NumonyxTM StrataFlash® Embedded Memory (P33-65nm) 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features High performance: — 95ns initial access time for Easy BGA — 105ns initial access time for TSOP — 25ns 16-word asynchronous-page read mode — 52MHz with zero wait states, 17ns clock-todata output synchronous-burst read mode — 4-, 8-, 16-, and continuous-word options for burst mode — Buffered Enhanced Factory Programming at 2.0MByte/s (typ) using 512-word buffer — 3.0V buffered programming at 1.5MByte/s (Typ) using 512-word buffer Architecture: — Multi-Level Cell Technology: Highest Density at Lowest Cost — Asymmetrically-blocked architecture — Four 32-KByte parameter blocks: top or bottom configuration — 128-KByte main blocks — Blank Check to verify an erase block Voltage and Power: — VCC (core) voltage: 2.3 V – 3.6 V — VCCQ (I/O) voltage: 2.3 V – 3.6 V — Standby current: 65uA (Typ) for 256-Mbit — Continuous synchronous read current: 21 mA (Typ)/24 mA (Max) at 52 MHz Datasheet 1 Security: — One-Time Programmable Registers: — 64 unique factory device identifier bits — 2112 user-programmable OTP bits — — — — — Absolute write protection: VPP = VSS Power-transition erase/program lockout Individual zero-latency block locking Individual block lock-down capability Password Access feature Software: — 20µs (Typ) program suspend — 20µs (Typ) erase suspend — Numonyx™ Flash Data Integrator optimized — Basic Command Set and Extended Function Interface Command Set compatible — Common Flash Interface capable Density and Packaging — 56-Lead TSOP package (256-Mbit only) — 64-Ball Easy BGA package (256, 512-Mbit) — 16-bit wide data bus Quality and Reliability — Operating temperature: –40 °C to +85 °C — Minimum 100,000 erase cycles per block — 65nm ETOX™ X process technology Aug 2009 Order Number: 320003-08 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. 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The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by visiting Numonyx's website at http://www.numonyx.com. Numonyx, the Numonyx logo, and StrataFlash are trademarks or registered trademarks of Numonyx, B.V. or its subsidiaries in other countries. *Other names and brands may be claimed as the property of others. Copyright © 2009, Numonyx, B.V., All Rights Reserved. Datasheet 2 Aug 2009 Order Number: 320003-08 P33-65nm Contents 1.0 Functional Description ............................................................................................... 5 1.1 Introduction ....................................................................................................... 5 1.2 Overview ........................................................................................................... 5 1.3 Virtual Chip Enable Description.............................................................................. 6 1.4 Memory Maps ..................................................................................................... 7 2.0 Package Information ................................................................................................. 8 2.1 56-Lead TSOP..................................................................................................... 8 2.2 64-Ball Easy BGA Package .................................................................................... 9 3.0 Ballouts ................................................................................................................... 11 4.0 Signals .................................................................................................................... 13 4.1 Dual-Die Configurations ..................................................................................... 14 5.0 Bus Operations ........................................................................................................ 15 5.1 Read ............................................................................................................... 15 5.2 Write ............................................................................................................... 15 5.3 Output Disable .................................................................................................. 15 5.4 Standby ........................................................................................................... 16 5.5 Reset............................................................................................................... 16 6.0 Command Set .......................................................................................................... 17 6.1 Device Command Codes ..................................................................................... 17 6.2 Device Command Bus Cycles .............................................................................. 18 7.0 Read 7.1 7.2 7.3 7.4 8.0 Program Operation .................................................................................................. 23 8.1 Word Programming ........................................................................................... 23 8.2 Buffered Programming ....................................................................................... 23 8.3 Buffered Enhanced Factory Programming.............................................................. 24 8.4 Program Suspend .............................................................................................. 26 8.5 Program Resume............................................................................................... 27 8.6 Program Protection............................................................................................ 27 9.0 Erase Operation....................................................................................................... 28 9.1 Block Erase ...................................................................................................... 28 9.2 Blank Check ..................................................................................................... 28 9.3 Erase Suspend .................................................................................................. 29 9.4 Erase Resume................................................................................................... 29 9.5 Erase Protection ................................................................................................ 29 Operation........................................................................................................ 21 Asynchronous Page-Mode Read ........................................................................... 21 Synchronous Burst-Mode Read............................................................................ 21 Read Device Identifier........................................................................................ 22 Read CFI .......................................................................................................... 22 10.0 Security ................................................................................................................... 30 10.1 Block Locking.................................................................................................... 30 10.2 Selectable OTP Blocks ........................................................................................ 32 10.3 Password Access ............................................................................................... 32 11.0 Status Register........................................................................................................ 33 11.1 Read Configuration Register................................................................................ 34 11.2 One-Time Programmable (OTP) Registers ............................................................. 40 12.0 Power and Reset Specifications ............................................................................... 43 Datasheet 3 Aug 2009 Order Number: 320003-08 P33-65nm 12.1 12.2 12.3 Power-Up and Power-Down .................................................................................43 Reset Specifications ...........................................................................................43 Power Supply Decoupling....................................................................................44 13.0 Maximum Ratings and Operating Conditions ............................................................45 13.1 Absolute Maximum Ratings .................................................................................45 13.2 Operating Conditions..........................................................................................45 14.0 Electrical Specifications ...........................................................................................46 14.1 DC Current Characteristics ..................................................................................46 14.2 DC Voltage Characteristics ..................................................................................47 15.0 AC Characteristics ....................................................................................................48 15.1 AC Test Conditions.............................................................................................48 15.2 Capacitance ......................................................................................................49 15.3 AC Read Specifications .......................................................................................49 15.4 AC Write Specifications .......................................................................................54 15.5 Program and Erase Characteristics .......................................................................58 16.0 Ordering Information...............................................................................................59 16.1 Discrete Products...............................................................................................59 16.2 SCSP Products...................................................................................................60 A Supplemental Reference Information.......................................................................61 A.1 Common Flash Interface .....................................................................................61 A.2 Flowcharts ........................................................................................................73 A.3 Write State Machine ...........................................................................................83 B Conventions - Additional Documentation .................................................................87 B.1 Acronyms .........................................................................................................87 B.2 Definitions and Terms ........................................................................................87 C Revision History.......................................................................................................89 Datasheet 4 Aug 2009 Order Number: 320003-08 P33-65nm 1.0 Functional Description 1.1 Introduction This document provides information about the NumonyxTM StrataFlash® Embedded Memory (P33-65nm) device and describes its features, operations, and specifications. P33-65nm is the latest generation of NumonyxTM StrataFlash® Embedded Memory (P33-65nm) devices. P33-65nm device will be offered in 64-Mbit up through 2-Gbit densities. This document covers specifically 256-Mbit and 512-Mbit (256M/256M) product information. Benefits include more density in less space, high-speed interface NOR device, and support for code and data storage. Features include high-performance synchronous-burst read mode, fast asynchronous access times, low power, flexible security options, and two industry-standard package choices. P33-65nm is manufactured using Numonyx™ 65nm ETOX™ X process technology. 1.2 Overview This family of devices provides high performance at low voltage on a 16-bit data bus. Individually erasable memory blocks are sized for optimum code and data storage. Upon initial power-up or return from reset, the device defaults to asynchronous pagemode read. Configuring the RCR enables synchronous burst-mode reads. In synchronous burst mode, output data is synchronized with a user-supplied clock signal. A WAIT signal provides an easy CPU-to-flash memory synchronization. In addition to the enhanced architecture and interface, the device incorporates technology that enables fast factory program and erase operations. Designed for lowvoltage systems, the P33 Family Flash memory supports read operations with VCC at 3.0V, and erase and program operations with VPP at 3.0V or 9.0V. Buffered Enhanced Factory Programming provides the fastest flash array programming performance with VPP at 9.0V, which increases factory throughput. With VPP at 3.0V, VCC and VPP can be tied together for a simple, ultra low power design. In addition to voltage flexibility, a dedicated VPP connection provides complete data protection when VPP ≤ VPPLK. The Command User Interface is the interface between the system processor and all internal operations of the device. An internal Write State Machine automatically executes the algorithms and timings necessary for block erase and program. A Status Register indicates erase or program completion and any errors that may have occurred. An industry-standard command sequence invokes program and erase automation. Each erase operation erases one block. The Erase Suspend feature allows system software to pause an erase cycle to read or program data in another block. Program Suspend allows system software to pause programming to read other locations. Data is programmed in word increments (16 bits). The P33 Family Flash memory one-time-programmable (OTP) register allows unique flash device identification that can be used to increase system security. The individual Block Lock feature provides zero-latency block locking and unlocking. The P33-65nm device adds enhanced protection via Password Access Mode which allows user to protect write and/or read access to the defined blocks. In addition, the P33 Family Flash memory may also provide the backward compatible OTP permanent lock feature. Datasheet 5 Aug 2009 Order Number:320003-08 P33-65nm 1.3 Virtual Chip Enable Description The 512 Mbit P33 Family Flash memory employs a Virtual Chip Enable which combines two 256-Mbit die with a common chip enable, CE# for Easy BGA packages. Address A25 is then used to select between the die pair with CE# asserted, depending upon the package option used. When chip enable is asserted and A25 is low (VIL), The lower parameter die is selected; when chip enable is asserted and A25 is high (VIH), the upper parameter die is selected. Table 1: Datasheet 6 Flash Die Virtual Chip Enable Truth Table for 512 Mbit Easy BGA Package Die Selected CE# A25 Lower Param Die L L Upper Param Die L H Aug 2009 Order Number: 320003-08 P33-65nm 1.4 Memory Maps Figure 1: P33-65nm Memory Map A<24:1 > 256 Mbit : FF 0000 - FFFFFF 64- Kword Block A<24:1 > 256 Mbit Kword Block Kword Block Kword Block Kword Block 258 FF 0000 – FF3FFF 16161616- FE0000 – FEFFFF 64- Kword Block 254 010000 – 01 FFFF 64- Kword Block 1 000000 – 00 FFFF 64- Kword Block 0 FFC 000– FFFFFF 258 FF 8000 – FFBFFF 64- Kword Block 130 3 F0000 - 3FFFFF 64- Kword Block 66 020000 – 02 FFFF 64- Kword Block 5 64- Kword Block 4 010000 – 01 FFFF 00C000 – 00 FFFF 008000 – 00 BFFF 004000 – 007FFF 000000 – 003FFF 16161616- Kword Block Kword Block Kword Block Kword Block 256 255 256-Mbit 7F 0000 - 7FFFFF 257 256- Mbit FF 4000 – FF7FFF 3 2 1 0 Bottom Boot Word Wide (x16) Mode Top Boot 256 Mbit Word Wide (x16) Mode A<25:1> 512 Mbit (256/256) Kword Block Kword Block Kword Block Kword Block 517 1 FF0000 - 1FF3FFF 16161616- 1FE0000 - 1FEFFFF 64- Kword Block 513 1FD0000 - 1FDFFFF 64- Kword Block 512 0020000 - 002FFFF 64- Kword Block 5 0010000 - 001FFFF 64- Kword Block 4 000 C000 - 000FFFF 16161616- 3 1 FFC000 - 1FFFFFF 1FF8000 - 1FFBFFF 516 515 514 512 Mbit (256/256) 1 FF4000 - 1FF7FFF 0008000 - 000BFFF 0004000 - 0007 FFF 0000000 - 0003 FFF Kword Block Kword Block Kword Block Kword Block 2 1 0 512 Mbit (256/256) Word Wide (x16) Mode Datasheet 7 Aug 2009 Order Number:320003-08 P33-65nm 2.0 Package Information 2.1 56-Lead TSOP Figure 2: TSOP Mechanical Specifications (256-Mbit) Z See Notes 1 and 3 See Note 2 A2 Pin 1 e See Detail B E Y D1 A1 D Seating Plane See Detail A A Detail A Detail B C 0 b L Table 2: TSOP Package Dimensions (Sheet 1 of 2) Millimeters Product Information Inches Symbol Note Min Nom Max Min Nom Max - 1.200 - - 0.047 Package Height A - Standoff A1 0.050 - - 0.002 - - Package Body Thickness A2 0.965 0.995 1.025 0.038 0.039 0.040 Lead Width b 0.100 0.150 0.200 0.004 0.006 0.008 Lead Thickness c 0.100 0.150 0.200 0.004 0.006 0.008 Package Body Length D1 18.200 18.400 18.600 0.717 0.724 0.732 Note Package Body Width E 13.800 14.000 14.200 0.543 0.551 0.559 Note Lead Pitch e - 0.500 - - 0.0197 - Terminal Dimension D 19.800 20.00 20.200 0.780 0.787 0.795 Lead Tip Length L 0.500 0.600 0.700 0.020 0.024 0.028 Datasheet 8 Aug 2009 Order Number: 320003-08 P33-65nm Table 2: TSOP Package Dimensions (Sheet 2 of 2) Millimeters Product Information Inches Symbol Note Min Nom Max Min Nom Max N - 56 - - 56 - Lead Tip Angle θ 0° 3° 5° 0° 3° 5° Seating Plane Coplanarity Y - - 0.100 - - 0.004 Lead to Package Offset Z 0.150 0.250 0.350 0.006 0.010 0.014 Lead Count Notes: 1. One dimple on package denotes Pin 1. 2. If two dimples, then the larger dimple denotes Pin 1. 3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark. 2.2 64-Ball Easy BGA Package Figure 3: Easy BGA Mechanical Specifications (256/512-Mbit) Ball A1 Corner D 1 E Ball A1 Corner 2 3 4 S1 5 6 7 8 8 A A B B C C D D E E F F G G H H Top View - Ball side down 7 6 5 4 3 2 1 S2 b e Bottom View - Ball Side Up A1 A2 A Seating Plane Y Note: Drawing not to scale Datasheet 9 Aug 2009 Order Number:320003-08 P33-65nm Table 3: Easy BGA Package Dimensions Millimeters Product Information Inches Symbol Notes Min Nom Max Min Nom Max A - - 1.200 - - 0.0472 Ball Height A1 0.250 - - 0.0098 - - Package Body Thickness A2 - 0.780 - - 0.0307 - Ball (Lead) Width b 0.330 0.430 0.530 0.0130 0.0169 0.0209 Package Body Width D 9.900 10.000 10.100 0.3898 0.3937 0.3976 Note E 12.900 13.000 13.100 0.5079 0.5118 0.5157 Note [e] - 1.000 - - 0.0394 - Package Height Package Body Length Pitch Ball (Lead) Count N - 64 - - 64 - Seating Plane Coplanarity Y - - 0.100 - - 0.0039 Corner to Ball A1 Distance Along D S1 1.400 1.500 1.600 0.0551 0.0591 0.0630 Note Corner to Ball A1 Distance Along E S2 2.900 3.000 3.100 0.1142 0.1181 0.1220 Note Note: Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology http:// developer.numonyx.com/design/flash/packtech. Datasheet 10 Aug 2009 Order Number: 320003-08 P33-65nm 3.0 Ballouts Figure 4: A16 A15 A14 A13 A12 A11 A10 A9 A23 A22 A21 VSS VCC WE# WP# A20 A19 A18 A8 A7 A6 A5 A4 A3 A2 A24 RFU VSS Notes: 1. 2. 3. 4. 56-Lead TSOP Pinout (256-Mbit) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Numonyx™ StrataFlash® Embedded Memory (P33) 56-Lead TSOP Pinout 14 mm x 20 mm Top View 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 WAIT A17 DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 ADV# CLK RST# VPP DQ11 DQ3 DQ10 DQ2 VCCQ DQ9 DQ1 DQ8 DQ0 VCC OE# VSS CE# A1 A1 is the least significant address bit. A24 is valid for 256-Mbit densities; otherwise, it is a no connect (NC). No Internal Connection on VCC Pin 13; it may be driven or floated. For legacy designs, pin can be tied to Vcc. One dimple on package denotes Pin 1, which will always be in the upper left corner of the package, in reference to the product mark. Datasheet 11 Aug 2009 Order Number:320003-08 P33-65nm Figure 5: 64-Ball Easy BGA Ballout (256/512-Mbit) 1 2 3 4 5 6 7 8 8 7 6 5 4 3 2 1 A1 A6 A8 VPP A13 VCC A18 A22 A22 A18 VCC A13 VPP A8 A6 A1 A2 VSS A9 CE# A14 A25 A19 RFU RFU A19 A25 A14 CE# A9 VSS A2 A A B B C C A3 A7 A10 A20 A21 A21 A20 A10 A7 A3 A4 A5 A11 RST# VCCQ VCCQ A16 A17 A17 A16 VCCQ VCCQ RST# A11 A5 A4 DQ1 DQ8 OE# WAIT ADV# DQ12 DQ11 DQ10 DQ0 RFU A12 A15 WP# WP# A15 A12 D D E E DQ8 DQ1 DQ9 DQ3 DQ4 CLK DQ15 RFU RFU DQ0 DQ10 DQ11 DQ12 ADV# WAIT OE# RFU DQ15 CLK DQ4 DQ3 DQ9 F F G G A23 RFU DQ2 VCCQ DQ5 DQ6 DQ14 WE# WE# DQ14 DQ6 DQ5 VCCQ DQ2 RFU A23 RFU VSS VCC DQ7 A24 DQ13 VSS VCC VSS RFU H H VSS DQ13 VSS Easy BGA Top View- Ball side down Notes: 1. 2. 3. 