Freescale Semiconductor Advance Information Document Number: MM908E625 Rev 6.0, 11/2007 Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication 908E625 H-BRIDGE POWER SUPPLY WITH EMBEDDED MCU AND LIN The 908E625 is an integrated single-package solution including a high-performance HC08 microcontroller with a SMARTMOS TM analog control IC. The HC08 includes Flash Memory, a timer, Enhanced Serial Communications Interface (ESCI), an Analog-to-Digital Converter (ADC), Serial Peripheral Interface (SPI) (only internal), and an Internal Clock Generator (ICG) module. The analog control die provides fully protected H-Bridge/high-side outputs, voltage regulator, autonomous watchdog with cyclic wake-up, and Local Interconnect Network (LIN) physical layer. The single-package solution, together with LIN, provides optimal application performance adjustments and space-saving PCB design. It is well suited for the control of automotive mirror, door lock, and light-levelling applications. DWB SUFFIX EK SUFFIX (Pb-FREE) 98ARL105910 54-PIN SOICWB-EP Features • • • • • • • • • • • • • High-Performance M68HC908EY16 Core 16K Bytes of On-Chip Flash Memory & 512 Bytes of RAM Internal Clock Generation Module Two 16-bit, 2-Channel Timers 10-Bit Analog-to-Digital Converter LIN Physical Layer Autonomous Watchdog with Cyclic Wakeup Three Two-Pin Hall-Effect Sensor Input Ports One Analog Input with Switchable Current Source Four Low RDS(ON) Half-Bridge Outputs One Low RDS(ON) High-Side Output 13 Micro Controller I/Os Pb-free packaging designated by suffix code EK 3 LIN VREFH VDDA EVDD VDD ORDERING INFORMATION Device MM908E625ACEK HB1 M HB2 HB3 HB4 VREFL VSSA EVSS VSS RST RST_A IRQ IRQ_A SS PTB1/AD1 RXD PTE1/RXD PTD1/TACH1 FGEN BEMF PTD0/TACH0/BEMF M M 4 Half-Bridges Controlling 3 Loads HS High-Side Output HVDD H1 H2 H3 PA1 GND EP Port A I/Os Port B I/Os Port C I/Os Switchable Internal VDD Output Three 2-Terminal Hall-Effect Sensor Inputs Analog Input with Current Source Microcontroller Ports 2 Figure 1. 908E625 Simplified Application Diagram * This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2006, 2007. All rights reserved. Package -40°C to 85°C 54 SOICW EP MM908E625ACDWB 908E625 VSUP Temperature Range (TA) FLSVPP PTC4/OSC1 PTC3/OSC2 PTC2/MCLK PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTB5/AD5 PTB4/AD4 PTB3/AD3 PTA4/KBD4 PTA3/KBD3 VDD VSS PTA6/SS PTA5/SPSCK PTA4/KBD4 PTA3/KBD3 PTA2/KBD2 PTA1/KBD1 PTA0/KBD0 Security Module PTE0/TxD PTE1/RxD PTD0/TACH0 PTD1/TACH1 PTC4/OSC1 PTC3/OSC2 PTC2/MCLK PTC1/MOSI PTC0/MISO BEMF Module Prescaler Module Power-On Reset Module Periodic Wake-Up Timebase Module Configuration Register Module Serial Pheripheral Interface Module Computer Operating Properly Module Enhanced Serial Communication Interface Module 2-channel Timer Interface Module B 2-Channel Timer Interface Module A 5-Bit Keyboard Interrupt Module Single Breakpoint Break Module Arbiter Module IRQ POWER 10 Bit Analog-toDigital Converter Module Single External IRQ Module 24 Internal System Integration Module Internal Clock Generator Module PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTB5/AD5 PTB4/AD4 PTB3/AD3 PTB2/AD2 PTB1/AD1 PTB0/AD0 VREFH VDDA VREFL VSSA IRQ RST OSC2 OSC1 User Flash Vector Space, 36 Bytes Flash Programming (burn in) ROM, 1024 Bytes Monitor ROM, 310 Bytes User RAM, 512 Bytes User Flash, 15,872 Bytes PORT A PORT B 2 PTA2/KBD2 VDDA PTA1/KBD1 EVDD Control and Status Register, 64 Bytes VSSA DDRA PTA0/KBD0 EVSS ALU VREFL M68HC08 CPU RST Internal Bus PTB1/AD1 DDRB PTD0/TACH0 DDRC PTE1/RXD PTD1/TACH1 MCU Die PTB0/AD0 PTA5/SPSCK PTC1/MOSI PTC0/MISO PTE0/TXD SS TXD ADOUT SPSCK MOSI MISO SS PORT C RXD Analog Die Analog Multiplexer VSUP Prescaler Chip Temp Autonomous Watchdog SPI & CONTROL Interrupt Control Module Reset Control Module LIN Physical Layer LIN DDRD FGEN PORT D BEMF FGEN BEMF FGEN BEMF FGEN BEMF FGEN FGEN RST_A DDRE Analog Input with Current Source Hall-Effect Sensor Inputs Half Bridge Driver & Diagnostic Half Bridge Driver & Diagnostic Half Bridge Driver & Diagnostic Half Bridge Driver & Diagnostic High Side Driver & Diagnostic Switched VDD Driver & Diagnostic Voltage Regulator VSUP1-3 PORT E GND1-2 CPU Registers VSUP VSUP VSUP VSUP VSUP PA1 H3 H2 H1 HB4 HB3 HB2 HB1 HS HVDD VDD VSS INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM IRQ_A BEMF VREFH Figure 2. 908E625 Simplified Internal Block Diagram 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTC4/OSC1 PTC3/OSC2 PTC2/MCLK PTB5/AD5 PTB4/AD4 PTB3/AD3 1 54 2 53 3 52 4 51 5 50 6 49 7 48 8 47 IRQ RST 9 46 10 45 PTB1/AD1 PTD0/TACH0/BEMF PTD1/TACH1 NC FGEN BEMF 11 44 12 43 16 39 RST_A 17 38 IRQ_A SS 18 37 19 36 LIN NC NC HB1 VSUP1 GND1 HB2 VSUP2 20 35 21 34 22 33 23 32 24 31 25 30 26 29 27 28 13 14 15 42 Exposed Pad 41 40 PTA0/KBD0 PTA1/KBD1 PTA2/KBD2 FLSVPP PTA3/KBD3 PTA4/KBD4 VREFH VDDA EVDD EVSS VSSA VREFL PTE1/RXD RXD VSS PA1 VDD H1 H2 H3 HVDD NC HB4 VSUP3 GND2 HB3 HS Figure 3. 908E625 Pin Connections (Transparent Package Top View) Table 1. 908E625 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 14. Pin Function Pin Pin Name Formal Name Definition MCU 1 2 6 7 8 11 PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTB5/AD5 PTB4/AD4 PTB3/AD3 PTB1/AD1 Port B I/Os These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. MCU 3 4 5 PTC4/OSC1 PTC3/OSC2 PTC2/MCLK Port C I/Os These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. MCU 9 IRQ MCU 10 RST External Reset This pin is bidirectional, allowing a reset of the entire system. It is driven low when any internal reset source is asserted. MCU 12 13 PTD0/TACH0/BEMF PTD1/TACH1 Port D I/Os These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. – 14, 21, 22, 33 NC No Connect Not connected. External Interrupt Input This pin is an asynchronous external interrupt input pin. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 3 PIN CONNECTIONS Table 1. 908E625 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 14. Pin Function Pin Pin Name Formal Name Definition MCU 42 PTE1/RXD Port E I/O This pin is a special-function, bidirectional I/O port pin that can is shared with other functional modules in the MCU. MCU 43 48 VREFL VREFH ADC References These pins are the reference voltage pins for the analog-todigital converter (ADC). MCU 44 47 VSSA VDDA ADC Supply pins These pins are the power supply pins for the analog-to-digital converter. MCU 45 46 EVSS EVDD MCU Power Supply Pins These pins are the ground and power supply pins, respectively. The MCU operates from a single power supply. MCU 49 50 52 53 54 PTA4/KBD4 PTA3/KBD3 PTA2/KBD2 PTA1/KBD1 PTA0/KBD0 Port A I/Os These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. MCU 51 FLSVPP Test Pin Analog 15 FGEN Current Limitation Frequency Input Analog 16 BEMF Analog 17 RST_A Internal Reset Analog 18 IRQ_A Internal Interrupt Output Analog 19 SS Slave Select For test purposes only. Do not connect in the application. This is the input pin for the half-bridge current limitation and the high-side inrush current limiter PWM frequency. Back Electromagnetic This pin gives the user information about back electromagnetic Force Output force (BEMF). This pin is the bidirectional reset pin of the analog die. This pin is the interrupt output pin of the analog die indicating errors or wake-up events. This pin is the SPI slave select pin for the analog chip. Analog 20 LIN LIN Bus This pin represents the single-wire bus transmitter and receiver. Analog 23 26 29 32 HB1 HB2 HB3 HB4 Half-Bridge Outputs This device includes power MOSFETs configured as four halfbridge driver outputs. These outputs may be configured for step motor drivers, DC motor drivers, or as high-side and low-side switches. Analog 24 27 31 VSUP1 VSUP2 VSUP3 Power Supply Pins These pins are device power supply pins. Analog 25 30 GND1 GND2 Power Ground Pins These pins are device power ground connections. Analog 28 HS High-Side Output This output pin is a low RDS(ON) high-side switch. Analog 34 HVDD Analog 35 36 37 H3 H2 H1 Hall-Effect Sensor Inputs These pins provide inputs for Hall-effect sensors and switches. Analog 38 VDD Voltage Regulator Output The +5.0 V voltage regulator output pin is intended to supply the embedded microcontroller. Analog 39 PA1 Analog Input This pin is an analog input port with selectable source values. Analog 40 VSS Voltage Regulator Ground Analog 41 RXD – EP Exposed Pad Switchable VDD Output This pin is a switchable VDD output for driving resistive loads requiring a regulated 5.0 V supply; e.g., 3-pin Hall-effect sensors. Ground pin for the connection of all non-power ground connections (microcontroller and sensors). LIN Transceiver Output This pin is the output of LIN transceiver. Exposed Pad The exposed pad pin on the bottom side of the package conducts heat from the chip to the PCB board. 908E625 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit Analog Chip Supply Voltage under Normal Operation, Steady State VSUP(SS) -0.3 to 28 Analog Chip Supply Voltage under Transient Conditions (1) VSUP(PK) -0.3 to 40 VDD -0.3 to 6.0 VIN (ANALOG) -0.3 to 5.5 VIN (MCU) VSS -0.3 to VDD +0.3 All Pins Except VDD, VSS, PTA0:PTA6, PTC0:PTC1 IPIN(1) ±15 Pins PTA0:PTA6, PTC0:PTC1 IPIN(2) ±25 Maximum Microcontroller VSS Output Current IMVSS 100 mA Maximum Microcontroller VDD Input Current IMVDD 100 mA ELECTRICAL RATINGS V Supply Voltage Microcontroller Chip Supply Voltage Input Pin Voltage V Analog Chip Microcontroller Chip mA Maximum Microcontroller Current per Pin LIN Supply Voltage V Normal Operation (Steady-State) Transient Conditions (1) VBUS(SS) -18 to 28 VBUS(DYNAMIC) 40 VESD ±3000 V ESD Voltage (2) Human Body Model (HBM) ±150 Machine Model (MM)(3) ±500 Charge Device Model (CDM)(4) THERMAL RATINGS TSTG -40 to 150 °C Ambient Operating Temperature TA -40 to 85 °C Operating Case Temperature (5) TC -40 to 85 °C Operating Junction Temperature(6) TJ -40 to 125 °C TSOLDER 245 °C Storage Temperature Peak Package Reflow Temperature During Solder Mounting (7) Notes 1. Transient capability for pulses with a time of t < 0.5 sec. 2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω) 3. ESD voltage testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 Ω) 4. ESD voltage testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF). 5. 6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40°C ≤ TJ ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit VSUP 8.0 – 18 V IRUN – 20 – mA ISTOP – – 60 µA V SUPPLY VOLTAGE Nominal Operating Voltage SUPPLY CURRENT NORMAL Mode VSUP = 12 V, Power Die ON (PSON=1), MCU Operating Using Internal Oscillator at 32 MHz (8.0 MHz Bus Frequency), SPI, ESCI, ADC Enabled STOP Mode (8) VSUP = 12 V, Cyclic Wake-Up Disabled DIGITAL INTERFACE RATINGS (ANALOG DIE) Output Pins RST_A, IRQ_A Low-State Output Voltage (IOUT = -1.5 mA) VOL – – 0.4 High-State Output Voltage (IOUT = 1.0 µA) VOH 3.85 – – VOL – – 0.4 VOH 3.85 – – CIN – 4.0 – pF V Output Pins BEMF, RXD Low-State Output Voltage (IOUT = -1.5 mA) High-State Output Voltage (IOUT = 1.5 mA) Output Pin RXD–Capacitance (9) V Input Pins RST_A, FGEN, SS Input Logic Low Voltage VIL – – 1.5 Input Logic High Voltage VIH 3.5 – – CIN – 4.0 – pF Pins RST_A, IRQ_A –Pullup Resistor RPULLUP1 – 10 – kΩ Pin SS –Pullup Resistor RPULLUP2 – 60 – kΩ RPULLDOWN – 60 – kΩ IPULLUP – 35 – µA Input Pins RST_A, FGEN, SS –Capacitance (9) Pins FGEN, MOSI, SPSCK–Pulldown Resistor Pin TXD–Pullup Current Source Notes 8. STOP mode current will increase if VSUP exceeds 15 V. 9. This parameter is guaranteed by process monitoring but is not production tested. 