MCX18N00A/MCX18N00B Micro Unit CCD Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. 64 pin QFN (Ceramic) Features • Ultra-compact size: MCX18N00A 18.3mm × 18.3mm × 8.4mm MCX18N00B 18.3mm × 18.3mm × 9.6mm • Y/C analog output • Employs a Type 1/5, 180,000-pixel color CCD image sensor • Equipped with a fixed focus lens: MCX18N00A F2.8/f = 2.9mm MCX18N00B F2.8/f = 4.0mm Peripheral ICs • EVR: MB88347 (Fujitsu Limited.) • EEPROM: AK6420 (Asahi Kasei Microsystems Co., Ltd.) Applications • TV conference cameras • Image input cameras Absolute Maximum Ratings • Supply voltage VH DVDD1, DVDD2, AVDD6 AVDD1, AVDD2, AVDD3 AVDD4, AVDD5 VCC VL • Input voltage VI • Operating temperature Topr • Storage temperature Tstg +18 +7.0 +7.0 +7.0 +14.0 –17.5 –0.5 to DVDD + 0.5 0 to +40 –30 to +80 V V V V V V V °C °C Recommended Operating Conditions • Supply voltage VH DVDD1, DVDD2, AVDD6 AVDD1, AVDD2, AVDD3 AVDD4, AVDD5 VCC VL • Input voltage VDCIN • Operating temperature Topr 14.25 to 15.75 3.0 to 3.6 4.75 to 5.25 4.5 to 5.5 4.5 to 5.25 –8.5 to –7.5 1.0 to 4.5 0 to +40 V V V V V V V °C Block Diagram Lens CCD Image Sensor S/H Digital Signal Process Y/C Timing Generator Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E97432B9X MCX18N00A/MCX18N00B SCK XCLR AVDD6 4FSCI 4FSCO AGND PCOMP VD HD DGND DGND DGND CCDOUT VBC VREFC IREFC Pin Configuration 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 SI VGC 57 AVDD5 58 39 SO IOC 59 38 CASI IOY 60 37 CSROM 36 RESETTG VGY 61 IREFY 62 35 DGND VREFY 63 34 OSCI 33 OSCO VBY 64 DGND 1 DGND 2 32 CK 31 DVDD1 30 XCS DGND 3 SHOUT 4 29 CASCK SHIN 5 28 CASO AGND 6 27 CSEVR AGND 7 26 DGND SIFSEL 8 25 VL –2– DCOUT SUBOUT DCIN AVDD3 AVDD1 AVDD2 OFFSET AGCCONT SUBIN VCC TEST AGND AVDD4 VH AGND DVDD2 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MCX18N00A/MCX18N00B Pin Description Pin No. Symbol I/O Description 1 DGND — Digital GND 2 DGND — Digital GND 3 DGND — Digital GND 4 SHOUT O Sample-and-hold output. Connect directly to Pin 5. 5 SHIN I Sample-and-hold input. 6 AGND — Analog GND 7 AGND I Analog GND 8 SIFSEL I Serial communication mode selection: Microcomputer (low)/RS232C (high). 9 DVDD2 — +3.3V power supply for signal processing system. 10 AGND — Analog GND 11 VH — +15V power supply for CCD image sensor drive. 12 AGND — Analog GND 13 AVDD4 — +5V power supply for A/D converter. 14 VCC — +5V power supply for sample-and-hold. 15 TEST I Test pin. Connect to VCC. 16 SUBIN I CCD image sensor SUB voltage input. 17 AGCCONT I AGC control. 18 OFFSET I OFFSET control. 19 AVDD1 — +5V power supply for sample-and-hold pulse. 20 AVDD2 — +5V power supply for RG pulse. 21 AVDD3 — +5V power supply for H pulse. 22 DCIN I DC amplifier input. 23 DCOUT O DC amplifier output. 