4. A24 DQ7 VSS Easy BGA Bottom View- Ball side up A1 is the least significant address bit. A24 is valid for 256-Mbit densities and above; otherwise, it is a no connect. A25 is valid for 512-Mbit densities; otherwise, it is a no connect. One dimple on package denotes A1 Pin, which will always be in the upper left corner of the package, in reference to the product mark. Datasheet 12 Aug 2009 Order Number: 320003-08 P33-65nm 4.0 Table 4: Symbol Signals TSOP and Easy BGA Signal Descriptions (Sheet 1 of 2) Type Name and Function ADDRESS INPUTS: Device address inputs. 256-Mbit: A[24:1]; 512-Mbit: A[25:1]. Note: The virtual selection of the 256-Mbit “Top parameter” die in the dual-die 512-Mbit configuration is accomplished by setting A[25] high (VIH). A[MAX:1] Input DQ[15:0] Input/ Output DATA INPUT/OUTPUTS: Inputs data and commands during write cycles; outputs data during reads of memory, status register, OTP register, and read configuration register. Data balls float when the CE# or OE# are deasserted. Data is internally latched during writes. Input ADDRESS VALID: Active low input. During synchronous read operations, addresses are latched on the rising edge of ADV#, or on the next valid CLK edge with ADV# low, whichever occurs first. In asynchronous mode, the address is latched when ADV# going high or continuously flows through if ADV# is held low. WARNING: Designs not using ADV# must tie it to VSS to allow addresses to flow through. CE# Input CHIP ENABLE: Active low input. CE# low selects the associated flash memory die. When asserted, flash internal control logic, input buffers, decoders, and sense amplifiers are active. When deasserted, the associated flash die is deselected, power is reduced to standby levels, data and WAIT outputs are placed in high-Z state. WARNING: All chip enables must be high when device is not in use. CLK Input CLOCK: Synchronizes the device with the system’s bus frequency in synchronous-read mode. During synchronous read operations, addresses are latched on the rising edge of ADV#, or on the next valid CLK edge with ADV# low, whichever occurs first. WARNING: Designs not using CLK for synchronous read mode must tie it to VCCQ or VSS. OE# Input OUTPUT ENABLE: Active low input. OE# low enables the device’s output data buffers during read cycles. OE# high places the data outputs and WAIT in High-Z. RST# Input RESET: Active low input. RST# resets internal automation and inhibits write operations. This provides data protection during power transitions. RST# high enables normal operation. Exit from reset places the device in asynchronous read array mode. ADV# WAIT Output WAIT: Indicates data valid in synchronous array or non-array burst reads. RCR[10], (WT) determines its polarity when asserted. WAIT’s active output is VOL or VOH when CE# and OE# are VIL. WAIT is high-Z if CE# or OE# is VIH. • In synchronous array or non-array read modes, WAIT indicates invalid data when asserted and valid data when deasserted. • In asynchronous page mode, and all write modes, WAIT is deasserted. WE# Input WRITE ENABLE: Active low input. WE# controls writes to the device. Address and data are latched on the rising edge of WE#. WP# Input WRITE PROTECT: Active low input. WP# low enables the lock-down mechanism. Blocks in lockdown cannot be unlocked with the Unlock command. WP# high overrides the lock-down function enabling blocks to be erased or programmed using software commands. VPP Power/ Input ERASE AND PROGRAM POWER: A valid voltage on this pin allows erasing or programming. Memory contents cannot be altered when VPP ≤ VPPLK. Block erase and program at invalid VPP voltages should not be attempted. Set VPP = VPPL for in-system program and erase operations. To accommodate resistor or diode drops from the system supply, the VIH level of VPP can be as low as VPPL min. VPP must remain above VPPL min to perform in-system flash modification. VPP may be 0 V during read operations. VPPH can be applied to main blocks for 1000 cycles maximum and to parameter blocks for 2500 cycles. VPP can be connected to 9 V for a cumulative total not to exceed 80 hours. Extended use of this pin at 9 V may reduce block cycling capability. VCC Power DEVICE CORE POWER SUPPLY: Core (logic) source voltage. Writes to the flash array are inhibited when VCC ≤ VLKO. Operations at invalid VCC voltages should not be attempted. VCCQ Power OUTPUT POWER SUPPLY: Output-driver source voltage. VSS Power GROUND: Connect to system ground. Do not float any VSS connection. Datasheet 13 Aug 2009 Order Number:320003-08 P33-65nm Table 4: Symbol TSOP and Easy BGA Signal Descriptions (Sheet 2 of 2) Type Name and Function RFU — RESERVED FOR FUTURE USE: Reserved by Numonyx for future device functionality and enhancement. These should be treated in the same way as a Don’t Use (DU) signal. DU — DON’T USE: Do not connect to any other signal, or power supply; must be left floating. NC — NO CONNECT: No internal connection; can be driven or floated. 4.1 Figure 6: Dual-Die Configurations 512-Mbit Easy BGA Block Diagram Easy BGA 512-Mbit (Dual-Die) Configuration CE# WP# OE# Top Param Die (256-Mbit) VCCQ CLK ADV# VSS Bottom Param Die (256-Mbit) Note: Datasheet 14 VCC VPP WE# A[MAX:1] RST# DQ[15:0] WAIT Amax = VIH selects the Top parameter Die; Amax = VIL selects the Bottom Parameter Die. Aug 2009 Order Number: 320003-08 P33-65nm 5.0 Bus Operations CE# low and RST# high enable device read operations. The device internally decodes upper address inputs to determine the accessed block. ADV# low opens the internal address latches. OE# low activates the outputs and gates selected data onto the I/O bus. In asynchronous mode, the address is latched when ADV# goes high or continuously flows through if ADV# is held low. In synchronous mode, the address is latched by the first of either the rising ADV# edge or the next valid CLK edge with ADV# low (WE# and RST# must be VIH; CE# must be VIL). Bus cycles to/from the P33-65nm device conform to standard microprocessor bus operations. Table 5, “Bus Operations Summary”summarizes the bus operations and the logic levels that must be applied to the device control signal inputs. Table 5: Bus Operations Summary Bus Operation Read RST# CLK ADV# CE# OE# WE# WAIT DQ[15:0] VIH X L L L H Deasserted Output Asynchronous Notes VIH Running L L L H Driven Output VIH X L L H L High-Z Input 1 Output Disable VIH X X L H H High-Z High-Z 2 Standby VIH X X H X X High-Z High-Z 2 Reset VIL X X X X X High-Z High-Z 2,3 Synchronous Write Notes: 1. Refer to the Table 7, “Command Bus Cycles” on page 19 for valid DQ[15:0] during a write operation. 2. X = Don’t Care (H or L). 3. RST# must be at VSS ± 0.2 V to meet the maximum specified power-down current. 5.1 Read To perform a read operation, RST# and WE# must be deasserted while CE# and OE# are asserted. CE# is the device-select control. When asserted, it enables the flash memory device. OE# is the data-output control. When asserted, the addressed flash memory data is driven onto the I/O bus. 5.2 Write To perform a write operation, both CE# and WE# are asserted while RST# and OE# are deasserted. During a write operation, address and data are latched on the rising edge of WE# or CE#, whichever occurs first. Table 7, “Command Bus Cycles” on page 19 shows the bus cycle sequence for each of the supported device commands, while Table 6, “Command Codes and Definitions” on page 17 describes each command. See Section 15.0, “AC Characteristics” on page 48 for signal-timing details. Note: Write operations with invalid VCC and/or VPP voltages can produce spurious results and should not be attempted. 5.3 Output Disable When OE# is deasserted, device outputs DQ[15:0] are disabled and placed in a highimpedance (High-Z) state, WAIT is also placed in High-Z. Datasheet 15 Aug 2009 Order Number:320003-08 P33-65nm 5.4 Standby When CE# is deasserted the device is deselected and placed in standby, substantially reducing power consumption. In standby, the data outputs are placed in High-Z, independent of the level placed on OE#. Standby current, ICCS, is the average current measured over any 5 ms time interval, 5 µs after CE# is deasserted. During standby, average current is measured over the same time interval 5 µs after CE# is deasserted. When the device is deselected (while CE# is deasserted) during a program or erase operation, it continues to consume active power until the program or erase operation is completed. 5.5 Reset As with any automated device, it is important to assert RST# when the system is reset. When the system comes out of reset, the system processor attempts to read from the flash memory if it is the system boot device. If a CPU reset occurs with no flash memory reset, improper CPU initialization may occur because the flash memory may be providing status information rather than array data. Flash memory devices from Numonyx allow proper CPU initialization following a system reset through the use of the RST# input. RST# should be controlled by the same low-true reset signal that resets the system CPU. After initial power-up or reset, the device defaults to asynchronous Read Array mode, and the Status Register is set to 0x80. Asserting RST# de-energizes all internal circuits, and places the output drivers in High-Z. When RST# is asserted, the device shuts down the operation in progress, a process which takes a minimum amount of time to complete. When RST# has been deasserted, the device is reset to asynchronous Read Array state. Note: If RST# is asserted during a program or erase operation, the operation is terminated and the memory contents at the aborted location (for a program) or block (for an erase) are no longer valid, because the data may have been only partially written or erased. When returning from a reset (RST# deasserted), a minimum wait is required before the initial read access outputs valid data. Also, a minimum delay is required after a reset before a write cycle can be initiated. After this wake-up interval passes, normal operation is restored. See Section 15.0, “AC Characteristics” on page 48 for details about signal-timing. Datasheet 16 Aug 2009 Order Number: 320003-08 P33-65nm 6.0 Command Set 6.1 Device Command Codes The system Central Processing Unit provides control of all in-system read, write, and erase operations of the device via the system bus. The on-chip WSM manages all blockerase and word-program algorithms. Device commands are written to the CUI to control all flash memory device operations. The CUI does not occupy an addressable memory location; it is the mechanism through which the flash device is controlled. Table 6 shows valid device command codes and descriptions. Table 6: Mode Read Write Command Codes and Definitions (Sheet 1 of 2) Code Device Mode 0xFF Read Array Places the device in Read Array mode. Array data is output on DQ[15:0]. 0x70 Read Status Register Places the device in Read Status Register mode. The device enters this mode after a program or erase command is issued. SR data is output on DQ[7:0]. 0x90 Read Device ID or Configuration Register Places device in Read Device Identifier mode. Subsequent reads output manufacturer/device codes, Configuration Register data, Block Lock status, or OTP register data on DQ[15:0]. 0x98 Read Query Places the device in Read Query mode. Subsequent reads output Common Flash Interface information on DQ[7:0]. 0x50 Clear Status Register The WSM can only set SR error bits. The Clear Status Register command is used to clear the SR error bits. 0x40 Word Program Setup First cycle of a 2-cycle programming command; prepares the CUI for a write operation. On the next write cycle, the address and data are latched and the WSM executes the programming algorithm at the addressed location. During program operations, the device responds only to Read Status Register and Program Suspend commands. CE# or OE# must be toggled to update the Status Register in asynchronous read. CE# or ADV# must be toggled to update the SR Data for synchronous Non-array reads. The Read Array command must be issued to read array data after programming has finished. 0xE8 Buffered Program This command loads a variable number of words up to the buffer size of 512 words onto the program buffer. 0xD0 Buffered Program Confirm The confirm command is Issued after the data streaming for writing into the buffer is done. This instructs the WSM to perform the Buffered Program algorithm, writing the data from the buffer to the flash memory array. 0x80 BEFP Setup First cycle of a 2-cycle command; initiates the BEFP mode. The CUI then waits for the BEFP Confirm command, 0xD0, that initiates the BEFP algorithm. All other commands are ignored when BEFP mode begins. 0xD0 BEFP Confirm If the previous command was BEFP Setup (0x80), the CUI latches the address and data, and prepares the device for BEFP mode. Block Erase Setup First cycle of a 2-cycle command; prepares the CUI for a block-erase operation. The WSM performs the erase algorithm on the block addressed by the Erase Confirm command. If the next command is not the Erase Confirm (0xD0) command, the CUI sets Status Register bits SR [5,4], and places the device in Read Status Register mode. Block Erase Confirm If the first command was Block Erase Setup (0x20), the CUI latches the address and data, and the WSM erases the addressed block. During blockerase operations, the device responds only to Read Status Register and Erase Suspend commands. CE# or OE# must be toggled to update the Status Register in asynchronous read. CE# or ADV# must be toggled to update the SR Data for synchronous Non-array reads. 0x20 Erase 0xD0 Datasheet 17 Description Aug 2009 Order Number:320003-08 P33-65nm Table 6: Command Codes and Definitions (Sheet 2 of 2) Mode Code 0xB0 Program or Erase Suspend 0xD0 Suspend Resume This command issued to any device address resumes the suspended program or block-erase operation. 0x60 Block lock Setup First cycle of a 2-cycle command; prepares the CUI for block lock configuration changes. If the next command is not Block Lock (0x01), Block Unlock (0xD0), or Block Lock-Down (0x2F), the CUI sets SR.5 and SR.4, indicating a command sequence error. 0x01 Block lock If the previous command was Block Lock Setup (0x60), the addressed block is locked. 0xD0 Unlock Block If the previous command was Block Lock Setup (0x60), the addressed block is unlocked. If the addressed block is in a lock-down state, the operation has no effect. 0x2F Lock-Down Block If the previous command was Block Lock Setup (0x60), the addressed block is locked down. 0xC0 Protection program setup First cycle of a 2-cycle command; prepares the device for a OTP register or Lock Register program operation. The second cycle latches the register address and data, and starts the programming algorithm to program data the the OTP array. 0x60 Read Configuration Register Setup First cycle of a 2-cycle command; prepares the CUI for device read configuration. If the Set Read Configuration Register command (0x03) is not the next command, the CUI sets Status Register bits SR.5 and SR.4, indicating a command sequence error. 0x03 Read Configuration Register If the previous command was Read Configuration Register Setup (0x60), the CUI latches the address and writes A[15:0]to the Read Configuration Register. Following a Configure RCR command, subsequent read operations access array data. 0xBC Blank Check First cycle of a 2-cycle command; initiates the Blank Check operation on a main block. 0xD0 Blank Check Confirm Second cycle of blank check command sequence; it latches the block address and executes blank check on the main array block. 0xEB Extended Function Interface command This command is used in extended function interface. first cycle of a multiplecycle command second cycle is a Sub-Op-Code, the data written on third cycle is one less than the word count; the allowable value on this cycle are 0 through 511. The subsequent cycles load data words into the program buffer at a specified address until word count is achieved. Configuration blank check other 6.2 Description This command issued to any device address initiates a suspend of the currently-executing program or block erase operation. The Status Register indicates successful suspend operation by setting either SR.2 (program suspended) or SR 6 (erase suspended), along with SR.7 (ready). The WSM remains in the suspend mode regardless of control signal states (except for RST# asserted). Suspend Protection Device Mode Device Command Bus Cycles Device operations are initiated by writing specific device commands to the CUI. See Table 7, “Command Bus Cycles” on page 19. Several commands are used to modify array data including Word Program and Block Erase commands. Writing either command to the CUI initiates a sequence of internally-timed functions that culminate in the completion of the requested task. However, the operation can be aborted by either asserting RST# or by issuing an appropriate suspend command. Datasheet 18 Aug 2009 Order Number: 320003-08 P33-65nm Table 7: Command Bus Cycles (Sheet 1 of 2) Mode Command Erase Suspend Protection Configuration Datasheet 19 Second Bus Cycle Addr(1) Data(2) Oper Addr(1) Data(2) 1 Write DnA 0xFF - - - Read Device Identifier ≥2 Write DnA 0x90 Read DBA + IA ID Read CFI ≥2 Write DnA 0x98 Read DBA + CFI-A CFI-D Read Status Register 2 Write DnA 0x70 Read DnA SRD Clear Status Register 1 Write DnA 0x50 - - - Word Program Program First Bus Cycle Oper Read Array Read Bus Cycles 2 Write WA 0x40 Write WA WD Buffered Program(3) >2 Write WA 0xE8 Write WA N-1 Buffered Enhanced Factory Program (BEFP)(4) >2 Write WA 0x80 Write WA 0xD0 Block Erase 2 Write BA 0x20 Write BA 0xD0 Program/Erase Suspend 1 Write DnA 0xB0 - - - Program/Erase Resume 1 Write DnA 0xD0 - - - Lock Block 2 Write BA 0x60 Write BA 0x01 Unlock Block 2 Write BA 0x60 Write BA 0xD0 Lock-down Block 2 Write BA 0x60 Write BA 0x2F Program OTP register 2 Write PRA 0xC0 Write OTP-RA OTP-D Program Lock Register 2 Write LRA 0xC0 Write LRA LRD Program Read Configuration Register 2 Write RCD 0x60 Write RCD 0x03 Aug 2009 Order Number:320003-08 P33-65nm Table 7: Mode Command Bus Cycles (Sheet 2 of 2) Command Blank Check Others Extended Function Interface command(5) Bus Cycles First Bus Cycle Second Bus Cycle Oper Addr(1) Data(2) Oper Addr(1) Data(2) 2 Write BA 0xBC Write BA D0 >2 Write WA 0xEB Write WA Sub-Op code Notes: 1. First command cycle address should be the same as the operation’s target address. DBA = Device Base Address (NOTE: needed for dual-die 512Mbit device) DnA = Address within the device. IA = Identification code address offset. CFI-A = Read CFI address offset. WA = Word address of memory location to be written. BA = Address within the block. OTP-RA = OTP register address. LRA = Lock Register address. RCD = Read Configuration Register data on A[16:1]. 2. ID = Identifier data. CFI-D = CFI data on DQ[15:0]. SRD = Status Register data. WD = Word data. N = Word count of data to be loaded into the write buffer. OTP-D = OTP register data. LRD = Lock Register data. 3. The second cycle of the Buffered Program Command is the word count of the data to be loaded into the write buffer. This is followed by up to 512 words of data.Then the confirm command (0xD0) is issued, triggering the array programming operation. 4. The confirm command (0xD0) is followed by the buffer data. 5. The second cycle is a Sub-Op-Code, the data written on third cycle is N-1; 1=< N <=512. The subsequent cycles load data words into the program buffer at a specified address until word count is achieved, after the data words are loaded, the final cycle is the confirm cycle 0xD0) Datasheet 20 Aug 2009 Order Number: 320003-08 P33-65nm 7.0 Read Operation The device can be in any of four read states: Read Array, Read Identifier, Read Status or Read Query. Upon power-up, or after a reset, the device defaults to Read Array mode. To change the read state, the appropriate read command must be written to the device (see Section 6.2, “Device Command Bus Cycles” on page 18). The following sections describe read-mode operations in detail. The device supports two read modes: asynchronous page mode and synchronous burst mode. Asynchronous page mode is the default read mode after device power-up or a reset. The RCR must be configured to enable synchronous burst reads of the flash memory array (see Section 11.1, “Read Configuration Register” on page 34). 