M48Z512A M48Z512AY, M48Z512AV 4 Mbit (512 Kbit x 8) ZEROPOWER® SRAM Features ■ Integrated, ultra low power SRAM, power-fail control circuit, and battery ■ Conventional SRAM operation; unlimited WRITE cycles ■ 10 years of data retention in the absence of power ■ Automatic power-fail chip deselect and WRITE protection ■ Two WRITE protect voltages: (VPFD = power-fail deselect voltage) – M48Z512A: VCC = 4.75 to 5.5 V, 4.5 V ≤ VPFD ≤ 4.75 V – M48Z512AY: VCC = 4.5 to 5.5 V, 4.2 V ≤ VPFD ≤ 4.5 V – M48Z512AV: VCC = 3.0 to 3.6 V, 2.8 V ≤ VPFD ≤ 3.0 V M48Z512AV not for new design (see M48Z512BV). Contact ST sales office for availability. ■ Battery internally isolated until power is applied ■ Pin and function compatible with JEDEC standard 512 K x 8 SRAMs ■ PMDIP32 is an ECOPACK® package ■ RoHS compliant – Lead-free second level interconnect August 2010 32 1 PMDIP32 module (PM) Description The M48Z512A/Y/V ZEROPOWER® RAM is a non-volatile, 4,194,304-bit static RAM organized as 524,288 words by 8 bits. The devices combine an internal lithium battery, a CMOS SRAM and a control circuit in a plastic, 32-pin DIP Module. Doc ID 5146 Rev 8 1/21 www.st.com 1 Contents M48Z512A, M48Z512AY, M48Z512AV Contents 1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 READ mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 WRITE mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4 VCC noise and negative going transients . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Environmental information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 READ mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 WRITE mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PMDIP32 – 32-pin plastic DIP module, package mechanical data. . . . . . . . . . . . . . . . . . . 17 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Doc ID 5146 Rev 8 3/21 List of figures M48Z512A, M48Z512AY, M48Z512AV List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. 4/21 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Chip enable or output enable controlled, READ mode AC waveforms. . . . . . . . . . . . . . . . . 8 Address controlled, READ mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 WRITE enable controlled, WRITE AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Chip enable controlled, WRITE AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Supply voltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 PMDIP32 – 32-pin plastic DIP module, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Recycling symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV 1 Device overview Device overview Figure 1. Logic diagram VCC 19 8 A0-A18 W E DQ0-DQ7 M48Z512A M48Z512AY M48Z512AV G VSS Table 1. AI02043 Signal names A0-A18 DQ0-DQ7 Address inputs Data inputs/outputs E Chip enable input G Output enable input W WRITE enable input VCC Supply voltage VSS Ground Doc ID 5146 Rev 8 5/21 Device overview Figure 2. M48Z512A, M48Z512AY, M48Z512AV DIP connections A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 2 3 4 5 6 7 M48Z512A 8 M48Z512AY 9 M48Z512AV 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A15 A17 W A13 A8 A9 A11 G A10 E DQ7 DQ6 DQ5 DQ4 DQ3 AI02044 Figure 3. Block diagram VCC A0-A18 POWER E VOLTAGE SENSE AND SWITCHING CIRCUITRY 512K x 8 SRAM ARRAY DQ0-DQ7 E W G INTERNAL BATTERY VSS 6/21 Doc ID 5146 Rev 8 AI02045 M48Z512A, M48Z512AY, M48Z512AV 2 Operating modes Operating modes The M48Z512A/Y/V also has its own power-fail detect circuit. The control circuitry constantly monitors the single VCC supply for an out of tolerance condition. When VCC is out of tolerance, the circuit WRITE protects the SRAM, providing a high degree of data security in the midst of unpredictable system operation brought on by low VCC. As VCC falls below the switchover voltage (VSO), the control circuitry connects the battery which