M35080
8 Kbit Serial SPI Bus EEPROM
With Incremental Registers
PRELIMINARY DATA
■
Compatible with SPI Bus Serial Interface
(Positive Clock SPI Modes)
■
Single Supply Voltage: 4.5 V to 5.5 V
■
5 MHz Clock Rate (maximum)
■
Sixteen 16-bit Incremental Registers
■
BYTE and PAGE WRITE (up to 32 Bytes)
(except for the Incremental Registers)
■
Self-Timed Programming Cycle
■
Hardware Protection of the Status Register
■
Resizeable Read-Only EEPROM Area
■
Enhanced ESD Protection
■
1 Million Erase/Write Cycles (minimum)
■
40 Year Data Retention (minimum)
DESCRIPTION
The M35080 device consists of 1024x8 bits of low
power
EEPROM,
fabricated
with
STMicroelectronics’ proprietary High Endurance
Double Polysilicon CMOS technology.
The device is accessed by a simple SPI-compatible serial interface. The bus signals consist of a
serial clock input (C), a serial data input (D) and a
serial data output (Q), as shown in Table 1.
The device is selected when the chip select input
(S) is held low. Data is clocked in during the low to
high transition of the clock, C. Data is clocked out
during the high to low transition of the clock.
Table 1. Signal Names
C
Serial Clock
8
1
PSDIP8 (BN)
0.25 mm frame
8
1
SO8 (MN)
150 mil width
Figure 1. Logic Diagram
VCC
D
Q
C
M35080
S
D
Serial Data Input
Q
Serial Data Output
S
Chip Select
W
Write Protect
VCC
Supply Voltage
VSS
Ground
W
VSS
AI02143
June 1999
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/18
M35080
Figure 2. DIP and SO Connections
M35080
VSS
S
W
Q
1
2
3
4
8
7
6
5
VCC
D
C
NC
AI02144B
Note: 1. NC = Not Connected.
The memory is organized in pages of 32 bytes.
However, the first page is not treated in the same
way as the others. Instead, it is considered to consist of sixteen 16-bit incremental registers. Each
register can be modified using the conventional
write instructions, but the new value will only be
accepted if it is greater than the current value.
Thus, each register is restricted to being modified
monotonically upwards.
This is useful in applications where it is necessary
to implement a counter that is protected from
fraudulent tampering (such as in a car odometer,
an electricity meter, or a tally for remaining credit).
SIGNAL DESCRIPTION
Serial Output (Q)
The output pin is used to transfer data serially out
of the Memory. Data is shifted out on the falling
edge of the serial clock.
Serial Input (D)
The input pin is used to transfer data serially into
the device. Instructions, addresses, and the data
to be written, are each received this way. Input is
latched on the rising edge of the serial clock.
Serial Clock (C)
The serial clock provides the timing for the serial
interface (as shown in Figure 3). Instructions, addresses, or data are latched, from the input pin, on
the rising edge of the clock input. The output data
on the Q pin changes state after the falling edge of
the clock input.
Chip Select (S)
When S is high, the memory device is deselected,
and the Q output pin is held in its high impedance
state. Unless an internal write operation is underway, the memory device is placed in its stand-by
power mode.
After power-on, a high-to-low transition on S is required prior to the start of any operation.
Write Protect (W)
The protection features of the memory device are
summarized in Table 3.
The hardware write protection, controlled by the W
pin, restricts write access to the Status Register
Table 2. Absolute Maximum Ratings 1
Symbol
Value
Unit
Ambient Operating Temperature
-40 to 125
°C
TSTG
Storage Temperature
-65 to 150
°C
TLEAD
Lead Temperature during Soldering
260
215
°C
-0.3 to VCC+0.6
V
TA
Parameter
PSDIP8: 10 sec
SO8: 40 sec
VO
Output Voltage Range
VI
Input Voltage Range
-0.3 to 6.5
V
Supply Voltage Range
-0.3 to 6.5
V
Electrostatic Discharge Voltage (Human Body model) 2
4000
V
Electrostatic Discharge Voltage (Machine model) 3
400
V
VCC
VESD
Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum
Rating conditions for extended periods may affect device reliability. Refer also to the ST SURE Program and
other relevant quality documents.
