In-Vehicle Networking Automotive Local Interconnect Network (LIN) Applications Overview Local interconnect network (LIN) is a UARTbased, single-master, multiple-slave networking architecture originally developed for automotive sensor and actuator networking applications. LIN provides a lowcost networking option for connecting motors, switches, sensors, and lamps in the vehicle. The LIN master node connects the LIN network with higher-level networks, like controller area network (CAN), extending the benefits of networking all the way to the individual sensors and actuators. HC08 or HCS12 MCU MC33388 MC33389, MC33742, MC33889, MC33989 CAN System Basis Chips MSCAN MC33399 MC33661 LIN Physical Layer SCI (Vreg + CAN Phy + Low Power Mode) LIN Bus *The MC33742 is a system basis chip. TYPICAL LIN SLAVE MODULE LIN Bus MC33399, MC33661 LIN Physical Layer or MC33689 LIN System Basis Chip > LIN physical layer has critical wave shaping that aids EMC problems by reducing radiated emissions > Mechatronics smart connector solutions offer increased integration of connectors and silicon for greater design flexibility and added feature content TYPICAL LIN MASTER MODULE CAN Key Benefits > All Freescale Semiconductor MCUs are capable of LIN communications HC08 MCU (Vreg + LIN Phy + Low PowerMode) Analog Load Control Hardware (Contact Monitors, H-Bridges, High & Low Side Switches) Motors, Lamps, Sensors, Switches > Freescale Semiconductor is a founding member of the LIN consortium and the only semiconductor provider in the steering circle AUTOMOTIVE LIN DOOR SYSTEM BLOCK DIAGRAM CAN Control Switch Panel HCS12 or HC08 LIN Master LIN Bus (Bus, Power, Ground) 3 Headrest Height Motor HC08 LIN Slave MM908E624Headrest Angle Motor HC08 LIN Slave MM908E624 Lumbar Adjust Motor HC08 LIN Slave MM908E624Backrest Angle Motor HC08 LIN Slave MM908E624 Rear Seat Height Motor HC08 LIN Slave MM908E624Front Seat Height Motor HC08 LIN Slave MM908E624 Longitudinal Seat Travel Motor HC08 LIN Slave MM908E624Seat Front Angle Motor HC08 LIN Slave MM908E624 LIN Physical Interface MC33399 MC33661 Seat Ventilation Fan HC08 LIN Slave Seat Heating Element HC08 LIN Slave MM908E624 SG2034-2 DRIVER’S SIDE: LIN DOOR SYSTEM BLOCK DIAGRAM Control Switch Panel Switch Interface MC33972 MC33975 MC33993 Driver's Side HCS12 or HC08 LIN Master 3 Front Window Lifter Motor CAN 3 LIN Bus LIN Bus HC08 LIN Slave Sensor Anti-Pitch Sensor HC08 LIN Slave Rear Window Lifter Motor HC08 LIN Slave Rear Door Lock Motor Assembly HC08 LIN Slave Driver Power Mirror Assembly Electrochrome HC08/Mechatronics LIN Slave SG2034-3 (Bus, Power, Ground) Front Door Lock Motor Assembly (Bus, Power, Ground) HC08 LIN Slave PASSENGER’S SIDE: LIN DOOR SYSTEM BLOCK DIAGRAM Passenger's Side Control Switch Panel Switch Interface MC33972 MC33975 MC33993 CAN HCS12 or HC08 LIN Master 3 3 LIN Bus (Bus, Power, Ground) (Bus, Power, Ground) LIN Bus Front Window Lifter Motor HC08 LIN Slave MM980E624 Door Lock Motor Assembly HC08 LIN Slave MM980E624 Anti-Pitch Sensor Sensor HC08 LIN Slave Rear Window Lifter Motor HC08 LIN Slave Rear Door Lock MM980E624 Motor Assembly HC08 LIN Slave Passenger Power Mirror Assembly Electrochrome HC08/Mechatronics LIN Slave MM908E625 SG2034-4 AUTOMOTIVE HVAC SYSTEM USING LIN CAN Climate Control Panel HCS12 or HC08 LIN Master (Bus, Power, Ground) LIN 3 Fresh Air Intake Damper HC08 LIN Slave Config H-B Defrost MC33879, MC33880 Zone Damper HC08 LIN Slave Config H-B Vent MC33879, MC33880 Zone Damper HC08 LIN Slave HC08 LIN Slave ConfigConfig H-B H-B Footwell MC33879,MC33880 MC33880 MC33879, Zone Damper HC08 LIN Slave Config H-B MC33879, MC33880 Compressor Controller HC08 LIN Slave MC33399, MC33661 MC33689, MC33742 AC Compressor Evaporator Temperature Sensor HC08 LIN Slave MC33399, MC33661 MC33689, MC33742 Sensor Cabin Air Temperature Sensor HC08 LIN Slave MC33399, MC33661 MC33689, MC33742 Heat Control Valve HC08 LIN Slave MC33399, MC33661 MC33689, MC33742 Blower Motor HC08 LIN Slave MC33981 SG2034-5 Sensor Solenoid Freescale Ordering InformationNote Part Number Product Highlights Additional Information HC08 Family Refer to SG187 for 8- and 16-Bit Microcontroller Part Numbers; Capable of LIN Communication; Smaller and Less Expensive for Creating LIN Slave Node Applications (when sized appropriately); Up to 60K of Flash or ROM Memory; Enhanced SCI for LIN; Serial Peripheral Interface; Clock Generation Module; Freescale Semiconductor Scalable CAN www.freescale.com HC12 Family Refer to SG187 for 8- and 16-bit Microcontroller Part Numbers; Capable of LIN Communication; Powerful Choice for LIN Master Node Application; Up to 128 K of Flash or ROM; SCI, SPI, Clock Generation Module; Up to Three CAN Modules HCS12 Family Refer to SG187 for 8- and 16-bit microcontroller Part Numbers; Capable of LIN Communication; Powerful Choice for LIN Master Node Application; Up to 512 K of Flash or ROM; Up to Two ESCI; Up to Three SPI; Up to 4 CAN Modules; Clock