7.1 Asynchronous Page-Mode Read Following a device power-up or reset, asynchronous page mode is the default read mode and the device is set to Read Array mode. However, to perform array reads after any other device operation (e.g. write operation), the Read Array command must be issued in order to read from the flash memory array. Note: Asynchronous page-mode reads can only be performed when RCR.15 is set The Clear Status Register command clears the status register. It functions independent of VPP. The WSM sets and clears SR[7,6,2], but it sets bits SR[5,3,1] without clearing them. The Status Register should be cleared before starting a command sequence to avoid any ambiguity. A device reset also clears the Status Register. To perform an asynchronous page-mode read, an address is driven onto the address bus, and CE# and ADV# are asserted. WE# and RST# must already have been deasserted. WAIT is deasserted during asynchronous page mode. ADV# can be driven high to latch the address, or it must be held low throughout the read cycle. CLK is not used for asynchronous page-mode reads, and is ignored. If only asynchronous reads are to be performed, CLK should be tied to a valid VIH level, WAIT signal can be floated and ADV# must be tied to ground. Array data is driven onto DQ[15:0] after an initial access time tAVQV delay. (see Section 15.0, “AC Characteristics” on page 48). In asynchronous page mode, sixteen data words are “sensed” simultaneously from the flash memory array and loaded into an internal page buffer. The buffer word corresponding to the initial address on the Address bus is driven onto DQ[15:0] after the initial access delay. The lowest four address bits determine which word of the 16-word page is output from the data buffer at any given time. 7.2 Synchronous Burst-Mode Read To perform a synchronous burst-read, an initial address is driven onto the address bus, and CE# and ADV# are asserted. WE# and RST# must already have been deasserted. ADV# is asserted, and then deasserted to latch the address. Alternately, ADV# can remain asserted throughout the burst access, in which case the address is latched on the next valid CLK edge while ADV# is asserted. During synchronous array and non-array read modes, the first word is output from the data buffer on the next valid CLK edge after the initial access latency delay (see Section 11.1.2, “Latency Count” on page 35). Subsequent data is output on valid CLK edges following a minimum delay. However, for a synchronous non-array read, the same word of data will be output on successive clock edges until the burst length requirements are satisfied. Refer to the following waveforms for more detailed information: • Figure 20, “Synchronous Single-Word Array or Non-array Read Timing” on page 53 Datasheet 21 Aug 2009 Order Number:320003-08 P33-65nm • Figure 21, “Continuous Burst Read, showing an Output Delay Timing” on page 53 • Figure 22, “Synchronous Burst-Mode Four-Word Read Timing” on page 54 7.3 Read Device Identifier The Read Device Identifier command instructs the device to output manufacturer code, device identifier code, block-lock status, OTP register data, or configuration register data (see Section 6.2, “Device Command Bus Cycles” on page 18 for details on issuing the Read Device Identifier command). Table 8, “Device Identifier Information” on page 22 and Table 9, “Device ID codes” on page 22 show the address offsets and data values for this device. Table 8: Device Identifier Information Address(1,2) Data Manufacturer Code 0x00 0x89h Device ID Code 0x01 Item ID (see Block Lock Configuration: • Block Is Unlocked • Block Is Locked Table 9) Lock Bit: DQ0 = 0b0 DQ0 = 0b1 BBA + 0x02 • Block Is not Locked-Down DQ1 = 0b0 • Block Is Locked-Down DQ1 = 0b1 Read Configuration Register 0x05 RCR Contents General Purpose Register(3) DBA + 0x07 general data Lock Register 0 0x80 PR-LK0 64-bit Factory-Programmed OTP register 0x81–0x84 Factory OTP register data 64-bit User-Programmable OTP Register 0x85–0x88 User OTP register data 0x89 OTP register lock data 0x8A–0x109 User OTP register data Lock Register 1 128-bit User-Programmable OTP registers Notes: 1. BBA = Block Base Address. 2. DBA = Device base Address, Numonyx reserves other configuration address locations 3. In P33-65nm, the GPR is used as read out register for Extended Functional interface command. Table 9: Device ID codes Device Identifier Codes ID Code Type Device Code Note: Device Density 256-Mbit –T (Top Parameter) –B (Bottom Parameter) 891F 8922 The 512-Mbit devices do not have a Device ID associated with them. Each die within the stack can be identified by either of the 256-Mbit Device ID codes depending on its parameter option. 7.4 Read CFI The Read CFI command instructs the device to output Common Flash Interface data when read. Datasheet 22 Aug 2009 Order Number: 320003-08 P33-65nm 8.0 Program Operation The device supports three programming methods: Word Programming (40h or 10h), Buffered Programming (E8h, D0h), and Buffered Enhanced Factory Programming (80h, D0h). The following sections describe device programming in detail. Successful programming requires the addressed block to be unlocked. If the block is locked down, WP# must be deasserted and the block must be unlocked before attempting to program the block. Attempting to program a locked block causes a program error (SR.4 and SR.1 set) and termination of the operation. See Section 10.0, “Security” on page 30 for details on locking and unlocking blocks. 8.1 Word Programming Word programming operations are initiated by writing the Word Program Setup command to the device. This is followed by a second write to the device with the address and data to be programmed. The device outputs Status Register data when read. See Figure 31, “Word Program Flowchart” on page 72. VPP must be above VPPLK, and within the specified VPPL min/max values. During programming, the WSM executes a sequence of internally-timed events that program the desired data bits at the addressed location, and verifies that the bits are sufficiently programmed. Programming the flash memory array changes “ones” to “zeros”. Memory array bits that are zeros can be changed to ones only by erasing the block. The Status Register can be examined for programming progress and errors by reading at any address. The device remains in the Read Status Register state until another command is written to the device. Status Register bit SR.7 indicates the programming status while the sequence executes. Commands that can be issued to the device during programming are Program Suspend, Read Status Register, Read Device Identifier, Read CFI, and Read Array (this returns unknown data). When programming has finished, Status Register bit SR.4 (when set) indicates a programming failure. If SR.3 is set, the WSM could not perform the word programming operation because VPP was outside of its acceptable limits. If SR.1 is set, the word programming operation attempted to program a locked block, causing the operation to abort. Before issuing a new command, the Status Register contents should be examined and then cleared using the Clear Status Register command. Any valid command can follow, when word programming has completed. 8.2 Buffered Programming The device features a 512-word buffer to enable optimum programming performance. For Buffered Programming, data is first written to an on-chip write buffer. Then the buffer data is programmed into the flash memory array in buffer-size increments. This can improve system programming performance significantly over non-buffered programming. (see Figure 33, “Buffer Program Flowchart” on page 74). When the Buffered Programming Setup command is issued, Status Register information is updated and reflects the availability of the buffer. SR.7 indicates buffer availability: if set, the buffer is available; if cleared, the buffer is not available. Note: Datasheet 23 The device default state is to output SR data after the Buffer Programming Setup Command. CE# and OE# low drive device to update Status Register. It is not allowed Aug 2009 Order Number:320003-08 P33-65nm to issue 70h to read SR data after E8h command otherwise 70h would be counted as Word Count. On the next write, a word count is written to the device at the buffer address. This tells the device how many data words will be written to the buffer, up to the maximum size of the buffer. On the next write, a device start address is given along with the first data to be written to the flash memory array. Subsequent writes provide additional device addresses and data. All data addresses must lie within the start address plus the word count. Optimum programming performance and lower power usage are obtained by aligning the starting address at the beginning of a 512-word boundary (A[9:1] = 0x00). The maximum buffer size would be 256-word if the misaligned address range is crossing a 512-word boundary during programming. After the last data is written to the buffer, the Buffered Programming Confirm command must be issued to the original block address. The WSM begins to program buffer contents to the flash memory array. If a command other than the Buffered Programming Confirm command is written to the device, a command sequence error occurs and SR[7,5,4] are set. If an error occurs while writing to the array, the device stops programming, and SR[7,4] are set, indicating a programming failure. When Buffered Programming has completed, additional buffer writes can be initiated by issuing another Buffered Programming Setup command and repeating the buffered program sequence. Buffered programming may be performed with VPP = VPPL or VPPH (see Section 13.2, “Operating Conditions” on page 45 for limitations when operating the device with VPP = VPPH). If an attempt is made to program past an erase-block boundary using the Buffered Program command, the device aborts the operation. This generates a command sequence error, and SR[5,4] are set. If Buffered programming is attempted while VPP is below VPPLK, SR[4,3] are set. If any errors are detected that have set Status Register bits, the Status Register should be cleared using the Clear Status Register command. 8.3 Buffered Enhanced Factory Programming Buffered Enhanced Factory Programing (BEFP) speeds up Multi-Level Cell (MLC) flash programming. The enhanced programming algorithm used in BEFP eliminates traditional programming elements that drive up overhead in device programmer systems. (see Figure 34, “BEFP Flowchart” on page 75). BEFP consists of three phases: Setup, Program/Verify, and Exit It uses a write buffer to spread MLC program performance across 512 data words. Verification occurs in the same phase as programming to accurately program the flash memory cell to the correct bit state. A single two-cycle command sequence programs the entire block of data. This enhancement eliminates three write cycles per buffer: two commands and the word count for each set of 512 data words. Host programmer bus cycles fill the device’s write buffer followed by a status check. SR.0 indicates when data from the buffer has been programmed into sequential flash memory array locations. Following the buffer-to-flash array programming sequence, the Write State Machine (WSM) increments internal addressing to automatically select the next 512-word array boundary. This aspect of BEFP saves host programming equipment the address-bus setup overhead. Datasheet 24 Aug 2009 Order Number: 320003-08 P33-65nm With adequate continuity testing, programming equipment can rely on the WSM’s internal verification to ensure that the device has programmed properly. This eliminates the external post-program verification and its associated overhead. 8.3.1 BEFP Requirements and Considerations BEFP requirements: • Case temperature: TC = 30 °C ± 10 °C • Nominal VCC • VPP driven to VPPH • Target block must be unlocked before issuing the BEFP Setup and Confirm commands • The first-word address for the block to be programmed must be held constant from the setup phase through all data streaming into the target block, until transition to the exit phase is desired. • The first-word address must align with the start of an array buffer boundary. Word buffer boundaries in the array are determined by A[8:0] (0x000 through 01FF); the alignment start point is A[8:0] = 0x000. BEFP considerations: • For optimum performance, cycling must be limited below 50 erase cycles per block. Some degradation in performance may occur is this limit is exceeded, but the internal algorithm continues to work properly. • BEFP programs one block at a time; all buffer data must fall within a single block. If the internal address counter increments beyond the block’s maximum address, addressing wraps around to the beginning of the block. • BEFP cannot be suspended • Programming to the flash memory array can occur only when the buffer is full. If the number of words is less than 512, remaining locations must be filled with 0xFFFF. 8.3.2 BEFP Setup Phase After receiving the BEFP Setup and Confirm command sequence, Status Register bit SR.7 (Ready) is cleared, indicating that the WSM is busy with BEFP algorithm startup. A delay before checking SR.7 is required to allow the WSM enough time to perform all of its setups and checks (Block-Lock status, VPP level, etc.). If an error is detected, SR.4 is set and BEFP operation terminates. If the block was found to be locked, SR.1 is also set. SR.3 is set if the error occurred due to an incorrect VPP level. Note: Reading from the device after the BEFP Setup and Confirm command sequence outputs Status Register data. Do not issue the Read Status Register command; it will be interpreted as data to be loaded into the buffer. 8.3.3 BEFP Program/Verify Phase After the BEFP Setup Phase has completed, the host programming system must check SR[7,0] to determine the availability of the write buffer for data streaming. SR.7 cleared indicates the device is busy and the BEFP program/verify phase is activated. SR.0 indicates the write buffer is available. Two basic sequences repeat in this phase: loading of the write buffer, followed by buffer data programming to the array. For BEFP, the count value for buffer loading is always the maximum buffer size of 512 words. During the buffer-loading sequence, data is Datasheet 25 Aug 2009 Order Number:320003-08 P33-65nm stored to sequential buffer locations starting at address 0x00. Programming of the buffer contents to the flash memory array starts as soon as the buffer is full. If the number of words is less than 512, the remaining buffer locations must be filled with 0xFFFF. Caution: The buffer must be completely filled for programming to occur. Supplying an address outside of the current block's range during a buffer-fill sequence causes the algorithm to exit immediately. Any data previously loaded into the buffer during the fill cycle is not programmed into the array. The starting address for data entry must be buffer size aligned, if not the BEFP algorithm will be aborted and the program fails and (SR.4) flag will be set. Data words from the write buffer are directed to sequential memory locations in the flash memory array; programming continues from where the previous buffer sequence ended. The host programming system must poll SR.0 to determine when the buffer program sequence completes. SR.0 cleared indicates that all buffer data has been transferred to the flash array; SR.0 set indicates that the buffer is not available yet for the next fill cycle. The host system may check full status for errors at any time, but it is only necessary on a block basis after BEFP exit. After the buffer fill cycle, no write cycles should be issued to the device until SR.0 = 0 and the device is ready for the next buffer fill. Note: Any spurious writes are ignored after a buffer fill operation and when internal program is proceeding. The host programming system continues the BEFP algorithm by providing the next group of data words to be written to the buffer. Alternatively, it can terminate this phase by changing the block address to one outside of the current block’s range. The Program/Verify phase concludes when the programmer writes to a different block address; data supplied must be 0xFFFF. Upon Program/Verify phase completion, the device enters the BEFP Exit phase. 8.3.4 BEFP Exit Phase When SR.7 is set, the device has returned to normal operating conditions. A full status check should be performed at this time to ensure the entire block programmed successfully. When exiting the BEFP algorithm with a block address change, the read mode will not change. After BEFP exit, any valid command can be issued to the device. 8.4 Program Suspend Issuing the Program Suspend command while programming suspends the programming operation. This allows data to be accessed from the device other than the one being programmed. The Program Suspend command can be issued to any device address. A program operation can be suspended to perform reads only. Additionally, a program operation that is running during an erase suspend can be suspended to perform a read operation (see Figure 32, “Program Suspend/Resume Flowchart” on page 73). When a programming operation is executing, issuing the Program Suspend command requests the WSM to suspend the programming algorithm at predetermined points. The device continues to output Status Register data after the Program Suspend command is issued. Programming is suspended when Status Register bits SR[7,2] are set. Suspend latency is specified in Section 15.5, “Program and Erase Characteristics” on page 58. Datasheet 26 Aug 2009 Order Number: 320003-08 P33-65nm To read data from the device, the Read Array command must be issued. Read Array, Read Status Register, Read Device Identifier, Read CFI, and Program Resume are valid commands during a program suspend. During a program suspend, deasserting CE# places the device in standby, reducing active current. VPP must remain at its programming level, and WP# must remain unchanged while in program suspend. If RST# is asserted, the device is reset. 8.5 Program Resume The Resume command instructs the device to continue programming, and automatically clears Status Register bits SR[7,2]. This command can be written to any address. If error bits are set, the Status Register should be cleared before issuing the next instruction. RST# must remain deasserted (see Figure 32, “Program Suspend/ Resume Flowchart” on page 73). 8.6 Program Protection When VPP = VIL, absolute hardware write protection is provided for all device blocks. If VPP is at or below VPPLK, programming operations halt and SR.3 is set indicating a VPPlevel error. Block lock registers are not affected by the voltage level on VPP; they may still be programmed and read, even if VPP is less than VPPLK. Figure 7: Example VPP Supply Connections VCC VPP VCC VPP VPP=VPPH VCC VPP • Low Voltage and Factory Programming Datasheet 27 PROT # VCC VPP ≤ 10K Ω • Factory Programming with VPP = VPPH • Complete write/Erase Protection when VPP ≤ VPPLK VCC VCC • Low-voltage Programming only • Logic Control of Device Protection VCC VCC VPP • Low Voltage Programming Only • Full Device Protection Unavailable Aug 2009 Order Number:320003-08 P33-65nm 9.0 Erase Operation Flash erasing is performed on a block basis. An entire block is erased each time an erase command sequence is issued, and only one block is erased at a time. When a block is erased, all bits within that block read as logical ones. The following sections describe block erase operations in detail. 9.1 Block Erase Block erase operations are initiated by writing the Block Erase Setup command to the address of the block to be erased (see Section 6.2, “Device Command Bus Cycles” on page 18). Next, the Block Erase Confirm command is written to the address of the block to be erased. If the device is placed in standby (CE# deasserted) during an erase operation, the device completes the erase operation before entering standby. VPP must be above VPPLK and the block must be unlocked (see Figure 35, “Block Erase Flowchart” on page 76). During a block erase, the WSM executes a sequence of internally-timed events that conditions, erases, and verifies all bits within the block. Erasing the flash memory array changes “zeros” to “ones”. Memory array bits that are ones can be changed to zeros only by programming the block. The Status Register can be examined for block erase progress and errors by reading any address. The device remains in the Read Status Register state until another command is written. SR.0 indicates whether the addressed block is erasing. Status Register bit SR.7 is set upon erase completion. Status Register bit SR.7 indicates block erase status while the sequence executes. When the erase operation has finished, Status Register bit SR.5 indicates an erase failure if set. SR.3 set would indicate that the WSM could not perform the erase operation because VPP was outside of its acceptable limits. SR.1 set indicates that the erase operation attempted to erase a locked block, causing the operation to abort. Before issuing a new command, the Status Register contents should be examined and then cleared using the Clear Status Register command. Any valid command can follow once the block erase operation has completed. 