 2,000 cycles. 4.4.2.2 Group B inspection, appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup 3: Condition for intermittent operation life are as follows: VCB ± 10 V dc. ∆TJ between cycles ± +100°C, 2,000 cycles. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table VII of MIL-PRF-19500. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table III herein. 4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500. a. Subgroup 2: Condition for terminal strength (tension) is method 2036, condition A, weight = 4.5 kg, t = 10 seconds. b. Subgroup 6: Condition for intermittent operation life are as follows: VCB > 10 V dc. ∆TJ between cycles ≥ +100°C, 6,000 cycles. 4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750. 4.5.2 Thermal resistance. Thermal resistance measurements shall be conducted in accordance with test method 3131 of MIL-STD-750. The following details shall apply: a. Collector current magnitude during power application shall be 1.0 A dc. b. Collector to emitter voltage magnitude shall be ≥ 10 V dc. c. Reference temperature measuring point shall be the case. d. Reference point temperature shall be +25°C ≤ TR ≤ +75°C and recorded before the test is started. e. Mounting arrangement shall be with heat sink to header. f. Maximum limit of RθJC shall be 1.5°C/W. 4.5.3 Thermal Impedance Z limit for end point measurements. The following test conditions shall be used for ZθJX, end point measurements: ZθJX = 1.4°C/W a. IM .....................................................................10 mA. b. VCB measurement voltage...............................20 V (same as VH). c. IH collector heating current .............................4 A (minimum). d. VH collector-emitter heating voltage .................20 V (minimum). e. tH heating time ................................................100 ms. f. tMD measurement delay time ...........................80 µs maximum. g. ts sample window time .....................................10 µs (maximum). 5 MIL-PRF-19500/622A TABLE I. Group A inspection. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min Unit Max Subgroup 1 Visual and mechanical examination 2071 Subgroup 2 V dc 80 Collector - emitter breakdown voltage 3011 Bias condition D; IC = 0.2 A dc; pulsed (see 4.5.1) VCEO(sus) Emitter - base cutoff current 3061 Bias condition D; VEB = 7 V dc IEBO 1.0 mA dc Collector - emitter cutoff current 3041 Bias condition A; VBE = 1.5 V dc; VCE = 80 V dc ICEX1 1.0 mA dc Collector - emitter cutoff current 3041 Bias condition C; VCE = 70 V dc ICES1 1.0 mA dc Base - emitter saturated voltage 3066 Test condition A; IC = 5 A dc; IB = 0.5 A dc; pulsed (see 4.5.1) VBE(sat)1 1.5 V dc Collector - emitter saturated voltage 3071 IC = 5 A dc; |IB = 0.5 A dc; pulsed (see 4.5.1) VCE(sat)1 1.0 V dc hFE1 175 3076 VCE = 2.0 V dc; IC = 1.0 A dc; pulsed (see 4.5.1) 50 Forward - current transfer ratio 140 3076 VCE = 2.0 V dc; IC = 3.0 A dc; pulsed (see 4.5.1) hFE2 30 Forward - current transfer ratio Subgroup 3 TA = +150°C High - temperature operation: Collector to emitter cutoff current 3041 Low - temperature operation: Forward - current transfer ratio Bias condition C; VCE = 70 V dc ICES2 5.0 TA = -55°C 3076 VCE = 2.0 V dc; IC = 3.0 A dc; pulsed (see 4.5.1) See footnote at end of table. 6 hFE3 12 mA dc MIL-PRF-19500/622A TABLE I. Group A inspection - Continued. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min Unit Max Subgroup 4 Switching parameters Pulse delay time See figure 2 td 0.2 µs Pulse rise time See figure 2 tr 1.3 µs Pulse storage time See figure 2 ts 1.4 µs Pulse fall time See figure 2 1.2 µs tf Magnitude of smallsignal short-circuit forward-current transfer ratio 3306 VCE = 10 V dc; IC = 0.5 A dc; f = 1 MHz |hfe| Open circuit output capacitance 3236 VCB = 10 V dc; IE = 0; f = 100 kHz to 1 MHz Cobo Subgroup 5 Safe operating area (continuous dc) 3051 TC = +25°C; t ≥ 1 s; 1 cycle; (see figure 3) Test 1 VCE = 11.5 V dc; IC = 10 A dc Test 2 VCE = 45 V dc; IC = 2.5 A dc Test 3 VCE = 60 V dc; IC = 0.9 A dc Safe operating area (clamped inductive) 3053 Electrical measurements TA = +25°C; IC = 10 A dc; VCC = 11.5 V dc; (See figures 4 and 5) Clamp voltage = 80 V dc See table III, steps 1 and 2 Subgroups 6 and 7 Not applicable 1/ For sampling plan see MIL-PRF 19500. 