908E625 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40°C ≤ TJ ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit Threshold VHVRON 27 30 33 Hysteresis VHVRH – 1.5 – VLVRON 3.6 4.0 4.5 V VLVRH – 100 – mV Threshold VHVION 17.5 21 23 Hysteresis VHVIH – 1.0 – SYSTEM RESETS AND INTERRUPTS High-Voltage Reset V Low-Voltage Reset Threshold Hysteresis High-Voltage Interrupt V Low-Voltage Interrupt V Threshold VLVION 6.5 – 8.0 Hysteresis VLVIH – 0.4 – Threshold TRON – 170 – Hysteresis TRH 5.0 – – Threshold TION – 160 – Hysteresis TIH 5.0 – – 4.75 5.0 5.25 °C High-Temperature Reset (10) °C High-Temperature Interrupt (11) VOLTAGE REGULATOR Normal Mode Output Voltage VDDRUN IOUT = 60 mA, 6.0 V < VSUP < 18 V Load Regulation VLR IOUT = 80 mA, VSUP = 9.0 V, TJ = 125°C STOP Mode Output Voltage (Maximum Output Current 100 µA) V VDDSTOP mV – – 100 4.5 4.7 4.9 – – 1.4 VSUP -1.0 – – 20 30 60 0.0 – 20 V LIN PHYSICAL LAYER Output Low Level VLIN-LOW TXD LOW, 500 Ω Pullup to VSUP Output High Level VLIN-HIGH TXD HIGH, IOUT = 1.0 µA Pullup Resistor to VSUP Leakage Current to GND V RSLAVE V µA IBUS_PAS_rec Recessive State (-0.5 V < VLIN < VSUP) kΩ µA Leakage Current to GND (VSUP Disconnected) Including Internal Pullup Resistor, VLIN @ -18 V IBUS_NO_GND – -600 – Including Internal Pullup Resistor, VLIN @ +18 V IBUS – 25 – Notes 10. This parameter is guaranteed by process monitoring but is not production tested. 11. High-Temperature Interrupt (HTI) threshold is linked to High-Temperature Reset (HTR) threshold (HTR = HTI + 10°C). 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40°C ≤ TJ ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Recessive VIH 0.6 VLIN – VSUP Dominant VIL 0.0 – 0.4 VLIN Threshold VITH – VSUP /2 – VIHY 0.01 VSUP – 0.1 VSUP VWTH – VSUP /2 – V RDS(ON)HS – 600 700 mΩ IHSOC 3.9 – 7.0 A High Side RDS(ON)HB_HS – 425 500 Low Side RDS(ON)HB_LS – 400 500 High-Side Overcurrent Shutdown IHBHSOC 4.0 – 7.5 A Low-Side Overcurrent Shutdown IHBLSOC 2.8 – 7.5 A Current Limit 1 (CLS2 = 0, CLS1 = 1, CLS0 = 1) ICL1 – 55 – Current Limit 2 (CLS2 = 1, CLS1 = 0, CLS0 = 0) ICL2 210 260 315 Current Limit 3 (CLS2 = 1, CLS1 = 0, CLS0 = 1) ICL3 300 370 440 Current Limit 4 (CLS2 = 1, CLS1 = 1, CLS0 = 0) ICL4 450 550 650 Current Limit 5 (CLS2 = 1, CLS1 = 1, CLS0 = 1) ICL5 600 740 880 Half-Bridge Output HIGH Threshold for BEMF Detection VBEMFH – -30 0 V Half-Bridge Output LOW Threshold for BEMF Detection VBEMFL – -60 -5.0 mV VBEMFHY – 30 – mV LIN Receiver Input Hysteresis LIN Wake-Up Threshold Unit V HIGH-SIDE OUTPUT (HS) Switch ON Resistance @ TJ = 25°C with ILOAD = 1.0 A High-Side Overcurrent Shutdown HALF-BRIDGE OUTPUTS (HB1:HB4) Switch ON Resistance @ TJ = 25°C with ILOAD = 1.0 A mΩ Low-Side Current Limitation @ TJ = 25°C Hysteresis for BEMF Detection mA Low-Side Current-to-Voltage Ratio (VADOUT [V]/IHB [A]) V/A CSA = 1 RATIOH 7.0 12.0 14.0 CSA = 0 RATIOL 1.0 2.0 3.0 IHVDDOCT 24 30 40 mA RATIOVSUP 4.8 5.1 5.35 – Voltage/Temperature Slope STtoV – 19 – mV/°C Output Voltage @ 25°C VT25 1.7 2.1 2.5 V VSUP < 16.2 V VHALL1 – VSUP - 1.2 – VSUP > 16.2 V VHALL2 – – 15 SWITCHABLE VDD OUTPUT (PH.D.) Overcurrent Shutdown Threshold VSUP DOWN-SCALER Voltage Ratio (RATIOVSUP = VSUP /VADOUT) INTERNAL DIE TEMPERATURE SENSOR HALL-EFFECT SENSOR INPUTS (H1:H3) Output Voltage V 908E625 8 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40°C ≤ TJ ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Threshold IHSCT 6.9 8.8 11 Hysteresis IHSCH – 0.88 – IHL – 90 – mA Overcurrent Warning HP_OCF Flag Threshold] VHPOCT – 3.0 – V Dropout Voltage @ ILOAD = 15 mA VHPDO – 0.5 – V ICSPA1 570 670 770 CSSEL1 = 0, CSSEL0 = 0 NCSPA1-0 8.5 10 11.5 CSSEL1 = 0, CSSEL0 = 1 NCSPA1-1 28.5 30 31.5 CSSEL1 = 1, CSSEL0 = 0 NCSPA1-2 58.5 60 61.5 Sense Current Output Current Limitation Unit mA ANALOG INPUT (PA1) µA Current Source PA1 CSSEL1 = 1, CSSEL0 = 1 Selectable Scaling Factor Current Source PA1 (I(N) = ICSPA1* N) % 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 9 ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics All characteristics are for the analog chip only. Please refer to the specification for 68HC908EY16 for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ VSUP ≤ 16 V, -40°C ≤ TJ ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit LIN PHYSICAL LAYER µs Propagation Delay (12), (13) TXD LOW to LIN LOW t TXD-LIN-low TXD HIGH to LIN HIGH t TXD-LIN-high LIN LOW to RXD LOW t LIN-RXD-low LIN HIGH to RXD HIGH t LIN-RXD- – – – – -2.0 -2.0 – – 4.0 4.0 – – 6.0 6.0 8.0 8.0 2.0 2.0 -1.0 -2.0 -3.0 1.0 2.0 3.0 SRS -2.0 – 2.0 µs t HPPD – 1.0 – µs t OSC – 40 – µs AWD Period Low = 512 t OSC t AWDPH 16 22 28 ms AWD Period High = 256 t OSC t AWDPL 8.0 11 14 ms t AWDHPON – 90 – µs high TXD Symmetry t TXD-SYM RXD Symmetry t RXD-SYM SRF Output Falling Edge Slew Rate (12), (14) 80% to 20% V/µs SRR Output Rising Edge Slew Rate (12), (14) V/µs 20% to 80%, RBUS > 1.0 kΩ, CBUS < 10 nF LIN Rise/Fall Slew Rate Symmetry (12), (14) HALL-EFFECT SENSOR INPUTS (H1:H3) Propagation Delay AUTONOMOUS WATCHDOG (AWD) AWD Oscillator Period AWD Cyclic Wake-Up On Time Notes 12. All LIN characteristics are for initial LIN slew rate selection (20 kBaud) (SRS0:SRS1= 00). 13. See Figure 2. 14. See Figure 3. MICROCONTROLLER PARAMETRICS Table 5. Microcontroller Description For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet. Module Description Core High-Performance HC08 Core with a Maximum Internal Bus Frequency of 8.0 MHz Timer Two 16-Bit Timers with Two Channels (TIM A and TIM B) Flash 16 K Bytes RAM 512 Bytes ADC 10-Bit Analog-to-Digital Converter SPI SPI Module 908E625 10 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS MICROCONTROLLER PARAMETRICS Table 5. Microcontroller Description For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet. Module Description ESCI Standard Serial Communication Interface (SCI) Module Bit-Time Measurement Arbitration Prescaler with Fine Baud-Rate Adjustment ICG Internal Clock Generation Module (25% Accuracy with Trim Capability to 2%) BEMF Counter Special Counter for SMARTMOS™ BEMF Output 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 11 ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS t TXD-LIN-low t t TXD-LIN-high tTx-LIN-high Tx-LIN-low TXD Tx TXD LIN LIN Recessive State 0.9 VSUP VSUP 0.9 Recessive State 0.6 VSUP VSUP 0.4 VSUP VSUP 0.1 SUP 0.1 V VSUP Dominant State Rx RXD t LIN-RXD-low t ttLIN-RXD-high LIN-Rx-low LIN-Rx-high Figure 4. LIN Timing Description ∆t Fall-time ∆t Rise-time 0.8 VSUP 0.8 VSUP 0.8 VSUP VSUP ∆V Fall ∆V Rise 0.2 VSUP VSUP 0.2 0.2VSUP VSUP 0.2 Dominant State SRF = ∆V Fall ∆t Fall-time SRR = ∆V Rise ∆t Rise-time Figure 5. LIN Slew Rate Description 908E625 12 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES ELECTRICAL PERFORMANCE CURVES 1.6 Forward Voltage (V) 1.4 1.2 TJ = 25°C 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ILOAD (A) 4.0 4.5 5.0 H-Bridge Low Side Figure 6. Free Wheel Diode Forward Voltage vs ILOAD 250 Drop Out Voltage (mV) 200 TA = 125°C 150 100 TA = 25°C 50 TA = -40°C 0 0 5 10 15 20 25 ILoad (mA) Figure 7. Dropout Voltage on HVDD vs ILOAD 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 13 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 908E625 device was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. For automotive body electronics, the 908E625 is well suited to perform complete mirror, door lock, and light-levelling control all via a three-wire LIN bus. This device combines an standard HC08 MCU core (68HC908EY16) with flash memory together with a SMARTMOS™ IC chip. The SMARTMOS™ IC chip combines power and control in one chip. Power switches are provided on the SMARTMOS™ IC configured as half-bridge outputs with one high-side switch. Other ports are also provided; they include Hall-effect sensor input ports, analog input ports, and a selectable HVDD pin. An internal voltage regulator is provided on the SMARTMOS™ IC chip, which provides power to the MCU chip. Also included in this device is a LIN physical layer, which communicates using a single wire. This enables the device to be compatible with three-wire bus systems, where one wire is used for communication, one for battery, and the third for ground. FUNCTIONAL PIN DESCRIPTION See Figure 1 for a graphic representation of the various pins referred to in the following paragraphs. Also, see the pin diagram on Figure 3 for a depiction of the pin locations on the package. PORT A I/O PINS (PTA0:4) These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. PTA0:PTA4 are shared with the keyboard interrupt pins, KBD0:KBD4. The PTA5/SPSCK pin is not accessible in this device and is internally connected to the SPI clock pin of the analog die. The PTA6/SS pin is likewise not accessible. For details refer to the 68HC908EY16 datasheet. PORT B I/O PINS (PTB1, PTB3:7) These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. All pins are shared with the ADC module. The PTB6:PTB7 pins are also shared with the Timer B module. PTB0/AD0 is internally connected to the ADOUT pin of the analog die, allowing diagnostic measurements to be calculated; e.g., current recopy, VSUP, etc. The PTB2/AD2 pin is not accessible in this device. For details refer to the 68HC908EY16 datasheet. PORT C I/O PINS (PTC2:4) These pins are special-function, bidirectional I/O port pins that are shared with other functional modules in the MCU. For example, PTC2:PTC4 are shared with the ICG module. PTC0/MISO and PTC1/MOSI are not accessible in this device and are internally connected to the MISO and MOSI SPI pins of the analog die. For details refer to the 68HC908EY16 datasheet. PORT D I/O PINS (PTD0:1) PTD1/TACH1 and PTD0/TACH0/BEMF are specialfunction, bidirectional I/O port pins that can also be programmed to be timer pins. In step motor applications the PTD0 pin should be connected to the BEMF output of the analog die in order to evaluate the BEMF signal with a special BEMF module of the MCU. PTD1 pin is recommended for use as an output pin for generating the FGEN signal (PWM signal) if required by the application. PORT E I/O PIN (PTE1) PTE1/RXD and PTE0/TXD are special-function, bidirectional I/O port pins that can also be programmed to be enhanced serial communication. PTE0/TXD is internally connected to the TXD pin of the analog die. The connection for the receiver must be done externally. EXTERNAL INTERRUPT PIN (IRQ) The IRQ pin is an asynchronous external interrupt pin. This pin contains an internal pull-up resistor that is always activated, even when the IRQ pin is pulled LOW. For details refer to the 68HC908EY16 datasheet. EXTERNAL RESET PIN (RST) A Logic [0] on the RST pin forces the MCU to a known startup state. RST is bidirectional, allowing a reset of the entire system. It is driven LOW when any internal reset source is asserted. This pin contains an internal pull-up resistor that is always activated, even when the reset pin is pulled LOW. For details refer to the 68HC908EY16 datasheet. 