24 SUBOUT O SUB pulse output. 25 VL — –8V power supply for CCD image sensor drive. 26 DGND — Digital GND 27 CSEVR O EVR chip select. 28 CASO O Serial communication data output for peripheral ICs (EVR, EEPROM). 29 CASCK O Serial communication clock output for peripheral ICs (EVR, EEPROM). 30 XCS I Switched by the SIFSEL setting. Chip select during microcomputer mode. Baud rate setting (4800bps (low)/9600bps (high)) during RS232C mode. 31 DVDD1 32 CK I 27MHz clock input. 33 OSCO O 27MHz oscillator output. 34 OSCI I 27MHz oscillator input. 35 DGND — — +3.3V power supply for timing generator. Digital GND –3– MCX18N00A/MCX18N00B Pin No. Symbol I/O 36 RESETTG I Reset pin (active low) with pull-up resistor for timing generator. 37 CSROM O EEPROM chip select. 38 CASI I Serial communication data input for peripheral ICs (EVR, EEPROM). 39 SO O Serial communication data output. 40 SI I Serial communication data input. 41 SCK I Serial communication clock input. 42 XCLR I Initialization pin (active low). EEPROM re-read. 43 AVDD6 — 44 4FSCI I 4fsc oscillator input. 45 4FSCO O 4fsc oscillator output. 46 AGND — Analog GND 47 PCOMP O Phase comparison output for PLL lock. 48 VD O Vertical sync output. 49 HD O Horizontal sync output. 50 DGND — Digital GND 51 DGND — Digital GND 52 DGND — Digital GND 53 CCDOUT O CCD image sensor buffer output. 54 VBC 55 VREFC 56 IREFC 57 VGC 58 AVDD5 — +5V power supply for D/A converter. 59 IOC O Chroma signal output. 60 IOY O Luminance signal output. 61 VGY 62 IREFY 63 VREFY 64 VBY I I Description +3.3V power supply for 4fsc oscillator. D/A converter peripheral circuit connection pins for chroma signal. D/A converter peripheral circuit connection pins for luminance signal. –4– MCX18N00A/MCX18N00B Electrical Characteristics DC Characteristics Item Symbol Supply voltage Operating current Conditions Min. Typ. Max. Unit DVDD1 3.0 3.3 3.6 V DVDD2 3.0 3.3 3.6 V AVDD1 4.75 5.00 5.25 V AVDD2 4.75 5.00 5.25 V AVDD3 4.75 5.00 5.25 V Pins AVDD4 A/D input amplitude = 2Vp-p 4.5 5.0 5.5 V AVDD5 D/A output amplitude = 2Vp-p 4.5 5.0 5.5 V AVDD6 3.0 3.3 3.6 V VCC 4.5 5.0 5.25 V VH 14.25 15.00 15.75 V VL –8.5 –8.0 –7.5 V IDD1 DVDD1 = 3.3V 7.2 mA IDD2 DVDD2 = 3.3V 36 mA IADD1 AVDD1 = 5.0V 3.1 mA IADD2 AVDD2 = 5.0V 1.0 mA IADD3 AVDD3 = 5.0V 4.9 mA IADD4 AVDD4 = 5.0V 15 mA IADD5 AVDD5 = 5.0V 24 mA IADD6 AVDD6 = 3.3V 1.0 mA ICC VCC = 5.0V 54 mA IH VH = 15.0V 6.9 mA IL VL = –8.0V 1.4 mA Input voltage 1 ∗5, ∗7 VT+ VT– DVDD2 × 0.8 Input voltage 2 ∗1, ∗6 VIH1 VIL1 DVDD1 × 0.7 Input voltage 3 DCIN VDCIN 1.0 Display Display value – 0.1 value Input voltage 4 SUBIN VSUB Input voltage 5 4FSCI AVDD4 × 0.7 VIH2 VIL2 –5– DVDD2 × 0.2 V DVDD1 × 0.3 V 4.5 V Display value + 0.1 V AVDD4 × 0.3 V MCX18N00A/MCX18N00B