9.2 Blank Check The Blank Check operation determines whether a specified main block is blank (i.e. completely erased). Without Blank Check, Block Erase would be the only other way to ensure a block is completely erased. so Blank Check can be used to determine whether or not a prior erase operation was successful; this includes erase operations that may have been interrupted by power loss. Blank check can apply to only one block at a time, and no operations other than Status Register Reads are allowed during Blank Check (e.g. reading array data, program, erase etc). Suspend and resume operations are not supported during Blank Check, nor is Blank Check supported during any suspended operations. Blank Check operations are initiated by writing the Blank Check Setup command to the block address. Next, the Check Confirm command is issued along with the same block address. When a successful command sequence is entered, the device automatically enters the Read Status State. The WSM then reads the entire specified block, and determines whether any bit in the block is programmed or over-erased. Datasheet 28 Aug 2009 Order Number: 320003-08 P33-65nm The status register can be examined for Blank Check progress and errors by reading any address within the block being accessed. During a blank check operation, the Status Register indicates a busy status (SR7 = 0). Upon completion, the Status Register indicates a ready status (SR7 = 1). The Status Register should be checked for any errors, and then cleared. If the Blank Check operation fails, which means the block is not completely erased, the Status 9.3 Erase Suspend Issuing the Erase Suspend command while erasing suspends the block erase operation. This allows data to be accessed from memory locations other than the one being erased. The Erase Suspend command can be issued to any device address. A block erase operation can be suspended to perform a word or buffer program operation, or a read operation within any block except the block that is erase suspended (see Figure 37, “Erase Suspend/Resume Flowchart” on page 78). When a block erase operation is executing, issuing the Erase Suspend command requests the WSM to suspend the erase algorithm at predetermined points. The device continues to output Status Register data after the Erase Suspend command is issued. Block erase is suspended when Status Register bits SR[7,6] are set. Suspend latency is specified in Section 15.5, “Program and Erase Characteristics” on page 58. To read data from the device (other than an erase-suspended block), the Read Array command must be issued. During Erase Suspend, a Program command can be issued to any block other than the erase-suspended block. Block erase cannot resume until program operations initiated during erase suspend complete. Read Array, Read Status Register, Read Device Identifier, Read CFI, and Erase Resume are valid commands during Erase Suspend. Additionally, Clear Status Register, Program, Program Suspend, Block Lock, Block Unlock, and Block Lock-Down are valid commands during Erase Suspend. During an erase suspend, deasserting CE# places the device in standby, reducing active current. VPP must remain at a valid level, and WP# must remain unchanged while in erase suspend. If RST# is asserted, the device is reset. 9.4 Erase Resume The Erase Resume command instructs the device to continue erasing, and automatically clears SR[7,6]. This command can be written to any address. If status register error bits are set, the Status Register should be cleared before issuing the next instruction. RST# must remain deasserted. 9.5 Erase Protection When VPP = VIL, absolute hardware erase protection is provided for all device blocks. If VPP is at or below VPPLK, erase operations halt and SR.3 is set indicating a VPP-level error. Datasheet 29 Aug 2009 Order Number:320003-08 P33-65nm 10.0 Security The device features security modes used to protect the information stored in the flash memory array. The following sections describe each security mode in detail. 10.1 Block Locking Individual instant block locking is used to protect user code and/or data within the flash memory array. All blocks power up in a locked state to protect array data from being altered during power transitions. Any block can be locked or unlocked with no latency. Locked blocks cannot be programmed or erased; they can only be read. Software-controlled security is implemented using the Block Lock and Block Unlock commands. Hardware-controlled security can be implemented using the Block LockDown command along with asserting WP#. Also, VPP data security can be used to inhibit program and erase operations (see Section 8.6, “Program Protection” on page 27 and Section 9.5, “Erase Protection” on page 29). The P33-65nm device also offers four pre-defined areas in the main array that can be configured as One-Time Programmable (OTP) for the highest level of security. These include the four 32 KB parameter blocks together as one and the three adjacent 128 KB main blocks. This is available for top or bottom parameter devices. 10.1.1 Lock Block To lock a block, issue the Lock Block Setup command. The next command must be the Lock Block command issued to the desired block’s address (see Section 6.2, “Device Command Bus Cycles” on page 18 and Figure 36, “Block Lock Operations Flowchart” on page 77). If the Set Read Configuration Register command is issued after the Block Lock Setup command, the device configures the RCR instead. Block lock and unlock operations are not affected by the voltage level on VPP. The block lock bits may be modified and/or read even if VPP is at or below VPPLK. 10.1.2 Unlock Block The Unlock Block command is used to unlock blocks (see Section 6.2, “Device Command Bus Cycles” on page 18). Unlocked blocks can be read, programmed, and erased. Unlocked blocks return to a locked state when the device is reset or powered down. If a block is in a lock-down state, WP# must be deasserted before it can be unlocked (see Figure 8, “Block Locking State Diagram” on page 31). 10.1.3 Lock-Down Block A locked or unlocked block can be locked-down by writing the Lock-Down Block command sequence (see Section 6.2, “Device Command Bus Cycles” on page 18). Blocks in a lock-down state cannot be programmed or erased; they can only be read. However, unlike locked blocks, their locked state cannot be changed by software commands alone. A locked-down block can only be unlocked by issuing the Unlock Block command with WP# deasserted. To return an unlocked block to locked-down state, a Lock-Down command must be issued prior to changing WP# to VIL. Lockeddown blocks revert to the locked state upon reset or power up the device (see Figure 8, “Block Locking State Diagram” on page 31). Datasheet 30 Aug 2009 Order Number: 320003-08 P33-65nm 10.1.4 Block Lock Status The Read Device Identifier command is used to determine a block’s lock status (see Section 7.3, “Read Device Identifier” on page 22). Data bits DQ[1:0] display the addressed block’s lock status; DQ0 is the addressed block’s lock bit, while DQ1 is the addressed block’s lock-down bit. Figure 8: Block Locking State Diagram P G M /E R A S E ALLOW ED P G M /E R A S E PREVENTED LK/ D 0h [0 0 0 ] LK/ LK/ 01h 2Fh [0 0 1 ] P o w e r -U p / R e s e t D e fa u lt LK/ 2Fh W P # = V IL = 0 V ir tu a l lo c k down W [1 1 0 ] P# g to LK/ D0h W P # = V IH = 1 [0 1 1 ] A ny Lock com m ands e LK/ 01h or 2Fh LK/ D 0h LK/ 01h L o c k e d -d o w n W P # to g g le L o c k e d -d o w n is d is a b le d b y W P # = V IH [1 1 1 ] LK/ 2Fh [1 0 0 ] Note: gl [0 1 0 ] LK/ 2Fh P o w e r-U p / R e s e t D e fa u lt [1 0 1 ] LK: Lock Setup Command, 60h; LK/D0h: Unlock Command; LK/01h: Lock Command; LK/2Fh: Lock-Down Command. 10.1.5 Block Locking During Suspend Block lock and unlock changes can be performed during an erase suspend. To change block locking during an erase operation, first issue the Erase Suspend command. Monitor the Status Register until SR.7 and SR.6 are set, indicating the device is suspended and ready to accept another command. Next, write the desired lock command sequence to a block, which changes the lock state of that block. After completing block lock or unlock operations, resume the erase operation using the Erase Resume command. Note: Datasheet 31 A Lock Block Setup command followed by any command other than Lock Block, Unlock Block, or Lock-Down Block produces a command sequence error and set Status Register bits SR.4 and SR.5. If a command sequence error occurs during an erase suspend, SR.4 and SR.5 remains set, even after the erase operation is resumed. Unless the Status Register is cleared using the Clear Status Register command before resuming the erase operation, possible erase errors may be masked by the command sequence error. Aug 2009 Order Number:320003-08 P33-65nm If a block is locked or locked-down during an erase suspend of the same block, the lock status bits change immediately. However, the erase operation completes when it is resumed. Block lock operations cannot occur during a program suspend. See Appendix A, “Write State Machine” on page 81, which shows valid commands during an erase suspend. 10.2 Selectable OTP Blocks Blocks from the main array may be optionally configured as OTP. Ask your local Numonyx representative for details about any of these selectable OTP implementations. 10.3 Password Access Password Access is a security enhancement offered on the P33-65nm device.This feature protects information stored in main-array memory blocks by preventing content alteration or reads until a valid 64-bit password is received. Password Access may be combined with Non-Volatile Protection and/or Volatile Protection to create a multitiered solution. Please contact your Numonyx Sales for further details concerning Password Access. Datasheet 32 Aug 2009 Order Number: 320003-08 P33-65nm 11.0 Status Register To read the Status Register, issue the Read Status Register command at any address. Status Register information is available to which the Read Status Register, Word Program, or Block Erase command was issued. SRD is automatically made available following a Word Program, Block Erase, or Block Lock command sequence. Reads from the device after any of these command sequences outputs the device’s status until another valid command is written (e.g. the Read Array command). The Status Register is read using single asynchronous-mode or synchronous burst mode reads. SRD is output on DQ[7:0], while 0x00 is output on DQ[15:8]. In asynchronous mode the falling edge of OE#, or CE# (whichever occurs first) updates and latches the Status Register contents. However, when reading the Status Register in synchronous burst mode, CE# or ADV# must be toggled to update SRD. The Device Write Status bit (SR.7) provides overall status of the device. SR[6:1] present status and error information about the program, erase, suspend, VPP, and block-locked operations. Table 10: Status Register Description Status Register (SR) Default Value = 0x80 Device Write Status Erase Suspend Status Erase Status Program Status VPP Status Program Suspend Status Block-Locked Status BEFP Write Status DWS ESS ES PS VPPS PSS BLS BWS 7 6 5 4 3 2 1 0 Bit Name Description 7 Device Write Status (DWS) 0 = Device is busy; program or erase cycle in progress; SR.0 valid. 1 = Device is ready; SR[6:1] are valid. 6 Erase Suspend Status (ESS) 0 = Erase suspend not in effect. 1 = Erase suspend in effect. 5 Erase Status (ES) SR.5 4 Program Status (PS) 3 VPP Status (VPPS) 0 = VPP within acceptable limits during program or erase operation. 1 = VPP < VPPLK during program or erase operation. 2 Program Suspend Status (PSS) 0 = Program suspend not in effect. 1 = Program suspend in effect. 1 Block-Locked Status (BLS) 0 = Block not locked during program or erase. 1 = Block locked during program or erase; operation aborted. 0 BEFP Write Status (BWS) After Buffered Enhanced Factory Programming (BEFP) data is loaded into the buffer: 0 = BEFP complete. 1 = BEFP in-progress. Command Sequence Error 0 0 1 1 SR.4 0 1 0 1 Description Program or Erase operation successful. Program error - operation aborted. Erase error - operation aborted. Command sequence error - command aborted. Notes: 1. Always clear the Status Register prior to resuming erase operations. It avoids Status Register ambiguity when issuing commands during Erase Suspend. If a command sequence error occurs during an erase-suspend state, the Status Register contains the command sequence error status (SR[7,5,4] set). When the erase operation resumes and finishes, possible errors during the erase operation cannot be detected via the Status Register because it contains the previous error status 2. BEFP mode is only valid in main array. Datasheet 33 Aug 2009 Order Number:320003-08 P33-65nm 11.0.1 Clear Status Register The Clear Status Register command clears the status register. It functions independent of VPP. The WSM sets and clears SR[7,6,2], but it sets bits SR[5:3,1] without clearing them. The Status Register should be cleared before starting a command sequence to avoid any ambiguity. A device reset also clears the Status Register. 11.1 Read Configuration Register The RCR is used to select the read mode (synchronous or asynchronous), and it defines the synchronous burst characteristics of the device. To modify RCR settings, use the Configure Read Configuration Register command (see Section 6.2, “Device Command Bus Cycles” on page 18). RCR contents can be examined using the Read Device Identifier command, and then reading from offset 0x05 (see Section 7.3, “Read Device Identifier” on page 22). The RCR is shown in Table 11. The following sections describe each RCR bit. Table 11: Read Configuration Register Description (Sheet 1 of 2) Read Configuration Register (RCR) Read Mode Latency Count WAIT Polarity RES WAIT Delay Burst Seq CLK Edge RES RES Burst Wrap Burst Length RM LC[3:0] WP R WD BS CE R R BW BL[2:0] 10 9 8 7 6 5 4 3 15 Bit 15 14:11 14 13 12 11 Name Read Mode (RM) 0 = Synchronous burst-mode read 1 = Asynchronous page-mode read (default) Latency Count (LC[3:0]) 0010 =Code 2 0011 =Code 3 0100 =Code 4 0101 =Code 5 0110 =Code 6 0111 =Code 7 1000 =Code 8 1001 =Code 9 1010 =Code 10 1011 =Code 11 1100 =Code 12 1101 =Code 13 1110 =Code 14 1111 =Code 15 (default) (Other bit settings are reserved) WAIT Polarity (WP) 0 =WAIT signal is active low (default) 1 =WAIT signal is active high 9 Reserved (R) Default “0”, Non-changeable 8 WAIT Delay (WD) 0 =WAIT deasserted with valid data 1 =WAIT deasserted one data cycle before valid data (default) 10 7 6 5:4 Datasheet 34 Burst Sequence (BS) 2 1 0 Description Default “0”, Non-changeable Clock Edge (CE) 0 = Falling edge 1 = Rising edge (default) Reserved (R) Default “0”, Non-changeable Aug 2009 Order Number: 320003-08 P33-65nm Table 11: Read Configuration Register Description (Sheet 2 of 2) 3 2:0 11.1.1 Burst Wrap (BW) Burst Length (BL[2:0]) 0 =Wrap; Burst accesses wrap within burst length set by BL[2:0] 1 =No Wrap; Burst accesses do not wrap within burst length (default) 001 =4-word burst 010 =8-word burst 011 =16-word burst 111 =Continuous-word burst (default) (Other bit settings are reserved) Read Mode The Read Mode (RM) bit selects synchronous burst-mode or asynchronous page-mode operation for the device. When the RM bit is set, asynchronous page mode is selected (default). When RM is cleared, synchronous burst mode is selected. 11.1.2 Latency Count The Latency Count (LC) bits tell the device how many clock cycles must elapse from the rising edge of ADV# (or from the first valid clock edge after ADV# is asserted) until the first valid data word is driven onto DQ[15:0]. The input clock frequency is used to determine this value and Figure 9 shows the data output latency for the different settings of LC. The maximum Latency Count for P33 would be Code 4 based on the Max clock frequency specification of 52 MHz, and there will be zero WAIT States when bursting within the word line. Please also refer to Section 11.1.3, “End of Word Line (EOWL) Considerations” on page 37 for more information on EOWL. Refer to Table 12, “LC and Frequency Support” on page 36 for Latency Code Settings. Datasheet 35 Aug 2009 Order Number:320003-08 P33-65nm Figure 9: First-Access Latency Count CLK [C] Address [A] Valid Address ADV# [V] Code 0 (Reserved) Valid Output DQ15-0 [D/Q] Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Valid Output Code 1 (Reserved DQ15-0 [D/Q] Code 2 DQ15-0 [D/Q] Code 3 DQ15-0 [D/Q] Code 4 DQ15-0 [D/Q] Code 5 DQ15-0 [D/Q] Code 6 DQ15-0 [D/Q] Code 7 DQ15-0 [D/Q] Valid Output Table 12: LC and Frequency Support Datasheet 36 Latency Count Settings Frequency Support (MHz) 3 ≤ 40 4 ≤ 52 Aug 2009 Order Number: 320003-08 P33-65nm Figure 10: Example Latency Count Setting Using Code 3 0 1 2 3 tData 4 CLK CE# ADV# A[MAX:0] A[MAX:1] Address Code 3 High-Z D[15:0] Data R103 11.1.3 End of Word Line (EOWL) Considerations End of Wordline (EOWL) WAIT states can result when the starting address of the burst operation is not aligned to a 16-word boundary; that is, A[3:0] of start address does not equal 0x0. Figure 11, “End of Wordline Timing Diagram” on page 37 illustrates the end of wordline WAIT state(s), which occur after the first 16-word boundary is reached. The number of data words and the number of WAIT states is summarized in Table 13, “End of Wordline Data and WAIT state Comparison” on page 38for both P33-130nm and P33-65nm devices. Figure 11: End of Wordline Timing Diagram Latency Count CLK A [Max :1] D Q[15 :0 ] Address Data Data Data ADV# OE# W AIT Datasheet 37 EOW L Aug 2009 Order Number:320003-08 P33-65nm Table 13: End of Wordline Data and WAIT state Comparison Latency Count 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 11.1.4 P33-130nm P33-65nm Data States WAIT States Data States WAIT States Not Supported 4 4 4 4 4 4 Not Supported 0 to 1 0 to 2 0 to 3 0 to 4 0 to 5 0 to 6 Not Supported Not Supported Not Supported Not Supported 16 16 16 16 16 16 16 16 16 16 16 16 16 Not Supported Not Supported 0 to 2 0 to 3 0 to 4 0 to 5 0 to 6 0 to 7 0 to 8 0 to 9 0 to 10 0 to 11 0 to 12 0 to 13 0 to 14 WAIT Polarity The WAIT Polarity bit (WP), RCR.10 determines the asserted level (VOH or VOL) of WAIT. When WP is set, WAIT is asserted high. When WP is cleared, WAIT is asserted low (default). WAIT changes state on valid clock edges during active bus cycles (CE# asserted, OE# asserted, RST# deasserted). 11.1.5 WAIT Signal Function The WAIT signal indicates data valid when the device is operating in synchronous mode (RCR.15=0). The WAIT signal is only “deasserted” when data is valid on the bus. When the device is operating in synchronous non-array read mode, such as read status, read ID, or read query. The WAIT signal is also “deasserted” when data is valid on the bus. WAIT behavior during synchronous non-array reads at the end of word line works correctly only on the first data access. When the device is operating in asynchronous page mode, asynchronous single word read mode, and all write operations, WAIT is set to a deasserted state as determined by RCR.10. See Figure 18, “Asynchronous Single-Word Read (ADV# Latch)” on page 52, and Figure 19, “Asynchronous Page-Mode Read Timing” on page 52. Datasheet 38 Aug 2009 Order Number: 320003-08 P33-65nm Table 14: WAIT Functionality Table Condition WAIT Notes CE# = ‘1’, OE# = ‘X’ or CE# = ‘0’, OE# = ‘1’ High-Z 1 CE# =’0’, OE# = ‘0’ Active 1 Synchronous Array Reads Active 1 Synchronous Non-Array Reads Active 1 All Asynchronous Reads Deasserted All Writes High-Z 1 1,2 Notes: 1. Active: WAIT is asserted until data becomes valid, then deasserts. 