maintains data until valid power returns. The ZEROPOWER® RAM replaces industry standard SRAMs. It provides the nonvolatility of PROMs without any requirement for special WRITE timing or limitations on the number of WRITEs that can be performed. Table 2. Operating modes Mode Deselect WRITE READ READ Deselect VCC E G W DQ0-DQ7 Power 4.75 to 5.5 V or 4.5 to 5.5 V or 3.0 to 3.6 V VIH X X High Z Standby VIL X VIL DIN Active VIL VIL VIH DOUT Active VIL VIH VIH High Z Active X X X High Z CMOS standby X X X High Z Battery backup mode VSO to VPFD Deselect ≤ (min)(1) VSO(1) 1. X = VIH or VIL; VSO = battery backup switchover voltage. Note: See Table 10 on page 16 for details. 2.1 READ mode The M48Z512A/Y/V is in the READ mode whenever W (WRITE enable) is high and E (chip enable) is low. The device architecture allows ripple-through access of data from eight of 4,194,304 locations in the static storage array. Thus, the unique address specified by the 19 address inputs defines which one of the 524,288 bytes of data is to be accessed. Valid data will be available at the data I/O pins within address access time (tAVQV) after the last address input signal is stable, providing that the E (chip enable) and G (output enable) access times are also satisfied. If the E and G access times are not met, valid data will be available after the later of chip enable access time (tELQV) or output enable access Time (tGLQV). The state of the eight three-state data I/O signals is controlled by E and G. If the outputs are activated before tAVQV, the data lines will be driven to an indeterminate state until tAVQV. If the address inputs are changed while E and G remain low, output data will remain valid for output data hold time (tAXQX) but will go indeterminate until the next address access. Doc ID 5146 Rev 8 7/21 Operating modes Figure 4. M48Z512A, M48Z512AY, M48Z512AV Chip enable or output enable controlled, READ mode AC waveforms tAVAV VALID A0-A18 tAVQV tAXQX tELQV tEHQZ E tELQX tGLQV tGHQZ G tGLQX DQ0-DQ7 DATA OUT AI01221 1. WRITE enable (W) = high Figure 5. Address controlled, READ mode AC waveforms A0-A18 tAVAV tAVQV DQ0-DQ7 tAXQX DATA VALID AI01220 1. Chip enable (E) and output enable (G) = low, WRITE enable (W) = high 8/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV Table 3. Operating modes READ mode AC characteristics (1) Symbol Parameter M48Z512A/Y –70 Min Max M48Z512A/Y/V –85 Min Unit Max tAVAV READ cycle time tAVQV Address valid to output valid 70 85 ns tELQV Chip enable low to output valid 70 85 ns tGLQV Output enable low to output valid 35 45 ns (2) 70 85 ns Chip enable low to output transition 5 5 ns tGLQX(2) Output enable low to output transition 5 5 ns tEHQZ(2) Chip enable high to output Hi-Z tELQX tGHQZ(2) Output enable high to output Hi-Z tAXQX Address transition to output transition 5 30 35 ns 20 25 ns 5 ns 1. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V, or 3.0 to 3.6 V (except where noted). 2. CL = 5 pF. 2.2 WRITE mode The M48Z512A/Y/V is in the WRITE mode whenever W and E are active. The start of a WRITE is referenced from the latter occurring falling edge of W or E. A WRITE is terminated by the earlier rising edge of W or E. The addresses must be held valid throughout the cycle. E or W must return high for a minimum of tEHAX from E or tWHAX from W prior to the initiation of another READ or WRITE cycle. Data-in must be valid tDVEH or tDVWH prior to the end of WRITE and remain valid for tEHDX or tWHDX afterward. G should be kept high during WRITE cycles to avoid bus contention; although, if the output bus has been activated by a low on E and G, a low on W will disable the outputs tWLQZ after W falls. Doc ID 5146 Rev 8 9/21 Operating modes Figure 6. M48Z512A, M48Z512AY, M48Z512AV WRITE enable controlled, WRITE AC waveforms tAVAV A0-A18 VALID tAVWH tWHAX tAVEL E tWLWH tAVWL W tWHQX