Item Conditions Pins Symbol Output voltage 1 ∗2 VOH1 VOL1 IOH1 = –1.2mA IOL1 = 2.4mA DVDD2 – 0.8 Output voltage 2 ∗3 VOH2 VOL2 IOH2 = –2.4mA IOL2 = 4.8mA DVDD2 – 0.8 Output voltage 3 ∗4 VOH3 VOL3 IOH3 = –8mA IOL3 = 8mA DVDD1/2 Output voltage 4 SUBOUT VOH4 VOL4 IOH4 = –4mA IOL4 = 5.4mA VH – 0.25 Output voltage 5 4FSCO VOH5 VOL5 IOH5 = –3mA IOL5 = 3mA AVDD4/2 Min. Typ. Max. 0.4 0.4 DVDD1/2 VL + 0.25 AVDD4/2 Unit V V V V V Hysteresis 1 ∗7 0.5 V Hysteresis 2 ∗5 0.6 V Threshold value 1 VTH1 1.35 V Threshold value 2 TEST ∗6 VTH2 DVDD1/2 V Threshold value 3 4FSCI VTH3 AVDD4/2 V Feedback resistance 1 OSC RFE1 OSCI = DVDD1 or GND 500k 2M 5M Ω Feedback resistance 2 4FSC RFE2 4FSCI = AVDD4 or GND 250k 1M 2.5M Ω Input amplitude OSC Pull-up resistance ∗1 DC amplifier gain Input leak current 1 Input leak current 2 ∗1 ∗2 ∗3 ∗4 ∗5 ∗6 ∗7 50MHz sine wave 0.5 50k RPU G SIFSEL II3 ∗5 II2 Vp-p 100k 150k Ω 75 µA 10 µA 4.4 VIN = DVDD2 12 VIN = GND or DVDD2 –10 RESETTG CSEVR, CSROM, SO, PCOMP, VD, HD CASO, CASCK OSCO XCS, SI, SCK, XCLR, CASI OSCI, CK SIFSEL –6– 30 MCX18N00A/MCX18N00B Note) VSUB display value The VSUB display value is displayed by a code on the rear surface of the MUC. — Symbol Actual voltage (V) 5.00 E Symbol Actual voltage (V) 8.50 W Symbol = 0 1 2 3 4 6 7 8 9 A C D 5.25 5.50 5.75 6.00 6.25 6.50 6.75 7.00 7.25 7.50 7.75 8.00 8.25 f G h J K L m N P R S U V 8.75 9.00 9.25 9.50 X Y Z 9.75 10.00 10.25 10.50 10.75 11.00 11.25 11.50 11.75 Actual voltage (V) 12.00 12.25 12.50 12.75 AC Characteristics Classification Item Symbol Min. Typ. Max. Unit XCLR Minimum low interval TWCLR 500 — — ns RESETTG Minimum low interval TWRST 35 — — ns SCK input pulse width (high interval) TWHSCK 430 — — ns SCK input pulse width (low interval) TWLSCK 430 — — ns XCS input setup time, activated by the falling edge of SCK TSUXCS 430 — — ns XCS input hold time, activated by the rising edge of SCK THXCS 640 — — ns TSUSI 140 — — ns THSI 140 — — ns SO output transition time (Hi-Z → Data active), activated by the falling edge of XCS TZDSO 70 — 200 ns SO transition time (Data active → Hi-Z), activated by the rising edge of XCS TDZSO 70 — 200 ns SO output delay time, activated by the falling edge of SCK TPDSO 70 — 240 ns SI input setup time, activated by the rising edge of Serial SCK communication SI input hold time, activated by the rising edge of SCK TSUXCS THXCS XCS TWLSCK TWHSCK SCK TPDSO TDZSO TZDSO SO DATA DATA DATA TSUSI THSI SI DATA DATA –7– DATA MCX18N00A/MCX18N00B Image Sensor Characteristics Item (Ta = 25°C) Unit Measurement method mV 1 Center of screen mV 2 Ta = 60°C, center of screen 0.012 % 3 Ydt 2 mV 4 Ta = 60°C ∆Ydt 1 mV 5 Ta = 60°C Symbol Min. Typ. Sensitivity S 285 360 Saturation signal Ysat 700 