2. When OE# = VIH during writes, WAIT = High-Z. 11.1.6 WAIT Delay The WAIT Delay (WD) bit controls the WAIT assertion-delay behavior during synchronous burst reads. WAIT can be asserted either during or one data cycle before valid data is output on DQ[15:0]. When WD is set, WAIT is deasserted one data cycle before valid data (default). When WD is cleared, WAIT is deasserted during valid data. 11.1.7 Burst Sequence The Burst Sequence (BS) bit selects linear-burst sequence (default). Only linear-burst sequence is supported. Table 15 shows the synchronous burst sequence for all burst lengths, as well as the effect of the Burst Wrap (BW) setting. Table 15: Burst Sequence Word Ordering (Sheet 1 of 2) Start Addr. (DEC) Burst Wrap (RCR.3) 0 1 Burst Addressing Sequence (DEC) 4-Word Burst (BL[2:0] = 0b001) 8-Word Burst (BL[2:0] = 0b010) 16-Word Burst (BL[2:0] = 0b011) Continuous Burst (BL[2:0] = 0b111) 0 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4…14-15 0-1-2-3-4-5-6-… 0 1-2-3-0 1-2-3-4-5-6-7-0 1-2-3-4-5…15-0 1-2-3-4-5-6-7-… 2 0 2-3-0-1 2-3-4-5-6-7-0-1 2-3-4-5-6…15-0-1 2-3-4-5-6-7-8-… 3 0 3-0-1-2 3-4-5-6-7-0-1-2 3-4-5-6-7…15-0-1-2 3-4-5-6-7-8-9-… 4 0 4-5-6-7-0-1-2-3 4-5-6-7-8…15-0-1-2-3 4-5-6-7-8-9-10… 5-6-7-8-9-10-11… 5 0 5-6-7-0-1-2-3-4 5-6-7-8-9…15-0-1-2-34 6 0 6-7-0-1-2-3-4-5 6-7-8-9-10…15-0-1-23-4-5 6-7-8-9-10-11-12-… 7 0 7-0-1-2-3-4-5-6 7-8-9-10…15-0-1-2-34-5-6 7-8-9-10-11-12-13… 15-0-1-2-3…13-14 15-16-17-18-19-20-21… … … … 0 … … 15 … 14-15-16-17-18-19-20… … … 14-15-0-1-2…12-13 … … 0 Datasheet 39 … … 14 Aug 2009 Order Number:320003-08 P33-65nm Table 15: Burst Sequence Word Ordering (Sheet 2 of 2) 0 1 0-1-2-3 0-1-2-3-4-5-6-7 0-1-2-3-4…14-15 0-1-2-3-4-5-6-… 1 1 1-2-3-4 1-2-3-4-5-6-7-8 1-2-3-4-5…15-16 1-2-3-4-5-6-7-… 2 1 2-3-4-5 2-3-4-5-6-7-8-9 2-3-4-5-6…16-17 2-3-4-5-6-7-8-… 3 1 3-4-5-6 4 1 5 1 5-6-7-8-9-10-11-12 5-6-7-8-9…19-20 5-6-7-8-9-10-11… 6 1 6-7-8-9-10-11-12-13 6-7-8-9-10…20-21 6-7-8-9-10-11-12-… 7 1 7-8-9-10-11-12-13-14 7-8-9-10-11…21-22 7-8-9-10-11-12-13… 3-4-5-6-7-8-9-10 3-4-5-6-7…17-18 3-4-5-6-7-8-9-… 4-5-6-7-8-9-10-11 4-5-6-7-8…18-19 4-5-6-7-8-9-10… … … … … 1 14-15-16-17-18…28-29 14-15-16-17-18-19-20… 15 1 15-16-17-18-19…29-30 15-16-17-18-19-20-21… 11.1.8 … … 14 Clock Edge The Clock Edge (CE) bit selects either a rising (default) or falling clock edge for CLK. This clock edge is used at the start of a burst cycle, to output synchronous data, and to assert/deassert WAIT. 11.1.9 Burst Wrap The Burst Wrap (BW) bit determines whether 4, 8, or 16-word burst length accesses wrap within the selected word-length boundaries or cross word-length boundaries. When BW is set, burst wrapping does not occur (default). When BW is cleared, burst wrapping occurs. 11.1.10 Burst Length The Burst Length bits (BL[2:0]) selects the linear burst length for all synchronous burst reads of the flash memory array. The burst lengths are 4-word, 8-word, 16-word, and continuous word. Continuous burst accesses are linear only, and do not wrap within any word length boundaries (see Table 15, “Burst Sequence Word Ordering” on page 39). When a burst cycle begins, the device outputs synchronous burst data until it reaches the end of the “burstable” address space. 11.2 One-Time Programmable (OTP) Registers The device contains 17 one-time programmable (OTP) registers that can be used to implement system security measures and/or device identification. Each OTP register can be individually locked. The first 128-bit OTP Register is comprised of two 64-bit (8-word) segments. The lower 64-bit segment is pre-programmed at the Numonyx factory with a unique 64-bit number. The other 64-bit segment, as well as the other sixteen 128-bit OTP Registers, are blank. Users can program these registers as needed. Once programmed, users can then lock the OTP Register(s) to prevent additional bit programming (see Figure 12, “OTP Register Map” on page 41). Datasheet 40 Aug 2009 Order Number: 320003-08 P33-65nm The OTP Registers contain OTP bits; when programmed, PR bits cannot be erased. Each OTP Register can be accessed multiple times to program individual bits, as long as the register remains unlocked. Each OTP Register has an associated Lock Register bit. When a Lock Register bit is programmed, the associated OTP Register can only be read; it can no longer be programmed. Additionally, because the Lock Register bits themselves are OTP, when programmed, Lock Register bits cannot be erased. Therefore, when a OTP Register is locked, it cannot be unlocked. . Figure 12: OTP Register Map 0x109 128-bit Protection Register 16 (User-Programmable) 0x102 0x91 128-bit Protection Register 1 (User-Programmable) 0x8A Lock Register 1 0x89 0x88 0x85 0x84 0x81 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 1 0 64-bit Segment (User-Programmable) 128-Bit Protection Register 0 64-bit Segment (Factory-Programmed) Lock Register 0 0x80 11.2.1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 Reading the OTP Registers The OTP Registers can be read from any address. To read the OTP Register, first issue the Read Device Identifier command at any address to place the device in the Read Device Identifier state (see Section 6.2, “Device Command Bus Cycles” on page 18). Next, perform a read operation using the address offset corresponding to the register to be read. Table 8, “Device Identifier Information” on page 22 shows the address offsets of the OTP Registers and Lock Registers. PR data is read 16 bits at a time. Datasheet 41 Aug 2009 Order Number:320003-08 P33-65nm 11.2.2 Programming the OTP Registers To program any of the OTP Registers, first issue the Program OTP Register command at the parameter’s base address plus the offset to the desired OTP Register (see Section 6.2, “Device Command Bus Cycles” on page 18). Next, write the desired OTP Register data to the same OTP Register address (see Figure 12, “OTP Register Map” on page 41). The device programs the 64-bit and 128-bit user-programmable OTP Register data 16 bits at a time (see Figure 38, “OTP Register Programming Flowchart” on page 79). Issuing the Program OTP Register command outside of the OTP Register’s address space causes a program error (SR.4 set). Attempting to program a locked OTP Register causes a program error (SR.4 set) and a lock error (SR.1 set). Note: When programming the OTP bits in the OTP registers for a Top Parameter Device, the following upper address bits must also be driven properly: A[Max:17] driven high (VIH). 11.2.3 Locking the OTP Registers Each OTP Register can be locked by programming its respective lock bit in the Lock Register. To lock a OTP Register, program the corresponding bit in the Lock Register by issuing the Program Lock Register command, followed by the desired Lock Register data (see Section 6.2, “Device Command Bus Cycles” on page 18). The physical addresses of the Lock Registers are 0x80 for register 0 and 0x89 for register 1. These addresses are used when programming the lock registers (see Table 8, “Device Identifier Information” on page 22). Bit 0 of Lock Register 0 is already programmed during the manufacturing process at the “factory”, locking the lower, pre-programmed 64-bit region of the first 128-bit OTP Register containing the unique identification number of the device. Bit 1 of Lock Register 0 can be programmed by the user to lock the user-programmable, 64-bit region of the first 128-bit OTP Register. When programming Bit 1 of Lock Register 0, all other bits need to be left as ‘1’ such that the data programmed is 0xFFFD. Lock Register 1 controls the locking of the upper sixteen 128-bit OTP Registers. Each of the 16 bits of Lock Register 1 correspond to each of the upper sixteen 128-bit OTP Registers. Programming a bit in Lock Register 1 locks the corresponding 128-bit OTP Register. Caution: Datasheet 42 After being locked, the OTP Registers cannot be unlocked. Aug 2009 Order Number: 320003-08 P33-65nm 12.0 Power and Reset Specifications 12.1 Power-Up and Power-Down Power supply sequencing is not required if VPP is connected to VCC or VCCQ. Otherwise VCC and VCCQ should attain their minimum operating voltage before applying VPP. Power supply transitions should only occur when RST# is low. This protects the device from accidental programming or erasure during power transitions. 12.2 Reset Specifications Asserting RST# during a system reset is important with automated program/erase devices because systems typically expect to read from flash memory when coming out of reset. If a CPU reset occurs without a flash memory reset, proper CPU initialization may not occur. This is because the flash memory may be providing status information, instead of array data as expected. Connect RST# to the same active low reset signal used for CPU initialization. Also, because the device is disabled when RST# is asserted, it ignores its control inputs during power-up/down. Invalid bus conditions are masked, providing a level of memory protection. Table 16: Power and Reset Num Symbol P1 tPLPH P2 tPLRH P3 tVCCPH Notes: 1. 2. 3. 4. 5. 6. 7. Parameter Min Max Unit Notes 100 - ns 1,2,3,4 RST# low to device reset during erase - 25 RST# low to device reset during program - 25 µs 1,3,4,7 300 - RST# pulse width low VCC Power valid to RST# de-assertion (high) 1,3,4,7 1,4,5,6 These specifications are valid for all device versions (packages and speeds). The device may reset if tPLPH is < tPLPH Min, but this is not guaranteed. Not applicable if RST# is tied to VCC. Sampled, but not 100% tested. When RST# is tied to the VCC supply, device will not be ready until tVCCPH after VCC ≥ VCCMIN. When RST# is tied to the VCCQ supply, device will not be ready until tVCCPH after VCC ≥ VCCMIN. Reset completes within tPLPH if RST# is asserted while no erase or program operation is executing. Datasheet 43 Aug 2009 Order Number:320003-08 P33-65nm Figure 13: Reset Operation Waveforms P1 (A) Reset during read mode RST# [P] VIH VIL P2 (B) Reset during program or block erase P1 ≤ P2 RST# [P] RST# [P] Abort Complete R5 VIH VIL P2 (C) Reset during program or block erase P1 ≥ P2 R5 Abort Complete R5 VIH VIL P3 (D) VCC Power-up to RST# high 12.3 VCC VCC 0V Power Supply Decoupling Flash memory devices require careful power supply de-coupling. Three basic power supply current considerations are: 1) standby current levels; 2) active current levels; and 3) transient peaks produced when CE# and OE# are asserted and deasserted. When the device is accessed, many internal conditions change. Circuits within the device enable charge-pumps, and internal logic states change at high speed. All of these internal activities produce transient signals. Transient current magnitudes depend on the device outputs’ capacitive and inductive loading. Two-line control and correct de-coupling capacitor selection suppress transient voltage peaks. Because Numonyx MLC flash memory devices draw their power from VCC, VPP, and VCCQ, each power connection should have a 0.1 µF ceramic capacitor to ground. Highfrequency, inherently low-inductance capacitors should be placed as close as possible to package leads. Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor should be placed between power and ground close to the devices. The bulk capacitor is meant to overcome voltage droop caused by PCB trace inductance. Datasheet 44 Aug 2009 Order Number: 320003-08 P33-65nm 13.0 Maximum Ratings and Operating Conditions 13.1 Absolute Maximum Ratings Warning: Stressing the device beyond the Absolute Maximum Ratings may cause permanent damage. These are stress ratings only. Table 17: Absolute Maximum Ratings Parameter Temperature under bias Storage temperature Maximum Rating Notes –40 °C to +85 °C - –65 °C to +125 °C - Voltage on any signal (except VCC, VPP and VCCQ) –0.5 V to +4.1 V 1 VPP voltage –0.2 V to +10 V 1,2,3 VCC voltage –0.2 V to +4.1 V 1 VCCQ voltage –0.2 V to +4.1 V 1 100 mA 4 Output short circuit current Notes: 1. Voltages shown are specified with respect to VSS. Minimum DC voltage is –0.5 V on input/output signals and –0.2 V on VCC, VCCQ, and VPP. During transitions, this level may undershoot to –2.0 V for periods less than 20 ns. Maximum DC voltage on VCC is VCC + 0.5 V, which, during transitions, may overshoot to VCC + 2.0 V for periods less than 20 ns. Maximum DC voltage on input/output signals and VCCQ is VCCQ + 0.5 V, which, during transitions, may overshoot to VCCQ + 2.0 V for periods less than 20 ns. 2. Maximum DC voltage on VPP may overshoot to +11.5 V for periods less than 20 ns. 3. Program/erase voltage is typically 2.3 V – 3.6 V. 9.0 V can be applied for 80 hours maximum total, to any blocks for 1000 cycles maximum. 9.0 V program/erase voltage may reduce block cycling capability. 4. Output shorted for no more than one second. No more than one output shorted at a time. 13.2 Operating Conditions Note: Operation beyond the Operating Conditions is not recommended and extended exposure beyond the Operating Conditions may affect device reliability. Table 18: Operating Conditions Symbol TC VCC VCCQ Parameter Operating Temperature VCC Supply Voltage I/O Supply Voltage Min Max Units Notes –40 +85 °C 1 2.3 3.6 CMOS inputs 2.3 3.6 TTL inputs 2.4 3.6 1.5 3.6 VPPL VPP Voltage Supply (Logic Level) VPPH Buffered Enhanced Factory Programming VPP 8.5 9.5 tPPH Maximum VPP Hours VPP = VPPH - 80 Main and Parameter Blocks VPP = VPPL 100,000 - Main Blocks VPP = VPPH 100,000 - Parameter Blocks VPP = VPPH 100,000 - Block Erase Cycles - V Hours - 2 Cycles Notes: 1. TC = Case Temperature. 2. In typical operation VPP program voltage is VPPL. Datasheet 45 Aug 2009 Order Number:320003-08 P33-65nm 14.0 Electrical Specifications 14.1 DC Current Characteristics Table 19: DC Current Characteristics (Sheet 1 of 2) Sym Parameter ILI Input Load Current ILO Output Leakage Current ICCS, ICCD ICCR ICCW, ICCE ICCWS, ICCES DQ[15:0], WAIT Max Typ Max - ±1 - ±2 Test Conditions µA VCC = VCC Max VCCQ = VCCQ Max VIN = VCCQ or VSS µA VCC = VCC Max VCCQ = VCCQ Max VIN = VCCQ or VSS - ±10 256-Mbit 65 210 65 210 512-Mbit 130 420 130 420 Asynchronous SingleWord f = 5 MHz (1 CLK) 26 31 26 31 mA 16-Word Read Page-Mode Read f = 13 MHz (17 CLK) 12 16 12 16 mA 16-Word Read 19 22 19 22 mA 8-Word Read 16 18 16 18 mA 16-Word Read 21 24 21 24 mA Continuous Read Synchronous Burst f = 52 MHz, LC=4 VCC Program Current, VCC Erase Current VCC Program Suspend Current, VCC Erase Suspend Current 256-Mbit 512-Mbit IPPES IPPR VPP Read IPPW VPP Program Current IPPE VPP Erase Current Datasheet 46 Typ Unit ±1 VPP Standby Current, VPP Program Suspend Current, VPP Erase Suspend Current IPPS, IPPWS, TTL Inputs (VCCQ = 2.4 V - 3.6 V) - VCC Standby, Power-Down Average VCC Read Current CMOS Inputs (VCCQ = 2.3 V - 3.6 V) 35 50 35 50 35 50 35 50 65 210 65 210 µA 1,3,5 µA CE# = VCCQ; suspend in progress 1,3,4 VPP = VPPL, suspend in progress 1,3,7 225 0.2 5 0.2 5 µA µA 15 2 15 0.05 0.10 0.05 0.10 0.05 0.10 0.05 0.10 0.05 0.10 0.05 0.10 0.05 0.10 1 1,3,5 70 0.10 1,2 VPP = VPPH, Pgm/Ers in progress 225 2 VCC = VCCMax CE# = VIL OE# = VIH Inputs: VIL or VIH 1,6 VPP = VPPL, Pgm/Ers in progress mA 70 0.05 VCC = VCC Max VCCQ = VCC Max CE# =VCCQ RST# = VCCQ (for ICCS) RST# = VSS (for ICCD) WP# = VIH Notes mA mA VPP = VPPL 1,3 VPP = VPPL, program in progress VPP = VPPH, program in progress VPP = VPPL, erase in progress VPP = VPPH, erase in progress 3 3 Aug 2009 Order Number: 320003-08 P33-65nm Table 19: DC Current Characteristics (Sheet 2 of 2) Sym Parameter IPPBC Notes: 1. 2. 3. 4. 5. 6. 7. VPP Blank Check CMOS Inputs (VCCQ = 2.3 V - 3.6 V) TTL Inputs (VCCQ = 2.4 V - 3.6 V) Typ Max Typ Max 0.05 0.10 0.05 0.10 0.05 0.10 0.05 0.10 Unit mA Test Conditions VPP = VPPL, erase in progress VPP = VPPH, erase in progress Notes 3 All currents are RMS unless noted. Typical values at typical VCC, TC = +25 °C. ICCS is the average current measured over any 5 ms time interval 5 µs after CE# is deasserted. Sampled, not 100% tested. ICCES is specified with the device deselected. If device is read while in erase suspend, current is ICCES plus ICCR. ICCW, ICCE measured over typical or max times specified in Section 15.5, “Program and Erase Characteristics” on page 58. if VIN > VCC the input load current increases to 10uA max. the IPPS,IPPWS,IPPES Will increase to 200uA when VPP/WP# is at VPPH. 14.2 DC Voltage Characteristics Table 20: DC Voltage Characteristics Sym Parameter CMOS Inputs (VCCQ = 2.3 V – 3.6 V) TTL Inputs (1) (VCCQ = 2.4 V – 3.6 V) Min Max Min Max Unit Test Conditions Notes VIL Input Low Voltage -0.5 0.4 -0.5 0.6 V VIH Input High Voltage VCCQ – 0.4 VCCQ + 0.5 2.0 VCCQ + 0.5 V VOL Output Low Voltage - 0.2 - 0.2 V VCC = VCC Min VCCQ = VCCQ Min IOL = 100 µA - VOH Output High Voltage VCCQ – 0.2 - VCCQ – 0.2 - V VCC = VCC Min VCCQ = VCCQ Min IOH = –100 µA - VPPLK VPP Lock-Out Voltage - 0.4 - 0.4 V 3 VLKO VCC Lock Voltage 1.5 - 1.5 - V - VLKOQ VCCQ Lock Voltage 0.9 - 0.9 - V - VPPL VPP Voltage Supply (Logic Level) 1.5 3.6 1.5 3.6 V VPPH Buffered Enhanced Factory Programming VPP 8.5 9.5 8.5 9.5 V 2 Notes: 1. Synchronous read mode is not supported with TTL inputs. 2. VIL can undershoot to –1.0 V for duration of 2ns or less and VIH can overshoot to VCCQ + 1.0 V for durations of 2ns or less. 3. VPP ≤ VPPLK inhibits erase and program operations. Do not use VPPL and VPPH outside their valid ranges. Datasheet 47 Aug 2009 Order Number:320003-08 P33-65nm 15.0 AC Characteristics 15.1 AC Test Conditions Figure 14: AC Input/Output Reference Waveform VCCQ Input VCCQ/2 Test Points VCCQ/2 Output 0V Note: IO_REF.WMF AC test inputs are driven at VCCQ for Logic "1" and 0 V for Logic "0." Input/output timing begins/ends at VCCQ/2. Input rise and fall times (10% to 90%) < 5 ns. Worst-case speed occurs at VCC = VCCMin. Figure 15: Transient Equivalent Testing Load Circuit Device Under Test Out CL Notes: 1. See the following table for component values. 2. Test configuration component value for worst case speed conditions. 3. CL includes jig capacitance . Table 21: Test Configuration Component Value for Worst Case Speed Conditions Test Configuration CL (pF) VCCQ Min Standard Test 30 Figure 16: Clock Input AC Waveform R201 CLK [C] VIH VIL R202 Datasheet 48 R203 Aug 2009 Order Number: 320003-08 P33-65nm 15.2 Capacitance Table 22: Capacitance Symbol Parameter Signals Min Typ Max Unit CIN Input Capacitance Address, Data, CE#, WE#, OE#, RST#, CLK, ADV#, WP# 2 6 7 pF COUT Output Capacitance Data, WAIT 2 4 5 pF Condition Note Typ temp = 25 °C, Max temp = 85 °C, VCC = (0 V - 3.6 V), VCCQ = (0 V - 3.6 V), Discrete silicon die 1,2,3 Notes: 1. Capacitance values are for a single die; for dual die, the capacitance values are doubled. 2. Sampled, not 100% tested. 3. Silicon die capacitance only, add 1 pF for discrete packages. 15.3 AC Read Specifications Table 23: AC Read Specifications - (Sheet 1 of 3) Num Symbol Parameter Min Max Easy BGA 95 - TSOP 105 Easy BGA - Unit Notes Asynchronous Specifications ns - ns - R1 tAVAV Read cycle time R2 tAVQV Address to output valid R3 tELQV CE# low to output valid R4 tGLQV OE# low to output valid R5 tPHQV RST# high to output valid R6 tELQX R7 tGLQX R8 tEHQZ CE# high to output in high-Z - 20 ns R9 tGHQZ OE# high to output in high-Z - 15 ns Output hold from first occurring address, CE#, or OE# change 0 - ns TSOP Easy BGA - 95 ns - 105 ns - 95 ns - 105 ns - - 25 ns 1,2 - 150 ns 1 CE# low to output in low-Z 0 - ns 1,3 OE# low to output in low-Z 0 - ns 1,2,3 TSOP 1,3 R10 tOH R11 tEHEL CE# pulse width high 17 - ns R12 tELTV CE# low to WAIT valid - 17 ns R13 tEHTZ CE# high to WAIT high-Z - 20 ns 1,3 R15 tGLTV OE# low to WAIT valid - 17 ns 1 R16 tGLTX OE# low to WAIT in low-Z 0 - ns R17 tGHTZ OE# high to WAIT in high-Z - 20 ns 1 1,3 Latching Specifications Datasheet 49 Aug 2009 Order Number:320003-08 P33-65nm Table 23: AC Read Specifications - (Sheet 2 of 3) Num Symbol Parameter Min R101 tAVVH Address setup to ADV# high 10 - ns R102 tELVH CE# low to ADV# high 10 - ns R103 tVLQV ADV# low to output valid Easy BGA - TSOP Max Unit 95 ns 105 ns R104 tVLVH ADV# pulse width low 10 - ns R105 tVHVL ADV# pulse width high 10 - ns R106 tVHAX Address hold from ADV# high 9 - ns R108 tAPA Page address access - 25 ns R111 tphvh RST# high to ADV# high 30 - ns - 52 MHz - 40 MHz Notes 1 1,4 1 Clock Specifications R200 fCLK CLK frequency R201 tCLK CLK period TSOP TSOP 19.2 - ns 25 - ns R202 tCH/CL CLK high/low time 5 - ns R203 tFCLK/RCLK CLK fall/rise time 0.3 3 ns Datasheet 50 1,3,5,6 Aug 2009 Order Number: 320003-08 P33-65nm Table 23: AC Read Specifications - (Sheet 3 of 3) Num Symbol Parameter Min Max Unit Notes Synchronous Specifications(5) R301 tAVCH/L Address setup to CLK 9 - ns R302 tVLCH/L ADV# low setup to CLK 9 - ns R303 tELCH/L CE# low setup to CLK 9 - ns R304 tCHQV / tCLQV - - 17 ns TSOP - 20 ns CLK to output valid 1,6 R305 tCHQX Output hold from CLK 3 - ns 1,6 R306 tCHAX Address hold from CLK 10 - ns 1,4,6 R307 tCHTV CLK to WAIT valid - 17 ns 1,6 - 20 ns 1,6 R311 tCHVL CLK Valid to ADV# Setup 3 - ns 1 R312 tCHTX WAIT Hold from CLK 3 - ns 1,6 TSOP Notes: 1. See Figure 14, “AC Input/Output Reference Waveform” on page 48 for timing measurements and max allowable input slew rate. 2. OE# may be delayed by up to tELQV – tGLQV after CE#’s falling edge without impact to tELQV. 3. Sampled, not 100% tested. 4. Address hold in synchronous burst read mode is tCHAX or tVHAX, whichever timing specification is satisfied first. 