MMA690xQ Rev 2.0, 11/2010 Freescale Semiconductor Technical Data High Accuracy Low g Inertial Sensor MEMS Sensing, State Machine ASIC MMA690xQ The MMA690xQ is a dual axis, Low g, XY, Sensor based on Freescale’s HARMEMS technology, with an embedded DSP ASIC, allowing for additional processing of the digital signals. Features Sensitivity in X and Y axes ±3.5 or ±5.0g full-scale range per axis AEC-Q100 qualified, Rev. G, grade 2 (-40 ≤ TA ≤ 105 °C) 50 Hz second order low-pass filter Unsigned 11-bits digital data output SPI-compatible serial interface Capture/hold input for system-wide synchronization support 3.3 or 5.0V single supply operation On-chip temperature sensor and voltage regulator Bi-directional internal self-test Minimal external component requirements Pb-free 16-pin QFN package Pulse-code modulated output available for device evaluation DUAL AXIS SPI INERTIAL SENSOR Bottom View 16-PIN QFN 98ASA10571D CASE 1477-02 Typical Applications VSSA PCM_X • • Top View With a ±3.5g or ±5.0g full scale range, the newly designed, high accuracy sensor, enables Electronic Stability Control (ESC) designers to accommodate higher original signal noise level without sacrificing resolution. Tilt Measurement Electronic Parking Brake CREGA • CREGA • • • • • • • • • • • • • 16 15 14 13 CREF 1 Tubes MMA6901(K)Q ±5.0 g MMA6900(K)QR2 ±3.5 g MMA6901(K)QR2 ±5.0 g 9 VPP 5 6 7 8 CREG ±3.5 g VSS 4 SCLK Shipping 10 DIN CS/RESET MMA6900(K)Q Range 11 CAP/HOLD VCC 3 DOUT ORDERING INFORMATION Device Name 12 PCM_Y CREF 2 Tape and Reel “K” suffix indicates the device is manufactured with an alternate silicon sourcing This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc. 2010. All rights reserved. PIN CONNECTIONS SECTION 1 INTRODUCTION 1.1 INTRODUCTION MMA690xQ is a two-axis member of Freescale’s family of SPI-compatible accelerometers. These devices incorporate digital signal processing for filtering, trim, and data formatting. 1.2 SERIAL COMMUNICATION CONFIGURATION The serial communication configuration provides a 4-wire SPI interface. Device serial number, acceleration range, filter characteristics, and status information are available along with acceleration data via the SPI. 1.3 BLOCK DIAGRAM A block diagram illustrating the major components of the design is shown in Figure 1-1. VPP UNIT PROGRAMMABLE DATA ARRAY VCC CREG CREGA CREGA VOLTAGE REGULATOR REFERENCE OSCILLATOR CLOCK MONITOR PRIMARY OSCILLATOR INTERNAL CLOCK CREF CREF DIN VSS SPI CONTROL LOGIC VSSA DOUT SCLK CS CAP/HOLD g-CELL (Y) ΣΔ CONVERTER CONTROL IN SINC FILTER IN 1 SELF-TEST INTERFACE TEMP. SENSOR TEMP STATUS OUT DIGITAL OUT DSP (SEE FIGURE 1-2) Y OUT PCM PCM_Y X OUT PCM PCM_X IN 0 g-CELL (X) ΣΔ CONVERTER SINC FILTER Figure 1-1 Block Diagram MMA690xQ 2 Sensors Freescale Semiconductor DSP CONTROL CONTROL IN IN 1 IN 0 LOW-PASS FILTER STATUS OUT OFFSET, GAIN, LINEARITY ADJUST OUTPUT SCALING DIGITAL OUT TEMP Figure 1-2 DSP Block Diagram 1.4 PIN FUNCTIONS The pinout is illustrated in Figure 1-3. Pin functions are described in the following paragraphs. When self-test is active, the output becomes more positive in both axes, if ST1 is cleared or more negative in both axes if ST1 is set, as described in Section 2.1.3. VSSA PCM_X CREGA CREGA X: 0 g Y: +1 g 16 15 14 13 12 PCM_Y CREF 2 11 CAP/HOLD VSS 4 9 VPP 5 6 7 8 CREG 10 DIN CS/RESET VCC 3 SCLK TO CENTER OF GRAVITATIONAL FIELD CREF 1 DOUT X: -1 g Y: 0 g X: +1 g Y: 0 g X: 0 g Y: -1 g Response to static orientation within 1 g field. TOP VIEW 16-PIN QFN PACKAGE Figure 1-3 Pinout for MMA690xQ MMA690xQ Sensors Freescale Semiconductor 3 1.4.1 VCC This pin supplies power to the device. Careful printed wiring board layout and capacitor placement is critical to ensure best performance. An external bypass capacitor between this pin and VSS is required, as described in Section 1.5. 1.4.2 VSS This pin is the power supply return node for the digital circuitry on the MMA690xQ device. 1.4.3 VSSA This pin is the power supply return node for analog circuitry on the MMA690xQ device. An external bypass capacitor between this pin and VCC is required, as described in Section 1.5. 1.4.4 CREG This pin is connected to the internal digital circuitry power supply rail. An external filter capacitor must be connected between this pin and VSS, as described in Section 1.5. 1.4.5 CREGA These pins are connected in parallel to the internal analog circuitry power supply rail. One or two external filter capacitors must be connected between these pins and VSSA, as described in Section 1.5. Two pins are provided to support redundant connection to the printed wiring board assembly. Redundant external capacitors may be connected to these pins for maximum reliability, as described in Section 1.5. 1.4.6 CREF These pins are connected in parallel to an internal reference voltage node utilized by the analog circuitry. One or two external filter capacitors must be connected between these pins and VSSA, as described shown in Section 1.5. Two pins are provided to support redundant connection to the printed wiring board assembly. Redundant external capacitors may be connected to these pins for maximum reliability, as described in Section 1.5. 1.4.7 VPP This pin should be tied directly to VSS. 1.4.8 SCLK This input pin provides the serial clock to the SPI port. The state of this pin is also used as a qualifier for externally-controlled reset. An internal pull-down device is connected to this pin. This input may be used to initiate device reset as described in Section 1.4.9 and Section 2.6. 1.4.9 CS/RESET This pin functions as the chip select input for the SPI port. The state of the DIN pin during low-to-high transitions of SCLK is latched internally and DOUT is enabled when CS is at a logic low level. This pin may also be used to initiate a hardware reset. If CS is held low and SCLK is held high for 512 μs, the internal reset signal is asserted. This behavior is described in Section 2.6. An internal pull-up device is connected to this pin. 1.4.10 DOUT This pin functions as the serial data output for the SPI port. 1.4.11 DIN This pin functions as the serial data input to the SPI port. 1.4.12 CAP/HOLD When this input pin is low, the SPI acceleration result registers are updated by the DSP whenever a data sample becomes available. Upon a low-to-high transition of CAP/HOLD, the contents of the acceleration result registers are frozen. The result registers will not be updated so long as this pin remains at a logic ‘1’ level. This pin may be tied directly to VSS if the hold function is not desired. MMA690xQ 4 Sensors Freescale Semiconductor 1.4.13 PCM_X, PCM_Y MMA690xQ provides the option for a Pulse Code Modulated (PCM) output function. The PCM output is activated when PCM_EN is set in the DEVCTL register. When the PCM function is enabled, the upper nine bits of the 11-bit scaled acceleration values are used to generate PCM signals proportional to incident respective acceleration, at 250 ns