2. MIL-STD-883C, 3015.7 (100pF, 1500W).
3. EIAJ IC-121 (Condition C) (200pF, 0W).
2/18
M35080
Table 3. Write Protection Control
SRWD
Bit
W
0 or 1
0
1
1
0
1
Data Bytes
Mode
Status Register
Protected Area
Unprotected Area
Software
Protected
(SPM)
Writeable (if the WREN
instruction has set the
WEL bit)
Software write protected
by the BP0 and BP1 bits
of the status register
Writeable (if the WREN
instruction has set the
WEL bit)
Hardware
Protected
(HPM)
Hardware write protected
Hardware write protected
by the BP0 and BP1 bits
of the status register
Writeable (if the WREN
instruction has set the
WEL bit)
(though not to the WIP and WEL bits, which are
set or reset by the device’s internal logic).
Bit 7 of the status register (as shown in Table 4) is
the Status Register Write Disable bit (SRWD).
When this is set to 0 (its initial delivery state) it is
possible to write to the status register if the WEL
bit (Write Enable Latch) has been set by the
WREN instruction (irrespective of the level being
applied to the W input).
When bit 7 (SRWD) of the status register is set to
1, the ability to write to the status register depends
on the logic level being presented at pin W:
– If W pin is high, it is possible to write to the status register, after having set the WEL bit using
the WREN instruction (Write Enable Latch).
– If W pin is low, any attempt to modify the status
register is ignored by the device, even if the
WEL bit has been set. As a consequence, all the
data bytes in the EEPROM area, protected by
the BP1 and BP0 bits of the status register, are
also hardware protected against data corruption, and appear as a Read Only EEPROM area
for the microcontroller. This mode is called the
Hardware Protected Mode (HPM).
It is possible to enter the Hardware Protected
Mode (HPM) either by setting the SRWD bit after
pulling low the W pin, or by pulling low the W pin
after setting the SRWD bit.
The only way to abort the Hardware Protected
Mode, once entered, is to pull high the W pin.
If W pin is permanently tied to the high level, the
Hardware Protected Mode is never activated, and
the memory device only allows the user to protect
a part of the memory, using the BP1 and BP0 bits
of the status register, in the Software Protected
Mode (SPM).
IMPORTANT: if W pin is left floating, not driven by
the application, W is read as a logical ’0’.
Table 4. Status Register Format
b7
SRWD
b0
UV
X
INC
BP1
BP0
WEL
WIP
Note: 1. BP0, BP1: Read and write bits
2. UV, INC, WEL, WIP: Read only bits.
3. SRWD: Read and Write bit.
Figure 3. Data and Clock Timing
CPOL
CPHA
0
0
C
1
1
C
D or Q
MSB
LSB
AI01438
3/18
M35080
Figure 4. EEPROM and SPI Bus
SPI Interface with
(CPOL, CPHA) =
('0', '0') or ('1', '1')
D
Q
Master
(ST6, ST7, ST9,
ST10, Others)
CS3
CS2
CS1
C
C Q D
C Q D
C Q D
M35xxx
M35xxx
M35xxx
S
S
S
AI02148C
OPERATIONS
All instructions, addresses and data are shifted serially in and out of the chip (along the bus, as
shown in Figure 4). The most significant bit is presented first, with the data input (D) sampled on the
first rising edge of the clock (C) after the chip select (S) goes low (as shown in Figure 5, Figure 9,
and Figure 12).
Every instruction, as summarized in Table 5, starts
with a single-byte code. If an invalid instruction is
sent (one not contained in Table 5), the chip automatically deselects itself.
The instruction code is entered via the data input
(D), and latched on the rising edge of the clock input (C). To enter an instruction code, the device
must have been previously selected (S held low).
Protection of the First 32 Bytes
The first 32-byte page is organized as 16 words
(two bytes each). The initial content of each word
on this page is 0000h. When writing to byte-pair, a
logic comparator verifies that the new two-byte
value is larger than the value currently stored. If
the new value is smaller than the current one, no
operation is performed. It is impossible to write a
value lower than the previous one, irrespective of
the state of W pin and status register, as indicated
in Table 6.
Write Enable (WREN) and Write Disable (WRDI)
The write enable latch, inside the memory device,
must be set prior to each WRITE and WRSR operation. The WREN instruction (write enable) sets
this latch, and the WRDI instruction (write disable)
resets it.