908E625 14 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION CURRENT LIMITATION FREQUENCY INPUT PIN (FGEN) Input pin for the half-bridge current limitation and the highside inrush current limiter PWM frequency. This input is not a real PWM input pin; it should just supply the period of the PWM. The duty cycle will be generate automatically. Important The recommended FGEN frequency should be in the range of 0.1 kHz to 20 kHz. BACK ELECTROMAGNETIC FORCE OUTPUT PIN (BEMF) This pin gives the user information about back electromagnetic force (BEMF). This feature is mainly used in step motor applications for detecting a stalled motor. In order to evaluate this signal the pin must be directly connected to pin PTD0/TACH0/BEMF. RESET PIN (RST_A) RST_A is the bidirectional reset pin of the analog die. It is an open drain with pull-up resistor and must be connected to the RST pin of the MCU. INTERRUPT PIN (IRQ_A) IRQ_A is the interrupt output pin of the analog die indicating errors or wake-up events. It is an open drain with pull-up resistor and must be connected to the IRQ pin of the MCU. SLAVE SELECT PIN (SS) This pin is the SPI Slave Select pin for the analog chip. All other SPI connections are done internally. SS must be connected to PTB1 or any other logic I/O of the microcontroller. LIN BUS PIN (LIN) The LIN pin represents the single-wire bus transmitter and receiver. It is suited for automotive bus systems and is based on the LIN bus specification. HALF-BRIDGE OUTPUT PINS (HB1:HB4) The 908E625 device includes power MOSFETs configured as four half-bridge driver outputs. The HB1:HB4 outputs may be configured for step motor drivers, DC motor drivers, or as high-side and low-side switches. The HB1:HB4 outputs are short-circuit and overtemperature protected, and they feature current recopy, current limitation, and BEMF generation. Current limitation and recopy are done on the low-side MOSFETs. POWER SUPPLY PINS (VSUP1:VSUP3) VSUP1:VSUP3 are device power supply pins. The nominal input voltage is designed for operation from 12 V systems. Owing to the low ON-resistance and current requirements of the half-bridge driver outputs and high-side output driver, multiple VSUP pins are provided. All VSUP pins must be connected to get full chip functionality. POWER GROUND PINS (GND1 AND GND2) GND1 and GND2 are device power ground connections. Owing to the low ON-resistance and current requirements of the half-bridge driver outputs and high-side output driver, multiple pins are provided. GND1 and GND2 pins must be connected to get full chip functionality. HIGH-SIDE OUTPUT PIN (HS) The HS output pin is a low RDS(ON) high-side switch. The switch is protected against overtemperature and overcurrent. The output is capable of limiting the inrush current with an automatic PWM generation using the FGEN module. SWITCHABLE VDD OUTPUT PIN (HVDD) The HVDD pin is a switchable VDD output for driving resistive loads requiring a regulated 5.0 V supply; e.g., 3-pin Hall-effect sensors. The output is short-circuit protected. HALL-EFFECT SENSOR INPUT PINS (H1:H3) The Hall-effect sensor input pins H1:H3 provide inputs for Hall-effect sensors and switches. +5.0 V VOLTAGE REGULATOR OUTPUT PIN (VDD) The VDD pin is needed to place an external capacitor to stabilize the regulated output voltage. The VDD pin is intended to supply the embedded microcontroller. Important The VDD pin should not be used to supply other loads; use the HVDD pin for this purpose. The VDD, EVDD, VDDA, and VREFH pins must be connected together. ANALOG INPUT PIN (PA1) This pin is an analog input port with selectable current source values. VOLTAGE REGULATOR GROUND PIN (VSS) The VSS pin is the ground pin for the connection of all nonpower ground connections (microcontroller and sensors). Important VSS, EVSS, VSSA, and VREFL pins must be connected together. LIN TRANSCEIVER OUTPUT PIN (RXD) This pin is the output of LIN transceiver. The pin must be connected to the microcontroller’s Enhanced Serial Communications Interface (ESCI) module (RXD pin). 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 15 FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION ADC REFERENCE PINS (VREFL AND VREFH) MCU POWER SUPPLY PINS (EVDD AND EVSS) VREFL and VREFH are the reference voltage pins for the ADC. It is recommended that a high-quality ceramic decoupling capacitor be placed between these pins. Important VREFH is the high reference supply for the ADC and should be tied to the same potential as VDDA via separate traces. VREFL is the low reference supply for the ADC and should be tied to the same potential as VSS via separate traces. For details refer to the 68HC908EY16 datasheet. EVDD and EVSS are the power supply and ground pins. The MCU operates from a single power supply. Fast signal transitions on MCU pins place high, shortduration current demands on the power supply. To prevent noise problems, take special care to provide power supply bypassing at the MCU. For details refer to the 68HC908EY16 datasheet. ADC SUPPLY PINS (VDDA AND VSSA) VDDA and VSSA are the power supply pins for the analogto-digital converter (ADC). It is recommended that a highquality ceramic decoupling capacitor be placed between these pins. Important VDDA is the supply for the ADC and should be tied to the same potential as EVDD via separate traces. VSSA is the ground pin for the ADC and should be tied to the same potential as EVSS via separate traces. For details refer to the 68HC908EY16 datasheet. TEST PIN (FLSVPP) This pin is for test purposes only. This pin should be either left open (not connected) or connected to GND. EXPOSED PAD PIN The exposed pad pin on the bottom side of the package conducts heat from the chip to the PCB board. For thermal performance the pad must be soldered to the PCB board. It is recommended that the pad be connected to the ground potential. 908E625 16 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES INTERRUPTS AUTONOMOUS WATCHDOG INTERRUPT (AWD) The 908E625 has seven different interrupt sources as described in the following paragraphs. The interrupts can be disabled or enabled via the SPI. After reset all interrupts are automatically disabled. Refer to Autonomous Watchdog Autonomous Watchdog (AWD) on page 39. LOW-VOLTAGE INTERRUPT The Low-Voltage Interrupt (LVI) is related to the external supply voltage, VSUP. If this voltage falls below the LVI threshold, it will set the LVI flag. If the low-voltage interrupt is enabled, an interrupt will be initiated. With LVI the H-Bridges (high-side MOSFET only) and the high-side driver are switched off. All other modules are not influenced by this interrupt. During STOP mode the LVI circuitry is disabled. LIN INTERRUPT If the LINIE bit is set, a falling edge on the LIN pin will generate an interrupt. During STOP mode this interrupt will initiate a system wake-up. HALL-EFFECT SENSOR INPUT PIN INTERRUPT If the PHIE bit is set, the enabled Hall-Effect Sensor input pins H1:H3 can generate an interrupt if a current above the threshold is detected. During STOP mode this interrupt, combined with the cyclic wake-up feature of the AWD, can wake up the system. Refer to pin Hall-Effect Sensor Input Pins (H1:H3). HIGH-VOLTAGE INTERRUPT The High-Voltage Interrupt (HVI) is related to the external supply voltage, VSUP. If this voltage rises above the HVI threshold, it will set the HVI flag. If the High-Voltage Interrupt is enabled, an interrupt will be initiated. With HVI the H-Bridges (high-side MOSFET only) and the high-side driver are switched off. All other modules are not influenced by this interrupt. During STOP mode the HVI circuitry is disabled. HIGH-TEMPERATURE INTERRUPT The High-Temperature Interrupt (HTI) is generated by the on-chip temperature sensors. If the chip temperature is above the HTI threshold, the HTI flag will be set. If the HighTemperature Interrupt is enabled, an interrupt will be initiated. During STOP mode the HTI circuitry is disabled. OVERCURRENT INTERRUPT If an overcurrent condition on a half-bridge occurs, the high-side or the HVDD output is detected and the OCIE bit is set and an interrupt generated. SYSTEM WAKE-UP System wake-up can be initiated by any of four events: • A falling edge on the LIN pin • A wake-up signal from the AWD • A Logic [1] at Hall-effect sensor input pin during cyclic check via AWD • An LVR condition If one of these wake-up events occurs and the interrupt mask bit for this event is set, the interrupt will wake-up the microcontroller as well as the main voltage regulator (MREG) (Figure 8). 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 17 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES MCU Die Analog Die From Reset Initialize Operate SPI: GS =1 (MREG off) STOP MREG STOP Wait for Action LIN AWD Hallport IRQ Interrupt? Assert IRQ_A SPI: Reason for Interrupt Start MREG Operate MREG = Main Voltage Regulator Figure 8. STOP Mode/Wake-Up Procedure 908E625 18 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES SERIAL SPI INTERFACE • MISO—Master-In Slave-Out • SPSCK—Serial Clock The SPI creates the communication link between the microcontroller and the 908E625. The interface consists of four pins. See Figure 9: A complete data transfer via the SPI consists of 2 bytes. The master sends address and data, slave system status, and data of the selected address. • SS —Slave Select • MOSI—Master-Out Slave-In SS Read/Write, Address, Parity MOSI R/W A4 A3 A2 A1 A0 Data (Register write) P X D7 D6 System Status Register MISO S7 S6 S5 S4 S3 S2 D5 D4 D3 D2 D1 D0 D1 D0 Data (Register read) S1 S0 D7 D6 D5 D4 D3 D2 SPSCK Rising edge of SPSCK Change MISO/MOSI Output Falling edge of SPSCK Sample MISO/MOSI Input Slave latch register address Slave latch data Figure 9. SPI Protocol selected register prior to write operation, write data is latched in the SMARTMOS™ register on rising edge of During the inactive phase of SS, the new data transfer is SS. prepared. The falling edge on the SS line indicates the start of a new data transfer and puts MISO in the low-impedance mode. The first valid data are moved to MISO with the rising edge of SPSCK. The MISO output changes data on a rising edge of SPSCK. The MOSI input is sampled on a falling edge of SPSCK. The data transfer is only valid if exactly 16 sample clock edges are present in the active phase of SS. After a write operation, the transmitted data is latched into the register by the rising edge of SS. Register read data is internally latched into the SPI at the time when the parity bit is transferred. SS HIGH forces MISO to high impedance. A4:A0 Contains the address of the desired register. R/ W Contains information about a read or a write operation. • If R/ W = 1, the second byte of master contains no valid information, slave just transmits back register data. • If R/ W = 0, the master sends data to be written in the second byte, slave sends concurrently contents of PARITY P The parity bit is equal to 0 if the number of 1 bits is an even number contained within R/ W, A4:A0. If the number of 1 bits is odd, P equals 1. For example, if R/ W = 1, A4:A0 = 00001, then P equals 0. The parity bit is only evaluated during a write operation. BIT X Not used. MASTER DATA BYTE Contains data to be written or no valid data during a read operation. SLAVE STATUS BYTE Contains the contents of the System Status Register ($0c) independent of whether it is a write or read operation or which register was selected. