MC74AC08, MC74ACT08 Quad 2−Input AND Gate • Outputs Source/Sink 24 mA • ′ACT08 Has TTL Compatible Inputs • Pb−Free Packages are Available http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit DC Supply Voltage (Referenced to GND) VCC −0.5 to +7.0 V DC Input Voltage (Referenced to GND) Vin −0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) Vout −0.5 to VCC +0.5 V DC Input Current, per Pin Iin ±20 mA DC Output Sink/Source Current, per Pin Iout ±50 mA DC VCC or GND Current per Output Pin ICC ±50 mA Storage Temperature Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. PDIP−14 N SUFFIX CASE 646 14 1 SO−14 D SUFFIX CASE 751A 14 1 14 1 TSSOP−14 DT SUFFIX CASE 948G VCC 14 13 12 11 10 9 8 SOEIAJ−14 M SUFFIX CASE 965 14 1 1 2 3 4 5 6 7 GND Figure 1. Pinout: 14−Lead Packages Conductors (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. DEVICE MARKING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2004 June, 2004 − Rev. 6 1 See general marking information in the device marking section on page 5 of this data sheet. Publication Order Number: MC74AC08/D MC74AC08, MC74ACT08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf IInputt Rise Ri and d Fall F ll Time Ti (Note (N t 1) ′AC Devices except Schmitt Inputs Min Typ Max ′AC 2.0 5.0 6.0 Unit ′ACT 4.5 5.0 5.5 0 − VCC V VCC @ 3.0 V − 150 − ns/V VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − − − 140 °C −40 25 85 °C V tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. DC CHARACTERISTICS Symbol Parameter Conditions 74AC 74AC TA = +25°C TA = −40°C to +85°C VCC (V) Typ Guaranteed Limits Unit VIH Minimum High Level Input Voltage VOUT = 0.1 V or VCC − 0.1 V 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VIL Maximum Low Level Input Voltage VOUT = 0.1 V or VCC − 0.1 V 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOH Minimum High Level Output Voltage IOUT = −50 A 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V VIN = VIL or VIH (Note 3) −12 mA −24 mA IOH −24 mA 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 VIN = VIL or VIH(Note 3) 12 mA 24 mA IOL 24 mA 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 VI = VCC, GND 5.5 − ±0.1 ±1.0 A VOLD = 1.65 V Max 5.5 − − 75 mA VOHD = 3.85 V Min 5.5 − − −75 mA VIN = VCC or GND 5.5 − 4.0 40 A VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD Minimum Dynamic (Note 4) O t t Current Output C t IOHD ICC Maximum Quiescent Supply Current NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. 3. All outputs loaded; thresholds on input associated with output under test. 4. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 2 V V MC74AC08, MC74ACT08 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74AC 74AC TA = −40°C Symbol Parameter TA = +25°C to +85°C CL = 50 pF CL = 50 pF Fig. VCC (V) (Note5 ) Min Typ Max Min Max Unit No. 1.5 1.5 7.5 5.5 9.5 7.5 1.0 1.0 10.0 8.5 ns 3−5 1.5 1.5 7.0 5.5 8.5 7.0 1.0 1.0 9.0 7.5 ns 3−5 tPLH Propagation Delay 3.3 5.0 tPHL Propagation Delay 3.3 5.0 5. Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS 74ACT 74ACT TA = +25°C −40°C to +85°C TA = Symbol VIH VIL VOH Parameter Conditions VCC (V) Typ Guaranteed Limits Minimum High Level I Input V Voltage l VOUT = 0.1 V 4.5 1.5 2.0 2.0 or VCC − 0.1 V 5.5 1.5 2.0 2.0 Maximum Low Level I V l Input Voltage VOUT = 0.1 V 4.5 1.5 0.8 0.8 or VCC − 0.1 V 5.5 1.5 0.8 0.8 Minimum High Level O Output Voltage IOUT = −50 A 4.5 4.49 4.4 4.4 5.5 5.49 5.4 5.4 Maximum Low Level O Output V Voltage l −24 mA 4.5 −24 mA IOUT = 50 A V V V V VIN = VIL or VIH (Note 6) VOL Unit − 3.86 3.76 5.5 − 4.86 4.76 4.5 0.001 0.1 0.1 5.5 0.001 0.1 0.1 V V VIN = VIL or VIH (Note 6) 24 mA 4.5 − 0.36 0.44 24 mA 5.5 − 0.36 0.44 IIN Maximum a u Input u Leakage Current VI = VCC, GND 55 5.5 − ±0 1 ±0.1 ±1 0 ±1.0 A ICCT Additional Max. ICC/Input VI = VCC − 2.1 V 5.5 0.6 − 1.5 mA IOLD Minimum Dynamic (Note 7) O t t Current Output C t VOLD = 1.65 V Max 5.5 − − 75 mA VOHD = 3.85 V Min 5.5 − − −75 mA VIN = VCC or GND 5.5 − 4.0 40 A IOHD ICC Maximum Quiescent Supply Current 6. All outputs loaded; thresholds on input associated with output under test. 7. Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 3 MC74AC08, MC74ACT08 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) 74ACT 74ACT TA = −40°C Symbol Parameter TA = +25°C to +85°C CL = 50 pF CL = 50 pF Fig. VCC (V) (Note 8) Min Typ Max Min Max Unit No. tPLH Propagation Delay 5.0 1.0 − 9.0 1.0 10.0 ns 3−5 tPHL Propagation Delay 5.0 1.0 − 9.0 1.0 10.0 ns 3−5 8. Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Value Symbol Parameter Test Conditions Typ Unit CIN Input Capacitance VCC = 5.0 V 4.5 pF CPD Power Dissipation Capacitance VCC = 5.0 V 20 pF http://onsemi.com 4 MC74AC08, MC74ACT08 MARKING DIAGRAMS PDIP−14 SOIC−14 TSSOP−14 SOEIAJ−14 MC74AC08N AWLYYWW AC08 AWLYWW AC 08 ALYW 74AC08 ALYW MC74ACT08N AWLYYWW ACT08 AWLYWW ACT 08 ALYW 74ACT08 ALYW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Package Shipping† MC74AC08N PDIP−14 500 Units / Rail MC74AC08D SOIC−14 55 Units / Rail MC74AC08DR2 TSSOP−14 2500 / Tape & Reel MC74AC08DTR2 TSSOP−14 (Pb−Free) 2500 / Tape & Reel MC74AC08MEL SOEIAJ−14 (Pb−Free) 2000 / Tape & Reel MC74ACT08N PDIP−14 500 Units / Rail MC74ACT08D SOIC−14 55 Units / Rail MC74ACT08DR2 SOIC−14 2500 / Tape & Reel MC74ACT08DTR2G SOIC−14 (Pb−Free) 2500 / Tape & Reel MC74ACT08NG PDIP−14 (Pb−Free) 500 Units / Rail MC74ACT08MEL SOEIAJ−14 (Pb−Free) 2000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC74AC08, MC74ACT08 PACKAGE DIMENSIONS PDIP−14 N SUFFIX CASE 646−06 ISSUE N 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L N C −T− SEATING PLANE J K H D 14 PL G M 0.13 (0.005) M INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 0.015 0.039 MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 0.38 1.01 SOIC−14 D SUFFIX CASE 751A−03 ISSUE G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M B M 7 1 G F R X 45 C −T− SEATING PLANE 0.25 (0.010) M T B J M K D 14 PL S A S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74AC08, MC74ACT08 PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE 948G−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. 14X K REF 0.10 (0.004) 0.15 (0.006) T U T U M V S S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E ÇÇÇ ÉÉ ÇÇÇ ÉÉ ÇÇÇ ÉÉ K A −V− K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING H G D PLANE DETAIL E MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 SOEIAJ−14 M SUFFIX CASE 965−01 ISSUE O 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.056 MC74AC08, MC74ACT08 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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