Table 5. Instruction Set
Instruction
4/18
Description
Instruction Format
WREN
Set Write Enable Latch
0000 0110
WRDI
Reset Write Enable Latch
0000 0100
RDSR
Read Status Register
0000 0101
WRSR
Write Status Register
0000 0001
READ
Read Data from Memory Array
0000 0011
WRITE
Write Data to Memory Array
0000 0010
WRINC
Write Data to Secure Array
0000 0111
M35080
Figure 5. Read EEPROM Array Operation Sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30
C
INSTRUCTION
16 BIT ADDRESS
15 14 13
D
3
2
1
0
DATA OUT
HIGH IMPEDANCE
7
Q
6
5
4
3
2
1
0
MSB
AI01793
Note: 1. The most significant address bits, A15-A10, are treated as Don’t Care.
The latch becomes reset by any of the following
events:
– Power on
– WRDI instruction completion
– WRSR instruction completion
– WRITE instruction completion.
As soon as the WREN or WRDI instruction is received, the memory device first executes the instruction, then enters a wait mode until the device
is deselected.
Read Status Register (RDSR)
The RDSR instruction allows the status register to
be read, and can be sent at any time, even during
a Write operation. Indeed, when a Write is in
progress, it is recommended that the value of the
Write-In-Progress (WIP) bit be checked. The value
in the WIP bit (whose position in the status register
is shown in Table 4) can be continuously polled,
before sending a new WRITE instruction. This can
be performed in one of two ways:
■ Repeated RDSR instructions (each one
consisting of S being taken low, C being clocked
8 times for the instruction and 8 times for the
read operation, and S being taken high)
■
A single, prolonged RDSR instruction
(consisting of S being taken low, C being
clocked 8 times for the instruction and kept
running for repeated read operations), as
shown in Figure 6.
The Write-In-Process (WIP) bit is read-only, and
indicates whether the memory is busy with a Write
operation. A ’1’ indicates that a write is in progress,
and a ’0’ that no write is in progress.
The Write Enable Latch (WEL) bit indicates the
status of the write enable latch. It, too, is read-only.
Its value can only be changed by one of the events
listed earlier, or as a result of executing WREN or
WRDI instruction. It cannot be changed using a
WRSR instruction. A ’1’ indicates that the latch is
set (the forthcoming Write instruction will be executed), and a ’0’ that it is reset (and any forthcoming Write instructions will be ignored).
The Block Protect (BP0 and BP1) bits indicate the
amount of the memory that is to be write-protected. These two bits are non-volatile. They are set
using a WRSR instruction.
During a Write operation (whether it be to the
memory area or to the status register), all bits of
the status register remain valid, and can be read
using the RDSR instruction. However, during a
Write operation, the values of the non-volatile bits
Table 6. Memory Mapping
Address
Protection
000h-01Fh
Incremental area: a word (2 bytes) can be written only if the new value to write is larger
than the value already stored
020h-3FFh
No specific protection except the one as of Table 7
5/18
M35080
Figure 6. RDSR: Read Status Register Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
INSTRUCTION
D
STATUS REG. OUT
STATUS REG. OUT
HIGH IMPEDANCE
Q
7
6
5
4
3
2
1
0
MSB
7
6
5
4
3
2
MSB
1
0
7
MSB
AI02031
the 16 th clock pulse, and before the rising edge of
the 17th clock (as indicated in Figure 7), otherwise
the internal write sequence is not performed.
The WRSR instruction is used for the following:
■ to select the size of memory area that is to be
write-protected
(SRWD, BP0, BP1) become frozen at a constant
value. The updated value of these bits becomes
available when a new RDSR instruction is executed, after completion of the write cycle. On the other hand, the two read-only bits (WEL, WIP) are
dynamically updated during internal write cycles.
Using this facility, it is possible to poll the WIP bit
to detect the end of the internal write cycle.
The Comparator bit (INC) indicates if the new value written in the 16 first word is lower ‘1’ or higher
‘0’ than the previous stored value.
The UV bit indicates if the memory chip has been
erased.