tWLQZ tWHDX DQ0-DQ7 DATA INPUT tDVWH AI01222 1. Output enable (G) = high. Figure 7. Chip enable controlled, WRITE AC waveforms tAVAV A0-A18 VALID tAVEH tAVEL tELEH tEHAX E tAVWL W tEHDX DQ0-DQ7 DATA INPUT tDVEH AI01223 1. Output enable (G) = high. 10/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV Table 4. Symbol Operating modes WRITE mode AC characteristics (1) Parameter M48Z512A/Y –70 Min Max M48Z512A/Y/V –85 Min Unit Max tAVAV WRITE cycle time 70 85 ns tAVWL Address valid to WRITE enable low 0 0 ns tAVEL Address valid to chip enable low 0 0 ns tWLWH WRITE enable pulse width 55 65 ns tELEH Chip enable low to chip enable high 55 75 ns tWHAX WRITE enable high to address transition 5 5 ns tEHAX Chip enable high to address transition 15 15 ns tDVWH Input valid to WRITE enable high 30 35 ns tDVEH Input valid to chip enable high 30 35 ns tWHDX WRITE enable high to input transition 0 0 ns tEHDX Chip enable high to input transition 10 10 ns tWLQZ(2)(3) WRITE enable low to output Hi-Z 25 30 ns tAVWH Address valid to WRITE enable high 65 75 ns tAVEH Address valid to chip enable high 65 75 ns WRITE enable high to output transition 5 5 ns tWHQX(2)(3) 1. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V or 3.0 to 3.6 V (except where noted). 2. CL = 5 pF. 3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state. 2.3 Data retention mode With valid VCC applied, the M48Z512A/Y/V operates as a conventional BYTEWIDE™ static RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect, WRITE protecting itself tWP after VCC falls below VPFD. All outputs become high impedance, and all inputs are treated as “don't care.” If power fail detection occurs during a valid access, the memory cycle continues to completion. If the memory cycle fails to terminate within the time tWP, WRITE protection takes place. When VCC drops below VSO, the control circuit switches power to the internal energy source which preserves data. The internal coin cell will maintain data in the M48Z512A/Y/V after the initial application of VCC for an accumulated period of at least 10 years when VCC is less than VSO. As system power returns and VCC rises above VSO, the battery is disconnected, and the power supply is switched to external VCC. WRITE protection continues for tER after VCC reaches VPFD to allow for processor stabilization. After tER, normal RAM operation can resume. For more information on battery storage life refer to the application note AN1012. Doc ID 5146 Rev 8 11/21 Operating modes 2.4 M48Z512A, M48Z512AY, M48Z512AV VCC noise and negative going transients ICC transients, including those produced by output switching, can produce voltage fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the bypass capacitors will be released as low going spikes are generated or energy will be absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1 µF (see Figure 8) is recommended in order to provide the needed filtering. In addition to transients that are caused by normal SRAM operation, power cycling can generate negative voltage spikes on VCC that drive it to values below VSS by as much as one volt. These negative spikes can cause data corruption in the SRAM while in battery backup mode. To protect from these voltage spikes, ST recommends connecting a schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS). (Schottky diode 1N5817 is recommended for through hole and MBRS120T3 is recommended for surface-mount). Figure 8. Supply voltage protection VCC VCC 0.1µF DEVICE VSS AI02169 12/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV 3 Maximum ratings Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 5. Absolute maximum ratings Symbol Parameter TA Ambient operating temperature TSTG Storage temperature (VCC off) TBIAS Temperature under bias TSLD(1) Value Grade 1 0 to 70 Grade 6 -40 to 85 Unit °C –40 to 85 Grade 1 0 to 