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 19 FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES SLAVE DATA BYTE SPI REGISTER OVERVIEW Contains the contents of selected register. During a write operation it includes the register content prior to a write operation. Table 6 summarizes the SPI register addresses and the bit names of each register. Table 6. List of Registers Addr Register Name R/W $01 H-Bridge Output (HBOUT) R $02 H-Bridge Control (HBCTL) W $03 System Control (SYSCTL) W $04 Interrupt Mask (IMR) $05 Interrupt Flag (IFR) W $06 Reset Mask (RMR) W $07 Analog Multiplexer Configuration (ADMUX) W $08 Hall-Effect Sensor Input Pin Control (HACTL) $09 Hall-Effect Sensor Input Pin Status (HASTAT) W Bit 7 6 5 4 3 2 1 0 HB4_H HB4_L HB3_H HB3_L HB2_H HB2_L HB1_H HB1_L OFC_EN CSA 0 0 0 CLS2 CLS1 CLS0 PSON SRS1 SRS0 0 0 0 0 0 HPIE LINIE HTIE LVIE HVIE 0 HPF LINF HTF LVF HVF 0 0 0 0 0 0 0 0 0 SS3 0 0 0 0 R R R W R R R R TTEST 0 GS OCIE 0 OCF 0 HVRE HTRE SS2 SS1 SS0 H3EN H2EN H1EN 0 W R 0 0 0 0 0 0 0 0 H3F H2F H1F AWDRE AWDIE AWDCC AWDF AWDR CSSEL0 CSEN1 CSEN0 HVDDON HS_ON LVF HVF W R $0a AWD Control (AWDCTL) W $0b Power Output (POUT) W $0c System Status (SYSSTAT) R R W AWDRST 0 HP_OCF 0 LINCL CSSEL1 HVDD_OC HS_OCF F HB_OCF HTF 908E625 20 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS LOGIC COMMANDS AND REGISTERS INTERRUPT FLAG REGISTER (IFR) Register Name and Address: IFR - $05 Bits 7 6 5 4 3 2 0 HPF LINF HTF LVF HVF Read 1 0 OCF 0 Write Reset condition is still present while writing a Logic [1] to HTF, the writing has no effect. Therefore, a high-temperature interrupt cannot be lost due to inadvertent clearing of HTF. Reset clears the HTF bit. Writing a Logic [0] to HTF has no effect. • 1 = High-temperature condition has occurred • 0 = High-temperature condition has not occurred Low-Voltage Flag Bit (LVF) 0 0 0 0 0 0 0 0 Hall-Effect Sensor Input Pin Flag Bit (HPF) This read/write flag is set depending on RUN/STOP mode. RUN Mode An interrupt will be generated when a state change on any enabled Hall-effect sensor input pin is detected. Clear HPF by writing a Logic [1] to HPF. Reset clears the HPF bit. Writing a Logic [0] to HPF has no effect. • 1 = State change on the hallflags detected • 0 = No state change on the hallflags detected STOP Mode An interrupt will be generated when AWDCC is set and a current above the threshold is detected on any enabled Halleffect sensor input pin. Clear HPF by writing a Logic [1] to HPF. Reset clears the HPF bit. Writing a Logic [0] to HPF has no effect. • 1 = One or more of the selected Hall-effect sensor input pins had been pulled HIGH • 0 = None of the selected Hall-effect sensor input pins has been pulled HIGH LIN Flag Bit (LINF) This read/write flag is set on the falling edge at the LIN data line. Clear LINF by writing a Logic [1] to LINF. Reset clears the LINF bit. Writing a Logic [0] to LINF has no effect. • 1 = Falling edge on LIN data line has occurred • 0 = Falling edge on LIN data line has not occurred since last clear This read/write flag is set on a low-voltage condition. Clear LVF by writing a Logic [1] to LVF. If a low-voltage condition is still present while writing a Logic [1] to LVF, the writing has no effect. Therefore, a low-voltage interrupt cannot be lost due to inadvertent clearing of LVF. Reset clears the LVF bit. Writing a Logic [0] to LVF has no effect. • 1 = Low-voltage condition has occurred • 0 = Low-voltage condition has not occurred High-Voltage Flag Bit (HVF) This read/write flag is set on a high-voltage condition. Clear HVF by writing a Logic [1] to HVF. If high-voltage condition is still present while writing a Logic [1] to HVF, the writing has no effect. Therefore, a high-voltage interrupt cannot be lost due to inadvertent clearing of HVF. Reset clears the HVF bit. Writing a Logic [0] to HVF has no effect. • 1 = High-voltage condition has occurred • 0 = High-voltage condition has not occurred Overcurrent Flag Bit (OCF) This read-only flag is set on an overcurrent condition. Reset clears the OCF bit. To clear this flag, write a Logic [1] to the appropriate overcurrent flag in the SYSSTAT Register. See Figure 10,illustrating the three signals triggering the OCF. • 1 = High-current condition has occurred • 0 = High-current condition has not occurred HVDD_OCF HS_OCF OCF HB_OCF Figure 10. Principal Implementation for OCF High-Temperature Flag Bit (HTF) This read/write flag is set on a high-temperature condition. Clear HTF by writing a Logic [1] to HTF. If a high-temperature 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 21 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS INTERRUPT MASK REGISTER (IMR) High-Temperature Interrupt Enable Bit (HTIE) Register Name and Address: IMR - $04 Bits 7 6 5 4 3 2 1 Read 0 0 0 HPIE LINIE HTIE LVIE HVIE OCIE Low-Voltage Interrupt Enable Bit (LVIE) Write Reset This read/ write bit enables CPU interrupts by the hightemperature flag, HTF. Reset clears the HTIE bit. • 1 = Interrupt requests from HTF flag enabled • 0 = Interrupt requests from HTF flag disabled 0 0 0 0 0 0 0 0 Hall-Effect Sensor Input Pin Interrupt Enable Bit (HPIE) This read/write bit enables CPU interrupts by the Halleffect sensor input pin flag, HPF. Reset clears the HPIE bit. • 1 = Interrupt requests from HPF flag enabled • 0 = Interrupt requests from HPF flag disabled LIN Line Interrupt Enable Bit (LINIE) This read/write bit enables CPU interrupts by the LIN flag, LINF. Reset clears the LINIE bit. • 1 = Interrupt requests from LINF flag enabled • 0 = Interrupt requests from LINF flag disabled This read/write bit enables CPU interrupts by the lowvoltage flag, LVF. Reset clears the LVIE bit. • 1 = Interrupt requests from LVF flag enabled • 0 = Interrupt requests from LVF flag disabled High-Voltage Interrupt Enable Bit (HVIE) This read/write bit enables CPU interrupts by the highvoltage flag, HVF. Reset clears the HVIE bit. • 1 = Interrupt requests from HVF flag enabled • 0 = Interrupt requests from HVF flag disabled Overcurrent Interrupt Enable Bit (OCIE) This read/write bit enables CPU interrupts by the overcurrent flag, OCF. Reset clears the OCIE bit. • 1 = Interrupt requests from OCF flag enabled • 0 = Interrupt requests from OCF flag disabled 908E625 22 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS RESET The 908E625 chip has four internal reset sources and one external reset source, as explained in the paragraphs below. Figure 11 depicts the internal reset sources. High-Temperature Reset To prevent damage to the device, a reset will be initiated if the temperature rises above a certain value. The reset is maskable with bit HTRE in the Reset Mask Register. After a reset the high-temperature reset is disabled. RESET INTERNAL SOURCES Autonomous Watchdog AWD modules generates a reset because of a timeout (watchdog function). Low-Voltage Reset The LVR is related to the internal VDD. In case the voltage falls below a certain threshold, it will pull down the RST_A pin. SPI REGISTERS AWDRE Flag AWD Reset Sensor VDD HVRE Flag High-Voltage Reset Sensor HTRE Flag High-Temperature Reset Sensor RST_A MONO FLOP Low-Voltage Reset Figure 11. Internal Reset Routing High-Voltage Reset The HVR is related to the external VSUP voltage. In case the voltage is above a certain threshold, it will pull down the RST_A pin. The reset is maskable with bit HVRE in the Reset Mask Register. After a reset the high-voltage reset is disabled. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 23 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS RESET EXTERNAL SOURCE • 1 = Low-temperature threshold enabled • 0 = Low-temperature threshold disabled External Reset Pin The microcontroller has the capability of resetting the SMARTMOS™ device by pulling down the RST pin. High-Voltage Reset Enable Bit (HVRE) This read/write bit enables resets on high-voltage conditions. Reset clears the HVRE bit. • 1 = High-voltage reset enabled • 0 = High-voltage reset disabled RESET MASK REGISTER (RMR) Register Name and Address: RMR - $06 Bits 7 Read 6 5 4 3 2 0 0 0 0 0 TTEST 1 0 HVRE HTRE Write Reset 0 0 0 0 0 0 0 0 High-Temperature Reset Enable Bit (HTRE) This read/write bit enables resets on high-temperature conditions. Reset clears the HTRE bit. • 1 = High-temperature reset enabled • 0 = High-temperature reset disabled High-Temperature Reset Test (TTEST) This read/write bit is for test purposes only. It decreases the overtemperature shutdown limit for final test. Reset clears the HTRE bit. 908E625 24 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS ANALOG DIE I/OS Analog Multiplexer/ADOUT Pin LIN Physical Layer The ADOUT pin is the analog output interface to the ADC of the MCU. See Figure 12. An analog multiplexer is used to read seven internal diagnostic analog voltages. The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to meet the LIN physical layer specification. The LIN driver is a low-side MOSFET with internal current limitation and thermal shutdown. An internal pull-up resistor with a serial diode structure is integrated, so no external pullup components are required for the application in a slave node. The fall time from dominant to recessive and the rise time from recessive to dominant is controlled. The symmetry between both slew rate controls is guaranteed. The LIN pin offers high susceptibility immunity level from external disturbance, guaranteeing communication during external disturbance. The LIN transmitter circuitry is enabled by setting the PSON bit in the System Control Register (SYSCTL). If the transmitter works in the current limitation region, the LINCL bit in the System Status Register (SYSSTAT) is