resolution. A simplified block diagram of the PCM output is shown in Figure 1-4. OUTPUT SCALING OC[9:1] 9 A PCM_X/PCM_Y CARRY 9-BIT ADDER 9 B SUM D fCLK = 4.0 MHz D Q D Q Q DFF Q D FF Q D FF Q D FF Q DFF Q CLK DFF Q CLK CLK FF FF CLK CLK FF CLK CLK CLK CLK 9 Figure 1-4 PCM Output Function Block Diagram MMA690xQ Sensors Freescale Semiconductor 5 1.5 EXTERNAL COMPONENTS The connections illustrated in Figure 1-5 are recommended. Careful printed wiring board layout and component placement is essential for best performance. Low ESR capacitors must be connected to CREG and CREGA pins for best performance. A grounded land area with solder mask should be placed under the package for improved shielding of the device from external effects. If a land area is not provided, no signals should be routed beneath the package. VCC MMA690xQ VCC CREG CREGA CREGA CREF 100 nF 1.0 μF 1.0 μF 1.0 μF 100 nF 100 nF CREF VSSA VSS RECOMMENDED EXTERNAL COMPONENT CONFIGURATION VCC MMA690xQ VCC CREG CREGA CREGA CREF CREF 100 nF 1 μF 1 μF 100 nF VSSA VSS ALTERNATE EXTERNAL COMPONENT CONFIGURATION Figure 1-5 External Components MMA690xQ 6 Sensors Freescale Semiconductor SECTION 2 INTERNAL MODULES 2.1 DATA ARRAY A 400-bit data array allows each device to be customized. The array interface incorporates parity circuitry for fault detection along with a locking mechanism, to prevent unintended changes. Portions of the array are reserved for factory-programmed trim values. Customer accessible data stored in the array are shown in the Table 2-1. Addresses $00 - $0D are associated with the data array. A writable register at address $0E is provided for device control operations. Two read-only registers at addresses $0F and $10 provide status information. Unused bits within the data array are always read as ‘0’ values. Unprogrammed OTP bits are also read as ‘0’ values. Table 2-1. DSP Configuration Register Location Bit Function Type Addr Register 7 6 5 4 3 2 1 0 $00 SN0 SN[7] SN[6] SN[5] SN[4] SN[3] SN[2] SN[1] SN[0] $01 SN1 SN[15] SN[14] SN[13] SN[12] SN[11] SN[10] SN[9] SN[8] $02 SN2 SN[23] SN[22] SN[21] SN[20] SN[19] SN[18] SN[17] SN[16] $03 SN3 SN[31] SN[30] SN[29] SN[28] SN[27] SN[26] SN[25] SN[24] $04 DEVCFG0 0 0 0 0 RNG[3] RNG[2] RNG[1] RNG[0] $05 DEVCFG1 0 0 0 0 RNG[3] RNG[2] RNG[1] RNG[0] $06 DEVCFG2 0 0 0 0 0 0 0 0 $07 DEVCFG3 0 0 0 0 0 0 0 0 $08 DEVCFG4 0 0 0 0 0 0 0 0 $09 DEVCFG5 1 0 1 0 0 0 0 0 $0A AXCFG_X 0 1 0 1 0 1 0 1 $0B AXCFG_Y 0 1 0 1 0 1 0 1 F/R F/R F/R $0C Unused N/A $0D DSPCFG 0 0 1 0 0 1 0 0 F/R $0E DEVCTL RES_1 RES_0 CE PCM_EN HPFB YINV ST1 ST0 R/W $0F TEMP TEMP[7] TEMP[6] TEMP[5] TEMP[4] TEMP[3] TEMP[2] TEMP[1] TEMP[0] $10 DEVSTAT IDE OSCF DEVINIT TF 0 0 0 DEVRES $11 COUNT COUNT[7] COUNT[6] COUNT[5] COUNT[4] COUNT[3] COUNT[2] COUNT[1] COUNT[0] $24 ACC_X11L ACC_X[7] ACC_X[6] ACC_X[5] ACC_X[4] ACC_X[3] ACC_X[2] ACC_X[1] ACC_X[0] $25 ACC_X11H 0 0 0 0 0 ACC_X[10] ACC_X[9] ACC_X[8] $26 ACC_Y11L ACC_Y[7] ACC_Y[6] ACC_Y[5] ACC_Y[4] ACC_Y[3] ACC_Y[2] ACC_Y[1] ACC_Y[0] $27 ACC_Y11H 0 0 0 0 0 ACC_Y[10] ACC_Y[9] ACC_Y[8] F: Factory programmed OTP location R: Read-only register R/W: Read/write register R N/A: Not applicable MMA690xQ Sensors Freescale Semiconductor 7 2.1.1 Device Serial Number A unique serial number is programmed into each device during manufacturing. The serial number is composed of the following information. Table 2-2. Serial Number Assignment Bit Function Bit Range Content SN12 - SN0 Serial Number SN31 - SN13 Lot Number Lot numbers begin at 1 for all devices produced and are sequentially assigned. Serial numbers begin at 1 for each lot, and are sequentially assigned. No lot will contain more devices than can be uniquely identified by the 13-bit serial number. Not all allowable lot numbers and serial numbers will be assigned. 2.1.2 Full-Scale Range Full-scale range is indicated by the value programmed into DEVCFG0 and DEVCFG1. Ranges for defined part numbers are shown in Table 2-3 below. Table 2-3. Full-Scale Range Range Bits Part Number RNG[3] RNG[2] RNG[1] RNG[0] Full-Scale Range (g) Register MMA6900Q DEVCFG0 0 0 0 0 3.5 DEVCFG1 0 0 0 0 3.5 MMA6901Q DEVCFG0 0 1 0 1 5.0 DEVCFG1 0 1 0 1 5.0 2.1.3 Device Control Register (DEVCTL) A read-write register at address $0E supports a number of device control operations as described in the following. Reserved bits within DEVCTL are always read as logic ‘0’ values. Write operations involving DEVCTL are effective approximately 1.0 μs following negation of CS/RESET. This delay must be considered if successive SPI operations involving write to DEVCTL followed by acceleration data read are conducted in the minimum allowed transfer timing, as the acceleration result may indicate lingering self-test or error status conditions. It is therefore recommended that acceleration data read operations be delayed by at least 1.2 μs following writes to DEVCTL. Table 2-4. Device Control Register Bit Address Register $0E DEVCTL 2.1.3.1 7 6 5 4 3 2 1 0 RES1 RES0 CE PCM_EN HPFB YINV ST1 ST0 Reset Control (RES_1, RES_0) A specific series of three write operations involving these two bits will cause the internal digital circuitry to be reset. The state of the remaining bits in the DEVCTL register do not affect the reset sequence, however any write operation involving this register in which both RES_1 and RES_0 are cleared will terminate the sequence. To reset the internal digital circuitry, the following register write operations must be performed in the order shown: 1. Set RES1. RES0 must remain cleared. 2. Set RES1 and RES0. 3. Clear RES1 and set RES0. RES1 and RES0 are always read as logic ‘0’ values. MMA690xQ 8 Sensors Freescale Semiconductor 2.1.3.2 Clear Error (CE) Setting this bit to a logic ‘1’ state will clear transient error status conditions. It is necessary to either set this bit or perform a device reset if an error condition has been reported by the device before acceleration data transfer can be resumed. The device reset condition may be cleared only after device initialization has completed. Error conditions and classification are described in Section 3.1. The state of this bit is always read as logic ‘0’. 2.1.3.3 PCM Enable (PCM_EN) This bit controls the PCM_X and PCM_Y outputs along with internal circuitry which generates a pulse-code modulated signal from the acceleration result. When this bit is set, the PCM outputs are enabled. When cleared, PCM_X and PCM_Y are driven to a logic low level. 2.1.3.4 High-pass Filter Bypass (HPFB) The high-pass filter is disabled through factory settings, therefore writing this bit will have no effect. If read, this bit will be “0”. 