MA-COM MADP-064908

MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
Features
♦
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Case Style - ODS-1310
No Wire Bonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Ultra-Low Parasitic Capacitance and Inductance
Higher RF C.W. Power Handling
Better Performance than Packaged Devices
Description and Applications
This device is a silicon glass PIN diode chip fabricated with
M/A-COM Tech Solutions patented HMIC process.
This 80μm I-region length device features six silicon
pedestals embedded in a low loss, low dispersion
glass. The diodes are formed on the top of a pedestal and connections to the backside of the device
are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside
is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch protection.
These protective coatings prevent damage to the
junction and the anode air-bridge during handling
and assembly. The vertical silicon diode topology
provides for a highly efficient heat transfer medium.
These surface mount devices are suitable for usage
in higher (3W avg.) incident power switches. Small
parasitic inductance and excellent RC constant
make these devices ideal for absorptive SPST, reflective SP2T switches, and attenuator circuits,
where higher P1db and power handling values are
required.
Absolute Maximum Ratings1
@ TAMB = +25°C (unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
250mA
Reverse Voltage
–100V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
+35dBm
Mounting Temperature
+300°C for 10 seconds
1. Operation of this device above any one of these parameters may
cause permanent damage.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
Inches
Min.
Max.
Millimeters
Min.
Max.
A
0.060
0.062
1.524
1.575
B
0.036
0.038
0.914
0.965
C
0.004
0.008
0.102
0.203
D
0.011
0.012
0.279
0.305
Dim
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
Electrical Specifications @ +25 °C, per Diode Junction
Symbol
Conditions
Units
CT
-40V, 1MHz1
CT
Min.
Typ.
Max.
pF
0.05
0.07
-40V, 1GHz1,3
pF
0.04
0.06
RS
10mA, 1GHz2,3
Ω
5.0
VF
10mA
V
0.83
VR
-10μA
V
IR
-70V
μA
–0.1
TL
+10mA /-6mA
ns
200
θTH
1A /10mA
°C/W
150
–70
1.00
–100
–10
1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj (Junction Resistance) + Rc (Ohmic Resistance)
3. Rs, CT, TL, θTH are measured on an HP4291A Impedance Analyzer with die mounted in a ceramic package with Sn 60/Pb 40
solder
Equivalent Double Tee Equivalent Circuit
Top View
6
1
5
2
3
4
Notes:
1. Ports 2 and 5 have a Connected Cathode-Anode Node.
2. Ports 1,3,4, and 6 Have a Singular, Un-Connected Node.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
SP2T All Series Reflective Switch with +5V and TTL Logic Control ( 2-18 GHz )
J1?
+1.8 V
22?pF
J22?pF
15 nH
J2
22 pF
22 pF
J3
1
4
3,6
5
2
HM IC Die
22 pF
15 nH
22 pF
15 nH
B2 Bias
B3 Bias
+5 V
+5V
+5V
100 Ω
+5V
100Ω
SN7406, SN7416 TTL Open Collector G ate Driver ( X2 )
RF Truth Table for Reflective SP2T using Singular Power Supply: +5V, + I Only
RF State
B2 Diode Bias
B3 Diode Bias
J1 – J2 Low Loss & J1– J3 Isolation
J1 – J3 Low Loss & J1–J2 Isolation
+3.6V @ +14mA
+0.5V @ 0mA
+0.5V @ 0mA
+ 3.6V @ + 14mA
Notes:
1. Diode Forward Voltage Differential (ΔVf ) @ 15mA = 0.9V
2. Insertion Loss Diode Bias = (+ 5V – (2)* 0.9V – 1.8V ) / ( 100Ω ) = 14mA
3. Off Isolation Diode Back Bias Voltage = | – ( +1.8V – 0.5V ) | = | – 1.3V |.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
SPST All Series Absorptive Switch with +5V and TTL Logic Control ( 2-18 GHz )
+5V
22pF
TTL DRIVER
15nH
-5V
J1
B1 Bias
22pF
J2
1
2
3,4
22pF
15nH
HMIC Die
5
6
43Ω
RF Truth Table for Absorptive SPST using +5V, –5V Power Supplies
RF State
J1 – J2 Low Loss
J1 – J2 Isolation
TTL Value
0
1
B1 Diode Bias
- 1.8V @ -20mA
+2.7V @ + 20mA
Notes:
1. Diode Forward Voltage Differential ( ΔVf ) @ 20mA = 0.9 V
2. Diode Rs @ 20mA = 3.5Ω
3. Insertion Loss Diode Bias = – 1.8 V @ -20mA from a Constant Current Source
4. Off Isolation Diode Back Bias Voltage through (2) Diodes = | – ( +2.7 V – 0 V ) | = | – 2.7 V |.
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
SPST All Series Reflective Switch with +5V and TTL Logic Control (2–18 GHz)
+5V
SN7406, SN7416 Open Collector Gate Driver
+5V
47 Ω
1kΩ
22 pF
15 nH
15 nH
B1 Bias
J1
J2
1
2
5
6
3,4
22 pF
22 pF
HMIC Die
RF Truth Table for Reflective SPST using Singular Power Supply: +5V, + I Only
RF State
TTL Value
B1 Diode Bias
J1 – J2 Low Loss
0
+ 0.5V @ +20mA
J1–J2 Isolation
1
+5.0V @ 0mA
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
MADP-064908 SPICE Model
PinDiodeModel
NLPINM1
Is=1.0E-14 A
Vi=0.0 V
Un=900 cm^2/V-sec
Wi=7.5 um
Rr=20 K Ohm
Cmin=0.05 pF
Tau=0.20 usec
Rs=0.1 Ohm
Cj0=0.06 pF
Vj=0.7 V
M=0.5
Fc=0.5
Imax=1.0E+6 A/m^2
Kf=0.0
Af=1.0
wBv=80 V
wPmax=3.0 W
Ffe=1.0
Equivalent per Diode Schematic
Ls
Cp
Rp
R via
R via
_
N otes :
Rs = 2 * R via + R p
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
+
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
MADP-064908-131000
Unconnected Double Tee
Surmount TM PIN Chip
RoHS Compliant
Rev. V3
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual
components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. Conductive silver epoxy may also
be used for lower Incident power applications (<1W Average Power). The epoxy should be approximately 1-2mils
thick and cured at approximately 90°C to 150°C per the manufacturer’s schedule.
When soldering these devices on to a hard substrate, hot gas die bonding is preferred. We recommend utilizing
a vacuum tip and force of 60 to 100 grams be applied to the top surface of the device. Position the die so that its
mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of
the die. The solder connections to the pads must not be made one at a time. Doing so would create un-equal
heat flow and thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through
the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually
inspected through the die to ensure proper solder flow after attachment is complete.
Typical solder re-flow profiles are provided in Application Note 538 “Surface Mounting Instructions“ located
on the MA-COM website at www.macomtech.com
Ordering Information
Part Number
MADP-064908-131000
ADVANCED: Data Sheets contain information regarding a product MA-COM Technical
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
Packaging
Die in Gel Pack
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
MA-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.