5. Synchronous burst read mode is not supported with TTL level inputs. 6. Applies only to subsequent synchronous reads. Figure 17: Asynchronous Single-Word Read (ADV# Low) R1 R2 Address [A] ADV# R3 R8 CE# [E} R4 R9 OE# [G] R15 R17 WAIT [T] R7 R6 Data [D/Q] R5 RST# [P] Note: WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low). Datasheet 51 Aug 2009 Order Number:320003-08 P33-65nm Figure 18: Asynchronous Single-Word Read (ADV# Latch) R1 R2 Address [A] A[1:0][A] R101 R105 R106 ADV# R3 R8 CE# [E} R4 R9 OE# [G] R15 R17 WAIT [T] R7 R6 R10 Data [D/Q] Note: WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low) Figure 19: Asynchronous Page-Mode Read Timing R2 A[Max:4] [A] Valid Address R10 A[3:0] 0 R10 1 R101 R105 R10 2 R10 F R106 ADV# R3 R8 CE# [E] R4 R9 OE# [G] WAIT [T] R6 DATA [D/Q] Note: Q1 R108 Q2 R108 Q3 R108 Q16 R13 WAIT shown deasserted during asynchronous read mode (RCR.10=0, WAIT asserted low). Datasheet 52 Aug 2009 Order Number: 320003-08 P33-65nm . Figure 20: Synchronous Single-Word Array or Non-array Read Timing R301 R306 CLK [C] R2 Address [A] R101 R106 R105 R104 ADV# [V] R303 R102 R3 R8 CE# [E] R7 R9 OE# [G] R15 R307 R312 R17 WAIT [T] R4 R304 R305 Data [D/Q] Notes: 1. WAIT is driven per OE# assertion during synchronous array or non-array read, and can be configured to assert either during or one data cycle before valid data. 2. This diagram illustrates the case in which an n-word burst is initiated to the flash memory array and it is terminated by CE# deassertion after the first word in the burst. Figure 21: Continuous Burst Read, showing an Output Delay Timing R301 R302 R306 R304 R304 R304 CLK [C] R2 R101 Address [A] R106 R105 ADV# [V] R303 R102 R3 CE# [E] OE# [G] R15 R307 R312 WAIT [T] R304 R4 R7 R305 R305 R305 R305 Data [D/Q] Notes: 1. WAIT is driven per OE# assertion during synchronous array or non-array read, and can be configured to assert either during or one data cycle before valid data. 2. At the end of Word Line; the delay incurred when a burst access crosses a 16-word boundary and the starting address is not 4-word boundary aligned. See Section 11.1.3, “End of Word Line (EOWL) Considerations” on page 37 for more information Datasheet 53 Aug 2009 Order Number:320003-08 P33-65nm Figure 22: Synchronous Burst-Mode Four-Word Read Timing y R302 R301 R306 CLK [C] R2 R101 A Address [A] R105 R102 R106 ADV# [V] R303 R3 R8 CE# [E] R9 OE# [G] R15 R17 R307 WAIT [T] R4 R7 R304 Data [D/Q] Note: R304 R305 Q0 R10 Q1 Q2 Q3 WAIT is driven per OE# assertion during synchronous array or non-array read. WAIT asserted during initial latency and deasserted during valid data (RCR.10=0, WAIT asserted low). 15.4 AC Write Specifications Table 24: AC Write Specifications (Sheet 1 of 2) Num Symbol Parameter W1 tPHWL RST# high recovery to WE# low W2 tELWL CE# setup to WE# low W3 tWLWH W4 tDVWH W5 W6 Min Max Unit Notes 150 - ns 1,2,3 0 - ns 1,2,3 WE# write pulse width low 50 - ns 1,2,4 Data setup to WE# high 50 - ns tAVWH Address setup to WE# high 50 - ns tWHEH CE# hold from WE# high 0 - ns W7 tWHDX Data hold from WE# high 0 - ns W8 tWHAX Address hold from WE# high 0 - ns W9 tWHWL WE# pulse width high W10 tVPWH VPP setup to WE# high W11 tQVVL W12 1,2 20 - ns 200 - ns 1,2,5 VPP hold from Status read 0 - ns tQVBL WP# hold from Status read 0 - ns W13 tBHWH WP# setup to WE# high 200 - ns W14 tWHGL WE# high to OE# low 0 - ns 1,2,9 W16 tWHQV WE# high to read valid tAVQV + 35 - ns 1,2,3,6,10 0 - ns 1,2,3,6,8 1,2,3,7 1,2,3,7 Write to Asynchronous Read Specifications W18 Datasheet 54 tWHAV WE# high to Address valid Aug 2009 Order Number: 320003-08 P33-65nm Table 24: AC Write Specifications (Sheet 2 of 2) Num Symbol Parameter Min Max Unit - ns Notes Write to Synchronous Read Specifications W19 tWHCH/L WE# high to Clock valid 19 W20 tWHVH WE# high to ADV# high 19 - ns W28 tWHVL WE# high to ADV# low 7 - ns 1,2,3,6,10 Write Specifications with Clock Active W21 tVHWL ADV# high to WE# low - 20 ns W22 tCHWL Clock high to WE# low - 20 ns Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 1,2,3,11 Write timing characteristics during erase suspend are the same as write-only operations. A write operation can be terminated with either CE# or WE#. Sampled, not 100% tested. Write pulse width low (tWLWH or tELEH) is defined from CE# or WE# low (whichever occurs last) to CE# or WE# high (whichever occurs first). Hence, tWLWH = tELEH = tWLEH = tELWH. Write pulse width high (tWHWL or tEHEL) is defined from CE# or WE# high (whichever occurs first) to CE# or WE# low (whichever occurs last). Hence, tWHWL = tEHEL = tWHEL = tEHWL). tWHVH or tWHCH/L must be met when transiting from a write cycle to a synchronous burst read. VPP and WP# should be at a valid level until erase or program success is determined. This specification is only applicable when transiting from a write cycle to an asynchronous read. See spec W19 and W20 for synchronous read. When doing a Read Status operation following any command that alters the Status Register, W14 is 20 ns. Add 10 ns if the write operations results in a RCR or block lock status change, for the subsequent read operation to reflect this change. These specs are required only when the device is in a synchronous mode and clock is active during address setup phase. Figure 23: Write-to-Write Timing W5 W8 W5 W8 Address [A] W2 W6 W2 W6 CE# [E} W3 W9 W3 WE# [W] OE# [G] W4 W7 W4 W7 Data [D/Q] W1 RST# [P] Datasheet 55 Aug 2009 Order Number:320003-08 P33-65nm Figure 24: Asynchronous Read-to-Write Timing R1 R2 W5 W8 Address [A] R3 R8 CE# [E} R4 R9 OE# [G] W2 W3 W6 WE# [W] R15 R17 WAIT [T] R7 W7 R6 R10 Data [D/Q] W4 Q D R5 RST# [P] Note: WAIT deasserted during asynchronous read and during write. WAIT High-Z during write per OE# deasserted. Figure 25: Write-to-Asynchronous Read Timing W5 W8 R1 Address [A] ADV# [V] W2 W6 R10 CE# [E} W3 W18 WE# [W] W14 OE# [G] R15 R17 WAIT [T] R4 W4 Data [D/Q] W7 D R2 R3 R8 R9 Q W1 RST# [P] Datasheet 56 Aug 2009 Order Number: 320003-08 P33-65nm Figure 26: Synchronous Read-to-Write Timing Latency Count R301 R302 R306 CLK [C] R2 W5 R101 W18 Address [A] R105 R102 R106 R104 ADV# [V] R303 R11 R13 R3 W6 CE# [E] R4 R8 OE# [G] W21 W22 W15 W21 W22 W2 W8 W3 W9 WE# R16 R307 R312 WAIT [T] R304 R7 R305 Note: W7 Q Data [D/Q] D D WAIT shown deasserted and High-Z per OE# deassertion during write operation (RCR 10=0, WAIT asserted low). Clock is ignored during write operation. Figure 27: Write-to-Synchronous Read Timing R302 R301 R2 CLK W5 W8 R306 Address [A] R106 R104 ADV# W6 W2 R303 R11 CE# [E} W18 W19 W20 W3 WE# [W] R4 OE# [G] R15 R307 WAIT [T] W7 W4 D Data [D/Q] R304 R305 R304 R3 Q Q W1 RST# [P] Note: WAIT shown deasserted and High-Z per OE# deassertion during write operation (RCR.10=0, WAIT asserted low). Datasheet 57 Aug 2009 Order Number:320003-08 P33-65nm Program and Erase Characteristics 15.5 Table 25: Program and Erase Specifications Num Symbol VPPH VPPL Parameter Min Typ Max Min Typ Max 456 - 150 456 Unit Note µs 1 µs 1 Conventional Word Programming W200 tPROG/W Program Time Single word - 150 Buffered Programming W250 tPROG Program Time Aligned 32-Wd, BP time (32 Words) - 176 716 - 176 716 Aligned 64-Wd, BP time (64 Word) - 216 900 - 216 900 Aligned 128-Wd, BP time (128 Words) - 272 1140 - 272 1140 Aligned 256-Wd, BP time (256 Words) - 396 1690 - 396 1690 one full buffer (512 Words) - 700 3016 - 700 3016 Buffered Enhanced Factory Programming W451 tBEFP/B W452 tBEFP/Setup Program Single byte BEFP Setup n/a n/a n/a - 0.5 - n/a n/a n/a 5 - - µs 1,2 1 Erase and Suspend W500 tERS/PB W501 tERS/MB W600 tSUSP/P W601 tSUSP/E W602 tERS/SUSP Erase Time Suspend Latency 32-KByte Parameter - 0.8 4.0 - 0.8 4.0 128-KByte Main - 0.8 4.0 - 0.8 4.0 Program suspend - 20 25 - 20 25 Erase suspend - 20 25 - 20 25 - 500 - - 500 - 3.2 - - 3.2 - Erase to Suspend s 1 µs 1,3 blank check W702 tBC/MB blank check Main Array Block - ms Notes: 1. Typical values measured at TC = +25 °C and nominal voltages. Performance numbers are valid for all speed versions. Excludes system overhead. Sampled, but not 100% tested. 2. Averaged over entire device. 3. W602 is the typical time between an initial block erase or erase resume command and the a subsequent erase suspend command. Violating the specification repeatedly during any particular block erase may cause erase failures. Datasheet 58 Aug 2009 Order Number: 320003-08 P33-65nm 16.0 Ordering Information 16.1 Discrete Products Figure 28: Decoder for Discrete Products J S 2 8 F 2 5 6 P 3 3 B F Device Details Package Designator 65 nm lithography TE = 56 -Lead TSOP, leaded JS = 56- Lead TSOP, lead-free RC = 64-Ball Easy BGA, leaded PC = 64 -Ball Easy BGA, lead-free Parameter Location B = Bottom Parameter T = Top Parameter Product Line Designator Product Family 28F = Numonyx™ Flash Memory P 33 = Numonyx™ StrataFlash ® Embedded Memory (P33) VCC = 2. 3 – 3. 6 V V CCQ = 2. 3 – 3. 6 V Device Density 256 = 256-Mbit Table 26: Valid Combinations for Discrete Products 256-Mbit RC28F256P33TF RC28F256P33BF PC28F256P33TF PC28F256P33BF TE28F256P33TF TE28F256P33BF JS28F256P33TF JS28F256P33BF Datasheet 59 Aug 2009 Order Number:320003-08 P33-65nm 16.2 SCSP Products Figure 29: Decoder for SCSP Devices P C 4 8 F 4 4 0 0 P 0 T B 0 E Package Designator RC = 64- Ball Easy BGA , leaded PC = 64- Ball Easy BGA, lead- free Device Details E = 65 nm lithography Ballout Descriptor 0 = Discrete ballout Product Designator 48F = Numonyx™ Flash Memory Only Device Density Parameter Location B = Bottom Parameter T = Top Parameter 0 = No die 4 = 256-Mbit I/ O Voltage, CE # Configuration Product Family P = Numonyx™ StrataFlash ® Embedded Memory (P33) 0 = No die X = Individual Chip Enable (s) T = Virtual Chip Enable(s) VCC = 2. 3 to 3.6 V VCCQ = 2. 3to 3. 6 V Table 27: Valid Combinations for Dual- Die Products 512-Mbit* RC48F4400P0TB0E PC48F4400P0TB0E Note: The “B” parameter is used for Top(Die1)/Bot(Die2) stack option in the 512-Mbit density. Datasheet 60 Aug 2009 Order Number: 320003-08 P33-65nm Appendix A Supplemental Reference Information A.1 Common Flash Interface The Common Flash Interface (CFI) is part of an overall specification for multiple command-set and control-interface descriptions. This appendix describes the database structure containing the data returned by a read operation after issuing the Read CFI command (see Section 6.2, “Device Command Bus Cycles” on page 18). System software can parse this database structure to obtain information about the flash device, such as block size, density, bus width, and electrical specifications. The system software will then know which command set(s) to use to properly perform flash writes, block erases, reads and otherwise control the flash device. A.1.1 Query Structure Output The Query database allows system software to obtain information for controlling the flash device. This section describes the device’s CFI-compliant interface that allows access to Query data. Query data are presented on the lowest-order data outputs (DQ7-0) only. The numerical offset value is the address relative to the maximum bus width supported by the device. On this family of devices, the Query table device starting address is a 10h, which is a word address for x16 devices. For a word-wide (x16) device, the first two Query-structure bytes, ASCII “Q” and “R,” appear on the low byte at word addresses 10h and 11h. This CFI-compliant device outputs 00h data on upper bytes. The device outputs ASCII “Q” in the low byte (DQ7-0) and 00h in the high byte (DQ15-8). At Query addresses containing two or more bytes of information, the least significant data byte is presented at the lower address, and the most significant data byte is presented at the higher address. In all of the following tables, addresses and data are represented in hexadecimal notation, so the “h” suffix has been dropped. In addition, since the upper byte of wordwide devices is always “00h,” the leading “00” has been dropped from the table notation and only the lower byte value is shown. Any x16 device outputs have 00h on the upper byte in this mode. Table 28: Summary of Query Structure Output as a Function of Device and Mode Device Device Addresses Datasheet 61 Hex Offset 00010: 00011: 00012: Hex Code 51 52 59 ASCII Value "Q" "R" "Y" Aug 2009 Order Number:320003-08 P33-65nm Table 29: Example of Query Structure Output of x16 Devices Offset Hex Code AX-A1 A.1.2 Value D15-D0 00010h 0051 “Q” 00011h 0052 “R” 00012h 0059 “Y” 00013h P_IDLO 00014h P_IDHI 00015h PLO 00016h PHI 00017h A_IDLO 00018h A_IDHI ... ... PrVendor ID# PrVendor TblAdr AltVendor ID# ... Query Structure Overview The Query command causes the flash component to display the Common Flash Interface (CFI) Query structure or database. Table 30 summarizes the structure sub-sections and address locations. Table 30: Query Structure 00001-Fh 00010h 0001Bh 00027h P(3) Note: 1. 2. 3. Reserved CFI query identification string System interface information Device geometry definition Reserved for vendor-specific information Command set ID and vendor data offset Device timing & voltage information Flash device layout Vendor-defined additional information specific Primary Numonyx-specific Extended Query to the Primary Vendor Algorithm Refer to the Query Structure Output section and offset 28h for the detailed definition of offset address as a function of device bus width and mode. BA = Block Address beginning location (i.e., 08000h is block 1’s beginning location when the block size is 32-KWord). Offset 15 defines “P” which points to the Primary Numonyx-specific Extended Query Table. A.1.3 Read CFI Identification String The Identification String provides verification that the component supports the Common Flash Interface specification. It also indicates the specification version and supported vendor-specified command set(s). Datasheet 62 Aug 2009 Order Number: 320003-08 P33-65nm Table 31: CFI Identification Add. Hex Code Value Query-unique ASCII string “QRY”. 10: 11: 12: --51 --52 --59 “Q” “R” “Y” 2 Primary Vendor command set and control interface ID code. 16-bit ID code for Vendor-specified algorithms. 13: 14: --01 --00 15h 2 Extended Query Table primay algorithm address. 15: 16: --0A --01 17h 2 Alernate vendor command set and control interface ID code. 0000h means no second vendor-specified alorithm exists. 17: 18: --00 --00 19h 2 Secondary algorithm Extended Query Table address. 0000h means none exists. 19: 1A: --00 --00 Add Hex Code Value Offset Length 10h 3 13h Description Table 32: System Interface Information Offset Length Description 1Bh 1 VCC logic supply minimum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 BCD volts 1B: --23 2.3V 1Ch 1 VCC logic supply maximum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 BCD volts 1C: --36 3.6V 1Dh 1 VPP [programming] supply minimum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 HEX volts 1D: --85 8.5V 1Eh 1 VPP [programming] supply maximum program/erase voltage bits 0-3 BCD 100 mV bits 4-7 HEX volts 1E: --95 9.5V 1Fh 1 “n” such that typical single word program time-out = 2n 1F: --08 256µs 20: --0A 1024µs 21: --0A 1s n µ-sec µ-sec 20h 1 “n” such that typical full buffer write time-out = 2 21h 1 “n” such that typical block erase time-out = 2n m-sec n 22h 1 “n” such that typical full chip erase time-out = 2 m-sec 22: --00 NA 23h 1 “n” such that maximum word program time-out = 2n times typical 23: --01 512µs 24h 1 “n” such that maximum buffer write time-out = 2n times typical 24: --02 4096µs 25h 1 “n” such that maximum block erase time-out = 2n times typical 25: --02 4s 26: --00 NA 26h Datasheet 63 1 n “n” such that maximum chip erase time-out = 2 times typical Aug 2009 Order Number:320003-08 P33-65nm A.1.4 Device Geometry Definition Table 33: Device Geometry Definition Offset Length 27h 1 Description “n” such that device size = 2n in number of bytes Add Hex Code 27: See Table Below Value Flash device interface code assignment: "n" such that n+1 specifies the bit field that represents the flash device width capabilities as described in the table: 28h 2Ah 2Ch 2 7 6 5 4 3 2 1 0 _ _ _ _ x64 x32 x16 x8 15 14 13 12 11 10 9 8 _ _ _ _ _ _ _ _ 2 “n” such that maximum number of bytes in write buffer = 2n 1 Number of erase block regions (x) within device: 1. x = 0 means no erase blocking; the device erases in bulk 2. x specifies the number of device regions with one or more contiguous same-size erase blocks. 3. Symmetrically blocked partitions have one blocking region 4 Erase Block Region 1 Information bits 0-15 = y, y+1 = number of identical-size erase blocks bits 16-31 = z, region erase block(s) size are z x 256 bytes 28: --01 29: --00 2A: --0A 2B: --00 2C: x16 1024 See Table Below 2D: 2D 2E: See Table Below 2F: 30: 31: 31h 4 Erase Block Region 2 Information bits 0-15 = y, y+1 = number of identical-size erase blocks bits 16-31 = z, region erase block(s) size are z x 256 bytes 32: See Table Below 33: 34: 35: 35h 4 36: Reserved for future erase block region information See Table Below 37: 38: 256-Mbit 256-Mbit Address 27: 256-Mbit Address -B -T --19 --19 Address -B -T 2D: --03 --FE 33: -B -T --00 --80 28: --01 --01 2E: --00 --00 34: --02 --00 29: --00 --00 2F: --80 --00 35: --00 --00 2A: --0A --0A 30: --00 --02 36: --00 --00 2B: --00 --00 31: --FE --03 37: --00 --00 2C: --02 --02 32: --00 --00 38: --00 --00 Datasheet 64 Aug 2009 Order Number: 320003-08 P33-65nm A.1.5 Numonyx-Specific Extended Query Table Table 34: Primary Vendor-Specific Extended Query Offset(1) Length Description P = 10Ah (Optional flash features and com m ands) (P+0)h 3 Primary extended query table (P+1)h Unique ASCII string “PRI“ (P+2)h (P+3)h 1 Major version number, ASCII (P+4)h 1 Minor version number, ASCII (P+5)h 4 Optional feature and command support (1=yes, 0=no) bits 10–31 are reserved; undefined bits are “0.” If bit 31 is (P+6)h “1” then another 31 bit field of Optional features follows at (P+7)h the end of the bit–30 field. (P+8)h bit 0 Chip erase supported bit 1 Suspend erase supported bit 2 Suspend program supported bit 3 Legacy lock/unlock supported bit 4 Queued erase supported bit 5 Instant individual block locking supported bit 6 Protection bits supported bit 7 Pagemode read supported bit 8 Synchronous read supported bit 9 Simultaneous operations supported bit 10 Extended Flash Array Blocks supported bit 11 Permanent Block Locking of up to Full Main Array supported bit 12 Permanent Block Locking of up to Partial Main Array supported bit 30 CFI Link(s) to follow bit 31 Another "Optional Features" field to follow (P+9)h 1 Supported functions after suspend: read Array, Status, Query Other supported operations are: bits 1–7 reserved; undefined bits are “0” bit 0 Program supported after erase suspend (P+A)h 2 Block status register mask bits 2–15 are Reserved; undefined bits are “0” (P+B)h bit 0 Block Lock-Bit Status register active bit 1 Block Lock-Dow n Bit Status active bit 4 EFA Block Lock-Bit Status register active bit 5 EFA Block Lock-Dow n Bit Status active (P+C)h 1 V CC logic supply highest performance program/erase voltage bits 0–3 BCD value in 100 mV bits 4–7 BCD value in volts (P+D)h 1 V PP optimum program/erase supply voltage bits 0–3 BCD value in 100 mV bits 4–7 HEX value in volts A ddress 112: Datasheet 65 Discrete –B –T ––--00 --00 Hex Add. Code 10A --50 10B: --52 10C: --49 10D: --31 10E: --35 10F: --E6 110: --09 111: --00 112: --40 bit 0 = 0 bit 1 = 1 bit 2 = 1 bit 3 = 0 bit 4 = 0 bit 5 = 1 bit 6 = 1 bit 7 = 1 bit 8 = 1 bit 9 = 0 bit 10 = 0 bit 11 = 1 bit 12 = 0 bit 30 = 1 bit 31 = 0 113: --01 Value "P" "R" "I" "1" "5" No Yes Yes No No Yes Yes Yes Yes No No Yes No Yes No bit 0 114: 115: bit 0 bit 1 bit 4 bit 5 116: =1 --03 --00 =1 =1 =0 =0 --18 Yes Yes Yes No No 1.8V 117: --90 9.0V 512-Mbit –B die 1 (B) --40 –T die 2 (T) --00 die 1 (T) --40 die 2 (B) --00 Aug 2009 Order Number:320003-08 P33-65nm Table 35: OTP Register Information Offset(1) Length Description P = 10Ah (Optional flash features and commands) Number of Protection register fields in JEDEC ID space. (P+E)h 1 “00h,” indicates that 256 protection fields are available (P+F)h 4 Protection Field 1: Protection Description (P+10)h This field describes user-available One Time Programmable (P+11)h (OTP) Protection register bytes. Some are pre-programmed w ith device-unique serial numbers. Others are user (P+12)h programmable. Bits 0–15 point to the Protection register Lock byte, the section’s first byte. The follow ing bytes are factory pre-programmed and user-programmable. Hex Add. Code Value 118: --02 2 119: 11A: 11B: 11C: --80 --00 --03 --03 80h 00h 8 byte 8 byte 11D: 11E: 11F: 120: 121: 122: 123: 124: 125: 126: --89 --00 --00 --00 --00 --00 --00 --10 --00 89h 00h 00h 00h 0 0 0 16 0 16 bits 0–7 = Lock/bytes Jedec-plane physical low address bits 8–15 = Lock/bytes Jedec-plane physical high address bits 16–23 = “n” such that 2n = factory pre-programmed bytes bits 24–31 = “n” such that 2n = user programmable bytes (P+13)h (P+14)h (P+15)h (P+16)h (P+17)h (P+18)h (P+19)h (P+1A)h (P+1B)h (P+1C)h Datasheet 66 10 Protection Field 2: Protection Description Bits 0–31 point to the Protection register physical Lock-w ord address in the Jedec-plane. Follow ing bytes are factory or user-programmable. bits 32–39 = “n” such that n = factory pgm'd groups (low byte) bits 40–47 = “n” such that n = factory pgm'd groups (high byte) bits 48–55 = “n” \ 2n = factory programmable bytes/group bits 56–63 = “n” such that n = user pgm'd groups (low byte) bits 64–71 = “n” such that n = user pgm'd groups (high byte) bits 72–79 = “n” such that 2n = user programmable bytes/group --04 Aug 2009 Order Number: 320003-08 P33-65nm Figure 30: Burst Read Information Offset(1) Length Description P = 10Ah (Optional flash features and commands) Add. (P+1D)h 1 127: Page Mode Read capability bits 0–7 = “n” such that 2n HEX value represents the number of read-page bytes. See offset 28h for device w ord w idth to determine page-mode data output w idth. 00h indicates no read page buffer. (P+1E)h 1 128: Number of synchronous mode read configuration fields that follow . 