2.1.3.5 Y-Axis Signal Inversion Control (YINV) This control function is provided as a means to verify operation of the two-channel multiplexor which alternately provides X-axis and Y-axis data to the DSP. An inverter block and multiplexor at the Y-axis input to the DSP are controlled by the YINV bit. Setting this bit when ST0 is set has the effect of changing the sign of acceleration in the Y-axis. Operation of the YINV bit is illustrated in Figure 2-1. Y-axis inversion may be selected only during self-test; the state of this bit has no effect when ST0 is cleared. ST0 YINV DSP 1 ΣΔ SINC FILTER ΣΔ SINC FILTER Y-AXIS CONVERTER X-AXIS CONVERTER 0 Figure 2-1 Y-Axis Inversion Function Self-test operations controlled by YINV along with ST1 and ST0 are summarized in the Table 2-5. 2.1.3.6 Self-test Control (ST1, ST0) Bidirectional self-test control is provided through manipulation of these bits. ST1 controls direction while ST0 enables and disables the self-test circuitry. ST1 and ST0 are always cleared following internal reset. When ST0 is set, the high-pass filter is bypassed and the values within the high-pass filter are frozen. Both axes are affected simultaneously by the state of these bits. If the offset monitor is enabled, self-test activation in a single direction should be limited to less than 30 ms. Communications Protocol bits S2 - S1 are inverted when self-test is activated, as described in Section 3.2. Table 2-5. Self-Test Control Operations Self-Test Operation YINV ST1 ST0 X-Axis Y-Axis X X 0 Self-test Disabled, Y-Axis Signal Inversion Disabled 0 0 1 Positive Deflection 0 1 1 Negative Deflection 1 0 1 Positive Deflection Negative Deflection 1 1 1 Negative Deflection Positive Deflection Offset correction is applied within the DSP, and is not affected by the state of the YINV bit. Consequently, inversion of the Y-axis signal may result in saturation of the Y-axis output value. Correct operation of the DSP input multiplexor may be confirmed by performing the operations shown in Figure 2-2. MMA690xQ Sensors Freescale Semiconductor 9 YINV = 0, ST1 = 0, ST0 = 1 READ ACCELERATION (R1) YINV = 0, ST1 = 1, ST0 = 1 READ ACCELERATION (R2) N R 1 > R2 Y YINV = 1, ST1 = 0, ST0 = 1 READ ACCELERATION (R3) YINV = 1, ST1 = 1, ST0 = 1 READ ACCELERATION (R4) N R3 ≤ R4 Y MULTIPLEXOR VERIFICATION SUCCESSFUL MULTIPLEXOR VERIFICATION FAILED Figure 2-2 DSP Input Multiplexor Verification Flow Chart (Y Axis) 2.1.4 Temperature Sensor Value (TEMP) This read-only register contains a signed value which provides a relative temperature indication. The temperature sensor is uncalibrated and its output for a given temperature will vary from one device to the next. The value in this register increases with temperature. Table 2-6. Temperature Sensor Value Register Location Bit Function Address Register 7 6 5 4 3 2 1 0 $0F TEMP TEMP[7] TEMP[6] TEMP[5] TEMP[4] TEMP[3] TEMP[2] TEMP[1] TEMP[0] 2.1.5 Device Status Register (DEVSTAT) This read-only register is accessible in all modes. Table 2-7. Device Status Register Location Bit Function Address Register 7 6 5 4 3 2 1 0 $10 DEVSTAT IDE 0 DEVINIT TF 0 0 0 DEVRES 2.1.5.1 Internal Data Error Flag (IDE) This flag will be set if a register data parity fault or a marginally programmed fuse is detected. Device reset is required to clear this fault condition. If a parity error is associated with the data stored in the fuse array, this fault condition cannot be cleared. This flag is disabled when the device is in test mode. 2.1.5.2 Device Initialization Flag (DEVINIT) This flag is set during the interval between negation of internal reset and completion of device initialization. DEVINIT is cleared automatically. MMA690xQ 10 Sensors Freescale Semiconductor 2.1.5.3 Temperature Fault Flag (TF) This flag is set if the value reported by the on-chip temperature sensor exceeds specified limits. TF may be cleared by writing a logic ‘1’ value to the CE bit in DEVCTL, provided that the fault condition is no longer detected. 2.1.5.4 Device Reset Flag (DEVRES) This flag is set during device initialization. A logic ‘1’ must be written to the CE bit in the Device Control register (DEVCTL) to clear this bit. Except when Communications Protocol is active, this bit must be explicitly cleared following reset before acceleration results can be read from MMA690xQ. 2.1.6 Counter Register (COUNT) This read-only register provides the value of a free-running 8-bit counter derived from the primary oscillator. A five-bit prescaler divides the 4.0 MHz primary oscillator frequency by 32. Thus, the value in the register increases by one count every 8.0 μs, and the counter rolls over every 2.048 ms. Table 2-8 Counter Register Location Bit Function Address Register 7 6 5 4 3 2 1 0 $11 COUNT COUNT[7] COUNT[6] COUNT[5] COUNT[4] COUNT[3] COUNT[2] COUNT[1] COUNT[0] 2.1.7 Acceleration Result Registers These read-only registers contain acceleration results produced by the DSP. The values in these registers are frozen by either of two events: • CAP/HOLD input at logic high level • CS input at logic low level Acceleration result registers are provided for each axis. ACC_X11L/ACC_X11H and ACC_Y11L/ACC_Y11H provide 11-bit results. Updates to ACC_X11L/ACC_X11H and ACC_Y11L/ACC_Y11H are halted upon reading the lower-byte register of either pair until the upper-byte register is read. There is no requirement to manipulate CAP/HOLD when reading ACC_X11L/ACC_X11H or ACC_Y11L/ACC_Y11H, however ACC_X11H or ACC_Y11H must be read after reading ACC_X11L or ACC_Y11L, respectively, or further updates to the register pair will not occur. Table 2-9. X-Axis Acceleration Result Registers Location Bit Function Address Register 7 6 5 4 3 2 1 0 $24 ACC_X11L ACC_X[7] ACC_X[6] ACC_X[5] ACC_X[4] ACC_X[3] ACC_X[2] ACC_X[1] ACC_X[0] $25 ACC_X11H 0 0 0 0 0 ACC_X[10] ACC_X[9] ACC_X[8] Table 2-10. Y-Axis Acceleration Result Registers Location Bit Function Address Register 7 6 5 4 3 2 1 0 $26 ACC_Y11L ACC_Y[7] ACC_Y[6] ACC_Y[5] ACC_Y[4] ACC_Y[3] ACC_Y[2] ACC_Y[1] ACC_Y[0] $27 ACC_Y11H 0 0 0 0 0 ACC_Y[10] ACC_Y[9] ACC_Y[8] Sign extension is applied to the upper five bits of ACC_X11H and ACC_Y11H. If an error condition exists, the reserved value 0 will be read in place of 11-bit acceleration data. MMA690xQ Sensors Freescale Semiconductor 11 2.2 VOLTAGE REGULATORS Separate internal voltage regulators supply fixed voltages to the analog and digital circuitry. External filter capacitors are required, as shown in Figure 1-5. The voltage regulator module includes a voltage monitoring circuitry which holds the device in reset following power-on until internal voltages have stabilized sufficiently for proper operation. The voltage monitor asserts internal reset when the external supply or internally regulated voltages fall below predetermined levels. A reference generator provides a stable voltage which is used by the ΣΔ converter. This circuit also requires an external filter capacitor. The voltage regulator module is illustrated in Figure 2-3 and Figure 2-4. VCC VREGA = 2.50 V VOLTAGE REGULATOR BANDGAP REFERENCE VBGA BIAS GENERATOR PRIMARY OSCILLATOR TRIM TRIM BIAS GENERATOR REFERENCE OSCILLATOR CREGA CREGA OTP ARRAY REFERENCE GENERATOR VREF = 1.250V ΣΔ CONVERTER BANDGAP REFERENCE CREF CREF VBG VOLTAGE REGULATOR ΣΔ CONVERTER VREG = 2.50V CREG DIGITAL LOGIC OTP ARRAY DSP Figure 2-3 Power Distribution MMA690xQ 12 Sensors Freescale Semiconductor VCC VOLTAGE DIVIDER + UV - VREG VOLTAGE DIVIDER + UV - VOLTAGE DIVIDER + OV - VREGA VOLTAGE DIVIDER + UV POR - VOLTAGE DIVIDER + OV VBG VREF VOLTAGE DIVIDER + UV - VOLTAGE DIVIDER + REFER TO SECTION 5.3 FOR POWER-ON RESET THRESHOLD LIMITS. OV VBGA Figure 2-4 Voltage Monitoring 2.3 OSCILLATOR An internal oscillator operating at a nominal frequency of 4.0 MHz provides a stable clock source. The oscillator is factory trimmed for best performance. A clock generator block divides the 4.0 MHz clock as needed by other blocks. 