Generators; Excellent EMC and Stop Idd. MC33399 Local Interconnect Network (LIN) Physical Layer MC33661 eLIN – Enhanced LIN Physical Layer (Local Interconnect Network) MC33689 LIN System Basis Chip: LIN physical interface, voltage regulation, two local wake-up inputs, power drive outputs MC33742 System Basis Chip with Enhanced High Speed CAN MC33879 Configureable Octal Serial Switch with Open Load Detect Current Disable MC33880 Configurable Eight Output SPI Controlled Switch (1.0 Ω RDS(ON)) MC33972 22 Input Multiple Switch Detection Interface with Suppressed Wake-Up MC33975 22 Input Multiple Switch Detection Interface with Higher Wetting Current MC33981 High-Frequency, High-Current, Self-Protected 4 mΩ RDS(ON) High-Side Switch MC33984 Self Protected 4 mΩ Switch with Diagnostic and Protection MC33993 22 Input Multiple Switch Detection Interface MC56F801x Family Up to 32 MHz, 32 MIPS, and up to 16KB Flash; 4KB Unified Data/Program RAM; EEPROM emulation capability; SCI with LIN, SPI, I2C, ADC, PWM, GPIO, COP/Watchdog; MCU-Style software stack support; JTAG/OnCE for debug (Slave functionality only) MM908E624 Integrated Triple High-Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers MM908E625 Integrated Quad Half H-Bridge with Power Supply, Embedded MUC, and LIN Serial Communication. www.freescale.com/analog www.freescale.com Note: Search on the listed part number. Design Challenges Form Factor, Manufacture Capability, Load Control, and Diagnostics Challenges exist when integrating LIN networking into an automotive environment. Most applications, where LIN could be used, are currently implemented using discrete, point-topoint wiring systems, with no allocation for silicon, circuits, or components at the load. The load, whether a lamp, motor, or sensor, is usually connected with a simple connector to wires in the tangle of the wiring harness. As a result, little room remains to incorporate the components to enable LIN. For example, in a power mirror, a supplier might place as many as three motors, heater element, electrochromic glass, and multiple lamps. These components do SG2034-6 not leave much room for other potential requirements. diagnose these loads in a small form factor that can fit in a very small space. The capability to manufacture control modules is another significant challenge to automotive electronics manufacturers. This problem is not unique to LIN developers but it is a problem not always faced by manufacturers of motors, sensors, and actuators. Stringent EMC Radiated Emissions Requirements Electromagnetic Compatibility (EMC) deals with how multiple electronic devices interact based on the Finally, when distributing the intelligence of the system using LIN, new options become available to designers. Motor, lamp, and solenoid loads can now be controlled at the origin. Diagnostic data can be easily rejected through the LIN network providing an unprecedented level of control and system level information. The challenge is how to provide the silicon content to control and electromagnetic emissions they radiate (radiated emissions) and how they respond to radiated emissions from outside sources (susceptibility). This is of enormous concern in the automotive environment due to the close proximity of a very wide range of electronic systems and devices. It is very important that the LIN network not radiate very much energy, since these busses pass information through long wires that result in antennae that send emissions to the rest of the vehicle. LIN is designed as a single-wire bus, switching from ground to battery-level voltages. This large voltage swing can be a potential source of large amounts of radiated emissions, particularly if little care or attention is paid to physical layer device design. Freescale Semiconductor Solution Freescale Semiconductor Mechatronics Address Form Factor, Manufacture Capability, Load Control, and Diagnostics Issues LIN, as an open standard UART protocol, enables Freescale Semiconductor to create a complete line of highly integrated mechatronic components. These components integrate all of the silicon components needed for a particular slave application and connector housings into one very compact assembly. This approach offers tremendous benefits to the LIN slave node designer. The high level of integration offers a solution to many customer design challenges. The compact size and integration of connector technologies means control units can be easily placed directly into the wiring harness without having to place the control circuitry into a separate box with more connectors and SG2034-7 mounting issues. Control units can be attached directly to motors and other loads, eliminating connections and wiring. In addition to the reduced form factor, these smart connectors increase the ease of manufacture because the module vendor no longer must deal with designing a circuit board, manufacturing that board assembly, and testing