Write Status Register (WRSR)
The format of the WRSR instruction is shown in
Figure 7. After the instruction and the eight bits of
the status register have been latched-in, the internal Write cycle is triggered by the rising edge of
the S line. This must occur after the falling edge of
■
to select between SPM (Software Protected
Mode) and HPM (Hardware Protected Mode).
The size of the write-protection area applies equally in SPM and HPM. The BP1 and BP0 bits of the
status register have the appropriate value (see Table 7) written into them after the contents of the
protected area of the EEPROM have been written.
The initial delivery state of the BP1 and BP0 bits is
00, indicating a write-protection size of 0.
Figure 7. WRSR: Write Status Register Sequence
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
C
INSTRUCTION
STATUS REG.
7
D
6
5
4
3
2
1
0
MSB
HIGH IMPEDANCE
Q
AI01797
6/18
M35080
Table 7. Write Protected Block Size
Status Register Bits
Array Addresses Protected
Protected Block
BP1
BP0
M35080
0
0
none 1
none 1
0
1
Upper quarter
0300h - 03FFh
1
0
Upper half
0200h - 03FFh
Note: 1. Except for the first sixteen pairs of bytes (see Table 6).
Software Protected Mode (SPM)
The act of writing a non-zero value to the BP1 and
BP0 bits causes the Software Protected Mode
(SPM) to be started. All attempts to write a byte or
page in the protected area are ignored, even if the
Write Enable Latch is set. However, writing is still
allowed in the unprotected area of the memory array and to the SRWD, BP1 and BP0 bits of the status register, provided that the WEL bit is first set.
Hardware Protected Mode (HPM)
The Hardware Protected Mode (HPM) offers a
higher level of protection, and can be selected by
setting the SRWD bit after pulling down the W pin
or by pulling down the W pin after setting the
SRWD bit. The SRWD is set by the WSR instruction, provided that the WEL bit is first set. The setting of the SRWD bit can be made independently
of, or at the same time as, writing a new value to
the BP1 and BP0 bits.
Once the device is in the Hardware Protected
Mode, the data bytes in the protected area of the
memory array, and the content of the status register, are write-protected. The only way to re-enable
writing new values to the status register is to pull
the W pin high. This cause the device to leave the
Hardware Protected Mode, and to revert to being
in the Software Protected Mode. (The value in the
BP1 and BP0 bits will not have been changed).
Further details of the operation of the Write Protect
pin (W) are given earlier, on page 2.
Typical Use of HPM and SPM
The W pin can be dynamically driven by an output
port of a microcontroller. It is also possible,
though, to connect it permanently to V SS (by a solder connection, or through a pull-down resistor).
The manufacturer of such a printed circuit board
can take the memory device, still in its initial delivery state, and can solder it directly on to the board.
After power on, the microcontroller can be instructed to write the protected data into the appropriate
area of the memory. When it has finished, the appropriate values are written to the BP1, BP0 and
SRWD bits, thereby putting the device in the hardware protected mode.
An alternative method is to write the protected data, and to set the BP1, BP0 and SRWD bits, before
soldering the memory device to the board. Again,
this results in the memory device being placed in
its hardware protected mode.
If the W pin has been connected to V SS by a pulldown resistor, the memory device can be taken
out of the hardware protected mode by driving the
W pin high, to override the pull-down resistor.
If the W pin has been directly soldered to V SS,
there is only one way of taking the memory device
out of the hardware protected mode: the memory
device must be de-soldered from the board, and
connected to external equipment in which the W
pin is allowed to be taken high.
Read Operation
The chip is first selected by holding S low. The serial one byte read instruction is followed by a two
byte address (A15-A0), each bit being latched-in
during the rising edge of the clock (C). The data
stored in the memory, at the selected address, is
shifted out on the Q output pin. Each bit is shifted
out during the falling edge of the clock (C) as
shown in Figure 5.
The internal address counter is automatically incremented to the next higher address after each
byte of data has been shifted out. The data stored
in the memory, at the next address, can be read by
successive clock pulses. When the highest address is reached, the address counter rolls over to
“0000h”, allowing the read cycle to be continued
indefinitely. The read operation is terminated by
deselecting the chip. The chip can be deselected
at any time during data output. If a read instruction
is received during a write cycle, it is rejected, and
the memory device deselects itself.