2.4 CREG MONITOR A monitor circuit is incorporated to ensure predictable operation of the device in the event that the connection to the external capacitor at the CREG pin (pin 8) fails, or the capacitor opens. The monitor disables the 2.5 V regulator which powers the digital circuitry for 2.0 μs every 249.5 μs. If the external capacitor is not present, voltage at the internal supply rail will drop below the internal reset threshold, continuously forcing the device into reset. Loss of communication from the device is a readily detectable condition. The XOUT and YOUT pins are driven to the low rail when the device is in the reset state. 2.5 CLOCK MONITOR Two independent oscillators are provided within MMA690xQ. One is factory-trimmed and provides the timing reference used throughout the device. The second oscillator acts as a reference for the first. If the frequency of these two oscillators varies by more than 10%, an oscillator fault condition is determined. In normal operating mode, an oscillator fault will cause the DOUT pin to be forced to a continuous logic high state when CS is asserted, as described in Section 3.1.1.2. MMA690xQ Sensors Freescale Semiconductor 13 2.6 INTERNAL RESET CONTROLLER Four conditions can result in an internal reset. The initial power-on condition always results in a reset condition An internal voltage monitor will assert reset when the supply voltage or a regulated output voltage falls below specified limits. This is referred to as a low voltage reset. Externally, a hardware reset can be initiated by holding SCLK high and driving the CS pin low for 512 μs. Finally, the device can be reset through a series of register write operations, as described in Section 2.1.3.1. 2.7 CONTROL LOGIC A control logic block coordinates a number of activities within the device. These include: • Post-reset device initialization • Self-test • Operating mode selection • Data array programming • Device support data transfers 2.8 TEMPERATURE SENSOR A temperature sensor provides input to the digital signal processing block. Device temperature is incorporated into a correction value, which is applied to each acceleration result. The upper eight bits of the temperature sensor value are accessible through the TEMP register, described in Section 2.1.4. The temperature sensor output is continuously compared to under- or over-temperature limits of approximately -40 and +110 °C, respectively. A temperature fault condition is indicated if the temperature sensor value exceeds the under- or over-temperature limit. 2.8.1 TEMPERATURE SENSOR MONITOR A monitor circuit associated with the temperature sensor is provided. The monitor will detect over- or under-temperature conditions as well as rapid fluctuations in temperature sensor output such as would be related to failure of the sensor. If a temperature related fault is detected, an error condition is indicated in lieu of acceleration data. Rapid fluctuation of the temperature sensor output is detected by comparing the value of each sample to the previous value. This operation, as well as temperature limit detection is illustrated in Figure 2-5. A fault condition is indicated if predetermined limits are exceeded. MMA690xQ 14 Sensors Freescale Semiconductor Start Read 10-bit temperature sensor value (tP) tP > OTL? Y OTL: OVER-TEMPERATURE LIMIT UTL: UNDER-TEMPERATURE LIMIT SSL: SAMPLE-TO-SAMPLE LIMIT N tP < UTL? Y N Δt = tP - tr N TSMEN == 1? Y |Δt| > 3? Y N tr = tP Set Temperature Fault flag End Figure 2-5 Temperature Sensor Monitor Flow Chart MMA690xQ Sensors Freescale Semiconductor 15 2.9 SPI The SPI is a full bidirectional port which is used for all configuration and control functions. 2.10 SELF-TEST INTERFACE The self-test interface provides a mechanism for applying a calibrated voltage to the g-cell. This results in deflection of the proof mass, causing reported acceleration results to be offset by a specified amount. Control of the self-test interface via the SPI is accommodated through write operations involving the DEVCTL register at address $0E, described in Section 2.1.3. 2.11 ΣΔ CONVERTERS Two sigma delta converters provide the interface between the g-cell and digital signal processing block. The output of each ΣΔ converter is a data stream at a nominal frequency of 1.0 MHz. 2.12 DIGITAL SIGNAL PROCESSING BLOCK A Digital Signal Processing (DSP) block is used to perform all filtering and correction operations. A diagram illustrating the signal processing flow within the DSP block is shown in Figure 1-1. The DSP operates at 2.0 MHz, twice the frequency of the ΣΔ converters. The two interleaved bit streams from the ΣΔ converters are processed simultaneously within the DSP. Each MMA690xQ device is factory programmed to select the acceleration range. Filter characteristics for the X- and Y-axes are customer programmed. 2.12.1 LOW-PASS FILTER Low-pass filtering occurs in two stages. The serial data stream produced by the ΣΔ converters is decimated and converted to parallel values by a sinc filter. Parallel data is then processed by an Infinite Impulse Response (IIR) low-pass filter. A selection of low-pass filter characteristics are available. The cutoff frequency (fC) and rate at which acceleration samples are determined by the device (tS) vary depending upon which filter is chosen. Power consumption is also affected, as higher sample rates require greater DSP activity, which in turn requires more supply current. Response parameters for available low-pass filter are summarized in A.2. MMA690xQ 16 Sensors Freescale Semiconductor SECTION 3 SERIAL COMMUNICATIONS Digital data communication is completed through synchronous serial transfers via the SPI port. Conventional SPI protocol is employed, acting as a slave device observing CPOL = 0, CPHA = 0, MSB first. A number of data integrity features are incorporated into the transfer protocols. 