set. Due to excessive power dissipation in the transmitter, software is advised to monitor this bit and turn the transmitter off immediately. TXD PIN The TXD pin is the MCU interface to control the state of the LIN transmitter (see Figure 1). When TXD is LOW, LIN output is low (dominant state). When TXD is HIGH, the LIN output MOSFET is turned off. The TXD pin has an internal pull-up current source in order to set the LIN bus in recessive state in the event, for instance, the microcontroller could not control it during system power-up or power-down. Current Recopy The analog multiplexer is connected to the four low-side current sense circuits of the half-bridges. These sense circuits offer a voltage proportional to the current through the low-side MOSFET. High or low resolution is selectable: 5.0 V/2.5 A or 5.0 V/500 mA, respectively. Refer to HalfBridge Current Recopy on page 34.) Analog Input PA1 The analog input PA1 is directly connected to the analog multiplexer, permitting analog values from the periphery to be read. TEMPERATURE SENSOR The 908E625 includes an on-chip temperature sensor. This sensor offers a voltage that is proportional to the actual chip junction temperature. VSUP PRESCALER The VSUP prescaler permits the reading or measurement of the external supply voltage. The output of this voltage is VSUP /RATIOVSUP. The different internal diagnostic analog voltages can be selected with the ADMUX Register. ANALOG MULTIPLEXER CONFIGURATION REGISTER (ADMUX) RXD PIN The RXD transceiver pin is the MCU interface, which reports the state of the LIN bus voltage. LIN HIGH (recessive state) is reported by a high level on RXD, LIN LOW (dominant state) by a low level on RXD. STOP MODE/WAKE-UP FEATURE During STOP mode operation the transmitter of the physical layer is disabled. The receiver pin is still active and able to detect wake-up events on the LIN bus line. If LIN interrupt is enabled (LINIE bit in the Interrupt Mask Register is set), a falling edge on the LIN line causes an interrupt. This interrupt switches on the main voltage regulator and generates a system wake-up. Register Name and Address: ADMUX - $07 Bits 7 6 5 4 Read 0 0 0 0 3 2 1 0 SS3 SS2 SS1 SS0 0 0 0 0 Write Reset 0 0 0 0 SS3, SS2, SS1, and SS0—A/D Input Select Bits These read/write bits select the input to the ADC in the microcontroller according to Table 7. Reset clears SS3, SS2, SS1, and SS0 bits. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 25 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS ANALOG INPUT PA1 Table 7. Analog Multiplexer Configuration Register SS3 SS2 SS1 SS0 Channel 0 0 0 0 Current Recopy HB1 0 0 0 1 Current Recopy HB2 0 0 1 0 Current Recopy HB3 0 0 1 1 Current Recopy HB4 0 1 0 0 VSUP Prescaler 0 1 0 1 Temperature Sensor 0 1 1 0 Not Used 0 1 1 1 PA1 Pin 1 0 0 0 1 0 0 1 1 0 1 0 1 0 1 1 The Analog input PA1 pin provides an input for reading analog signals and is internally connected to the analog multiplexer. It can be used for reading switches, potentiometers or resistor values, etc. ANALOG INPUT PA1 CURRENT SOURCE The analog input PA1 has an additional selectable current source. It enables the reading of switches, NTC, etc., without the need of an additional supply line for the sensor illustrated in Figure 12. With this feature it is also possible to read multiple switches on one input. Current source is enabled if the PSON bit in the System Control Register (SYSCTL) and the CSEN bit in the Power Output Register (POUT) is set. Four different current source values can be selected with the CSSELx bits shown in Table 8. This function ceases during STOP mode operation. Table 8. PA1 Current Source Level Selection Bits Not Used 1 1 0 0 1 1 0 1 0 0 10% 1 1 1 0 0 1 30% 1 1 1 1 1 0 60% 1 1 100% CSSEL1 CSSEL0 Current Source Enable (typ.) Source Selection Bits VDD SSx 3 CSSEL Selectable Current Source PSON ADOUT Analog Multiplexer CSEN PA1 Analog Input PA1 NTC Figure 12. Analog Input PA1 and Multiplexer 908E625 26 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS POWER OUTPUT REGISTER (POUT) Lamp Driver On Bit (HS_ON) Register Name and Address: POUT - $0b Bits 7 6 Read 0 0 5 4 3 CSSEL1 CSSEL0 CSEN 2 0(15) 1 0 HVDDON HS_ON Write Reset 0 0 0 0 0 0 0 0 Notes 15. This bit must always be set to 0. Current Source Select Bits (CSSEL0:CSSEL1) These read/write bits select the current source values. Reset clears the CSSEL0:CSSEL1 bits. Current Source Enable Bit (CSEN) This read/write bit enables the current source for PA1. Reset clears the CSEN bit (Table 9). Table 9. PA1 Current Source Enable Bit CSEN Current Source Enable 0 Current Source Off 1 Current Source On HVDD On Bit (HVDDON) This read/write bit enables HVDD output. Reset clears the HVDDON bit. • 1 = HVDD enabled • 0 = HVDD disabled This read/write bit enables the Lamp driver. Reset clears the HS_ON bit. • 1 = Lamp driver enabled • 0 = Lamp driver disabled Hall-Effect Sensor Input Pins (H1:H3) Function The Hall-effect sensor input pins provide three inputs for two-pin Hall-effect sensors for detecting stall and position or reading Hall-effect sensor contact switches. The Hall-effect sensor input pins are not influenced by the PSON bit in the System Control Register. Each pin of the Hall-effect sensor can be enabled by setting the HxEN bit in the Hall-Effect Sensor Input Pin Control Register (HACTL). If the pins are enabled, the Halleffect sensors are supplied with VSUP voltage and the sense circuitry is working. An internal clamp circuity limits the supply voltage to the sensor to 15 V. This sense circuitry monitors the current to VSS. The result of this sense operation is given by the HxF flags in the Hall-Effect Sensor Input Pin Status Register (HASTAT). The flag is set if the sensed current is higher than IHSCT. To prevent noise on this flag, a hysteresis is implemented on these pins. After switching on the Hall-effect sensor input pins (HxEN = 1), the Hall-effect sensors need some time to stabilize the output. In RUN mode the software must wait at least 40 µs between enabling the Hall-effect sensor and reading the hall flag. The Hall-effect sensor input pin works in an dynamic output voltage range from VSUP down to 2.0 V. Below 2.0 V the hallflags are not functional anymore. If the output voltage is below a certain threshold, the Hall-Effect Sensor Input Pin Overcurrent Flag (HP_OCF) in the System Status Register is set. Figures 13 through 15 illustrate the connections to the Hall-effect input sensors. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 27 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HxEN Two-Terminal Hall-Effect Sensor Hx Sense Circuitry HxF GND V Figure 13. Hall-Effect Sensor Input Pin Connected to Two-Pin Hall-Effect Sensor HxEN Sense Circuitry Hx Rv HxF V GND Figure 14. Hall-Effect Sensor Input Pin Connected to Local Switch 908E625 28 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Three-Terminal Hall-Effect Sensor Vs HxEN Sense Circuitry Hx Out HxF V GND GND Figure 15. Hall-Effect Sensor Input Pin Connected to Three-Pin Hall-Effect Sensor CYCLIC WAKE-UP Interrupts The Hall-effect sensor input pins are interrupt capable. How and when an interrupt occurs is dependent on the operating mode, RUN or Stop. RUN Mode In RUN mode the Hall-effect sensor input pin interrupt flag (HPF) will be set if a state change on the hallflags (HxF) is detected. The interrupt is maskable with the HPIE bit in the Interrupt Mask Register. Before enabling the interrupt, the flag should be cleared in order to prevent a wrong interrupt. STOP Mode In STOP mode the Hall-effect sensor input pins are disabled independent of the state of the HxEN flags. The Hall-effect sensor inputs can be used to wake up the system. This wake-up function is provided by the cyclic check wake-up feature of the AWD (Autonomous Watchdog). If the cyclic check wake-up feature is enabled (AWDCC bit is set), the AWD switches on the enabled Hall-effect sensor pins periodically. To ensure that the Hall-effect sensor current is stabilized after switching on, the inputs are sensed after ~40 µs. If a 1 is detected (IHall sensor > IHSCT) and the interrupt mask bit HPIE is set, an interrupt is performed. This wakes up the MCU and starts the main voltage regulator. The wake-up function via this input is available when all three conditions exist: • The two-pin Hall-effect sensor input is enabled (HxEN = 1) • The cyclic wake-up of the AWD is enabled (AWDCC = 1); see Figure 16 • The Hall-effect sensor input pin interrupt is enabled (HPIE = 1) 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 29 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SPI: AWDCC = 1 GS = 1 SPI Command STOP MREG No STOP AWD Timer Overflow? Yes No Switch on Selected Hallport IRQ_A = 0 Start MREG IRQ? Yes SPI: Reason for Wakeup Wait 40 µs Yes Operate Assert IRQ_A Hallport = 1 No Switch off Selected Hallport MREG = Main Voltage Regulator Figure 16. Hall-Effect Sensor Input Pin Cyclic Check Wake-Up Feature HALL-EFFECT SENSOR INPUT PIN CONTROL REGISTER (HACTL) • 1 = Hall-effect sensor input pin Hx switched on and sensed • 0 = Hall-effect sensor input pin Hx disabled Register Name and Address: HACTL - $08 Bits 7 6 5 4 3 Read 0 0 0 0 0 2 1 0 H3EN H2EN H1EN 0 0 0 Write Reset 0 0 0 0 0 Hall-Effect Sensor Input Pin Enable Bits (H3EN:H1EN) These read/write bits enable the Hall-effect sensor input pins. Reset clears the H3EN:H1EN bits. 908E625 30 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HALL-EFFECT SENSOR INPUT PIN STATUS REGISTER (HASTAT) • 0 = Hall-effect sensor input pin current below threshold HALF-BRIDGES Register Name and Address: HASTAT - $09 Bits 7 6 5 4 3 2 1 0 Read 0 0 0 0 0 H3F H2F H1F 0 0 0 0 0 0 0 0 Write Reset Hall-Effect Sensor Input Pin Flag Bits (H3F:H1F) These read-only flag bits reflect the input Hx while the Halleffect sensor input pin Hx is enabled (HxEN = 1). Reset clears the H3F:H1F bits. • 1 = Hall-effect sensor input pin current above threshold Outputs HB1:HB4 provide four low-resistive half-bridge output stages. The half-bridges can be used in H-Bridge, high-side, or low-side configurations. Reset clears all bits in the H-Bridge Output Register (HBOUT) owing to the fact that all half-bridge outputs are switched off. HB1:HB4 output features: • Short circuit (overcurrent) protection on high-side and low-side MOSFETs • Current recopy feature (low side MOSFET) • Overtemperature protection • Overvoltage and undervoltage protection • Current limitation feature (low side MOSFET) VSUP Control On/Off High-Side Driver Status Charge Pump, Overtemperature Protection, Overcurrent Protection BEMF HBx On/Off Low-Side Driver Status Current Limit Current Recopy, Current Limitation, Overcurrent Protection GND Figure 17. Half-Bridge Push-Pull Output Driver HALF-BRIDGE CONTROL Each output MOSFET can be controlled individually. The general enable of the circuitry is done by setting PSON in the System Control Register (SYSCTL). HBx_L and HBx_H form one half-bridge. It is not possible to switch on both MOSFETs in one half-bridge at the same time. If both bits are set, the high-side MOSFET has a higher priority. To avoid both MOSFETs (high side and low side) of one half-bridge being on at the same time, a break-before-make circuit exists. Switching the high-side MOSFET on is inhibited as long as the potential between gate and VSS is not below a certain threshold. Switching the low-side MOSFET on is blocked as long as the potential between gate and source of the high-side MOSFET did not fall below a certain threshold. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 31 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HALF-BRIDGE OUTPUT REGISTER (HBOUT) • 1 = High-side MOSFET turned on for half-bridge output x • 0 = High-side MOSFET turned on for half-bridge output x Register Name and Address: HBOUT - $01 Bits Read 7 6 5 4 3 2 1 0 HB4_ HB4_ HB3_ HB3_ HB2_ HB2_ HB1_ HB1_ H L H L H L H L Write Reset 0 0 0 0 0 0 0 0 HALF-BRIDGE CURRENT LIMITATION Each low-side MOSFET offers a current limit or constant current feature. This features is realized by a pulse width modulation on the low-side MOSFET. The pulse width modulation on the outputs is controlled by the FGEN input Low-Side On/Off Bits (HBx_L) These read/write bits turn on the low-side MOSFETs. Reset clears the HBx_L bits. • 1 = Low-side MOSFET turned on for half-bridge output x • 0 = Low-side MOSFET turned off for half-bridge output x High-Side On/Off Bits (HBx_H) These read/write bits turn on the high-side MOSFETs. Reset clears the HBx_H bits. and the load characteristics. The FGEN input provides the PWM frequency, whereas the duty cycle is controlled by the load characteristics. The recommended frequency range for the FGEN and the PWM is 0.1 kHz to 20 kHz. Functionality Each low-side MOSFET switches off if a current above the selected current limit was detected. The 908E625 offers five different current limits. Refer to Table 10 for current limit values. The low-side MOSFET switches on again if a rising edge on the FGEN input was detected (Figure 18). 908E625 32 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS H-Bridge low-side MOSFET will be switched off if select current limit is reached. Coil Current H-Bridge low-side MOSFET will be turned on with each rising edge of the FGEN input. t Half-Bridge Low-Side Output t FGEN Input (MCU PWM Signal) t Minimum 50 µs Figure 18. Half-Bridge Current Limitation OFFSET CHOPPING If bit OFC_EN in the H-Bridge Control Register (HBCTL) is set, HB1 and HB2 will continue to switch on the low-side MOSFETs with the rising edge of the FGEN signal and HB3 and HB4 will switch on the low-side MOSFETs with the falling edge on the FGEN input. In step motor applications this feature allows the reduction of EMI due to a reduction of the di/dt (Figure 19). 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 33 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Coil1 Current Coil2 Current FGEN Input (MCU PWM Signal) HB1 HB2 Coil1….. HB3 HB4 Coil2….. Current in VSUP Line Figure 19. Offset Chopping for Step Motor Control HALF-BRIDGE CURRENT RECOPY HALF-BRIDGE BEMF GENERATION Each low-side MOSFET has an additional sense output to allow a current recopy feature. This sense source is internally connected to a shunt resistor. The drop voltage is amplified and switched to the analog multiplexer. The factor for the current sense amplification can be selected via bit CSA in the System Control Register. • CSA = 1: Low resolution selected (500 mA measurement range) • CSA = 0: High resolution selected (2.5 A measurement range) The BEMF output is set to 1 if a recirculation current is detected in any half-bridge. This recirculation current flows via the two freewheeling diodes of the power MOSFETs. The BEMF circuitry detects that and generates a HIGH on the BEMF output as long as a recirculation current is detected. This signal provides a flexible and reliable detection of stall in step motor applications. For this the BEMF circuitry takes advantage of the instability of the electrical and mechanical behavior of a step motor when blocked. In addition the signal can be used for open load detection (absence of this signal), see Figure 20. 908E625 34 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Coil Current Voltage on 1 1 BEMF Signal Figure 20. BEMF Signal Generation HALF-BRIDGE OVERTEMPERATURE PROTECTION The half-bridge outputs provide an overtemperature prewarning with the HTF in the Interrupt Flag Register (IFR). In order to protect the outputs against overtemperature, the High-Temperature Reset must be enabled. If this value is reached, the part generates a reset and disables all power outputs. done by the low- and high-voltage interrupt circuitry. If one of these flags (LVF, HVF) is set, the outputs are automatically disabled. The overvoltage/undervoltage status flags are cleared (and the outputs re-enabled) by writing a Logic [1] to the LVF/ HVF flags in the Interrupt Flag Register or by reset. Clearing this flag is useless as long as a high- or low-voltage condition is present. HALF-BRIDGE OVERCURRENT PROTECTION HALF-BRIDGE CONTROL REGISTER (HBCTL) The half-bridges are protected against short to GND, short to VSUP, and load shorts. In the event an overcurrent on the high side is detected, the high-side MOSFETs on all HB high-side MOSFETs are switched off automatically. In the event an overcurrent on the low side is detected, all HB low-side MOSFETs are switched off automatically. In both cases the overcurrent status flag HB_OCF in the System Status Register (SYSSTAT) is set. The overcurrent status flag is cleared (and the outputs reenabled) by writing a Logic [1] to the HB_OCF flag in the System Status Register or by reset. HALF-BRIDGE OVERVOLTAGE/UNDERVOLTAGE The half-bridge outputs are protected against undervoltage and overvoltage conditions. This protection is Register Name and Address: HBCTL - $02 Bits 7 6 OFC_EN CSA 0 0 Read 5 4 3 0 0 0 2 1 0 CLS2 CLS1 CLS0 0 0 0 Write Reset 0 0 0 H-Bridge Offset Chopping Enable Bit (OFC_EN) This read/write bit enables offset chopping. Reset clears the OFC_EN bit. • 1 = Offset chopping enabled • 0 = Offset chopping disabled 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 35 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS H-Bridges Current Sense Amplification Select Bit (CSA) HIGH-SIDE DRIVER This read/write bit selects the current sense amplification of the H-Bridges. Reset clears the CSA bit. • 1 = Current sense amplification set for measuring 0.5 A. • 0 = Current sense amplification set for measuring 2.5 A. The high-side output is a low-resistive high-side switch targeted for driving lamps. The high side is protected against overtemperature. To limit the high inrush current of bulbs, overcurrent protection circuitry is used to limit the current. The output is enabled with bit PSON in the System Control Register and can be switched on/off with bit HS_ON in the Power Output Register. Figure 21 depicts the high-side switch circuitry and connection to external lamp. H-Bridge Current Limitation Selection Bits (CLS2:CLS0) These read/write bits select the current limitation value according to Table 10. Reset clears the CLS2:CLS0 bits. Table 10. H-Bridge Current Limitation Value Selection Bits CLS2 CLS1 CLS0 Current Limit 0 0 0 0 0 1 0 1 0 0 1 1 55 mA (typ) 1 0 0 260 mA (typ) 1 0 1 370 mA (typ) 1 1 0 550 mA (typ) 1 1 1 740 mA (typ) No Limit HIGH-SIDE OVERVOLTAGE/UNDERVOLTAGE PROTECTION The high-side output pin, HS, is protected against undervoltage/overvoltage conditions. This protection is done by the low- and high-voltage interrupt circuitry. If one of these flags (LVF, HVF) is set, the output is disabled. The overvoltage/undervoltage status flags are cleared and the output re-enabled by writing a Logic [1] to the LVF/ HVF flags in the Interrupt Flag Register or by reset. Clearing this flag is useless as long as a high- or low-voltage condition is present. VSUP On/Off High-Side Driver Control Status Current Limit Charge Pump, Overcurrent Protection, Inrush Current Limiter HS Figure 21. High-Side Circuitry 908E625 36 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HIGH-SIDE OVERTEMPERATURE PROTECTION The high-side output provides an overtemperature prewarning with the HTF in the Interrupt Flag Register. In order to protect the output against overtemperature, the HighTemperature Reset must be enabled. If this value is reached, the part generates a reset and disables all power outputs. HIGH-SIDE OVERCURRENT PROTECTION The high-side output is protected against overcurrent. In the event overcurrent limit is or was reached, the output automatically switches off and the overcurrent flag is set. Due to the high inrush current of bulbs, a special feature of the 908E625 prevents an overcurrent shutdown during this inrush. If an PWM frequency is supplied to the FGEN output during the switching on of a bulb, the inrush current is limited to the overcurrent shutdown limit. This means if the current reaches the overcurrent shutdown, the high side will be switched off, but each rising edge on the FGEN input will enable the driver again. To distinguish between a shutdown due to an inrush current or a real shutdown, the software must check if the overcurrent status flag (HS_OCF) in the System Status Register is set beyond a certain period of time. The overcurrent status flag is cleared by writing a Logic [1] to the HS_OCF in the System Status Register, see Figure 22. HS Current HS Overcurrent Shutdown Threshold t FGEN Input (MCU PWM Signal) t Figure 22. Inrush Current Limiter on High-Side Output SWITCHABLE VDD OUTPUT (HVDD) HVDD OVERTEMPERATURE PROTECTION The HVDD pin is a switchable VDD output pin. It can be used for driving external circuitry that requires a VDD voltage. The output is enabled with bit PSON in the System Control Register and can be switched on/off with bit HVDDON in the Power Output Register. Low- or high-voltage conditions (LVI/ HVI) have no influence on this circuitry. Overtemperature protection is enabled if the hightemperature reset is enabled. HVDD OVERCURRENT PROTECTION The HVDD output is protected against overcurrent. In the event the overcurrent limit is or was reached, the output automatically switches off and the HVDD overcurrent flag in the System Status Register is set. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 37 FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SYSTEM CONTROL REGISTER (SYSCTL) Register Name and Address: SYSCTL - $03 Bits 7 6 5 PSON SRS1 SRS0 Read 4 3 2 1 0 0 0 0 0 0 Write Reset Reset clears the HP_OCF bit. Writing a Logic [0] to HP_OCF has no effect. • 1 = Overcurrent condition on Hall-effect sensor input pin has occurred • 0 = No overcurrent condition on Hall-effect sensor input pin has occurred GS 0 0 0 0 0 0 0 0 Power Stages On Bit (PSON) This read/write bit enables the power stages (half-bridges, high side, LIN transmitter, Analog Input PA1 current sources, and HVDD output). Reset clears the PSON bit. • 1 = Power stages enabled. • 0 = Power stages disabled. LIN Slew Rate Selection Bits (SRS0:SRS1) These read/write bits enable the user to select the appropriate LIN slew rate for different baud rate configurations as shown in Table 11. The high speed slew rates are used, for example, for programming via the LIN and are not intended for use in the application. LIN Current Limitation Bit (LINCL) This read-only bit is set if the LIN transmitter operates in current limitation region. Due to excessive power dissipation in the transmitter, software is advised to turn the transmitter off immediately. •1 = Transmitter operating in current limitation region •0 = Transmitter not operating in current limitation region HVDD Output Overcurrent Flag Bit (HVDD_OCF) This read/write flag is set on an overcurrent condition at the HVDD pin. Clear HVDD_OCF and enable the output by writing a Logic [1] to the HVDD_OCF Flag. Reset clears the HVDD_OCF bit. Writing a Logic [0] to HVDD_OCF has no effect. •1 = Overcurrent condition on HVDD has occurred •0 = No overcurrent condition on HVDD has occurred High-Side Overcurrent Flag Bit (HS_OCF) Table 11. LIN Slew Rate Selection Bits SRS1 SRS0 LIN Slew Rate 0 0 Initial Slew Rate (20 kBaud) 0 1 Slow Slew Rate (10 kBaud) 1 0 High Speed II (8x) 1 1 High Speed I (4x) This read/write flag is set on an overcurrent condition at the high-side driver. Clear HS_OCF and enable the high-side driver by writing a Logic [1] to HS_OCF. Reset clears the HS_OCF bit. Writing a Logic [0] to HS_OCF has no effect. • 1 = Overcurrent condition on high-side drivers has occurred • 0 = No overcurrent condition on high-side drivers has occurred Go to STOP Mode Bit (GS) Low-Voltage Bit (LVF) This write-only bit instructs the 908E625 to power down and go into STOP mode. Reset or CPU interrupt requests clear the GS bit. • 1 = Power down and go into STOP mode • 0 = Not in STOP mode This read only bit is a copy of the LVF bit in the Interrupt Flag Register. • 1 = Low-voltage condition has occurred • 0 = No low-voltage condition has occurred SYSTEM STATUS REGISTER (SYSSTAT) High-Voltage Sensor Bit (HVF) Register Name and Address: SYSSTAT - $0c Bits Read Write Reset 7 HP_ OCF 0 6 LINCL 0 5 4 HVDD _OCF HS_ OCF 0 0 3 2 LVF HVF 0 0 1 HB_ OCF 0 0 HTF This read-only bit is a copy of the HVF bit in the Interrupt Flag Register. • 1 = High-voltage condition has occurred • 0 = No high-voltage condition has occurred H-Bridge Overcurrent Flag Bit (HB_OCF) 0 Hall-Effect Sensor Input Pin Overcurrent Flag Bit (HP_OCF) This read/write flag is set on an overcurrent condition at one of the Hall-effect sensor input pins. Clear HP_OCF and enable the output by writing a Logic [1] to the HP_OCF flag. This read / write flag is set on an overcurrent condition at the H-Bridges. Clear HB_OCF and enable the H-Bridge driver by writing a Logic [1] to HB_OCF. Reset clears the HB_OCF bit. Writing a Logic [0] to HB_OCF has no effect. • 1 = Overcurrent condition on H-Bridges has occurred • 0 = No overcurrent condition on H-Bridges has occurred 908E625 38 Analog Integrated Circuit Device Data Freescale Semiconductor FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Overtemperature Status Bit (HTF) This read-only bit is a copy of the HTF bit in the Interrupt Flag Register. • 1 = Overtemperature condition has occurred • 0 = No overtemperature condition has occurred AUTONOMOUS WATCHDOG (AWD) The Autonomous Watchdog module consists of three functions: • Watchdog function for the CPU in RUN mode • Periodic interrupt function in STOP mode • Cyclic wake-up function in STOP mode The AWD is enabled if AWDIE, AWDRE, or AWDCC in the AWDCTL Register is set. If these bits are cleared, the AWD oscillator is disabled and the watchdog switched off. WATCHDOG The watchdog function is only available in RUN mode. On setting the AWDRE bit, watchdog functionality in RUN mode is activated. Once this function is enabled, it is not possible to disable it via software. If the timer reaches end value and AWDRE is set, a system reset is initiated. Operations of the watchdog function cease in STOP mode. Normal operation will be continued when the system is back to RUN mode. To prevent a watchdog reset, the watchdog timeout counter must be reset before it reaches the end value. This is done by a write to the AWDRST bit in the AWDCTL Register. PERIODIC INTERRUPT Periodic interrupt is only available in STOP mode. It is enabled by setting the AWDIE bit in the AWDCTL Register. If AWDIE is set, the AWD wakes up the system after a fixed period of time. This time period can be selected with bit AWDR in the AWDCTL Register. CYCLIC WAKE-UP The cyclic wake-up feature is only available in STOP mode. If this feature is enabled, the selected Hall-effect sensor input pins are switched on and sensed. If a “1” is detected on one of these inputs and the interrupt for the Halleffect sensors is enabled, a system wake-up is performed. (Switch on main voltage regulator and assert IRQ_A to the microcontroller). AUTONOMOUS WATCHDOG CONTROL REGISTER (AWDCTL) Register Name and Address: AWDCTL - $0a Bits 7 6 5 Read 0 0 0 Write Reset AWDRS T 0 0 0 4 3 2 1 0 AWDR E AWDI E AWDC C AWDF AWD R 0 0 0 0 0 Autonomous Watchdog Reset Bit (AWDRST) This write-only bit resets the Autonomous Watchdog timeout period. AWDRST always reads 0. Reset clears AWDRST bit. • 1 = Reset AWD and restart timeout period • 0 = No effect Autonomous Watchdog Reset Enable Bit (AWDRE) This read/write bit enables resets on AWD time-outs. A reset on the RST_A is only asserted when the device is in RUN mode. AWDRE is one-time setable (write once) after each reset. Reset clears the AWDRE bit. • 1 = Autonomous watchdog enabled • 0 = Autonomous watchdog disabled Autonomous Watchdog Interrupt Enable Bit (AWDIE) This read/write bit enables CPU interrupts by the Autonomous Watchdog timeout flag, AWFD. IRQ_A is only asserted when the device is in STOP mode. Reset clears the AWDIE bit. • 1 = CPU interrupt requests from AWDF enabled • 0 = CPU interrupt requests from AWDF disabled Autonomous Watchdog Cyclic Check (AWDCC) This read/write bit enables the cyclic check of the two-pin Hall-effect sensor and the analog inputs. Reset clears the AWDCC bit. • 1 = Cyclic check of the Hall-effect sensor and analog port • 0 = No cyclic check of the Hall-effect sensor and analog port Autonomous Watchdog Timeout Flag Bit (AWDF) This read/write flag is set when the Autonomous Watchdog has timed out. Clear AWDF by writing a Logic [1] to AWDF. Clearing AWDF also resets the AWD counter and starts a new timeout period. Reset clears the AWDF bit. Writing a Logic [0] to AWDF has no effect. • 1 = AWD has timed out • 0 = AWD has not yet timed out 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 39 FUNCTIONAL DEVICE OPERATION FACTORY TRIMMING AND CALIBRATION Autonomous Watchdog Rate Bit (AWDR) This read/write bit selects the clock rate of the Autonomous Watchdog. Reset clears the AWDR bit. • 1 = Fast rate selected (10 ms) • 0 = Slow rate selected (20 ms) VOLTAGE REGULATOR The 908E625 chip contains a low-power, low-drop voltage regulator to provide internal power and external power for the MCU. The on-chip regulator consist of two elements, the main voltage regulator and the low-voltage reset circuit. The VDD regulator accepts a unregulated input supply and provides a regulated VDD supply to all digital sections of the device. The output of the regulator is also connected to the VDD pin to provide the 5.0 V to the microcontroller. RUN Mode During RUN mode the main voltage regulator is on. It provides a regulated supply to all digital sections. STOP Mode During STOP mode the STOP mode regulator supplies a regulated output voltage. The STOP mode regulator has a very limited output current capability. The output voltage will be lower than the output voltage of the main voltage regulator. FACTORY TRIMMING AND CALIBRATION To enhance the ease-of-use of the 908E625, various parameters (e.g. ICG trim value) are stored in the flash memory of the device. The following flash memory locations are reserved for this purpose and might have a value different from the empty (0xFF) state: •0xFD80:0xFDDF Trim and Calibration Values •0xFFFE:0xFFFF Reset Vector In the event the application uses these parameters, one has to take care not to erase or override these values. If these parameters are not used, these flash locations can be erased and otherwise used. Trim Values Below the usage of the trim values located in the flash memory is explained Internal Clock Generator (ICG) Trim Value The internal clock generator (ICG) module is used to create a stable clock source for the microcontroller without using any external components. The untrimmed frequency of the low-frequency base clock (IBASE), will vary as much as ±25 percent due to process, temperature, and voltage dependencies. To compensate this dependancies a ICG trim values is located at adress $FDC2. After trimming the ICG is a range of typ. ±2% (±3% max.) at nominal conditions (filtered (100nF) and stabilized (4,7uF) VDD = 5V, TAmbient~25°C) and will vary over temperature and voltage (VDD) as indicated in the 68HC908EY16 datasheet. To trim the ICG this values has to be copied to the ICG Trim Register ICGTR at adress $38 of the MCU. Important The value has to copied after every reset. 