Byte Write Operation
Before any write can take place, the WEL bit must
be set, using the WREN instruction, as shown in
Figure 8. The write state is entered by selecting
the chip, issuing three bytes of instruction and address, and one byte of data. Chip Select (S) must
remain low throughout the operation, as shown in
Figure 9. The device must be deselected just after
the eighth bit of the data byte has been latched in,
7/18
M35080
Figure 8. Write Enable Latch Sequence
S
0
1
2
3
4
5
6
7
C
D
HIGH IMPEDANCE
Q
AI01794
as shown in Figure 9, otherwise the write process
is cancelled. As soon as the memory device is deselected, the self-timed internal write cycle is initiated. While the write is in progress, the status
register may be read to check the status of the SRWD, BP1, BP0, WEL and WIP bits. In particular,
WIP contains a ‘1’ during the self-timed write cycle, and a ‘0’ when the cycle is complete, (at which
point the write enable latch is also reset).
Write Data In the Incremental Registers
Due to the special control on the first page of the
memory, the byte write operation is not usable on
the first 32 bytes. Instead, the WRINC instruction
must be used, the timing of which is shown in Figure 10.
Prior to any write attempt, the write enable latch
must be set by issuing the WREN instruction. First
the device is selected (by taking S low) and a serial WREN instruction is issued. Then the device is
deselected, by taking S high for at least t SHSL. The
device sets the write enable latch, and remains in
its stand-by state, until it is deselected. Then the
write state is entered by selecting the chip, by taking S low. The WRINC instruction is issued, and
the address is sent (always an even address, with
A0=0) along with two bytes of data. The Chip Select input (S) must remain low for the entire duration of the operation.
The device must be deselected just after the
eighth bit of the second data byte has been
latched in. Otherwise, the write process is cancelled. As a further protection, the WRINC instruction is cancelled if its duration is not exactly equal
to 40 clock pulses.
As soon as the device is deselected, the self-timed
write cycle is initiated. While the write is in
progress, the status register may be read, to check
the values of the UV, INC, BP1, BP0, WEL and
Figure 9. Byte Write Operation Sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
INSTRUCTION
16 BIT ADDRESS
15 14 13
D
3
2
1
DATA BYTE
0
7
6
5
4
3
2
1
0
HIGH IMPEDANCE
Q
AI01795
Note: 1. The most significant address bits, A15-A10, are treated as Don’t Care.
8/18
M35080
Figure 10. Write Data to Incremental Registers (WRINC)
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
INSTRUCTION
16 BIT ADDRESS
15 14 13
D
3
2
1
DATA BYTE 1
0
7
6
5
4
3
2
1
0
S
32 33 34 35 36 37 38 39
C
DATA BYTE 2
D
7
6
5
4
3
2
1
0
AI02146B
Note: 1. The most significant address bits, A15-A10, are treated as Don’t Care.
WIP bits. WIP is high during the self-timed write
cycle. When the cycle is completed, the write enable latch is reset.
Page Write Operation
A maximum of 32 bytes of data can be written during one Write time, tW, provided that they are all to
the same page (see Figure 11). The Page Write
operation is the same as the Byte Write operation,
except that instead of deselecting the device after
the first byte of data, up to 31 additional bytes can
be shifted in (and the device is deselected after the
last byte).
Any address of the memory can be chosen as the
first address to be written. If the address counter
reaches the end of the page (an address of the
form xxxx xxxx xxx1 1111) and the clock continues, the counter rolls over to the first address of
the same page (xxxx xxxx xxx0 0000) and overwrites any previously written data.
As before, the Write cycle only starts if the S transition occurs just after the eighth bit of the last data
byte has been received, as shown in Figure 12.
correctly formulated commands. The main security measures can be summarized as follows:
– The WEL bit is reset at power-up.
– S must rise after the eighth clock count (or multiple thereof) in order to start a non-volatile write
cycle (in the memory array or in the status register).
– Accesses to the memory array are ignored during the non-volatile programming cycle, and the
programming cycle continues unaffected.
– After execution of a WREN, WRDI, or RDSR instruction, the device enters a wait state, and
waits to be deselected.
– Invalid S transitions are ignored.