3.1 EXCEPTION CONDITIONS Under certain conditions, the MMA690xQ will respond to serial commands with a word, which indicates that an exception condition has been detected. Response varies according to the Communication Protocol selected. Exceptions fall into five classes and are prioritized. If multiple exception conditions are detected, only the exception of highest priority is reported. A reset exception condition exists following any device reset. Immediately following reset, a Device Initialization condition will be indicated until internal initialization of the circuitry has completed. Following internal initialization, a Device Reset exception condition exists until explicitly cleared by writing a logic ‘1’ to the CE bit in DEVCTL. Transient exception conditions result from data transmission errors such as data parity faults, an invalid number of clock cycles, etc. These exceptions are indicated during the following SPI transfer operation. These exceptions do not require an explicit operation to be cleared. Behavioral exception conditions are defined as those which affect acceleration data results but do not indicate an error condition. In MMA690xQ, the two behavioral exceptions are activation of self-test and a hold condition resulting from the external CAP/ HOLD pin being driven to a logic high state. Register operations are unaffected by behavioral exceptions. Acceleration data transfers will complete, with the S/T1 and S/T0 bits indicating that one or both behavioral exception conditions exist. See Section 3.2 for behavioral exceptions reported by the Communications Protocol. Critical error exceptions exist when an internal fault, which affects the reliability of device operation or acceleration results, is detected. If a critical error condition exists, an invalid data value is produced by the device in lieu of acceleration results. Register operations are unaffected except for the state of S[2:0]. Some critical errors, such as Temperature Fault, may be cleared by writing a logic ‘1’ to the CE bit in DEVCTL, provided the underlying fault condition no longer persists. Other critical error conditions require reset of the device to clear. 3.1.1 Defined Exceptions 3.1.1.1 Internal Data Error Class: Critical error During reset, a number of internal registers are loaded from a fuse array which stores factory-programmed values. The resistance of each fuse is measured and compared to thresholds to ensure integrity of programmed data. Additionally, the register array is continuously monitored for correct parity at all time while the device is powered. If either the margin test or parity verification fail, an internal data error exception is reported. Device reset is required to clear this exception condition. 3.1.1.2 Internal Oscillator Fault Class: Critical error If an oscillator fault condition is detected, DOUT is driven high continuously when CS is asserted, as illustrated in Figure 3-1. Device reset is required to clear this exception condition. SCLK CS DOUT Figure 3-1 Oscillator Failure Response MMA690xQ Sensors Freescale Semiconductor 17 3.1.1.3 Device Initialization Class: Reset Following a reset condition, the device requires a period of time to complete initialization of the DSP and internal registers. If multiple SPI transfers are attempted during this initialization period, the second and all subsequent transfers will result in this status. The first transfer following reset, regardless of the state of initialization returns device reset status. This exception condition is cleared automatically upon completion of device initialization. 3.1.1.4 Temperature Fault Class: Critical The internal temperature sensor value exceeds the allowable limits for the device. This exception condition may be cleared by writing a logic ‘1’ to the CE bit in DEVCTL, provided that the temperature has returned to within the operating limits of the device. 3.1.1.5 Unexpected Axis Selection Class: Transient An acceleration data request has been received with an axis specification which is not supported. This exception condition is reported during the subsequent transfer. 3.1.1.6 Device Reset Class: Reset This exception condition is latched any time the device undergoes reset. Device response will indicate the exception condition in lieu of acceleration data.The device reset exception condition must be explicitly cleared by writing a logic ‘1’ to the CE bit in DEVCTL. 3.1.1.7 SPI Clock Fault Class: Transient A SPI clock fault may result from the following conditions: • The number of rising clock edges detected while CS is asserted is not equal to the expected number for the selected communications protocol • SCLK is high when CS is asserted This exception condition is reported during the subsequent transfer. 3.1.1.8 DIN Parity Fault Class: Transient A parity error was detected on DIN during a data transmission. This exception condition is reported during the subsequent transfer. 3.1.1.9 HOLD Condition A HOLD condition exists when the CAP/HOLD pin is driven to a logic high level. Self-test activation is controlled through configuration of ST1 and ST0 in DEVCTL. 3.1.1.10 Self-Test Activation Class: Behavioral The device provides two status bits in its response which will indicate a behavioral exception condition if a HOLD condition exists or self-test is activated. As these are not error conditions, device response is otherwise unaffected. Refer to Section 3.2.1 for details regarding device response to behavioral exception conditions. A HOLD condition exists when the CAP/HOLD pin is driven to a logic level high level. Self-test activation is controlled through configuration of ST1 and ST0 in DEVCTL. MMA690xQ 18 Sensors Freescale Semiconductor 3.1.2 Exception Priority Table 3-1 provides a summary of exception conditions and order of priority. Table 3-1. Exception Conditions Condition Status Bit Class SPI Clock Fault, Previous Transfer — Transient DIN Parity Fault, Previous Transfer — Transient Internal Data Error IDE Critical Error Internal Oscillator Fault — Critical Error Device Initialization DEVINIT Reset Device Reset DEVRES Reset Temperature Fault TF Critical Error Invalid Axis Selection — Transient Hold Condition — Behavioral Self-test — Behavioral If an offset fault condition is detected simultaneously in both the X- and Y-axes, only the X-axis exception is reported by the device. Hold condition and self-test exceptions have equal priority; if both exceptions exist simultaneously, both are reported by the device. 3.2 COMMUNICATIONS PROTOCOL The Communications Protocol provides 11-bit acceleration data along with enhanced status notification in the event that an exception condition is detected. All transfers are 16-bits in length, with the intended operation indicated by a two-bit transfer type code transmitted by the SPI master. Table 3-2. Transfer Type Codes T1 T0 Transfer Type 0 0 Register Operation 0 1 X-axis acceleration data 1 0 Y-axis acceleration data 1 1 Unused Device response depends upon the transfer type code and the internal state of the device. If no exception condition has been detected, the device returns register or acceleration data as requested. If an exception condition exists, response depends upon the requested operation and the exception. Exceptions are divided into four classes: behavioral, reset, transient, and critical. Certain operations, such as register data write and register pointer write, will not be completed if an exception condition is detected during the associated SPI transfer. All exception conditions detected by MMA690xQ are listed in Table 3-1. Response to exceptions is described below, and summarized in Table 3-3. If both T1 and T0 are set to a logic ‘1’ state, an invalid axis selection exception will be reported by the device. 