MICROCHIP MCP9701T-ELT

MCP9700/01
Low-Power Linear Active Thermistor™ ICs
Features
Description
• Tiny Analog Temperature Sensor
• Available Packages: SC70-5
• Wide Temperature Measurement Range:
- -40°C to +125°C
• Accuracy: ±4°C (max.), 0°C to +70°C
• Optimized for Analog-to-Digital Converters
(ADCs):
- MCP9700: 10.0 mV/°C (typ.)
- MCP9701: 19.5 mV/°C (typ.)
• Wide Operating Voltage Range:
- MCP9700: VDD = 2.3V to 5.5V
- MCP9701: VDD = 3.1V to 5.5V
• Low Operating Current: 6 µA (typ.)
• Optimized to Drive Large Capacitive Loads
The MCP9700/01 Linear Active Thermistor™
Intergrated Circuit (IC) is an analog temperature sensor that converts temperature to analog voltage. It’s a
low-cost, low-power sensor with an accuracy of ±4°C
from 0°C to +70°C while consuming 6 µA (typ.) of
operating current.
Unlike resistive sensors (such as thermistors), the
Linear Active Thermistor IC does not require an
additional signal-conditioning circuit. Therefore, the
biasing circuit development overhead for thermistor
solutions can be avoided by implementing this
low-cost device. The voltage output pin (VOUT) can be
directly connected to the ADC input of a
microcontroller. The MCP9700 and MCP9701
temperature coefficients are scaled to provide a
1 °C/bit resolution for an 8-bit ADC with a reference
voltage of 2.5V and 5V, respectively.
The MCP9700/01 provides a low-cost solution for
applications that require measurement of a relative
change of temperature. When measuring relative
change in temperature from +25°C, an accuracy of
±1°C (typ.) can be realized from 0°C to +70°C. This
accuracy can also be achieved by applying system
calibration at +25°C.
In addition, this family is immune to the effects of
parasitic capacitance and can drive large capacitive
loads. This provides Printed Circuit Board (PCB) layout
design flexibility by enabling the device to be remotely
located from the microcontroller. Adding some
capacitance at the output also helps the output
transient response by reducing overshoots or
undershoots. However, capacitive load is not required
for sensor output stability.
Typical Applications
•
•
•
•
•
•
Hard Disk Drives and Other PC Peripherals
Entertainment Systems
Home Appliance
Office Equipment
Battery Packs and Portable Equipment
General Purpose Temperature Monitoring
Package Type
NC 1
GND 2
VOUT 3
MCP9700
MCP9701
SC70-5
5 NC
4 VDD
Typical Application Circuit
VDD
10 kΩ
MCLR
VSS
© 2005 Microchip Technology Inc.
MCP9700/01 VDD
VDD
VDD
PICmicro® ANI
MCU
Cbypass
0.1 µF
VOUT
GND
DS21942B-page 1
MCP9700/01
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD:...................................................................... 6.0V
†Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Storage temperature: ........................ -65°C to +150°C
Ambient Temp. with Power Applied:.. -40°C to +125°C
Junction Temperature (TJ):................................. 150°C
ESD Protection On All Pins (HBM:MM):.... (4 kV:200V)
Latch-Up Current at Each Pin: ...................... ±200 mA
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Sym
Min
Typ
Max
Unit
Conditions
Operating Voltage Range
VDD
VDD
2.3
3.1
—
—
5.5
5.5
V
V
Operating Current
IDD
—
6
12
µA
PSRR
—
0.1
—
°C/V
TACY
TACY
TACY
TACY
—
-4.0
-4.0
-4.0
±1
—
—
—
—
+4.0
+6.0
+6.0
°C
°C
°C
°C
MCP9700
MCP9701
V0°C
V0°C
—
—
500
400
—
—
mV
mV
MCP9700
MCP9701
TC1
TC1
—
—
10.0
19.5
—
—
VONL
—
±0.5
—
°C
Output Current
IOUT
—
—
100
µA
Output Impedance
ZOUT
—
20
—
Ω
IOUT = 100 µA, f = 500 Hz
ΔVOUT/
ΔIOUT
—
1
—
Ω
TA = 0°C to +70°C,
IOUT = 100 µA
800
—
µs
Power Supply
Power Supply Rejection Ratio
MCP9700
MCP9701
Sensor Accuracy (Notes 1, 2)
TA = +25°C
TA = 0°C to +70°C
TA = -40°C to +125°C
TA = -10°C to +125°C
Sensor Output
Output Voltage:
TA = 0°C
TA = 0°C
Temperature Coefficient
Output Non-linearity
Output Load Regulation
Turn-on Time
Typical Load Capacitance (Note 3)
Thermal Response to 63%
Note 1:
2:
3:
4:
mV/°C MCP9700
mV/°C MCP9701
tON
—
CLOAD
—
—
1000
pF
tRES
—
1.3
—
s
TA = 0°C to +70°C (Note 2)
30°C (Air) to +125°C
(Fluid Bath) (Note 4)
The MCP9700 accuracy is tested with VDD = 3.3V, while the MCP9701 accuracy is tested with VDD = 5.0V.