Smear Sm Dark signal Dark signal shading 0.007 Max. Measurement System [∗A] CCD OUT [∗Y] Micro unit CCD C.D.S AMP LPF1 Y signal output (3dB down 4MHz) Note) Adjust the amplifier gain so that the gain between [∗A] and [∗Y] equals 1. –8– Remarks MCX18N00A/MCX18N00B Image Sensor Characteristics Measurement Method Measurement conditions (1) In the following measurements, each supply voltage is at the typical values. (2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output of the measurement system. Definition of Standard Imaging Conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a ND2 filter and image at F5.6 or equivalent. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source with a uniformity of brightness within 2% at all angles (color temperature of 3200K). 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the values into the following formula. S = Ys × 250 [mV] 60 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity applying with an average value of Y signal output, 200mV, measure the minimum value of the Y signal. 3. Smear Set to standard imaging condition II. With using ND2 filter and the lens diaphragm at F5.6 or equivalent, adjust the luminous intensity to 500 times the intensity applying with an average value of Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output, and substitute the values into the following formula. Sm = 1 YSm 1 × × × 100 [%] (1/10V method conversion value) 10 200 500 4. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature of 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 5. Dark signal shading After measuring 4, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal output, and substitute the values into the following formula. ∆Ydt = Ydmax – Ydmin [mV] –9– MCX18N00A/MCX18N00B Optical Characteristics MCX18N00A Item Symbol Min. Typ. Max. Unit SH 50 % Horizontal SV 25 % Vertical Focus length f 2.9 Aperture F 2.8 Shading Resolution 220 R Remarks TV lines Center of screen Max. Unit Remarks SH 30 % Horizontal SV 15 % Vertical MCX18N00B Item Symbol Min. Typ. Focus length f 4.0 Aperture F 2.8 Shading Resolution 220 R TV lines Center of screen Measurement System IOY LPF Micro unit CCD AMP IOC BPF – 10 – VIDEO OUT MCX18N00A/MCX18N00B Communication Code Table CateByte Bit gory Symbol Description Recommended Initial EEPROM value (H) value (H) Address (H) 1 1 0 to 7 00 00 01 1 2 0 to 7 01 01 02 1 3 0 to 3 0 D 03 1 3 4 to 7 6 6 03 1 4 0 to 3 E E 04 1 4 4 to 7 YDLY 8 4 04 1 5 0 to 7 24 24 05 1 6 0 to 7 34 34 06 1 7 0 to 7 0B 0B 07 1 8 0 to 7 RMATY Matrix coefficient 2A 32 08 1 9 0 to 7 RMATC Matrix coefficient 12 F8 09 1 10 0 to 7 BMATY Matrix coefficient 3E 32 0A 1 11 0 to 7 BMATC Matrix coefficient CA D3 0B 1 12 0 to 7 0C 0C 0C 1 