3.2.1 Device Response Device response depends upon exception conditions which may be present at the time the transfer takes place. In case of multiple exceptions, the exception class of highest priority will determine response. MMA690xQ Sensors Freescale Semiconductor 19 Table 3-3. Device Response, Exception Conditions Exception Command Response Priority Class ST HOLD T1 T0 S2 S1 S0 Register Acceleration Data Transient X X X X 1 1 1 Status code Status code Reset X X 1 1 1 Critical X X 1 1 1 1 1 0 T1 T0 1 0 1 T1 T0 0 1 1 T1 T0 0 0 0 T1 T0 Behavioral None T1 T0 Highest ² $7FF ² ² As requested ² As requested ² Lowest ST = Self-test active Commands and response under normal and exception conditions are summarized in the following tables. Note that only DEVCTL at address $0E is writable when the device is in its normal operating mode. Table 3-4. Normal Response Summary Bit Operation 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Acceleration Data Read Command T1 T0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 0 T1 T0 P D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 Register Pointer Read Command 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 Response 0 0 0 0 0 P 0 0 A7 A6 A5 A4 A3 A2 A1 A0 Register Pointer Write Command 0 0 0 1 0 P 0 0 A7 A6 A5 A4 A3 A2 A1 A0 Response 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 Register Data Read Command 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 0 0 0 1 0 P 0 0 D7 D6 D5 D4 D3 D2 D1 D0 Register Data Write Command 0 0 1 1 0 P 0 0 D7 D6 D5 D4 D3 D2 D1 D0 Response 0 0 0 1 1 P 0 0 A7 A6 A5 A4 A3 A2 A1 A0 P: Parity T[1:0] Transfer type code Note that only DEVCTL is writable when the device operates in normal operating mode. Attempts to write other registers do not constitute a fault condition, but have no effect. Table 3-5. Behavioral Response Summary, One Exception Condition Bit Operation 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Acceleration Data Read Command T1 T0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 1 T1 T0 P D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 Register Pointer Read Command 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 Response 1 1 1 0 0 P 0 1 A7 A6 A5 A4 A3 A2 A1 A0 Register Pointer Write Command 0 0 0 1 0 P 0 0 A7 A6 A5 A4 A3 A2 A1 A0 Response 1 1 1 0 1 0 0 1 0 0 0 0 0 0 0 0 Register Data Read Command 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 1 1 1 1 0 P 0 1 D7 D6 D5 D4 D3 D2 D1 D0 Register Data Write Command 0 0 1 1 0 P 0 0 D7 D6 D5 D4 D3 D2 D1 D0 Response 1 1 1 1 1 P 0 1 A7 A6 A5 A4 A3 A2 A1 A0 P: Parity T[1:0] Transfer type code MMA690xQ 20 Sensors Freescale Semiconductor Behavioral exception conditions exist if self-test is active or the CAP/HOLD input is in a logic high state. MMA690xQ will respond as shown in Table 3-5 if either exception condition exists. If both exception conditions are true, response is as shown in Table 3-4. Table 3-6. Critical/Reset Exception Response Detail Bit Operation 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Acceleration Data Read Command T1 T0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 Register Pointer Read Command 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 Response 1 1 1 0 0 P 1 0 Register Address Register Pointer Write Command 0 0 0 1 0 P 0 0 Register Address Response 1 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 Register Data Read Command 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 Response 1 1 1 1 0 P 1 0 Register Data Register Data Write Command 0 0 1 1 0 P 0 0 Register Data Response 1 1 1 1 1 P 1 0 Register Address P: Parity T[1:0] Transfer type code A special case exists if an internal oscillator fault is detected. This critical error condition results in DOUT being driven high continuously while CS is asserted, as detailed in Section 3.1.1.2. Table 3-7. Transient Exception Response Detail Bit Operation 15 14 13 12 11 10 9 0 0 0 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 Acceleration Data Read Command T1 T0 0 0 Response 1 1 1 P Register Pointer Read Command 0 0 0 0 0 1 0 0 Response 1 1 1 0 0 P 1 1 Status code Register Pointer Write Command 0 0 0 1 0 P 0 0 Register Address Response 1 1 1 0 1 P 1 1 Status code Register Data Read Command 0 0 1 0 0 0 0 0 Response 1 1 1 1 0 P 1 1 Status code Register Data Write Command 0 0 1 1 0 P 0 0 Register Data Response 1 1 1 1 1 P 1 1 Status code Reserved value (refer to Table 3-8) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P: Parity T[1:0] Transfer type code MMA690xQ Sensors Freescale Semiconductor 21 3.2.2 Acceleration Data Transfer The format of an acceleration data transfer is illustrated in Figure 3-2. Response to acceleration data transfers is summarized in Table 3-8. Note that a number of reserved values are defined to indicate error exceptions. MMA690xQ will produce signed or unsigned data depending upon the state of the SD bit in the DSPCFG register, as described in Section 2.1.4. 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 MOSI T1 T0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 MISO S2 S1 S0 P D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 BIT SCLK CS 0 T[1:0] Transfer type code S[2:0]: Status code Figure 3-2 Communications Protocol, Acceleration Data Transfer Table 3-8. Range of Output, Communications Protocol 11-bit Data Value Unsigned Definition Decimal Hex 2047 7FF Critical/Reset Exception Value 2046 7FE Invalid Axis Selection 2045 7FD Internal Signal Path Overflow 2044 7FC Overrange Value 2043 7FB Maximum Positive Signal Level • • • 1024 • • • 400 • • • Zero Signal Level • • • 5 005 Minimum Negative Signal Level 4 004 Underrange Value 3 003 Internal Signal Path Underflow 2 002 SPI Clock Fault 1 001 DIN Parity Fault 0 000 Reserved Value MMA690xQ 22 Sensors Freescale Semiconductor 3.2.3 Register Operations Register operations involve four transfer types: register pointer write or read, and register data write or read. The basic format for register operations is illustrated in Figure 3-3. Response from MMA690xQ under normal conditions is illustrated. Specific details for each transfer type are provided in the command/response summaries provided in Section 3.2.1. 