The MCP9700/01 is characterized using the first-order or linear equation, as shown in Equation 4-2.
The MCP9700/01 family is characterized and production-tested with a capacitive load of 1000 pF.
Thermal response with 1x1 inch, dual-sided copper clad.
DS21942B-page 2
© 2005 Microchip Technology Inc.
MCP9700/01
M
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameters
Sym
Min
Typ
Max
Units
Conditions
TA
-40
—
+125
°C
MCP9700 (Note)
TA
-10
—
+125
°C
MCP9701 (Note)
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
θJA
—
331
—
°C/W
Temperature Ranges
Specified Temperature Range
Thermal Package Resistances
Thermal Resistance, 5L-SC70
Note:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
© 2005 Microchip Technology Inc.
DS21942B-page 3
MCP9700/01
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground,
Cbypass = 0.1 µF.
Accuracy (°C)
4.0
MCP9701
VDD= 5.0V
' Accuracy Due to Load (°C)
6.0
Spec. Limits
2.0
0.0
-2.0
MCP9700
VDD= 3.3V
-4.0
-50
-25
0
FIGURE 2-1:
Temperature.
25
50
TA (°C)
75
100
0.1
0
MCP9700
VDD = 3.3V
-0.1
ILOAD = 100 μA
-0.2
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-4:
Changes in Accuracy vs.
Ambient Temperature (Due to Load).
Accuracy vs. Ambient
4.0
Load Regulation 'V/'I (:)
MCP9701
VDD= 5.5V
VDD= 3.1V
MCP9700
VDD = 5.5V
VDD = 2.3V
4.0
Accuracy (°C)
MCP9701
VDD = 5.0V
125
6.0
2.0
0.0
-2.0
-4.0
MCP9700/01
VDD = 3.3V
3.0
IOUT = 50 μA
IOUT = 100 μA
IOUT = 200 μA
2.0
1.0
0.0
-50
-25
0
25
50
TA (°C)
75
100
125
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-5:
Load Regulation vs.
Ambient Temperature.
FIGURE 2-2:
Accuracy vs. Ambient
Temperature, with VDD.
12.0
1000
10.0
VDD = 5.0V
IOUT = 100 μA
TA = 26°C
Output Impedance (:)
MCP9701
8.0
IDD (µA)
0.2
6.0
MCP9700
4.0
2.0
0.0
-50
-25
FIGURE 2-3:
Temperature.
DS21942B-page 4
0
25
50
TA (°C)
75
100
Supply Current vs.
125
100
10
1
0.1
0.1
FIGURE 2-6:
Frequency.
1
1
10
100
1K
10
100
1000
Frequency (Hz)
10K
100K
10000 100000
Output Impedance vs.
© 2005 Microchip Technology Inc.
MCP9700/01
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground,
Cbypass = 0.1 µF.
45%
35%
MCP9701
VDD = 5.0V
108 samples
40%
35%
Occurrences
25%
20%
15%
10%
30%
25%
20%
15%
V0°C (mV)
FIGURE 2-7:
(MCP9700).
Output Voltage at 0°C
FIGURE 2-10:
(MCP9701).
FIGURE 2-8:
Occurrences vs.