it for faults. All of this process is done for the customer through the manufacturing process of the mechatronics components. One option with these mechatronic components is to have the MCU, physical layer, and load handling silicon placed onto an insulated metal substrate (IMS) that serves as a small printed circuit board. The advantage to this option is superior thermal performance. The IMS is thermally coupled to all of the load handling, communication, and logic silicon, providing unparalleled heat dissipation capability. Intrinsic to the mechatronics products is the incorporation of Freescale Semiconductor SMARTMOS™ products for sensing, load handling and diagnostics. These products are also available as peripheral devices for MCUs and provide features such as current control and limitation, full thermal and electrical protection, and advanced load diagnostics. The application designer can measure and control exactly how much current goes to a particular load and perform these advanced operations directly at the load, rather than over long wire lengths. Freescale Semiconductor LIN Physical Layer Designed to Meet Stringent EMC Radiated Emissions Requirements Freescale Semiconductor has a long history of dealing with single wire automotive communication busses. The experience and insight from working with the J1850 physical layer has proven invaluable in developing the MC33399, MC33661, and LIN physical layer. Freescale Semiconductor was one of the first to market a LIN physical layer in production quantities and the first to market a LIN physical layer with critical wave-shaping circuitry (essential for reducing radiated emissions). Wave shaping takes the traditional trapezoidal waveform and rounds the corners to reduce harmonic components in the resulting waveform. Originally, the LIN specification did not take these corners into account, but Freescale Semiconductor has gone beyond requirements to produce a superior WAVE-SHAPED WAVEFORM Unshaped Waveform Active Wave Shaping Shaped Waveform Bus Impedance will Affect this Corner Development ToolsNote Tool Type Product Name Vendor Description Additional Information Software drivers LIN software drivers Metrowerks LIN Master and Slave Driver Software for HC08, HC12, and HCS12, Including Both the LIN Standard API and Freescale Semiconductor Custom API. Hardware development tools EVBs and other development tools for respective MCUs and DSCs Metrowerks Helps Developers Simplify and Speed Development for High-Performance Microcontrollers and Digital Signal Controllers. Development kit CodeWarrior development system, HC08 LIN edition Metrowerks CodeWarrior Development Tools for HC08, Complete with LIN Master and Slave Driver SW, Sample Application SW, HC908GP32 Reference Board (Master Module), HC908KX8 Reference Board (Slave Module). Evaluation Kit KIT33388DEVB Metrowerks Fault Tolerant CAN Interface Evaluation Kit KIT33389DWEVB Metrowerks System Basis Chip Evaluation Kit KIT33399DEVB Metrowerks Local Interconnect Network (LIN) Physical Layer Evaluation Kit KIT33661DEVB Metrowerks LIN Enhanced Physical Interface Evaluation Kit KIT33742DWEVB Metrowerks System Basis Chip with Enhanced High-Speed CAN Evaluation Kit KIT33889DWEVB Metrowerks System Basis Chip with Low-Speed CAN Evaluation Kit KIT33989DWEVB Metrowerks System Basis Chip with High-Speed CAN Evaluation Kit KIT908EINTFC Metrowerks PC Interface for MM908Exxx www.metrowerks.com Note: Search on the listed product name. Third Party Support Vendor Description Additional Information CANoe (option LIN) System Level Networking Tool www.vector-cantech.com CANalyzer (option LIN) Network Monitoring, Emulation, Verification www.vector-cantech.com VNA/L (Volcano network architect for LIN) System Level Networking Tool www.volcanoautomotive.com LINspector tool Network Monitoring, Emulation, Verification www.volcanoautomotive.com LIN graphical objects (LINgo) Graphical Add-On to LINspector www.volcanoautomotive.com Vector CANtech Volcano Automotive Group SG2034-8 Disclaimer This document may not include all the details necessary to completely develop this design. It is provided as a reference only and is intended to demonstrate the variety of applications for the device. Related DocumentationNote Document Number Description Additional Information AN2103 Local Interconnect Network (LIN) Demonstration www.freescale.com AN2205 Car Door Keypad Using LIN AN2264 LIN Node Temperature Display 2002-01-1298 Implementing Local Interconnect Network (LIN) Slave Nodes (Society of Automotive engineers (SAE) Technical Papers) Note: Search on the listed document number. SG2034-9 www.sae.org Notes SG2034-10 Notes SG2034-11 Learn More: Contact the Technical Information Center at +1-800-521-6274 or +1-480-768-2130. For more information about Freescale products, please visit www.freescale.com. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005. All rights reserved. SG2034 REV 2 6/2005 June2005