15 14 13 12 11 10 9 8 MOSI T1 T0 A/D R/W 0 P 0 0 MISO S2 S1 S0 A/D R/W P EC1 EC0 BIT 7 6 5 4 3 2 1 0 SCLK CS D/A7 D/A6 D/A5 D/A4 D/A3 D/A2 D/A1 D/A0 D/A7 D/A6 D/A5 D/A4 D/A3 D/A2 D/A1 D/A0 T[1:0] Transfer type code S[2:0]: Status code A/D: ADDRESS/DATA R/W: READ/WRITE EC[1:0]: Exception class (refer to Table 3-9 below) D/A[7:0]: Data or address, depending upon transfer type and status Figure 3-3 Communications Protocol, Register Operations Table 3-9. Exception Class Encoding EC1 EC0 Exception Class 0 0 No Exception 0 1 Behavioral (one exception) 1 0 Critical/Reset 1 1 Transient MMA690xQ Sensors Freescale Semiconductor 23 3.3 REPRESENTATION Table 3-10. Nominal 11-bit Acceleration Data Values 11-bit Unsigned Digital Value 5.0g Range 2047 Critical/Reset Exception Value 2046 Invalid Axis Selection 2045 Overflow 2044 Overrange 2043 +3.50g +5.00g 2042 +3.50g +5.00g 2041 +3.49g +4.99g • • • • • • • • • 1027 +10.3 mg +14.7 mg 1026 +6.87 mg +9.81 mg 1025 +3.43 mg +4.91 mg 1024 0g 0g 1023 -3.43 mg -4.91 mg 1022 -6.87 mg -9.81 mg 1021 -10.3 mg -14.7 mg • • • • • • • • • 7 -3.49g -4.99g 6 -3.50g -5.00g 5 -3.50g 4 3.3.1 Nominal Acceleration 3.5g Range -5.00g Underrange 3 Underflow 2 SPI Clock Fault 1 DIN Parity Fault 0 Reserved Overrange Response Positive acceleration levels which exceed the full-scale range of the device fall into two categories: overrange and overflow. Overrange conditions exist when the signal level is beyond the full-scale range of the device but within the computational limits of the DSP. An overflow condition occurs if the output of the low-pass filter equals or exceeds the maximum digital value which can be output from the sinc filter. Sinc filter saturation will occur before the internal data path width is exceeded. At 25 °C and OVLD = 0, the sinc filter will not saturate at sustained acceleration levels with the range of ±200g. The DSP operates predictably under all cases of overrange, although the signal may include residual high frequency components for some time after returning to the normal range of operation due to non-linear effects of the sensor. If an overflow condition occurs, the signal is internally clipped. The DSP will recover from an overflow condition within a few sample times after the input signal returns to the input range of the DSP. Due to internal clipping within the DSP, some high-frequency artifacts may be present in the output following an overflow condition. For negative acceleration levels, corresponding underrange and underflow conditions are defined. 3.4 CAP/HOLD INPUT The CAP/HOLD input provides a system-level synchronization mechanism. When driven high, transfer of acceleration results from the DSP to the SPI buffers does not occur. The DSP continues its normal operation regardless of the state of CAP/HOLD. Data read from the device when CAP/HOLD is high will reflect the last values available from the DSP at the time of the signal transition. MMA690xQ 24 Sensors Freescale Semiconductor SECTION 4 OPERATING MODES MMA690xQ operates in one of two modes, factory test programming mode and normal operating mode. Factory test and programming mode is entered only when certain conditions are met, and provides support for programming of customer-defined data. Normal mode is entered by default when the device is powered on. 4.1 NORMAL OPERATING MODE Normal mode is entered whenever the device is powered and the VPP pin is held at or below the level of VCC. In normal mode, acceleration data and device support data transfers are supported. 4.1.1 Power-On Reset Upon application of voltage at the VCC pin, the internal regulators will begin driving the internal power supply rails. The CREG and CREGA pins are tied to the internal rails. As voltages at VCC, CREG and CREGA rise, the device becomes operational. An internal reset signal is asserted at this time. Separate comparators on monitor all three voltages, and when all are above specified thresholds, the reset signal is negated and the device begins its initialization process. 4.1.2 Device Initialization Following any reset, the device completes a sequence of operations which initialize internal circuitry. Device initialization is completed in two phases. During the first phase, the fuse array is read and its contents are transferred to mirror registers. Power to the fuse array is then removed to reduce supply current load. A voltage reference used within the sensor interface stabilizes during the second phase. If the HPFSEL bit is set in the DSP configuration register (DSPCFG), the high-pass filter is also initialized during phase two. The device will not respond to SPI accesses during initialization phase one. Acceleration results are not available during initialization phase two, however the SPI is functional and register operations may be performed. If an acceleration data access is attempted, the device will respond with non-acceleration data. The specific response depends upon the Communications Protocol selected. The first initialization phase requires approximately 800 μs to complete. The second phase completes in approximately 3.0 ms if no high-pass filter is selected, and 200 ms if the HPFSEL bit is programmed to a logic ‘1’ state. The DEVINIT bit in the device status register (DEVSTAT) remains set following reset until the second phase of device initialization completes. Following completion of the device initialization, the DEVRES bit in DEVSTAT may be cleared by writing a logic ‘1’ value to CE in DEVCTL. This operation will clear the device reset exception. Once cleared, register operations may be completed or acceleration data values may be read from the device in any desired sequence. MMA690xQ Sensors Freescale Semiconductor 25 SECTION 5 PERFORMANCE SPECIFICATION 5.1 MAXIMUM RATINGS Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. The device contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep input and output voltages within the range VSS ≤ V ≤ VCC. Rating Symbol Value Unit Supply Voltage VCC -0.3 to +7 V (1) CREG, CREGA, CREF VREG -0.3 to +3 V (1) VPP VREG -0.3 to +11 V (1) SCLK, CS, DIN, CAP/HOLD, PCM_X, PCM_Y VIN -0.3 to VCC + 0.3 V (1) DOUT (high impedance state) VIN -0.3 to VCC + 0.3 V (1) I 10 mA (1) Powered Shock (six sides, 0.5 ms duration) gpms ±1500 g (1) Unpowered Shock (six sides, 0.5 ms duration) gshock ±2000 g (1) Drop Shock (to concrete surface) hDROP 1.2 m (1) Electrostatic Discharge Human Body Model (HBM) Charge Device Model (CDM) Machine Model (MM) VESD VESD VESD ±2000 ±500 ±200 V V V (1) Tstg -40 to +125 °C (1) Current Drain per Pin Excluding VCC and VSS Storage Temperature Range (1) (1) 1.Verified by characterization, not tested in production. 5.2 OPERATING RANGE The operating ratings are the limits normally expected in the application and define the range of operation. Characteristic Supply Voltage Standard Operating Voltage, 3.3 V operating range Standard Operating Voltage, 5.0 V operating range Symbol Min Typ Max Units VCC VCC VL +3.15 +4.75 +3.3 +5.0 VH +3.45 +5.25 V V (1) TA TL -40 — TH +105 °C (2) Operating Temperature Range (1) 1.Characterized at all values of VL and VH. Production test is conducted at typical voltage unless otherwise noted. 