Temperature Coefficient (MCP9700).
0.30
MCP9700
VDD= 2.3V to 5.5V
Normalized PSRR (°C/V)
Normalized PSRR (°C/V)
20.0
19.9
19.8
19.7
500
480
460
FIGURE 2-11:
Occurrences vs.
Temperature Coefficient (MCP9701).
0.20
0.15
0.10
440
V0°C (mV)
TC1 (mV/°C)
0.25
420
300
10.5
10.4
10.3
10.2
10.1
10.0
9.9
0%
9.8
0%
9.7
5%
9.6
5%
400
10%
380
10%
15%
360
15%
20%
340
20%
25%
320
25%
9.5
MCP9701
VDD = 5.0V
108 samples
30%
30%
0.30
19.6
Output Voltage at 0°C
35%
MCP9700
VDD = 3.3V
108 samples
Occurrences
Occurrences
35%
19.5
TC1 (mV/°C)
45%
40%
19.4
19.3
19.2
19.0
600
580
560
540
520
500
480
460
440
0%
420
5%
0%
19.1
10%
5%
400
Occurrences
30%
MCP9700
VDD = 3.3V
108 samples
MCP9700
VDD= 2.3V to 4.0V
0.05
0.00
0.25
MCP9701
VDD= 3.1V to 5.5V
0.20
0.15
0.10
MCP9701
VDD= 3.1V to 4.0V
0.05
0.00
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-9:
Power Supply Rejection
Ration (PSRR) vs. Ambient Temperature.
© 2005 Microchip Technology Inc.
-50
-25
0
25
50
TA (°C)
75
100
125
FIGURE 2-12:
Power Supply Rejection
Ratio (PSRR) vs. Temperature.
DS21942B-page 5
MCP9700/01
Note: Unless otherwise indicated, MCP9700: VDD = 2.3V to 5.5V; MCP9701: VDD = 3.1V to 5.5V; GND = Ground,
Cbypass = 0.1 µF.
1.6
3.0
TA = 26°C
1.4
2.5
1.0
VOUT (V)
0.8
0.6
0.4
2.0
1.5
1.0
0.5
0.2
0.0
0.0
-50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
FIGURE 2-13:
Supply.
Output Voltage vs. Power
FIGURE 2-16:
Temperature.
1.7
IDD
0.8
8
6
2.5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
-2.5
0.2
-1.7
0
0.1
2
0.0
-0.8
-0.1
4
VOUT (V)
0.0
VOUT
25
50
75
100
125
Output Voltage vs. Ambient
30.0
IDD
VDD_RAMP = 5V/ms
TA = 26°C
18.0
2.0
6.0
1.5
-6.0
1.0
VOUT
-18.0
0.5
-30.0
0.0
-42.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (ms)
Time (ms)
FIGURE 2-14:
step VDD.
0
3.0
IDD (mA)
VDD_STEP = 5V
TA = 26°C
10
-25
TA (°C)
2.5
12
VOUT (V)
MCP9700
MCP9701
IDD (µA)
VOUT (V)
1.2
Output vs. Settling Time to
FIGURE 2-17:
Ramp VDD.
Output vs. Settling Time to
130
Output (°C)
105
80
55
SC70-5
30°C (Air) to 125°C (Fluid bath)
1 in. x 1 in. copper clad
30
-2
0
FIGURE 2-15:
DS21942B-page 6
2
4
6
8
10
Time (s)
12
14
16
18
Thermal Response.
© 2005 Microchip Technology Inc.
MCP9700/01
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in DC Electrical
Characteristics.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Name
1
NC
2
GND
Power Ground Pin
3
VOUT
Output Voltage Pin
4
VDD
Power Supply Input
5
NC
No Connect
3.1
Function
No Connect
Power Ground Pin (GND)
GND is the system ground pin.
3.2
Output Voltage Pin (VOUT)
The sensor output can be measured at VOUT. The
voltage range over the operating temperature range for
the MCP9700 is 100 mV to 1.75V and for the
MCP9701, 200 mV to 3V .
3.3
Power Supply Input (VDD)
The operating voltage as specified in the DC Electrical
Characteristics table is applied to VDD.