DATA PROTECTION AND PROTOCOL SAFETY
To protect the data in the memory from inadvertent
corruption, the memory device only responds to
9/18
M35080
Figure 11. Block Diagram
W
S
High Voltage
Generator
Control Logic
C
D
I/O Shift Register
Q
Address Register
and Counter
Data Register
& Comparators
Status
Register
An
Size of the
Read only
EEPROM
area
Y Decoder
An - 31
32 Bytes
0000h
Incremental Register
001Fh
X Decoder
AI02145C
Note: 1. An is the top address of the memory.
10/18
M35080
Figure 12. Page Write Operation Sequence
S
0
1
2
3
4
5
6
7
8
9 10
20 21 22 23 24 25 26 27 28 29 30 31
C
INSTRUCTION
16 BIT ADDRESS
15 14 13
D
3
2
DATA BYTE 1
1
0
7
6
5
4
3
2
0
1
S
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
C
DATA BYTE 2
D
7
6
5
4
3
2
DATA BYTE 3
1
0
7
6
5
4
3
2
DATA BYTE N
1
0
6
5
4
3
2
1
0
AI01796
Note: 1. The most significant address bits, A15-A10, are treated as Don’t Care.
2. The number of clock pulses must be a multiple of 8. Otherwise, the write is aborted.
POWER ON STATE
After power-on, the memory device is in the following state:
– low power stand-by state
– deselected (after power-on, a high-to-low transition is required on the S input before any operations can be started).
– the WEL bit is reset
– the SRWD, BP1 and BP0 bits of the status register are unchanged from the previous powerdown (they are non-volatile bits).
Table 8. Initial Status Register Format
b7
0
b0
0
0
1
0
0
0
0
INITIAL DELIVERY STATE
The device is delivered with the memory array in a
fully erased state. With the exception of the first 32
bytes, all data bits are set to ‘1’, and hence all data
bytes are at FFh. The first 32 bytes are set to all
‘0’s, and hence the first 16 words at 0000h.
The status register bits are initialized to ‘0’, except
for bit b4, which is set to ‘1’, as shown in Table 8.
11/18
M35080
Table 9. DC Characteristics
(TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 4.5V to 5.5V)
Symbol
Parameter
Test Condition
Min
Max
Unit
ILI
Input Leakage Current
±2
µA
ILO
Output Leakage Current
±2
µA
C = 0.1 VCC/0.9 VCC, @ 5 MHz,
VCC = 5V, Q = Open
3
mA
C = 0.1 VCC/0.9 VCC, @ 2 MHz,
VCC = 5V, Q = Open, Note 2
3
mA
S = VCC, VIN = VSS or VCC, VCC = 5V
10
µA
S = VCC, VIN = VSS or VCC, VCC = 5V,
Note 2
20
µA
ICC
ICC1
Supply Current
Standby Current
VIL
Input Low Voltage
–0.3
0.3 VCC
V
VIH
Input High Voltage
0.7 VCC
VCC + 1
V
IOL = 2mA, VCC = 5V
0.4
V
VOL 1
Output Low Voltage
IOL = 2mA, VCC = 5V, Note 2
0.4
V
VOH 1
Output High Voltage
IOH = –2mA, VCC = 5V
0.8 VCC
V
IOH = –2mA, VCC = 5V, Note 2
0.8 VCC
V
Note: 1. The device meets output requirements for both TTL and CMOS standards.
2. Test performed at –40 to 125°C temperature range, Grade 3.
Table 10. Input Parameters 1
(TA = 25 C, f = 5 MHz)
Symbol
Parameter
Min
Max
Unit
CIN
Input Capacitance (D)
8
pF
CIN
Input Capacitance (other pins)
6
pF
tLPF
Input Signal Pulse Width Filtered Out
10
ns
Note: 1. Sampled only, not 100% tested.
Table 11. AC Measurement Conditions
Input Rise and Fall Times
≤ 50ns
Input Pulse Voltages
0.2VCC to 0.8VCC
Input and Output Timing
Reference Voltages
0.3VCC to 0.7VCC
Output Load
CL = 100pF
Figure 13. AC Testing Input Output
0.8VCC
0.2VCC
0.7VCC
0.3VCC
AI00825
Note: 1. Output Hi-Z is defined as the point where data is no longer driven.