00h indicates no burst capability. (P+1F)h 1 129: Synchronous mode read capability configuration 1 Bits 3–7 = Reserved Bits 0–2 “n” such that 2n+1 HEX value represents the maximum number of continuous synchronous reads w hen the device is configured for its maximum w ord w idth. A value of 07h indicates that the device is capable of continuous linear bursts that w ill output data until the internal burst counter reaches the end of the device’s burstable address space. This field’s 3-bit value can be w ritten directly to the Read Configuration Register bits 0–2 if the device is configured for its maximum w ord w idth. See offset 28h for w ord w idth to determine the burst data output w idth. (P+20)h (P+21)h (P+22)h 1 1 1 Synchronous mode read capability configuration 2 Synchronous mode read capability configuration 3 Synchronous mode read capability configuration 4 12A: 12B: 12C: Hex Code Value --05 32 byte --04 4 --01 4 --02 --03 --07 8 16 Cont Table 36: Partition and Erase Block Region Information Offset(1) P = 10Ah Bottom Top (P+23)h Datasheet 67 Description (Optional flash features and commands) Number of device hardw are-partition regions w ithin the device. x = 0: a single hardw are partition device (no fields follow ). x specifies the number of device partition regions containing one or more contiguous erase block regions. (P+23)h See table below Address Bot Top Len 1 12D: 12D: Aug 2009 Order Number:320003-08 P33-65nm Table 37: Partition Region 1 Information (Sheet 1 of 2) Offset(1) P = 10Ah Description Bottom Top (Optional flash features and commands) (P+24)h (P+24)h Data size of this Parition Region Information field (P+25)h (P+25)h (# addressable locations, including this field) (P+26)h (P+26)h Number of identical partitions w ithin the partition region (P+27)h (P+27)h (P+28)h (P+28)h Number of program or erase operations allow ed in a partition bits 0–3 = number of simultaneous Program operations bits 4–7 = number of simultaneous Erase operations (P+29)h (P+29)h Simultaneous program or erase operations allow ed in other partitions w hile a partition in this region is in Program mode bits 0–3 = number of simultaneous Program operations bits 4–7 = number of simultaneous Erase operations (P+2A)h (P+2A)h Simultaneous program or erase operations allow ed in other partitions w hile a partition in this region is in Erase mode bits 0–3 = number of simultaneous Program operations bits 4–7 = number of simultaneous Erase operations (P+2B)h (P+2B)h Types of erase block regions in this Partition Region. x = 0 = no erase blocking; the Partition Region erases in bulk x = number of erase block regions w / contiguous same-size erase blocks. Symmetrically blocked partitions have one blocking region. Partition size = (Type 1 blocks)x(Type 1 block sizes) + (Type 2 blocks)x(Type 2 block sizes) +…+ (Type n blocks)x(Type n block sizes) Datasheet 68 See table below Address Bot Top Len 2 12E: 12E 12F 12F 2 130: 130: 131: 131: 1 132: 132: 1 133: 133: 1 134: 134: 1 135: 135: Aug 2009 Order Number: 320003-08 P33-65nm Table 38: Partition Region 1 Information (Sheet 2 of 2) Offset(1) P = 10Ah Description Bottom Top (Optional flash features and com m ands) (P+2C)h (P+2C)h Partition Region 1 Erase Block Type 1 Information (P+2D)h (P+2D)h bits 0–15 = y, y+1 = # identical-size erase blks in a partition (P+2E)h (P+2E)h bits 16–31 = z, region erase block(s) size are z x 256 bytes (P+2F)h (P+2F)h (P+30)h (P+30)h Partition 1 (Erase Block Type 1) (P+31)h (P+31)h Block erase cycles x 1000 (P+32)h (P+32)h Partition 1 (erase block Type 1) bits per cell; internal EDAC bits 0–3 = bits per cell in erase region bit 4 = internal EDAC used (1=yes, 0=no) bits 5–7 = reserve for future use (P+33)h (P+34)h (P+35)h (P+36)h (P+37)h (P+38)h (P+39)h (P+3A)h (P+3B)h (P+3C)h (P+3D)h (P+3E)h (P+3F)h (P+40)h (P+33)h Partition 1 (erase block Type 1) page mode and synchronous mode capabilities defined in Table 10. bit 0 = page-mode host reads permitted (1=yes, 0=no) bit 1 = synchronous host reads permitted (1=yes, 0=no) bit 2 = synchronous host w rites permitted (1=yes, 0=no) bits 3–7 = reserved for future use Partition Region 1 (Erase Block Type 1) Programming Region Information (P+34)h bits 0–7 = x, 2^x = Programming Region aligned size (bytes) (P+35)h bits 8–14 = Reserved; bit 15 = Legacy flash operation (ignore 0:7) (P+36)h bits 16–23 = y = Control Mode valid size in bytes (P+37)h bits 24-31 = Reserved (P+38)h bits 32-39 = z = Control Mode invalid size in bytes (P+39)h bits 40-46 = Reserved; bit 47 = Legacy flash operation (ignore 23:16 & 39:32) (P+3A)h Partition Region 1 Erase Block Type 2 Information (P+3B)h bits 0–15 = y, y+1 = # identical-size erase blks in a partition (P+3C)h bits 16–31 = z, region erase block(s) size are z x 256 bytes (P+3D)h (P+3E)h Partition 1 (Erase Block Type 2) (P+3F)h Block erase cycles x 1000 (P+40)h Partition 1 (erase block Type 2) bits per cell; internal EDAC bits 0–3 = bits per cell in erase region bit 4 = internal EDAC used (1=yes, 0=no) bits 5–7 = reserve for future use 13D: 13D: 1 13E: 13F: 140: 141: 142: 143: 144: 145: 146: 147: 148: 149: 14A: 13E: 13F: 140: 141: 142: 143: 144: 145: 146: 147: 148: 149: 14A: 1 14B: 14B: Partition Region 1 (Erase Block Type 2) Programming Region Information 6 bits 0–7 = x, 2^x = Programming Region aligned size (bytes) bits 8–14 = Reserved; bit 15 = Legacy flash operation (ignore 0:7) bits 16–23 = y = Control Mode valid size in bytes bits 24-31 = Reserved bits 32-39 = z = Control Mode invalid size in bytes bits 40-46 = Reserved; bit 47 = Legacy flash operation (ignore 23:16 & 39:32) 14C: 14D: 14E: 14F: 150: 151: 14C: 14D: 14E: 14F: 150: 151: (P+41)h (P+41)h Partition 1 (erase block Type 2) page mode and synchronous mode capabilities defined in Table 10. bit 0 = page-mode host reads permitted (1=yes, 0=no) bit 1 = synchronous host reads permitted (1=yes, 0=no) bit 2 = synchronous host w rites permitte (P+42)h (P+43)h (P+44)h (P+45)h (P+46)h (P+47)h (P+42)h (P+43)h (P+44)h (P+45)h (P+46)h (P+47)h Datasheet 69 See table below Address Bot Top Len 4 136: 136: 137: 137: 138: 138: 139: 139: 2 13A: 13A: 13B: 13B: 1 13C: 13C: 1 6 4 2 Aug 2009 Order Number:320003-08 P33-65nm Table 39: Partition and Erase Block Region Information Address 12D: 12E: 12F: 130: 131: 132: 133: 134: 135: 136: 137: 138: 139: 13A 13B: 13C: 13D: 13E: 13F: 140: 141: 142: 143: 144: 145: 146: 147: 148: 149: 14A 14B: 14C: 14D: 14E: 14F: 150: 151: Datasheet 70 256-Mbit –B –T --01 --01 --24 --24 --00 --00 --01 --01 --00 --00 --11 --11 --00 --00 --00 --00 --02 --02 --03 --FE --00 --00 --80 --00 --00 --02 --64 --64 --00 --00 --02 --02 --03 --03 --00 --00 --80 --80 --00 --00 --00 --00 --00 --00 --80 --80 --FE --03 --00 --00 --00 --80 --02 --00 --64 --64 --00 --00 --02 --02 --03 --03 --00 --00 --80 --80 --00 --00 --00 --00 --00 --00 --80 --80 Aug 2009 Order Number: 320003-08 P33-65nm Table 40: CFI Link Information Length 4 1 Address 152: 153: 154: 155: 156: Datasheet 71 Description (Optional flash features and commands) CFI Link Field bit definitions Bits 0–9 = Address offset (w ithin 32Mbit segment) of referenced CFI table Bits 10–27 = nth 32Mbit segment of referenced CFI table Bits 28–30 = Memory Type Bit 31 = Another CFI Link field immediately follow s CFI Link Field Quantity Subfield definitions Bits 0–3 = Quantity field (n such that n+1 equals quantity) Bit 4 = Table & Die relative location Bit 5 = Link Field & Table relative location Bits 6–7 = Reserved Discrete –B –T ––--FF --FF --FF --FF --FF --FF --FF --FF --FF --FF Add. 152: 153: 154: 155: Hex Code Value See table below 156: See table below 512-Mbit –B die 1 (B) --10 --20 --00 --00 --10 –T die 2 (T) --FF --FF --FF --FF --FF die 1 (T) --10 --20 --00 --00 --10 die 2 (B) --FF --FF --FF --FF --FF Aug 2009 Order Number:320003-08 P33-65nm A.2 Flowcharts Figure 31: Word Program Flowchart Start Command Cycle - Issue Program Command - Address = location to program - Data = 0x40 Data Cycle - Address = location to program - Data = Data to program Check Ready Status - Read Status Register Command not required - Perform read operation - Read Ready Status on signal D7 No D7 = '1' ? No Yes Read Status Register - Toggle CE# or OE# to update Status Register - See Status Register Flowchart Suspend ? No Yes Program Suspend See Suspend/ Resume Flowchart Errors ? Yes Error-Handler User Defined Routine End Datasheet 72 Aug 2009 Order Number: 320003-08 P33-65nm Figure 32: Program Suspend/Resume Flowchart PROGRAM SUSPEND / RESUME PROCEDURE Bus Command Operation Start Read Status Write Write 70h Any Address Write Program Suspend Write B0h Any Address 0 Status register data Initiate a read cycle to update Status register Addr = Suspended block (BA) Standby Check SR.7 1 = WSM ready 0 = WSM busy Standby Check SR.2 1 = Program suspended 0 = Program completed 1 SR. 2 = Read 0 Program Completed 1 Array Write Write FFh Any Address Read Read Array Data Done Reading Program Yes Resume Read Array Data = FFh Addr = Block address to read (BA) Read array data from block other than the one being programmed Program Data = D0 h Resume Addr = Suspended block (BA) No Read Array Write FFh Program Resumed Read Array Data Status Write70h Any Address Datasheet 73 Write Write D0h Any Address Read Data = 70h Addr = Block to suspend (BA) Program Data = B0h Suspend Addr = X Read Read Status Register SR. 7 = Read Status Comments PGM_ SUS. WMF Aug 2009 Order Number:320003-08 P33-65nm Figure 33: Buffer Program Flowchart Start Device Supports Buffer Writes? No Use Single Word Programming Yes Set Timeout or Loop Counter Get Next Target Address Issue Write to Buffer Command E8h and Block Address No 0 = No Timeout or Count Expired? Write Write to Buffer Comments Data = E8H Addr = Block Address Read (Note 7) SR. 7 = Valid Addr = Block Address Standby Check SR.7 1 = Device WSM is Busy 0 = Device WSM is Ready Write ( Notes1, 2) Data = N- 1 = Word Count N = 0 corresponds to count= 1 Addr = Block Address Write ( Notes3, 4) Data = Write Buffer Data Addr = Start Address Write ( Notes5, 6) Data = Write Buffer Data Addr = Block Address Program Confirm Data = D0H Addr = Block Address Read Status register Data CE # and OE# low updates SR Addr = Block Address Standby Check SR.7 1 = WSM Ready 0 = WSM Busy Notes: 1. Word count values on DQ 0-DQ15 are loaded into the Count register. Count ranges for this device are N=0000h to 00FFh. Yes 1 = Yes . 2. The device outputs the status register when read. Write Word Count Block Address 3. Write Buffer contents will be programmed at the device start address or destination flash address . Write Buffer Data Start Address X = X +1 X =0 Write Buffer Data Block Address 4. Align the start address on a Write Buffer boundary for maximum programming performance (i.e., A8-A1 of the start address =0). . 5. The device aborts the Buffered Program command if the current address is outside the original block address . No X = N? Command Write Read Status Register Block Address (note 7) Is WSM Ready? SR. 7 = Bus Operation No Yes . 6. The Status register indicates an “improper command Sequence” if the Buffered Program command is aborted. Follow this with a Clear Status Register command . Abort Bufferred Program? 7. The device default state is to output SR data after the Buffered Programming Setup Command (E8h).CE# and OE low drive the device to update Status Register . It is not allowed to issue 70h to read SR data after E8h command otherwise 70h would be counted as Word count. Yes Write Confirm D0h and Block Address Write to another Block Address Buffered Program Aborted 8. Full status check can be done after all erase and write sequences complete . Write FFh after the last operation to reset the device to read array mode. Read Status Register No SR. 7 =? 0 Suspend Program Yes Suspend Program Loop 1 Full Status Check if Desired Yes Another Buffered Programming? No Program Complete Datasheet 74 Aug 2009 Order Number: 320003-08 P33-65nm Figure 34: BEFP Flowchart Setup Phase Program/Verify Phase Start Read Status Register Exit Phase A B Issue BEFP Setup Cmd (Data = 0x80) Read Status Register No (SR.0=1) Buffer Ready ? No (SR.7=0) BEFP Exited ? Issue BEFP Confirm Cmd (Data = 00D0h) Yes (SR.0=0) Write Data Word to Buffer Yes (SR.7=1) BEFP Setup Delay Full Status Register check for errors Buffer Full ? No Read Status Register Finish Yes BEFP Setup Done ? Read Status Register Yes (SR.7=0) A No (SR.7=1) Program Done ? SR Error Handler (User-Defined) No (SR.0=1) Yes (SR.0=0) Exit Yes Program More Data ? No Write 0xFFFFh outside Block Datasheet 75 B Aug 2009 Order Number:320003-08 P33-65nm Figure 35: Block Erase Flowchart Start Command Cycle - Issue Erase command - Address = Block to be erased - Data = 0x20 Confirm Cycle - Issue Confirm command - Address = Block to be erased - Data = Erase confirm (0xD0) Check Ready Status - Read Status Register Command not required - Perform read operation - Read Ready Status on signal SR.7 No SR.7 = '1' ? No Yes Read Status Register - Toggle CE# or OE# to update Status Register - See Status Register Flowchart Suspend ? No Yes Erase Suspend See Suspend/ Resume Flowchart Errors ? Yes Error-Handler User Defined Routine End Datasheet 76 Aug 2009 Order Number: 320003-08 P33-65nm Figure 36: Block Lock Operations Flowchart LOCKING OPERATIONS PROCEDURE Bus Command Operation Start Lock Setup Write Write 60 h Block Address Lock Confirm Write Write 01 ,D0,2Fh Block Address Lock Setup Comments Data = 60h Addr = Block to lock/unlock/lock-down (BA) Lock, Data = 01h (Lock block) Unlock, or D0h (Unlock block) Lockdown 2Fh (Lockdown block) Confirm Addr = Block to lock/unlock/lock-down (BA) Read ID Plane Write ( Optional) Op tion al Write 90 h Yes Read Array Data = 90h Addr = Block address offset +2 ( BA+2) Read Block Lock Block Lock status data ( Optional) Status Addr = Block address offset +2 ( BA+2) Read Block Lock Status Locking Change ? Read ID Plane No Confirm locking change on DQ1, DQ0 . (See Block Locking State Transitions Table for valid combinations.) Standby ( Optional) Write Read Array Data = FFh Addr = Block address (BA) Write FFh Any Address Lock Change Complete Datasheet 77 LOCK_OP.WMF Aug 2009 Order Number:320003-08 P33-65nm Figure 37: Erase Suspend/Resume Flowchart ERASE SUSPEND / RESUME PROCEDURE Bus Command Operation Start Read Status Write Write 70h Any Address Write Erase Suspend Write B0h Any Address Read Read Status Register SR.7 = SR.6 = 0 Read Read or Program ? Read Array Data No Check SR.6 1 = Erase suspended 0 = Erase completed Read or Write Program Loop Status register data. Toggle CE# or OE # to update Status register Addr =X Standby Write Program Data = B0 h Erase Addr = Same partition address as Suspend above Check SR.7 1 = WSM ready 0 = WSM busy Erase Completed 1 Data = 70 h Addr = Any device address Standby 0 1 Read Status Comments Write Read Array Data = FFh or 40 h or Program Addr = Block to program or read Read array or program data from/to block other than the one being erased Program Data = D0h Resume Addr = Any address Done? Yes Erase Resume Read Write D0h Any Address Write FFh Any Addres Erase Resumed Read Array Data Read Status Write 70h Any Address Datasheet 78 Array ERAS_SUS.WMF Aug 2009 Order Number: 320003-08 P33-65nm Figure 38: OTP Register Programming Flowchart Start OTP Program Setup - Write 0xC0 - OTP Address Confirm Data - Write OTP Address and Data Check Ready Status - Read Status Register Command not required - Perform read operation - Read Ready Status on signal SR.7 SR.7 = '1' ? No Yes Read Status Register - Toggle CE# or OE# to update Status Register - See Status Register Flowchart End Datasheet 79 Aug 2009 Order Number:320003-08 P33-65nm Figure 39: Status Register Flowchart Start Command Cycle - Issue Status Register Command - Address = any device address - Data = 0x70 Data Cycle - Read Status Register SR[7:0] No SR7 = '1' Yes - Set/Reset by WSM SR6 = '1' Yes Erase Suspend See Suspend /Resume Flowchart Yes Program Suspend See Suspend /Resume Flowchart No SR2 = '1' No SR5 = '1' Yes SR4 = '1' Yes Error Command Sequence No No Error Erase Failure SR4 = '1' Yes Error Program Failure Yes Error VPEN/PP < VPENLK/PPLK Yes Error Block Locked No - Set by WSM - Reset by user - See Clear Status Register Command SR3 = '1' No SR1 = '1' No End Datasheet 80 Aug 2009 Order Number: 320003-08 P33-65nm A.3 Write State Machine Show here are the command state transitions (Next State Table) based on incoming commands. Only one partition can be actively programming or erasing at a time. Each partition stays in its last read state (Read Array, Read Device ID, Read CFI or Read Status Register) until a new command changes it. The next WSM state does not depend on the partition’s output state. Note: IS refers to Illegal State in the Next State Tables. Table 41: Next State Table for P3x-65nm (Sheet 1 of 3) OTP Busy IS in OTP Busy Setup Busy Word Program EFI IS in OTP Busy IS in Pgm Busy IS in Pgm Busy Ready (Unlock Block) IS in S-fn Susp Datasheet 81 OTP Setup Ready Ready Ready (Lock Ready (Lock Error (Lock down (Set Block Block CR) [Botc ) ) h]) OTP Busy Illegal State in OTP Busy OTP Busy OTP Busy Pgm Busy Pgm Susp IS in Pgm Susp Pgm Suspend WSM Operation Completes N/A N/A N/A Ready (Lock Error [Botch]) N/A N/A OTP Busy N/A N/A OTP Busy Ready OTP Busy Pgm Busy Pgm Susp Word Pgm Busy IS in Pgm Susp Pgm Busy Pgm Susp Word Pgm Susp (Er bits clear) IS in Word Pgm Busy N/A Pgm Busy Word Pgm Busy N/A Pgm Busy Word Program Suspend N/A Word Pgm Susp N/A Ready Pgm Busy Word Illegal State in Pgm Pgm Suspend Susp N/A Word Program Suspend Sub-function Setup Sub-op-code Load 1 Sub-function Load 2 if word count >0, else Sub-function confirm N/A Sub-function Confirm if data load in program buffer is complete, ELSE Sub-function Load 2 Ready (Error [Botch]) S-fn Busy IS in S-fn Busy S-fn Busy S-fn Busy Illegal State S-fn in S-fn Busy Busy Ready (Error [Botch]) S-fn Susp IS in Subfunction Busy Sub-function Susp Ready Word Program Busy Pgm Busy IS in Pgm Suspend EFI Setup Sub-function Setup Sub-op-code Load 1 Sub-function Load 2 Sub-function Confirm Sub-function Busy BC Setup Ready (Lock Error [Botch]) IS in Pgm Busy Suspend Lock/RCR /ECR Setup BEFP Setup Erase Setup EFI Setup OTP Busy IS in OTP OTP Busy Busy OTP Busy Ready other Ready Setup Busy BP Setup Ready (Lock Error [Botch]) Lock/RCR/ECR Setup OTP Program Setup Ready Ready (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) Other Commands (2) Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) OTP Setup Blank Check Lock/RCR/ECR Setup Read ID/Query Clear SR (5) Read Status Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Word Pgm Setup (4,9) Current Chip State Array Read (3) Command Input and Resulting Chip Next State(1) S-fn Busy IS in S-fn Busy S-fn Busy S-fn Busy Ready Sub-function Busy S-fn Susp IS in Illegal State S-fn S-fn Sub-function in S-fn Busy Busy Susp S-fn Suspend S-fn Susp S-fn (Er IS in S-fn Susp bits Susp clear) Sub-function Suspend S-fn Suspend N/A S-fn Susp N/A Aug 2009 Order Number:320003-08 P33-65nm Table 41: Next State Table for P3x-65nm (Sheet 2 of 3) Buffer Pgm (BP) Ready (Error [Botch]) IS in BP Busy BP Busy BP Busy Illegal State in BP Busy BP Busy BP Busy IS in BP Susp