© 2005 Microchip Technology Inc.
DS21942B-page 7
MCP9700/01
APPLICATIONS INFORMATION
The Linear Active Thermistor™ IC uses an internal
diode to measure temperature. The diode electrical
characteristics have a temperature coefficient that
provides a change in voltage based on the relative
ambient temperature from -40°C to 125°C. The change
in voltage is scaled to a temperature coefficient of
10.0 mV/°C (typ.) for the MCP9700 and 19.5 mV/°C
(typ.) for the MCP9701. The output voltage at 0°C is
also scaled to 500 mV (typ.) and 400 mV (typ.) for the
MCP9700 and MCP9701, respectively. This linear
scale is described in the first-order transfer function
shown in Equation 4-1.
EQUATION 4-1:
SENSOR TRANSFER
FUNCTION
For higher accuracy using a sensor compensation
technique, refer to AN1001 “IC Temperature Sensor
Accuracy
Compensation
with
a
PICmicro®
Microcontroller” (DS01001). The application note
shows that if the MCP9700 is compensated in addition
to room temperature calibration, the sensor accuracy
can be improved to ±0.5°C (typ.) accuracy over the
operating temperature (Figure 4-2).
6.0
100 Samples
4.0
Accuracy (°C)
4.0
2.0
Spec. Limits
0.0
+ V
Average
- V
-2.0
V OUT = T C1 • T A + V 0°C
-4.0
Where:
-50
-25
VOUT = Sensor Output Voltage
FIGURE 4-2:
Sensor Accuracy.
V0°C = Sensor Output Voltage at 0°C
TC1 = Temperature Coefficient
50
75
100
125
MCP9700 Calibrated
The compensation technique provides a linear temperature reading. A firmware look-up table can be
generated to compensate for the sensor error.
Improving Accuracy
The MCP9700/01 accuracy can be improved by
performing a system calibration at a specific temperature. For example, calibrating the system at +25°C
ambient improves the measurement accuracy to a
±0.5°C (typ.) from 0°C to +70°C, as shown in
Figure 4-1. Therefore, when measuring relative
temperature change, this family measures temperature
with higher accuracy.
3.0
2.0
Accuracy (°C)
25
Temperature (°C)
TA = Ambient Temperature
4.1
0
1.0
4.2
Shutdown Using Microcontroller
I/O Pin
The MCP9700/01 low operating current of 6 µA (typ.)
makes it ideal for battery-powered applications.
However, for applications that require tighter current
budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled
to shut down the device. In such applications, the
microcontroller internal digital switching noise is
emitted to the MCP9700/01 as power supply noise.
This switching noise compromises measurement
accuracy. Therefore, a decoupling capacitor and series
resistor will be necessary to filter out the system noise.
0.0
4.3
-1.0
-2.0
VDD= 3.3V
10 Samples
-3.0
-50
-25
FIGURE 4-1:
vs. Temperature.
0
25
50
TA (°C)
75
100
125
Relative Accuracy to +25°C
The change in accuracy from the calibration temperature is due to the output non-linearity from the
first-order equation, as specified in Equation 4-2. The
accuracy can be further improved by compensating for
the output non-linearity.
DS21942B-page 8
Layout Considerations
The MCP9700/01 does not require any additional
components to operate. However, it is recommended
that a decoupling capacitor of 0.1 µF to 1 µF be used
between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin
using a 200Ω resistor with a 1 µF decoupling capacitor.
A high-frequency ceramic capacitor is recommended. It
is necessary for the capacitor to be located as close as
possible to the VDD and GND pins in order to provide
effective noise protection. In addition, avoid tracing
digital lines in close proximity to the sensor.
© 2005 Microchip Technology Inc.
MCP9700/01
4.4
Thermal Considerations
The MCP9700/01 measures temperature by monitoring the voltage of a diode located in the die. A
low-impedance thermal path between the die and the
PCB is provided by the pins. Therefore, the
MCP9700/01 effectively monitors the temperature of
the PCB. However, the thermal path for the ambient air
is not as efficient because the plastic device package
functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature
sensors. If the application requires measuring ambient
air, the PCB needs to be designed with proper thermal
conduction to the sensor pins.