70 Grade 6 –40 to 85 °C °C Lead solder temperature for 10 seconds 260 °C –0.3 to 7 V M48Z512A/512AY –0.3 to 7.0 V M48Z512AV –0.3 to 4.6 V VIO Input or output voltages VCC Supply voltage IO Output current 20 mA PD Power dissipation 1 W 1. Soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to protect the lithium battery, preheat temperatures must be limited such that the battery temperature does not exceed +85 °C. Furthermore, the devices shall not be exposed to IR reflow. Caution: Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup mode. Doc ID 5146 Rev 8 13/21 DC and AC parameters 4 M48Z512A, M48Z512AY, M48Z512AV DC and AC parameters This section summarizes the operating and measurement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC characteristic tables are derived from tests performed under the measurement conditions listed in the relevant tables. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters. Table 6. Operating and AC measurement conditions Parameter M48Z512A/512AY Supply voltage (VCC) 4.75 to 5.5 V or 4.5 to 5.5 3.0 to 3.6 Grade 1 0 to 70 0 to 70 Grade 6 –40 to 85 –40 to 85 Load capacitance (CL) 100 50 pF Input rise and fall times ≤5 ≤ 5 ns 0 to 3 0 to 3 V 1.5 1.5 V Ambient operating temperature (TA) V °C Input pulse voltages Input and output timing ref. voltages Note: M48Z512AV Unit Output Hi-Z is defined as the point where data is no longer driven. Figure 9. AC measurement load circuit 650Ω DEVICE UNDER TEST CL = 100 pF (1) or 30 pF 1.75V CL includes JIG capacitance AI03903 1. Excluding open drain output pins; 50 pF for M48Z512AV. Table 7. Capacitance Parameter(1)(2) Symbol CIN CIO(3) Min Max Unit Input capacitance - 10 pF Input/output capacitance - 10 pF 1. Effective capacitance measured with power supply at 5 V (M48Z512A/Y) or 3.3 V (M48Z512AV); sampled only, not 100% tested. 2. Outputs deselected. 3. At 25 °C. 14/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV Table 8. DC and AC parameters DC characteristics Test condition(1) Sym Parameter M48Z512A/Y –70 Min ILI(2) Input leakage current ILO(2) Output leakage current M48Z512AV –85 Max Min Unit Max 0 V ≤ VIN ≤ VCC ±1 ±1 µA 0 V ≤ VOUT ≤ VCC ±1 ±1 µA E = VIL outputs open 115 50 mA E = VIH 10 4 mA E ≥ VCC – 0.2 V 5 3 mA ICC Supply current ICC1 Supply current (standby) TTL ICC2 Supply current (standby) CMOS VIL Input low voltage –0.3 0.8 –0.3 0.6 V VIH Input high voltage 2.2 VCC + 0.3 2.2 VCC + 0.3 V VOL Output low voltage IOL = 2.1 mA 0.4 V VOH Output high voltage IOH = –1 mA 0.4 2.4 2.2 V 1. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V, or 3.0 to 3.6 V (except where noted). 2. Outputs deselected. Figure 10. Power down/up mode AC waveforms tF VCC VPFD (max) VPFD (min) VSO VSS tWP tDR tR tFB INPUTS RECOGNIZED (Including E) tRB DON'T CARE tER RECOGNIZED HIGH-Z OUTPUTS VALID VALID AI02385 Doc ID 5146 Rev 8 15/21 DC and AC parameters Table 9. M48Z512A, M48Z512AY, M48Z512AV Power down/up AC characteristics Parameter(1) Symbol Min tF(2) VPFD (max) to VPFD (min) VCC fall time tFB(3) VPFD (min) to VSS VCC fall time Max 300 M48Z512A/Y 10 M48Z512AV 150 Unit µs µs tR VPFD (min) to VPFD (max) VCC rise time 10 µs tRB VSS to VPFD (min) VCC rise time 1 µs tWPT tER M48Z512A/Y 40 150 M48Z512AV 40 250 40 120 WRITE protect time µs E recovery time ms 1. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V, or 3.0 to 3.6 V (except where noted). 2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/WRITE protection not occurring until 200 µs after VCC passes VPFD (min). 3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data. Table 10. Power down/up trip points DC characteristics Parameter(1)(2) Symbol VPFD VSO tDR (3) Power-fail deselect voltage Min Typ Max Unit M48Z512A 4.5 4.6 4.75 V M48Z512AY 4.2 4.3 4.5 V M48Z512AV 2.8 2.9 3.0 V M48Z512A/Y 3.0 V M48Z512AV 2.5 V Battery backup switchover voltage Expected data retention time 10 Years 1. All voltages referenced to VSS. 2. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V, or 3.0 to 3.6 V (except where noted). 3. At 25 °C; VCC = 0 V. 16/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV 5 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. PMDIP32 – 32-pin plastic DIP module, package outline A A1 B S L C eA e1 e3 D N E 1 PMDIP 1. Drawing is not to scale. Table 11. PMDIP32 – 32-pin plastic DIP module, package mechanical data mm inches Symb Typ Min Max A 9.27 9.52 A1 0.38 B 0.43 0.59 0.017 0.023 C 0.20 0.33 0.008 0.013 D 42.42 43.18 1.670 1.700 E 18.03 18.80 0.710 0.740 e1 2.29 2.79 0.090 0.110 e3 Typ Min Max 0.365 0.375 0.015 38.10 1.50 eA 14.99 16.00 0.590 0.630 L 3.05 3.81 0.120 0.150 S 1.91 2.79 0.075 0.110 N 32 Doc ID 5146 Rev 8 32 17/21 Part numbering 6 M48Z512A, M48Z512AY, M48Z512AV Part numbering Table 12. Ordering information scheme Example: M48Z 512AY –70 PM 1 Device type M48Z Supply voltage and WRITE protect voltage 512A = VCC = 4.75 to 5.5 V; VPFD = 4.5 to 4.75 V 512AY = VCC = 4.5 to 5.5 V; VPFD = 4.2 to 4.5 V 512AV(1) = VCC = 3.0 to 3.6 V; VPFD = 2.8 to 3.0 V Speed –70 = 70 ns (for M48Z512A/Y) –85 = 85 ns (for M48Z512A/Y/V) Package PM = PMDIP32 Temperature range 1 = 0 to 70 °C 6 = –40 to 85 °C 1. M48Z512AV not for new design (see M48Z512BV). Contact ST sales office for availability. For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you. 18/21 Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV 7 Environmental information Environmental information Figure 12. Recycling symbols This product contains a non-rechargeable lithium (lithium carbon monofluoride chemistry) button cell battery fully encapsulated in the final product. Recycle or dispose of batteries in accordance with the battery manufacturer's instructions and local/national disposal and recycling regulations. Please refer to the following web site address for additional information regarding compliance statements and waste recycling. Go to www.st.com/nvram, then select "Lithium Battery Recycling" from "Related Topics". Doc ID 5146 Rev 8 19/21 Revision history 8 Revision history Table 13. 20/21 M48Z512A, M48Z512AY, M48Z512AV Revision history Date Revision Changes Mar-2000 1 19-Jul-2000 1.1 M48Z12AV added 15-Jan-2001 1.2 Changed LPSRAM device (Table 2) 19-Dec-2001 2 08-Feb-2002 2.1 Remove 85ns speed grade (Table 3, Table 4, and Table 8) 29-May-2002 2.2 Modify reflow time and temperature footnotes (Table 5) 18-Nov-2002 2.3 Modified SMT text (Figure 1, Figure , and Table 2) 17-Sep-2003 2.4 Remove references to M68xxx (obsolete) part (Figure and Table 2); update disclaimer 30-Nov-2004 3 Reformatted; remove extended temperature references (Table 12) 21-Dec-2004 4 Update Marketing Status for qualification, correct drawing (Figure and Table 12) 22-Feb-2005 5 IR reflow, SO package updates (Table 5) 21-Dec-2006 6 Document reformatted. ECOPACK package text added on coverpage. Note 2 concerning Leaded SOIC package removed below Table 5. Updated PMDIP32 package mechanical data in Section 5: Package mechanical data; updated TA to include Grade 1 (0 to 70°C) and Grade 6 (-40 to 85°C). 7-Nov-2008 7 Indicated that M48Z512AV is Not for New Design; removed all SNAPHAT® battery and SOIC package references; updated Section 5: Package mechanical data. 02-Aug-2010 8 Updated Features, Section 3, Table 12, ECOPACK® text in Section 5; added Section 7: Environmental information. First issue Reformatted; added temperature information (Table 3, Table 4, Table 7, Table 8, Table 9, and Table 10); remove chipset option from Ordering Information (Table 12); remove reference to “clock” Doc ID 5146 Rev 8 M48Z512A, M48Z512AY, M48Z512AV Please Read Carefully: Information in this document is provided solely in connection with ST products. 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