908E625 40 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION TYPICAL APPLICATIONS DEVELOPMENT SUPPORT As the 908E625 has the MC68HC908EY16 MCU embedded typically all the development tools available for the MCU also apply for this device, however due to the fact of the additional analog die circuitry and the nominal +12V supply voltage some additional items have to be considered: • nominal 12V rather than 5V or 3V supply • high voltage VTST might be applied not only to IRQ pin, but IRQ_A pin For a detailed information on the MCU related development support see the MC68HC908EY16 datasheet section development support. The programming is principially possible at two stages in the manufacturing process - first on chip level, before the IC is soldered onto a pcb board and second after the IC is soldered onto the pcb board. Chip level programming On Chip level the easiest way is to only power the MCU with +5V (see Figure 23) and not to provide the analog chip with VSUP, in this setup all the analog pin should be left open (e.g. VSUP[1:3]) and interconnections between MCU and analog die have to be separated (e.g. IRQ - IRQ_A). This mode is well descripted in the MC68HC908EY16 datasheet - section development support. VSUP[1:3] VDD GND[1:2] VSS +5V VREFH VDDA RST EVDD RST_A +5V 1 1µF + 4 C1- GND C2+ V+ + V5 RS232 DB-9 VCC + 3 1µF C1+ 100nF VTST 16 IRQ_A 1µF 4.7µF VREFL IRQ MM908E625 VSSA EVSS 15 1µF + 2 9.8304MHz CLOCK 6 +5V CLK MAX232 C2- 10k PTC4/OSC1 1µF +5V PTB4/AD4 + 10k 74HC125 2 7 T2OUT 3 8 R2IN T2IN 10 6 74HC125 R2OUT 9 10k 5 DATA PTA1/KBD1 PTA0/KBD0 10k 4 PTB3/AD3 3 2 1 5 Figure 23. Normal Monitor Mode Circuit (MCU only) Of course its also possible to supply the whole system with Vsup (12V) instead as descibted in Figure 24, page 42. PCB level programming If the IC is soldered onto the pcb board its typically not possible to seperately power the MCU with +5V, the whole 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 41 TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION system has to be powered up providing VSUP (see Figure 24). VDD VSUP + 100nF 47µF VSUP[1:3] VDD GND[1:2] VSS VREFH VDDA RST EVDD RST_A VDD 1 VCC C1+ 16 + 1µF + 3 4 GND C1C2+ V+ + 1µF V5 RS232 DB-9 100nF VTST MM908E625 IRQ_A 1µF VSSA EVSS 15 1µF + 2 9.8304MHz CLOCK 6 VDD CLK MAX232 C2- 10k PTC4/OSC1 VDD PTB4/AD4 1µF + 10k 74HC125 2 7 T2OUT 3 8 R2IN T2IN 10 6 74HC125 R2OUT 9 4.7µF VREFL IRQ 10k 5 DATA PTA1/KBD1 PTA0/KBD0 10k 4 PTB3/AD3 3 2 1 5 Figure 24. Normal Monitor Mode Circuit Table 12 summarizes the possible configurations and the necessary setups. Table 12. Monitor Mode Signal Requirements and Options Mode IRQ RST Normal Monitor VTST Reset Vector VDD X VDD $FFFF (blank) Serial Communication Mode Selection PTA0 PTA1 PTB3 PTB4 1 0 0 1 VDD Forced Monitor 1 0 X VDD VDD not $FFFF (not blank) X X X COP OFF disabled disabled 9.8304 MHz 2.4576 MHz 9600 OFF disabled disabled 9.8304 MHz 2.4576 MHz 9600 ON disabled disabled — Nominal 1.6MHz Nominal 6300 ON enabled enabled — Nominal 1.6MHz Nominal 6300 X GND User Communication Speed Normal Request Baud Bus Timeout External Clock Frequency Rate ICG X Notes 1. PTA0 must have a pullup resistor to VDD in monitor mode 2. 3. 4. 5. External clock is a 4.9152MHz, 9.8304MHz or 19.6608MHz canned oscillator on OCS1 Communication speed with external clock is depending on external clock value. Baud rate is bus frequency / 256 X = don’t care VTST is a high voltage VDD + 3.5V ≤ VTST ≤ VDD + 4.5V 908E625 42 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION EMC/EMI RECOMMENDATIONS This paragraph gives some device specific recommendations to improve EMC/EMI performance. Further generic design recommendations can be e.g. found on the Freescale website www.freescale.com. MCU digital supply pins (EVDD and EVSS) VSUP pins (VSUP1:VSUP3) Fast signal transitions on MCU pins place high, shortduration current demands on the power supply. To prevent noise problems, take special care to provide power supply bypassing at the MCU. It is recommended that a high-quality ceramic decoupling capacitor be placed between these pins. Its recommended to place a high-quality ceramic decoupling capacitor close to the VSUP pins to improve EMC/EMI behaviour. MCU analog supply pins (VREFH, VDDA and VREFL, VSSA) To avoid noise on the analog supply pins its important to take special care on the layout. The MCU digital and analog supplies should be tied to the same potential via seperate traces and connected to the voltage regulator output. Figure 25 and Figure 26 show the recommendations on schematics and layout level and Table 13 incidates recommended external components and layout considerations. LIN pin For DPI (Direct Power Injection) and ESD (Electro Static Discharge) its recommended to place a high-quality ceramic decoupling capacitor near the LIN pin. An additional varistor will further increase the immunity against ESD. A ferrit in the LIN line will suppress some of the noise induced. Voltage regulator output pins (VDD and AGND) Use a high-quality ceramic decoupling capacitor to stabilize the regulated voltage. D1 VSUP + C1 C2 VSUP1 VDD VSUP2 VSS VSUP3 VREFH VDDA L1 LIN LIN EVDD V1 C5 C3 C4 EVSS MM908E625 VSSA GND1 VREFL GND2 Figure 25. EMC/EMI recommendations 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 43 TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION 1 54 2 53 3 52 4 51 5 50 49 7 VREFH 48 8 VDDA 47 9 EVDD 46 10 EVSS 45 11 VSSA 44 12 VREFL 43 13 14 42 NC 908E625 15 41 VSS 16 VDD 18 C5 V1 36 20 LIN 21 NC 22 NC 35 34 NC 23 GND 32 VSUP1 VSUP3 31 25 GND1 GND2 30 26 C1 33 24 27 VBAT 38 37 19 L1 C4 40 39 17 LIN C3 6 29 VSUP2 28 C2 D1 Figure 26. PCB Layout Recommendations . Table 13. Component Value Recommendation Component Recommended Value(1) D1 Comments / Signal routing reverse battery protection C1 Bulk Capacitor C2 100nF, SMD Ceramic, Low ESR Close (<5mm) to VSUP1, VSUP2 pins with good ground return C3 100nF, SMD Ceramic, Low ESR Close (<3mm) to digital supply pins (EVDD, EVSS) with good ground return. The positive analog (VREFH, VDDA) and the digital (EVDD) supply should be connected right at the C3. C4 4,7uF, SMD Ceramic, Low ESR Bulk Capacitor C5 180pF, SMD Ceramic, Low ESR Close (<5mm) to LIN pin. Total Capacitance on LIN has to be below 220pF. (Ctotal = CLIN-Pin + C5 + CVaristor ~ 10pF + 180pF + 15pF) (2) Varistor Type TDK AVR-M1608C270MBAAB Optional (close to LIN connector) (2) SMD Ferrite Bead Type TDK MMZ2012Y202B Optional, (close to LIN connector) V1 L1 Notes 1. Freescale does not assume liability, endorse, or want components from external manufactures that are referenced in circuit drawings or tables. While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. 2. Components are recommended to improve EMC and ESD performance. 908E625 44 Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGING PACKAGING DIMENSIONS PACKAGING PACKAGING DIMENSIONS Important: For the most current revision of the package, visit www.freescale.com and perform a keyword search on 98ARL105910. 10.3 5 7.6 7.4 9 C B NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUMS B AND C TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSION OR GATE BURRS SHALL NOT EXCEED 0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF HTE LEADS EXIT THE PLASTIC BODY. 5. THIS DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 6. THIS DIMENSION DOES NOT INCUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 MM. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD SHALL NOT BE LESS THAN 0.07 MM. 7. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 8. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM THE LEAD TIP. 9. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM. THIS DIMENSION IS DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTER-LEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTOM OF THE PLASTIC BODY. 2.65 2.35 52X 1 54 0.65 PIN 1 INDEX 4 9 B 27 18.0 17.8 CL B 28 A 5.15 54X 2X 27 TIPS 0.3 SEATING PLANE 0.10 A A B C A R0.08 MIN C C 0˚MIN 0.25 GAUGE PLANE (1.43) A 10.9 9.7 8˚ 0˚ 0.1 0.0 0.9 0.5 SECTION B-B 0.30 A B C (0.29) DWB SUFFIX 54-PIN 5.3 PLASTIC4.8 PACKAGE 98ARL105910 0.30 A B C ISSUE B 0.30 0.25 BASE METAL (0.25) 0.38 0.22 6 0.13 M PLATING A B C 8 SECTION A-A ROTATED 90˚ CLOCKWISE VIEW C-C 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 45 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENTATION 908E625 THERMAL ADDENDUM (REV 2.0) Introduction This thermal addendum ia provided as a supplement to the MM908E625 technical data sheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All electrical, application and packaging information is provided in the data sheet. 54-PIN SOICW-EP Package and Thermal Considerations This MM908E625 is a dual die package. There are two heat sources in the package independently heating with P1 and P2. This results in two junction temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn. For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the reference temperature while only heat source 1 is heating with P1. For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the reference temperature while heat source 2 is heating with P2. This applies to RθJ21 and RθJ22, respectively. TJ1 TJ2 = RθJA11 RθJA12 RθJA21 RθJA22 . P1 P2 DWB SUFFIX EK SUFFIX (Pb-Free) 98ARL105910 54-PIN SOICW-EP Note For package dimensions, refer to the 908E625 device datasheet. The stated values are solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated values were obtained by measurement and simulation according to the standards listed below. Standards Table 14. Thermal Performance Comparison 1.0 1 = Power Chip, 2 = Logic Chip [°C/W] Thermal Resistance m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 RθJAmn (1)(2) 23 20 24 RθJBmn (2)(3) 9.0 6.0 10 RθJAmn (1)(4) 52 47 52 1.0 0 2.0 RθJCmn (5) 1.0 0.2 Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-7and JESD51-5. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the power outputs. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad, “infinite” heat sink attached to exposed pad. 0.2 * All measurements are in millimeters Soldermast openings Thermal vias connected to top buried plane 54 Terminal SOIC-EP 0.65 mm Pitch 17.9 mm x 7.5 mm Body 10.3 mm x 5.1 mm Exposed Pad Figure 27. Thermal Land Pattern for Direct Thermal Attachment Per JEDEC JESD51-5Thermal Test Board 908E625 46 Analog Integrated Circuit Device Data Freescale Semiconductor ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) A PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTC4/OSC1 PTC3/OSC2 PTC2/MCLK PTB5/AD5 PTB4/AD4 PTB3/AD3 IRQ RST PTB1/AD1 PTD0/TACH0/BEMF PTD1/TACH1 NC FGEN BEMF RST_A IRQ_A SS LIN NC NC HB1 VSUP1 GND1 HB2 VSUP2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Exposed Pad 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 PTA0/KBD0 PTA1/KBD1 PTA2/KBD2 FLSVPP PTA3/KBD3 PTA4/KBD4 VREFH VDDA EVDD EVSS VSSA VREFL PTE1/RXD RXD VSS PA1 VDD H1 H2 H3 HVDD NC HB4 VSUP3 GND2 HB3 HS 908E625 Pin Connections 54-Pin SOICW-EP 0.65 mm Pitch 17.9 mm x 7.5 mm Body 10.3 mm x 5.1 mm Exposed Pad Figure 28. Thermal Test Board Device on Thermal Test Board Material: Outline: Area A: Ambient Conditions: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness 80 mm x 100 mm board area, including edge connector for thermal testing Cu heat-spreading areas on board surface Natural convection, still air Table 15. Thermal Resistance Performance Thermal Resistance RθJAmn RθJSmn Area A (mm2) 1 = Power Chip, 2 = Logic Chip (°C/W) m = 1, n=1 m = 1, n = 2 m = 2, n = 1 m = 2, n=2 0 53 48 53 300 39 34 38 600 35 30 34 0 21 16 20 300 15 11 15 600 14 9.0 13 RθJA is the thermal resistance between die junction and ambient air. RθJSmn is the thermal resistance between die junction and the reference location on the board surface near a center lead of the package. This device is a dual die package. Index m indicates the die that is heated. Index n refers to the number of the die where the junction temperature is sensed. 908E625 Analog Integrated Circuit Device Data Freescale Semiconductor 47 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale’s Environmental Products program, go to http:// www.freescale.com/epp. USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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