2.Parameters tested 100% at final test. MMA690xQ 26 Sensors Freescale Semiconductor 5.3 ELECTRICAL CHARACTERISTICS VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4.0 k/min. unless otherwise specified Characteristic Symbol Min Typ Max Units IDD — — 8.0 mA VPOR_N VPOR_N VPOR_N VPOR_N 2.77 1.80 2.18 1.11 — — — — 3.15 2.32 2.50 1.29 V V V V (2) Power-On Reset Threshold (See Figure 5-1) VCC CREG CREGA CREF VPOR_A VPOR_A VPOR_A VPOR_A 2.77 1.80 2.18 1.11 — — — — 2.95 2.10 2.31 1.19 V V V V (2) Hysteresis (VPOR_N - VPOR_A, See Figure 5-1) VCC CREG CREGA CREF VHYST VHYST VHYST VHYST 0 0 0 0 — — — — 388 300 261 150 mV mV mV mV (2) VDD V2.5 VREF 2.42 2.42 1.20 2.50 2.50 1.25 2.58 2.58 1.29 V V V (1) CREG ESR 800 — 1000 — nF mΩ (2) 200 — — 0.004 digit/mv (2) NLOUT -1.0 — 1.0 % FSR (2) nSD — — 140 μg/√Hz (2) SENS — 3.43 — mg/digit (1) SENS — 4.91 — mg/digit (1) * ΔSENS -3.0 — +3.0 % (1) * DOUT — 1024 — digit (1) * * ΔDOUT ΔDOUT -8.9 -14.6 — — +8.9 +14.6 digit digit (1) Supply Current Drain VCC = 5.25 V, tS = 64 μs * Power-On Reset Threshold (See Figure 5-1) VCC CREG CREGA CREF Internally Regulated Voltages CREG CREGA(3) CREF Power Supply Coupling Nonlinearity Noise (1.0 Hz-1.0 kHz) Sensitivity Error (4) -40 °C ≤ TA ≤ +105 °C Offset at 0 g 11-bit unsigned data Offset error TA = 25 °C 11-bit data (2) (2) (2) (2) (2) (2) (2) (2) (2) (1) * * * External Filter Capacitor (CREG, CREGA) Value ESR (including interconnect resistance) Sensitivity 3.5 g Range 11-bit data 5.0 g Range 11-bit data (1) * * (1) (1) (2) (1) 1.Parameters tested 100% at final test. 2.Verified by characterization, not tested in production. 3.Tested at VCC = VL and VCC = VH. 4.Target value. Actual value to be determined during device characterization. * Indicates a Freescale critical characteristic. MMA690xQ Sensors Freescale Semiconductor 27 ELECTRICAL CHARACTERISTICS (continued) VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified. Characteristic Symbol Min Typ Max Units RANGE CFU IAU OFU ORU URU UFU SCFU PFU UNUSED 5 — — — — — — — — — — 2047 2046 2045 2044 4 3 2 1 0 2043 — — — — — — — — — digit digit digit digit digit digit digit digit digit digit (1) gOVER gOVER +3.22 +4.63 +3.50 +5.00 +3.79 +5.38 g g (2) gUNDER gUNDER -3.79 -5.38 -3.50 -5.00 -3.22 -4.63 g g (2) gSAT < -12 — > +12 g (2) ΔST ΔST 472 437 525 525 578 630 mg mg (4) Cross-Axis Sensitivity VZX VYX VZY VZX VYX VZY -4 -4 -4 — — — +4 +4 +4 % % % (2) Output High Voltage DOUT (ILoad = -100 μA) VOH 0.85 — — VCC (5) Output Low Voltage DOUT, (ILoad = 100 μA) VOL — — 0.1 VCC (5) ZOUT COUT 47 — — — — 35 kΩ pF (2) Input High Voltage CS/RESET, SCLK, DIN, CAP/HOLD VIH 0.65 — — VCC (5) Input Low Voltage CS/RESET, SCLK, DIN, CAP/HOLD VIL — — 0.2 VCC (5) IIH RIN -30 190 -50 270 -260 350 μA kΩ (5) IIL 30 50 260 μA (5) Range of Output 11-bit data, unsigned Normal Critical Fault Value Invalid Axis Selection Positive Acceleration Overflow Code Positive Acceleration Overrange Code Negative Acceleration Underrange Code Negative Acceleration Underlfow Code SPI Clock Fault DIN Parity Fault Unused Code Output value on overrange 11-bit data: 2043 3.5g Range 5.0g Range 11-bit data: 5 3.5g Range 5.0g Range Maximum acceleration without saturation of internal circuitry (OVLD = 0) Self-test Output Change(3) TA = 25 °C -40 ≤ TA ≤ 105 °C Output Loading (DOUT) Load Resistance Load Capacitance Input Current High (at VIH) SCLK, DIN, CAP/HOLD VPP (internal pull-down resistor) Low (at VIL) CS/RESET * * (1) (1) (1) (1) (1) (1) (1) (1) (1) (2) (2) (4) (2) (2) (2) (5) 1.Functionality verified 100% via scan. timing characteristic is directly determined by internal oscillator frequency. 2.Verified by characterization, not tested in production. 3.Self-test deflection is trimmed in positive direction. Deflection in negative direction is approximately equal in magnitude. 4.Parameters tested 100% at final test. 5.Parameters tested 100% at unit probe. * Indicates a Freescale critical characteristic. MMA690xQ 28 Sensors Freescale Semiconductor 5.4 CONTROL TIMING VL ≤ (VCC - VSS) ≤ VH, TL ≤ TA ≤ TH, |ΔTA| < 4 K/min unless otherwise specified Symbol Min Typ Max Units DSP Low-Pass Filter Cut-Off Frequency Filter Order Characteristic fC(LPF) OLPF 47.5 50.0 2 52.5 Hz 1 (1) Power-On Recovery Time POR negated to CS low Power applied to XOUT, YOUT valid tOP tXY ⎯ ⎯ ⎯ ⎯ 840 15 μs ms (1) Internal Oscillator Frequency fOSC 3.8 4.0 4.2 MHz (2) Clock Monitor Threshold fMON 3.6 ⎯ 4.4 MHz (1) Chip Select to Internal Reset (See Figure 5-2) tCSRES 486 512 538 μs (1) Serial Interface Timing (See Figure 5-3) Clock period CS asserted to SCLK high Data setup time Data hold time SCLK high to data out SCLK high to CS negated CS negated to CS asserted tSCLK tCSCLK tDC tCDIN tCDOUT tCHCSH tCSN 120 60 20 10 — 60 600 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 50 — — ns ns ns ns ns ns ns (3) fn ⎯ ⎯ 3 1.2 ⎯ ⎯ kHz kHz (3) Sensing Element Natural Frequency Sense Element Bandwidth (-3.0 dB) BWGCELL (1) (2) (3) (3) (3) (3) (3) (3) (3) 1.Functionality verified 100% via scan. timing characteristic is directly determined by internal oscillator frequency. 2.Parameters tested 100% at final test. 3.Verified by characterization, not tested in production. 5.5V VPOR_N VPOR_A VCC POR Figure 5-1 Power-Up Timing CS tCSRES INTERNAL RESET SCLK Figure 5-2 CS Reset Timing MMA690xQ Sensors Freescale Semiconductor 29 CS tCSN tCSCLK tCLK tCHCSH SCLK tDC tCDIN DIN tCDOUT DOUT DATA VALID Figure 5-3 Serial Interface Timing MMA690xQ 30 Sensors Freescale Semiconductor 5.5 PACKAGE INFORMATION The following documents provide a case outline drawing and information regarding printed wiring board mounting for the MMA690xQ device. For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. The board mounting application note AN3111 can be also located on the Freescale web site. 5.5.1 Package Dimensions 98ASA10571D ISSUE B CASE 1477-02 16 LEAD QFN PAGE 1 OF 3 MMA690xQ Sensors Freescale Semiconductor 31 98ASA10571D ISSUE B CASE 1477-02 16 LEAD QFN PAGE 2 OF 3 MMA690xQ 32 Sensors Freescale Semiconductor 98ASA10571D ISSUE B CASE 1477-02 16 LEAD QFN PAGE 3 OF 3 MMA690xQ 33 Sensors Freescale Semiconductor APPENDIX A DIGITAL FILTER CHARACTERISTICS Response curves for filter options are provided in this appendix. A.1 SINC FILTER CHARACTERISTICS sinc filter: R =32, N =3, fs =1000000 Magnitude (dB) 0 −50 −100 −150 −200 0 0.5 1 1.5 2 2.5 3 Frequency (Hz) 3.5 2 2.5 3 Frequency (Hz) 3.5 4 4.5 5 x 10 5 Phase (degrees) 0 −2000 −4000 −6000 −8000 0 0.5 1 1.5 4 4.5 5 x 10 5 Figure A-1 Sinc Filter Response, tS = 32 μs MMA690xQ 34 Sensors Freescale Semiconductor A.2 LOW-PASS FILTER CHARACTERISTICS Frequency Response 0 Gain (dB) −5 −10 −15 −20 −25 −30 1 10 2 Frequency (Hz) Group Delay 200 100 Phase (radians) Group Delay (samples) 10 0 10 1 10 2 Frequency (Hz) Phase Response 5 0 −5 10 1 10 2 Frequency (Hz) Figure A-2 Low-Pass Filter, fc = 50 Hz, Poles = 2, ts = 32 μs MMA690xQ Sensors Freescale Semiconductor 35 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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