Setup BP Suspend Illegal State in BP Busy Ready (Error [Botch]) IS in Erase Busy Erase Busy Erase Busy IS in Erase Busy EFI Word BP Setup Pgm Setup in Erase Setup in Erase Susp in Erase Erase Susp Susp Susp IS in Erase Susp Setup Word Pgm busy in Erase Susp Busy IS in Pgm busy in Ers Susp Word Pgm busy in Erase Susp IS in Erase Busy BP Busy Illegal State in Word Program Suspend in Erase Suspend Setup BP Load 1 (8) BP Load 2 (8) BP Confirm BP Busy BP Busy BP Suspend IS in BP Suspend BP Susp BP (Er Susp bits clear) BP Suspend Erase Busy BP Busy WSM Operation Completes Other Commands (2) BP Busy IS in BP Susp BP Suspend Ready (Error [Botch]) Erase Erase Busy Susp Erase Busy IS in Erase Busy Erase Busy N/A BP Susp N/A Ready (Err Botch0]) N/A Ers Busy N/A Ready Word iS in Pgm pgm susp susp in Ers in Ers susp Susp Word Pgm susp in Ers susp iS in pgm susp in Ers Susp Word Pgm busy in Erase Susp Word Pgm Word Word Word Pgm Pgm Susp Pgm in Ers susp susp Susp susp in Ers in Ers in Ers (Er susp susp susp bits clear) N/A N/A Ready Erase Suspend N/A Erase Susp N/A N/A Word Pgm busy in Erase Susp N/A Erase Susp IS in Word Pgm Busy in Ers Ers Suspend Susp Word Pgm busy in Erase Suspend iS in Word Pgm susp in Ers Susp Word Pgm susp in Ers susp N/A N/A Word Pgm busy in Erase Suspend BP Load 1 in Erase Suspend BP Load 2 in Erase Suspend if word count >0, else BP confirm BP Confirming Erase Suspend if data load in program buffer is complete, ELSE BP load 2 in Erase Suspend Erase Suspend (Error [BotchBP]) BP IS in BP BP BP Illegal State Busy Busy Busy BP Busy in in BP Busy in in Ers Susp BP Busy in Ers Susp in Ers Erase Susp Susp in Ers in Ers Ers Susp Susp Susp Susp IS in BP Busy BP Susp IS in BP Busy Erase Busy Lock/ Erase RCR/ Susp ECR IS in IS in Erase Erase Erase Erase (Er Setup Erase Erase Suspend Busy Suspend Susp Susp bits in Susp clear) Erase Susp Erase Suspend Word Pgm busy in Erase Suspend Word Word Pgm Pgm IS in Word busy IS in Word Pgm Word Pgm busy in Pgm busy in Susp in Erase Susp busy in Ers Susp Ers Susp in Ers Erase Susp Susp Illegal state(IS) in Pgm busy in Erase Suspend Suspend BP Confirm if data Ready (Error load in program buffer is [Botc complete, else BP h]) load 2 Ready (Error [Botch]) BP Susp IS in BP Susp Suspend other BP Busy BP Susp Busy Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) BP Confirm if data load in program buffer is complete, ELSE BP load 2 BP Susp Datasheet 82 OTP Setup BP Load 2 (8) BP Busy BP in Erase Suspend Blank Check (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) BP Load 1 BP Load 2 if word count >0, else BP confirm BP Confirm Word Pgm in Erase Suspend Lock/RCR/ECR Setup Setup BP Load 1 (8) IS in BP Busy Erase Read ID/Query Clear SR (5) Read Status Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Array Read (3) Current Chip State Word Pgm Setup (4,9) Command Input and Resulting Chip Next State(1) Ers Susp (Error [Botc h]) BP Confirm in Erase Suspend when count=0, ELSE BP load 2 N/A BP Busy in Ers Susp Erase Susp (Error [Botch BP]) IS in BP Busy in Erase Suspend BP Busy in Ers Susp BP Susp in Ers Susp (Er bits clear) BP Suspend BP Susp in Ers Susp BP Susp in Ers Susp IS in BP Busy in Erase Suspend Erase Susp IS in Ers Susp BP Busy in Erase Suspend IS in BP BP BP BP Suspend Illegal State Busy Susp Susp in Erase in BP Busy in in Ers in Ers in Ers Suspend Ers Susp Susp Susp Susp N/A BP Susp in Ers Susp N/A BP Susp in Ers Susp N/A in Erase Suspend Aug 2009 Order Number: 320003-08 P33-65nm Table 41: Next State Table for P3x-65nm (Sheet 2 of 3) Buffer Pgm (BP) Ready (Error [Botch]) IS in BP Busy BP Busy BP Busy Illegal State in BP Busy BP Busy BP Busy IS in BP Susp Setup BP Suspend Illegal State in BP Busy Ready (Error [Botch]) IS in Erase Busy Erase Busy Erase Busy IS in Erase Busy EFI Word BP Setup Pgm Setup in Erase Setup in Erase Susp in Erase Erase Susp Susp Susp IS in Erase Susp Setup Word Pgm busy in Erase Susp Busy IS in Pgm busy in Ers Susp Word Pgm busy in Erase Susp IS in Erase Busy BP Busy Illegal State in Word Program Suspend in Erase Suspend Setup BP Load 1 (8) BP Load 2 (8) BP Confirm BP Busy BP Busy BP Suspend IS in BP Suspend BP Susp BP (Er Susp bits clear) BP Suspend Erase Busy BP Busy IS in BP Susp BP Suspend WSM Operation Completes Other Commands (2) BP Busy Ready (Error [Botch]) Erase Erase Busy Susp Erase Busy IS in Erase Busy Erase Busy N/A BP Susp N/A Ready (Err Botch0]) N/A Ers Busy N/A Ready Word iS in Pgm pgm susp susp in Ers in Ers susp Susp Word Pgm susp in Ers susp iS in pgm susp in Ers Susp Word Pgm busy in Erase Susp Word Pgm Word Word Word Pgm Pgm Susp Pgm in Ers susp susp Susp susp in Ers in Ers in Ers (Er susp susp susp bits clear) N/A N/A Ready Erase Suspend N/A Erase Susp N/A N/A Word Pgm busy in Erase Susp N/A Erase Susp IS in Word Pgm Busy in Ers Ers Suspend Susp Word Pgm busy in Erase Suspend iS in Word Pgm susp in Ers Susp Word Pgm susp in Ers susp N/A N/A Word Pgm busy in Erase Suspend BP Load 1 in Erase Suspend BP Load 2 in Erase Suspend if word count >0, else BP confirm BP Confirming Erase Suspend if data load in program buffer is complete, ELSE BP load 2 in Erase Suspend Erase Suspend (Error [BotchBP]) BP IS in BP BP BP Illegal State Busy Busy Busy BP Busy in in BP Busy in in Ers Susp BP Busy in Ers Susp in Ers Erase Susp Susp in Ers in Ers Ers Susp Susp Susp Susp IS in BP Busy BP Susp IS in BP Busy Erase Busy Lock/ Erase RCR/ Susp ECR IS in IS in Erase Erase Erase Erase (Er Setup Erase Erase Suspend Busy Suspend Susp Susp bits in Susp clear) Erase Susp Erase Suspend Word Pgm busy in Erase Suspend Word Word Pgm Pgm IS in Word busy IS in Word Pgm Word Pgm busy in Pgm busy in Susp in Erase Susp busy in Ers Susp Ers Susp in Ers Erase Susp Susp Illegal state(IS) in Pgm busy in Erase Suspend Suspend BP Confirm if data Ready (Error load in program buffer is [Botc complete, else BP h]) load 2 Ready (Error [Botch]) BP Susp IS in BP Susp Suspend other BP Busy BP Susp Busy Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) BP Confirm if data load in program buffer is complete, ELSE BP load 2 BP Susp Datasheet 83 OTP Setup BP Load 2 (8) BP Busy BP in Erase Suspend Blank Check (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) BP Load 1 BP Load 2 if word count >0, else BP confirm BP Confirm Word Pgm in Erase Suspend Lock/RCR/ECR Setup Setup BP Load 1 (8) IS in BP Busy Erase Read ID/Query Clear SR (5) Read Status Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Array Read (3) Current Chip State Word Pgm Setup (4,9) Command Input and Resulting Chip Next State(1) Ers Susp (Error [Botc h]) BP Confirm in Erase Suspend when count=0, ELSE BP load 2 N/A BP Busy in Ers Susp Erase Susp (Error [Botch BP]) IS in BP Busy in Erase Suspend BP Busy in Ers Susp BP Susp in Ers Susp (Er bits clear) BP Suspend BP Susp in Ers Susp BP Susp in Ers Susp IS in BP Busy in Erase Suspend Erase Susp IS in Ers Susp BP Busy in Erase Suspend IS in BP BP BP BP Suspend Illegal State Busy Susp Susp in Erase in BP Busy in in Ers in Ers in Ers Suspend Ers Susp Susp Susp Susp N/A BP Susp in Ers Susp N/A BP Susp in Ers Susp N/A in Erase Suspend Aug 2009 Order Number:320003-08 P33-65nm Table 41: Next State Table for P3x-65nm (Sheet 2 of 3) Buffer Pgm (BP) Ready (Error [Botch]) IS in BP Busy BP Busy BP Busy Illegal State in BP Busy BP Busy BP Busy IS in BP Susp Setup BP Suspend Illegal State in BP Busy Ready (Error [Botch]) IS in Erase Busy Erase Busy Erase Busy IS in Erase Busy EFI Word BP Setup Pgm Setup in Erase Setup in Erase Susp in Erase Erase Susp Susp Susp IS in Erase Susp Setup Word Pgm busy in Erase Susp Busy IS in Pgm busy in Ers Susp Word Pgm busy in Erase Susp IS in Erase Busy BP Busy Illegal State in Word Program Suspend in Erase Suspend Setup BP Load 1 (8) BP Load 2 (8) BP Confirm BP Busy BP Busy BP Suspend IS in BP Suspend BP Susp BP (Er Susp bits clear) BP Suspend Erase Busy BP Busy WSM Operation Completes Other Commands (2) BP Busy IS in BP Susp BP Suspend Ready (Error [Botch]) Erase Erase Busy Susp Erase Busy IS in Erase Busy Erase Busy N/A BP Susp N/A Ready (Err Botch0]) N/A Ers Busy N/A Ready Word iS in Pgm pgm susp susp in Ers in Ers susp Susp Word Pgm susp in Ers susp iS in pgm susp in Ers Susp Word Pgm busy in Erase Susp Word Pgm Word Word Word Pgm Pgm Susp Pgm in Ers susp susp Susp susp in Ers in Ers in Ers (Er susp susp susp bits clear) N/A N/A Ready Erase Suspend N/A Erase Susp N/A N/A Word Pgm busy in Erase Susp N/A Erase Susp IS in Word Pgm Busy in Ers Ers Suspend Susp Word Pgm busy in Erase Suspend iS in Word Pgm susp in Ers Susp Word Pgm susp in Ers susp N/A N/A Word Pgm busy in Erase Suspend BP Load 1 in Erase Suspend BP Load 2 in Erase Suspend if word count >0, else BP confirm BP Confirming Erase Suspend if data load in program buffer is complete, ELSE BP load 2 in Erase Suspend Erase Suspend (Error [BotchBP]) BP IS in BP BP BP Illegal State Busy Busy Busy BP Busy in in BP Busy in in Ers Susp BP Busy in Ers Susp in Ers Erase Susp Susp in Ers in Ers Ers Susp Susp Susp Susp IS in BP Busy BP Susp IS in BP Busy Erase Busy Lock/ Erase RCR/ Susp ECR IS in IS in Erase Erase Erase Erase (Er Setup Erase Erase Suspend Busy Suspend Susp Susp bits in Susp clear) Erase Susp Erase Suspend Word Pgm busy in Erase Suspend Word Word Pgm Pgm IS in Word busy IS in Word Pgm Word Pgm busy in Pgm busy in Susp in Erase Susp busy in Ers Susp Ers Susp in Ers Erase Susp Susp Illegal state(IS) in Pgm busy in Erase Suspend Suspend BP Confirm if data Ready (Error load in program buffer is [Botc complete, else BP h]) load 2 Ready (Error [Botch]) BP Susp IS in BP Susp Suspend other BP Busy BP Susp Busy Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) BP Confirm if data load in program buffer is complete, ELSE BP load 2 BP Susp Datasheet 84 OTP Setup BP Load 2 (8) BP Busy BP in Erase Suspend Blank Check (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) BP Load 1 BP Load 2 if word count >0, else BP confirm BP Confirm Word Pgm in Erase Suspend Lock/RCR/ECR Setup Setup BP Load 1 (8) IS in BP Busy Erase Read ID/Query Clear SR (5) Read Status Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Array Read (3) Current Chip State Word Pgm Setup (4,9) Command Input and Resulting Chip Next State(1) Ers Susp (Error [Botc h]) BP Confirm in Erase Suspend when count=0, ELSE BP load 2 N/A BP Busy in Ers Susp Erase Susp (Error [Botch BP]) IS in BP Busy in Erase Suspend BP Busy in Ers Susp BP Susp in Ers Susp (Er bits clear) BP Suspend BP Susp in Ers Susp BP Susp in Ers Susp IS in BP Busy in Erase Suspend Erase Susp IS in Ers Susp BP Busy in Erase Suspend IS in BP BP BP BP Suspend Illegal State Busy Susp Susp in Erase in BP Busy in in Ers in Ers in Ers Suspend Ers Susp Susp Susp Susp N/A BP Susp in Ers Susp N/A BP Susp in Ers Susp N/A in Erase Suspend Aug 2009 Order Number: 320003-08 P33-65nm Table 41: Next State Table for P3x-65nm (Sheet 3 of 3) EFI Setup Sub-function Setup Sub-op-code Load 1 Sub-function Load 2 Sub-function Confirm EFI in Erase Suspend Sub-function Busy Blank Check Busy Setup BEFP Busy Datasheet 85 WSM Operation Completes Other Commands (2) Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) OTP Setup Blank Check Lock/RCR/ECR Setup Read ID/Query Sub-function Confirm in Erase Suspend if data load in program buffer is complete, ELSE Sub-function Load 2 Erase Suspend (Error [Botch]) S-fn IS in Busy S-fn S-fn Busy S-fn S-fn Busy in Illegal State in Ers Susp in S-fn Busy Susp Busy in Ers in Ers in Ers Ers Suspend in Ers Susp Susp Susp Susp Ers Susp (Error [Botc h]) Sub-function Confirm if data load in program buffer is complete, ELSE Sub-function Load 2 N/A S-fn Busy in Ers Susp IS in S-fn S-fn Susp in Ers Susp in Ers Susp Susp S-fn Suspend in Ers Susp Illegal State S-fn Busy in S-fn Busy in Ers in Ers Susp Susp N/A Erase Suspend (Error [Botch]) S-fn Busy in Ers Susp IS in S-fn Busy in Ers Susp S-fn Busy in Ers Susp S-fn Suspend in Ers Susp S-fn Susp in Ers S-fn Susp Susp in Ers (Er bits Susp clear) Erase Susp IS in Ers Susp Sub-function Busy in Ers Susp IS in S-fn Susp in Ers Susp S-fn Suspend in Ers Susp N/A S-fn Susp in Ers Susp Ers Ers Susp Ers Susp Ers Susp Susp (Error Blk Blk CR [Botc LkLock Down Set h]) N/A Ers Susp (Error [Botch]) N/A Ready (Error [Botch]) N/A BC Busy Ready BEFP Busy Ready N/A Sub-Function Suspend in Erase Suspend Erase Suspend (Lock Error [Botch]) Ready (Error [Botch]) BC Busy IS in BC Busy BC Busy IS in BC Busy IS in Blank Check Busy BEFP Clear SR (5) Sub-op-code Load 1 in Erase Suspend Setup Blank Check other Sub-function Load 2 in Erase Suspend if word count >0, else Sub-function confirm in Erase Suspend IS in Phase-1 Susp Lock/RCR/ECR/Lock EFA Block Setup in Erase Suspend Read Status (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) Sub-function Setup in Erase Suspend IS in Subfunction Busy Sub-function Susp Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Array Read (3) Current Chip State Word Pgm Setup (4,9) Command Input and Resulting Chip Next State(1) Ers Susp (Unlock Block ) BC Busy Ers Susp (Lock Error [Botch]) Ready (Error [Botch]) Blank Check Busy IS in BC Busy BC Busy N/A BP Busy BEFP Load Ready (Error [Botch]) Data BEFP Program and Verify Busy (if Block Address given matches address given on BEFP Setup command). Commands Ready treated as data. (7) Ready (Error [Botch]) N/A Aug 2009 Order Number:320003-08 P33-65nm Table 42: Output Next State Table for P3x-65nm Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. Other Commands (2) Status Read Status Read Status Read ID/Query Read Array Read Status Read Status Read Output MUX Does not Change Status Read Status Read Output MUX doesn’t Change Status Read Output MUX will not change Output MUX does not Change Output MUX does not Change Array Read Status Read Array Read Ready, Word Pgm Suspend, BP Suspend, Phase-1 BP Suspend, Erase Suspend, BP Suspend in Erase Suspend Phase-1 BP Susp in Ers Susp other WSM Operation Completes (90h, (03h, (FFh) (40h) (E8h) (EBh) (20h) (80h) (D0h) (B0) (70h) (50h) 98h) (60h) (BCh) (C0h) (01h) (2Fh) 04h) BEFP Setup, BEFP Pgm & Verify Busy, Erase Setup, OTP Setup, BP Setup, Load 1, Load 2 BP Setup, Load1, Load 2 - in Erase Susp. BP Confirm EFI Sub-function Confirm WordPgmSetup, Word Pgm Setup in Erase Susp, BP Confirm in Erase Suspend, EFI S-fn Confirm in Ers Susp, Blank Check Setup, Blank Check Busy Lock/RCR/ECR Setup, Lock/RCR/ECR Setup in Erase Susp EFI S-fn Setup, Ld 1, Ld 2 EFI S-fn Setup, Ld1, Ld 2 - in Erase Susp. BP Busy BP Busy in Erase Suspend EFI Sub-function Busy EFI Sub-fn Busy in Ers Susp Word Program Busy, Word Pgm Busy in Erase Suspend, OTP Busy Erase Busy Block Address Change Write ECR/RCR Confirm (7) Lock-down Blk Confirm (7) Lock Blk Confirm (7) OTP Setup Blank Check Lock/RCR/ECR Setup Read ID/Query Clear SR (5) Read Status Pgm/Ers Suspend Confirm (7) BEFP Setup (6) Erase Setup (4,9) EFI Command Setup BP Setup (8) Word Pgm Setup (4,9) Current Chip State Array Read (3) Command Input to Chip and Resulting Output MUX Next State(1) IS refers to Illegal State in the Next State Table. “Illegal commands” include commands outside of the allowed command set. The device defaults to "Read Array" on powerup. If a “Read Array” is attempted when the device is busy, the result will be “garbage” data (we should not tell the user that it will actually be Status Register data). The key point is that the output mux will be pointing to the “array”, but garbage data will be output. “Read ID” and "Read Query" commands do the exact same thing in the device. The ID and Query data are located at different locations in the address map. The Clear Status command only clears the error bits in the status register if the device is not in the following modes:1. WSM running (Pgm Busy, Erase Busy, Pgm Busy In Erase Suspend, OTP Busy, BEFP modes) 2. Suspend states (Erase Suspend, Pgm Suspend, Pgm Suspend In Erase Suspend). BEFP writes are only allowed when the status register bit #0 = 0 or else the data is ignored. Confirm commands (Lock Block, Unlock Block, Lock-Down Block, Configuration Register and Blank Check) perform the operation and then move to the Ready State. Buffered programming will botch when a different block address (as compared to the address given on the first data write cycle) is written during the BP Load1 and BP Load2 states. All two cycle commands will be considered as a contiguous whole during device suspend states. Individual commands will not be parsed separately. (I.e. If an erase set-up command is issued followed by a D0h command, the D0h command will not resume the program operation. Issuing the erase set-up places the CUI in an “illegal state”. A subsequent command will clear the “illegal state”, but the command will be otherwise ignored. Datasheet 86 Aug 2009 Order Number: 320003-08 P33-65nm Appendix B Conventions - Additional Documentation B.1 BEFP: Acronyms Buffered Enhanced Factory Programming CUI : Command User Interface MLC : Multi-Level Cell OTP : One-Time Programmable PLR : one-time programmable Lock Register PR : one-time programmable Register RCR : Read Configuration Register RFU : Reserved for Future Use SR : Status Register SRD Status Register Data WSM Write State Machine B.2 VCC : Definitions and Terms Signal or voltage connection VCC : Signal or voltage level h: Hexadecimal number suffix 0b : Binary number prefix 0x : hexadecimal number prefix SR.4 : Denotes an individual register bit. A[15:0] : Denotes a group of similarly named signals, such as address or data bus. A5 : Denotes one element of a signal group membership, such as an individual address bit. Bit : Single Binary unit Byte : Eight bits Word : Two bytes, or sixteen bits Kbit : 1024 bits KByte : 1024 bytes KWord : 1024 words Mbit : 1,048,576 bits MByte : 1,048,576 bytes MWord : 1,048,576 words K 1,000 M 1,000,000 3.0 V : VCC (core) and VCCQ (I/O) voltage range of 2.3 V – 3.6 V 9.0 V : VPP voltage range of 8.5 V – 9.5 V Block : A group of bits, bytes, or words within the flash memory array that erase simultaneously. The P33-65nm has two block sizes: 32 KByte and 128 KByte. Datasheet 87 Aug 2009 Order Number:320003-08 P33-65nm Main block : An array block that is usually used to store code and/or data. Main blocks are larger than parameter blocks. Parameter block : An array block that may be used to store frequently changing data or small system parameters that traditionally would be stored in EEPROM. Top parameter device : A device with its parameter blocks located at the highest physical address of its memory map. Bottom parameter device : A device with its parameter blocks located at the lowest physical address of its memory map. Datasheet 88 Aug 2009 Order Number: 320003-08 P33-65nm Appendix C Revision History Date Revision Description May 2008 01 Initial release June 2008 02 Corrected SCSP order information July 2008 03 Added W28 AC specification; Fixed Buffered Program Command error in figure 38; Updated block locking state diagram; Updated Address range in Memory Map figure; Changed LSB Address from A0 to A1 in figure7 under dual die configurations section; Changed LSB Address in ballout and pinout description from A0 back to A1 to match P33 130nm. Sep 2008 04 Updated AxcellTM trademark; Remove 64M related content; Nov 2008 05 Update the Buffer program flowchart to reflect the read status register; minor wording modification; Return to StrataFlash; Update the buffer program comments for cross 512-Word boundary; Remove 128M related contents from this document; Correct A24 to A25 for virtual CE description in section 1.3; Remove Numonyx Confidential; Dec 2008 06 Read” on page 21. Correct Page buffer address bits to Four on Correct VHH to VPPH on Section 7.1, “Asynchronous Page-Mode Table 19, “DC Current Characteristics” on page 46 note. Figure 1, “P33-65nm Memory Map” on Add 512 Mbit (256/256) memory map in page 7 Apr 2009 07 Correct RCR.4, RCR.5, RCR.7 and RCR.9 definitions in Register Description” on page 34 Table 11, “Read Configuration Correct A0 to A1 signal naming and remove invalid x8 information in Query Structure Output of x16 Devices” on page 62 Aug 2009 Datasheet 89 08 Table 29, “Example of Update the Block lock Operations, Program Suspend/Resume, Erase Suspend/Resume flowcharts in Figure 36, Figure 37, Figure 37, backward compatible with 130nm. Align the sequence error description in Table 11. Add TSOP 40Mhz Burst Spec, fCLK, tCLK, tCHQV, tCHTV. Add note 7 in buffer program flowchart Figure 33. Update VIL undershoot and overshoot of Note 2 in Table 20. Update CFI 0x2A data in Section A.1, “Common Flash Interface” . Aug 2009 Order Number:320003-08 P33-65nm Datasheet 90 Aug 2009 Order Number: 320003-08