The MCP9700/01 is designed to source/sink 100 µA
(max.). The power dissipation due to the output current
is relatively insignificant. The effect of the output
current can be described using Equation 5-1.
EQUATION 4-2:
EFFECT OF
SELF-HEATING
T J – T A = θ JA ( V DD I DD + ( V DD – V OUT ) I OUT )
Where:
TJ = Junction Temperature
TA = Ambient Temperature
θJA = Package Thermal Resistance
(331°C/W)
VOUT = Sensor Output Voltage
IOUT = Sensor Output Current
IDD = Operating Current
VDD = Operating Voltage
At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA,
the self-heating due to power dissipation (TJ – TA) is
0.179°C.
© 2005 Microchip Technology Inc.
DS21942B-page 9
MCP9700/01
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
5-Lead SC-70 (MCP9700)
Example:
Device
XXN (Front)
YWW (Back)
Code
MCP9700
AUN
MCP9701
AVN
AU2 (Front)
548 (Back)
Note: Applies to 5-Lead SC-70.
5-Lead SC-70 (MCP9701)
Example:
Device
XXNN
Code
MCP9700
AUNN
MCP9701
AVNN
AV25
Note: Applies to 5-Lead SC-70.
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21942B-page 10
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
MCP9700/01
5-Lead Plastic Small Outline Transistor (LT) (SC-70)
E
E1
D
p
B
n
1
Q1
A2
c
A1
L
Units
Dimension Limits
A
MILLIMETERS*
INCHES
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
n
p
Overall Height
A
.031
.043
0.80
Molded Package Thickness
A2
.031
.039
0.80
1.00
Standoff
A1
.000
.004
0.00
0.10
Number of Pins
5
5
.026 (BSC)
0.65 (BSC)
1.10
Overall Width
E
.071
.094
1.80
2.40
Molded Package Width
E1
.045
.053
1.15
1.35
Overall Length
D
.071
.087
1.80
2.20
Foot Length
L
.004
.012
0.10
0.30
Q1
.004
.016
0.10
0.40
Lead Thickness
c
.004
.007
0.10
0.18
Lead Width
B
.006
.012
0.15
0.30
Top of Molded Pkg to
Lead Shoulder
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
© 2005 Microchip Technology Inc.
Revised 07-19-05
DS21942B-page 11
MCP9700/01
NOTES:
DS21942B-page 12
© 2005 Microchip Technology Inc.
MCP9700/01
APPENDIX A:
REVISION HISTORY
Revision B (October 2005)
The following is the list of modifications:
• Added Section 3.0 “Pin Descriptions”
• Added the Linear Active Thermistor™ IC
trademark
• Removed the 2nd order temperature equation and
the temperature coeficient histogram
• Added a reference to AN1001 and corresponding
verbiage
• Added Figure 4-2 and corresponding verbiage
Revision A (March 2005)
• Original Release of this Document.
© 2005 Microchip Technology Inc.
DS21942B-page 13
MCP9700/01
NOTES:
DS21942B-page 14
© 2005 Microchip Technology Inc.
MCP9700/01
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
–
X
/XX
Temperature
Range
Package
MCP9700T: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9701T: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
Temperature Range: E
Package:
Examples:
a)
MCP9700T-E/LT:Linear Active Thermistor™ IC,
Tape and Reel,
-40°C to +125°C,
5LD SC70 package.
a)
MCP9701T-E/LT:Linear Active Thermistor™ IC,
Tape and Reel,
-40°C to +125°C,
5LD SC70 package.
= -40°C to +125°C
LT =
Plastic Small Outline Transistor, 5-lead
© 2005 Microchip Technology Inc.
DS21942B-page 15
MCP9700/01
NOTES:
DS21942B-page 16
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21942B-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
Malaysia - Penang
Tel: 604-646-8870
Fax: 604-646-5086
Philippines - Manila
Tel: 632-634-9065
Fax: 632-634-9069
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-352-30-52
Fax: 34-91-352-11-47
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
**DS21942B**
08/24/05
DS21942B-page 18
© 2005 Microchip Technology Inc.