13 0 to 7 00 00 0D 1 14 0 to 7 FF 00 0E 2 1 0 to 7 YGAIN 86 86 0F 2 2 0 to 7 AA AA 10 2 3 0 to 7 26 26 11 2 4 0 to 7 84 84 12 2 5 0 to 7 04 04 13 2 6 0 to 7 FC FC 14 2 7 0 to 3 RBQUAD Linear matrix quadrant control — F 2 7 4 CONGAIN Linear matrix gain — 1 2 7 5 CONHUE Linear matrix hue — 1 2 7 6 to 7 — 0 2 8 0 to 7 RYGAIN Linear matrix coefficient Adjustment value 20 4F, 51, 53, 55 2 9 0 to 7 BYGAIN Linear matrix coefficient Adjustment value 11 50, 52, 54, 56 2 10 0 to 7 RYHUE Linear matrix coefficient Adjustment value D0 57, 59, 5B, 5D 2 11 0 to 7 BYHUE Linear matrix coefficient Adjustment value F8 58, 5A, 5C, 5E 3 1 0 to 7 00 00 15 3 2 0 to 7 00 00 16 3 3 0 to 7 00 00 17 3 4 0 to 7 SHOFST 3D 3D 18 3 5 0 to 7 89 89 19 3 6 0 to 7 00 00 1A Setup level Luminance signal delay adjustment Luminance signal gain Sample-and-hold output offset – 11 – MCX18N00A/MCX18N00B CateByte Bit gory Symbol 3 7 0 to 7 4 1 0 to 7 VREFY 4 2 4 Description Recommended Initial EEPROM value (H) value (H) Address (H) 00 00 1B VREFY adjustment Adjustment value 70 1C 0 to 7 VREFC VREFC adjustment Adjustment value 66 1D 3 0 to 7 VSUB VSUB adjustment Adjustment value 80 1E 4 4 0 to 7 80 80 1F 5 1 0 to 7 AGCCONT Gain control 1E 1E 20 5 2 0 to 7 FF FF 21 5 3 0 SHTSPDM Shutter speed (bit 8) — 0 5 3 1 SHTHL Electronic shutter high speed/ low speed switching — 0 5 3 2 SHTON Electronic shutter OFF/ON — 0 5 3 3 to 7 — 10 5 4 0 to 7 SHTSPDL — 00 5 5 0 to 7 — 00 5 6 0 to 7 — 00 5 7 0 to 7 — 00 6 1 0 to 7 WBR White balance control 3A 3A 22 6 2 0 to 7 WBG White balance control 26 26 23 6 3 0 to 7 WBB White balance control 48 48 24 6 4 0 to 7 — D0 6 5 0 to 7 — 04 7 1 0 to 7 00 00 25 7 2 0 to 7 14 14 26 7 3 0 to 7 05 05 27 7 4 0 to 7 55 55 28 7 5 0 to 7 74 74 29 8 1 0 to 2 — 0 8 1 3 — 0 8 1 4 to 6 AEADJUST AE adjustment mode switching — 0 8 1 7 AE AE control — 0 8 2 0 MCR Microcontroller control — 0 8 2 1 SPRS Suppress control — 0 8 2 2 — 0 8 2 3 — 0 8 2 4 to 7 — 0 8 3 0 to 7 — 00 AWB SW Shutter speed (bit 0 to bit 7) AWB control External switch control – 12 – MCX18N00A/MCX18N00B CateByte Bit gory Symbol Description Recommended Initial EEPROM value (H) value (H) Address (H) 8 4 0 FLON Flickerless ON/OFF — 0 8 4 1 BLCOF Backlight compensation ON/OFF — 0 8 4 2 to 4 — 0 8 4 5 AWB1 AWB mode selection — 0 8 4 6 AWB2 AWB mode selection — 0 8 4 7 AWB3 AWB mode selection — 0 8 5 0 E2WR EEPROM write control — 0 8 5 1 E2WEN EEPROM write enable transmit — 0 8 5 2 — 0 8 5 3 E2RSW EEPROM read control — 0 8 5 4 E2RAL1 EEPROM read range specification — 0 8 5 5 E2RAL2 EEPROM read range specification — 0 8 5 6 E2RAL3 EEPROM read range specification — 0 8 5 7 E2RAL4 EEPROM read range specification — 0 8 6 0 to 7 E2CODE EEPROM control code — 00 