12/18
M35080
Table 12. AC Characteristics
M35080
Symbol
Alt.
fC
fC
tSLCH
tCSS
tCHSL
Parameter
VCC = 4.5V to 5.5V,
TA = 0 to 70°C,
TA = –40 to 85°C
VCC = 4.5V to 5.5V,
TA = –40 to 125°C
Unit
Min
Max
Min
Max
Clock Frequency
D.C.
5
D.C.
2.1
S Active Setup Time
100
100
ns
S Not Active Hold Time
100
100
ns
MHz
tCH (1)
tCLH
Clock High Time
60
200
ns
tCL (1)
tCLL
Clock Low Time
80
200
ns
tCLCH
tRC
Clock Rise Time
1
1
µs
tCHCL
tFC
Clock Fall Time
1
1
µs
tDVCH
tDSU
Data In Setup Time
20
50
ns
tCHDX
tDH
Data In Hold Time
30
60
ns
tDLDH
tRI
Data In Rise Time
1
1
µs
tDHDL
tFI
Data In Fall Time
1
1
µs
tCHSH
S Active Hold Time
200
200
ns
tSHCH
S Not Active Setup Time
100
100
ns
200
200
ns
tSHSL
tCSH
S Deselect Time
tSHQZ
tDIS
Output Disable Time
100
150
ns
tCLQV
tV
Clock Low to Output Valid
60
300
ns
tCLQX
tHO
Output Hold Time
tQLQH (2)
tRO
Output Rise Time
100
100
ns
tQHQL (2)
tFO
Output Fall Time
100
100
ns
tW
tWP
Write Cycle Time
10
10
ms
0
0
ns
Note: 1. tCH + tCL ≥1/fc
2. Value guaranteed by characterization, not 100% tested in production.
13/18
M35080
Figure 14. Serial Input Timing
tSHSL
S
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
tCLCH
LSB IN
MSB IN
D
HIGH IMPEDANCE
Q
tDLDH
tDHDL
AI01447
Figure 15. Output Timing
S
tCH
C
tCLQV
tCL
tSHQZ
tCLQX
LSB OUT
Q
tQLQH
tQHQL
D
ADDR.LSB IN
AI01449B
14/18
M35080
ORDERING INFORMATION
The notation used for the device number is as
shown in Table 13. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact the ST
Sales Office nearest to you.
Table 13. Ordering Information Scheme
Example:
M35080
–
MN
6
T
Package
BN
PSDIP8 (0.25 mm frame)
MN
SO8 (150 mil width)
Temperature Range
6
–40 °C to 85 °C
3
–40 °C to 125 °C
Option
T
Tape and Reel Packing
15/18
M35080
Table 14. PSDIP8 - 8 pin Plastic Skinny DIP, 0.25mm lead frame
mm
inches
Symb.
Typ.
Min.
Max.
A
3.90
A1
Min.
Max.
5.90
0.154
0.232
0.49
–
0.019
–
A2
3.30
5.30
0.130
0.209
B
0.36
0.56
0.014
0.022
B1
1.15
1.65
0.045
0.065
C
0.20
0.36
0.008
0.014
D
9.20
9.90
0.362
0.390
–
–
–
–
6.00
6.70
0.236
0.264
–
–
–
–
7.80
–
0.307
–
E
7.62
E1
e1
2.54
eA
eB
Typ.
0.300
0.100
10.00
L
3.00
N
8
0.394
3.80
0.118
8
Figure 16. PSDIP8 (BN)
A2
A1
B
A
L
e1
eA
eB
B1
D
C
N
E1
E
1
PSDIP-a
Note: 1. Drawing is not to scale.
16/18
0.150
M35080
Table 15. SO8 - 8 lead Plastic Small Outline, 150 mils body width
mm
inches
Symb.
Typ.
Min.
Max.
A
1.35
A1
Min.
Max.
1.75
0.053
0.069
0.10
0.25
0.004
0.010
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
–
–
–
–
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
0.90
0.016
0.035
α
0°
8°
0°
8°
N
8
e
1.27
Typ.
0.050
8
CP
0.10
0.004
Figure 17. SO8 narrow (MN)
h x 45˚
A
C
B
CP
e
D
N
E
H
1
A1
α
L
SO-a
Note: 1. Drawing is not to scale.
17/18
M35080
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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18/18