7 4.0 20 500 pF MIL-PRF-19500/622A TABLE II. Group E inspection (all quality levels) for qualification only. Inspection MIL-STD-750 Method Conditions Subgroup 1 22 devices, c = 0 Temperature cycling 1051 Hermetic seal 1071 Electrical measurements 500 cycles See table III, steps 1 and 2 Subgroup 2 High temperature reverse bias Qualification conformance inspection 22 devices, c = 0 1039 Electrical measurements Condition A; 1,000 hours See table III, steps 1 and 2 Subgroup 3 Not applicable Subgroup 4 Thermal resistance 22 devices, c = 0 3131 RθJC = 1.5°C/W maximum. See 4.5.2 Subgroup 5 Not applicable 8 MIL-PRF-19500/622A TABLE III. Group B, C, and E electrical measurements. 1/ 2/ 3/ Step Inspection MIL-STD-750 Method Symbol Conditions Limit Min Unit Max 1. Collector - emitter cutoff current 3041 Bias condition C; VCE = 70 V dc ICES1 1.0 2. Forward - current transfer ratio 3076 VCE = 2.0 V dc; IC = 3.0 A dc; pulsed (see 4.5.1) hFE2 3. Collector - emitter cutoff current 3041 Bias condition C; VCE = 70 V dc ∆ICES1 4/ 100 percent of initial value or 10 µA dc; whichever is greater 4. Forward - current transfer ratio 3076 VCE = 2.0 V dc; IC = 3.0 A dc; pulsed (see 4.5.1) ∆hFE2 4/ ±25 percent change from initial value 5. Thermal impedance 3131 See 4.5.3 30 ZθJX mA dc 140 1.4 °C/W 1/ The electrical measurements for appendix E, table VIa (JANS) of MIL-PRF-19500 are as follow: a. Subgroup 2, see table II herein, steps 1 and 2. b. Subgroup 3, see table II herein, steps 3, 4, and 5. c. Subgroup 6, see table II herein, steps 3, 4, and 5. 2/ The electrical measurements for table IVb (JANTX and JANTXV) of MIL-S-19500 are as follow: a. Subgroup 2, see table II herein, steps 1 and 2. b. Subgroup 3, see table II herein, steps 1, 2, and 5. c. Subgroup 6, see table II herein, steps 1, 2, and 5. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroup 2, see table II herein, steps 1 and 2. b. Subgroup 3, see table II herein, steps 1 and 2. c. Subgroup 6, see table II herein, steps 1, 2, and 5. 4/ Devices which exceed the group A limits for this test shall not be shippable but are not considered failures for the test. 9 MIL-PRF-19500/622A NOTES: 1. The input waveform is supplied by a pulse generator with the following characteristics: tr ≤ 20.0 ns, tf ≤ 1 µs, 10 µs ≤ PW ≤ 100 µs, ZOUT = 50Ω, duty cycle ≤ 2 percent. 2. Output waveforms are monitored on an oscilloscope with the following characteristics: tr ≤ 5 ns, ZIN ≥ 100 kS, CIN ≤ 12 pF. 3. Test circuit A for td and tr; test circuit B for ts and tf. FIGURE 2. Pulse response test circuits. 10 MIL-PRF-19500/622A FIGURE 3. Safe operating area. 11 MIL-PRF-19500/622A FIGURE 4. Safe operating area for switching between saturation and cutoff (clamped inductive load). 12 MIL-PRF-19500/622A L = 4 mH, .05Ω, 20 A Q ≥ 100 at 1 kHz (Stanford Miller CK-20 or equivalent Procedures: 1. With switch S1 closed, set the specified test conditions. 2. Open S1. Device fails, if clamp voltage is not reached. 3. Perform specified end-point tests. FIGURE 5. Clamped inductive sweep test circuit. 13 MIL-PRF-19500/622A 5. PACKAGING 5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2 Acquisition requirements. See MIL- PRF-19500. 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH 43216-5000. 6.4 Interchangeability information. MIL-PRF-19500/622 is a T0-254 package version of MIL-PRF-19500/408, which is a T0-3 package version. The military 2N7368 contains the same die as the military 2N3716. The MIL-PRF-19500/622 is preferred over the MILPRF-19500/408 whenever interchangeability is not a problem. For new design use 2N7368. The 2N3716 is inactive for new design. 6.5 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes. Custodians: Army - CR Navy - EC Air Force - 17 NASA - NA Preparing activity: DLA - CC (Project 5961-1899-04) Review activities: Army - AR, MI, SM Navy - AS, CG, MC Air Force - 13, 19, 85, 99 14 STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-PRF-19500/622A 2. DOCUMENT DATE (YYMMDD) 971022 3. DOCUMENT TITLE SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, HIGH-POWER TYPE 2N7368, JAN, JANTX, JANTXV, AND JANS 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) b. ORGANIZATION c. ADDRESS (Include Zip Code) d. TELEPHONE (Include Area Code) (1) Commercial (2) AUTOVON (If applicable) 7. DATE SUBMITTED (YYMMDD) 8. PREPARING ACTIVITY a. NAME Alan Barone b. TELEPHONE (Include Area Code) (1) Commercial (2) AUTOVON (614)692-0510 850-0510 c. ADDRESS (Include Zip Code) IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Quality and Standardization Office 5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466 Telephone (703) 756-2340 AUTOVON 289-2340 Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000 DD Form 1426, OCT 89 Previous editions are obsolete 198/290