8 7 0 to 7 E2ADRS EEPROM address — 00 8 8 0 to 7 E2DATA EEPROM data — 00 8 9 0 to 7 SPCODE SPEC code — 00 8 10 0 to 7 SPCDAT SPEC data — 00 8 11 0 to 7 — 00 9 1 0 to 7 07 07 2A 9 2 0 to 7 00 00 2B 9 3 0 to 7 02 02 2C 9 4 0 to 7 00 00 2D 9 5 0 to 7 80 80 2E 10 1 0 to 7 — 00 10 2 0 to 6 ADJSTH Horizontal position specification — 00 10 2 ADJSTVL Vertical position specification — 0 10 3 0 to 1 ADJSTVM Vertical position specification — 0 10 3 2 — 0 10 3 3 — 0 10 3 4 to 7 — 0 10 4 0 PGON1 Pattern generator ON/OFF — 0 10 4 1 PGON2 Pattern generator ON/OFF — 0 10 4 2 — 0 10 4 3 — 0 7 PGON3 Pattern generator ON/OFF – 13 – MCX18N00A/MCX18N00B CateByte Bit gory Symbol 10 4 10 4 10 5 0 10 5 1 10 5 10 5 4 10 5 5 10 5 6 to 7 PGGAIN 10 6 10 Recommended Initial EEPROM value (H) value (H) Address (H) Color bar monochrome switching — 0 Color specification — 0 PGHV Horizontal/vertical switching — 0 PGRSTR Raster setting — 0 Pattern switching — 0 Pattern generator ON/OFF — 0 — 0 — 0 0 to 7 — 00 7 0 to 7 — 00 10 8 0 to 7 — 00 10 9 0 to 7 — 00 4 PGCOLSEL Description 5 to 7 PGCOL 2 to 3 PGPTSL PGON4 Output level – 14 – MCX18N00A/MCX18N00B SPEC Code Table Code (H) 1 Symbol [AE] SPD Description AE response speed 2 Recommended value (H) Initial Address value (H) (H) 08 08 2F 04 04 30 3 [AE] MAX AE maximum gain BB BB 31 4 [AE] MIN AE minimum gain Adjustment value 11 32 5 [AE] LIM AE shutter speed upper limit 07 07 33 EE EE 34 6 7 [AE] BLC Backlight compensation control 0C 0C 35 8 [AE] HIST Histogram backlight compensation control 00 00 36 9 01 01 37 0A 01 01 38 0B 03 03 39 0C 03 03 3A 11 [AWB] SPD AWB response speed 02 02 3B 12 [AWB] FRM AWB detection window setting 12 00 3C 13 [AWB] RSFT 03 03 3D 14 [AWB] BSFT 02 02 3E 15 [AWB] USRR 4C 4C 3F 16 [AWB] USRB 58 58 40 17 [AWB] PRER Adjustment value 3A 41 18 [AWB] PREB Adjustment value 90 42 21 08 08 43 22 05 05 44 23 05 05 45 24 04 04 46 25 07 07 47 31 52 52 48 32 80 80 49 33 8A 8A 4A 34 3D 3D 4B 35 80 80 4C 36 00 00 4D – 15 – MCX18N00A/MCX18N00B Notes on Handling 1) Static charge prevention Micro unit CCDs are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling micro unit CCDs. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Please use IC socket for mounting of micro unit CCDs. IC socket : HS6401-K YAMATO SCIENTIFIC CO.,LTD. 3) Dust and dirt protection a) Operate in clean environments. b) Do not either touch lens by hand or have any object come in contact with lens surfaces. Should dirt stick to a lens surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the lens. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 4) Do not expose to strong light (sun rays) for long periods. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) Micro unit CCDs are precise optical equipment that should not be subject to mechanical shocks. – 16 – GND +15V +5V –8V +3.3V C132 0.1 DI 14 CLK 13 LD 12 DO 11 AO8 10 VCC 9 4 AO4 5 AO5 6 AO6 7 AO7 8 VDD AO1 15 2 AO2 3 AO3 GND 16 1 VSS L109 10µH L101 10µH C101 10/6.3V TP101 S/H OUT 57 VGC 7 AGND SIFSEL 8 6 AGND 5 SHIN 4 SHOUT 3 DGND 2 DGND 1 DGND 64 VBY 63 VREFY 62 IREFY 61 VGY 60 IOY 59 IOC TP102 CCDOUT C126 0.1 R105 220 X102 14.31818MHz C125 C124 18p 18p 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 58 AVDD5 IC101 MCX18N00A/B C102 0.1 C105 0.1 SO 39 SI 40 CSROM 37 C106 0.1 C107 0.1 C108 0.1 C109 2.2/20V C110 0.1 X101 27MHz C121 10p C111 22/20V C112 6.8 16V R118 1k C116 0.1 L110 10µH Q103 2SA1586YG R117 3.3k C115 1000p 50V LPF (3.0MHz) 1 2 3 R119 1k 1 2 3 C133 27p FL101 BPF (3.58MHz) R114 1k Q101 2SA1586YG R113 3.3k D101 MA159A-TX (2/2) R102 1M C114 0.1 25V R101 100k C113 1 35V D101 MA159A-TX (1/2) L106 10µH C118 0.1 C1191000p C120 10p C117 10/16V VL 25 CSEVR 27 DGND 26 CASO 28 CASCK 29 XCS 30 DVDD1 31 CK 32 OSCO 33 OSCI 34 DGND 35 RESETTG 36 C123 0.1 R103 270 C122 0.1 1 2 3 CASI 38 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 C103 2.2/20V IC104 S-80730AN R121 47k R120 33k R115 1k +5V Y R122 2.2k C Q104 2SD2216J-Q R116 3.3k Q102 2SD2216J-Q Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. C104 1/10V R110 10 R111 3.3k 0.5% C130 0.1 C129 0.1 R109 220 0.5% R108 220 0.5% C127 R107 0.1 10 C128 0.1 VREFC AGND IC102 MB88347PFV R106 3.3k 0.5% VBC VH L102 100µH R112 10k CCDOUT AGND GND 5 DGND AVDD4 L103 10µH RESET 6 DGND VCC 4 DO DGND TEST L104 10µH 3 DI VD AGCCONT VCC 8 HD SUBIN BUSY 7 AGND AVDD1 2 SK AVDD6 1 CS L108 10µH DCIN C131 0.1 4FSCI AVDD3 IC103 AK6420AM 4FSCO AVDD2 L105 10µH SO SI DCOUT IREFC DVDD2 PCOMP OFFSET XCLR OUT VDD VSS RS-232C R104 100k SCK SUBOUT – 17 – L107 100µH IN GND OUT IN GND OUT Application Circuit MCX18N00A/MCX18N00B – 18 – 41 56 18.28 ± 0.3 16.2 7.6 40 2° 57 PACKAGE WEIGHT 4.20g Au LEAD TREATMENT LEAD MATERIAL ceramic 0.30min 64 1 Ø 04 1. 25 9 24 8 1st. pin Index. 35° 18.28 ± 0.3 7.6 PACKAGE MATERIAL PACKAGE STRUCTURE MCX18N00A 3.5 ± 0.4 3.20max. 2-1.50max 64pin QFN (720mil) 3.20max. 64-R(0.25) 5.50max 16.08 ± 0.2 P1.016 X 15 = 15.24 64 - 0.50 5.50max Unit: mm 2-1.50max 8.37 ± 0.5 7.30 ± 0.5 Package Outline MCX18N00A/MCX18N00B 64 - 0.80 – 19 – 56 57 2° 41 40 PACKAGE WEIGHT 4.20g Au LEAD TREATMENT LEAD MATERIAL ceramic PACKAGE MATERIAL 0.30min 64 1 04 1. Ø 25 9 24 35° 8 1st. pin Index. 18.28 ± 0.3 7.6 3.5 ± 0.4 18.28 ± 0.3 16.2 7.6 PACKAGE STRUCTURE MCX18N00B Unit: mm 3.20max. 2-1.50max 64pin QFN (720mil) 5.50max 3.20max. 64-R(0.25) 5.50max 16.08 ± 0.2 P1.016 X 15 = 15.24 64 - 0.50 2-1.50max 9.57 ± 0.5 8.50 ± 0.5 Package Outline MCX18N00A/MCX18N00B 64 - 0.80