DYNEX MP02X175-14

MP02X175 Series
MP02X175 Series
Phase Control Dual SCR, SCR/Diode Modules
Replaces January 2000 version, DS4478-3.0
DS4478-5.0 August 2001
FEATURES
KEY PARAMETERS
■ Dual Device Module
VDRM
1600V
■ Electrically Isolated Package
ITSM
6800A
■ Pressure Contact Construction
IT(AV)(per arm)
175A
■ International Standard Footprint
Visol
3000V
■ Alumina (non-toxic) Isolation Medium
Code
Circuit
APPLICATIONS
HBT
■ Motor Control
■ Controlled Rectifier Bridges
HBP
■ Heater Control
HBN
■ AC Phase Control
Fig.1 Circuit diagrams
VOLTAGE RATINGS
Type
Number
Repetitive
Peak
Voltages
VDRM VRRM
Conditions
MP02X175-16
1600
Tvj = 125oC
MP02X175-14
1400
IDRM = IRRM = 30mA
MP02X175-12
1200
MP02X175-10
1000
1
2
3
VDSM & VRSM =
VDRM & VRRM + 100V
respectively
Lower voltage grades available.
ORDERING INFORMATION
Module type code: MP02.
For further information see Package Details.
Order As:
MP02HBT175-16 or MP02HBT175-14 or MP02HBT175-12 or
MP02HBT175-10
Fig. 2 Electrical connections - (not to scale)
MP02HBP175-16 or MP02HBP175-14 or MP02HBP175-12 or
MP02HBP175-10
MP02HBN175-16 or MP02HBN175-14 or MP02HBN175-12 or
MP02HBN175-10
Note: When ordering, please use the complete part number.
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MP02X175 Series
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
IT(AV)
IT(RMS
ITSM
I2t
ITSM
I2t
Visol
Test Conditions
Parameter
Mean on-state current
RMS value
Max.
Units
Tcase = 75˚C
175
A
Tcase = 85˚C
150
A
275
A
10ms half sine, Tj = 125˚C
6.8
kA
VR = 0
231 x 103
A2s
10ms half sine, Tj = 125˚C
5.5
kA
VR = 50% VDRM
150 x 103
A2s
3000
V
Half wave resistive load
Tcase = 75˚C
Surge (non-repetitive) on-current
I2t for fusing
Surge (non-repetitive) on-current
I2t for fusing
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Isolation voltage
THERMAL AND MECHANICAL RATINGS
Test Conditions
Parameter
Symbol
Min.
Max.
Units
Thermal resistance - junction to case
dc
-
0.19
˚C/kW
(per thyristor or diode)
Half wave
-
0.20
˚C/kW
3 Phase
-
0.21
˚C/kW
Thermal resistance - case to heatsink
Mounting torque = 5Nm
-
0.07
˚C/kW
(per thyristor or diode)
with mounting compound
Tvj
Virtual junction temperature
Reverse (blocking)
-
125
˚C
Tstg
Storage temperature range
–40
125
˚C
Rth(j-c)
Rth(c-hs)
-
-
Screw torque
Weight (nominal)
Mounting - M6
-
6 (55) Nm (lb.ins)
Electrical connections - M6
-
5 (44) Nm (lb.ins)
-
-
350
g
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MP02X175 Series
DYNAMIC CHARACTERISTICS - THYRISTOR
Parameter
Symbol
Test Conditions
Min.
Max.
Units
Peak reverse and off-state current
At VRRM/VDRM, Tj = 125˚C
-
30
mA
dV/dt
Linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125˚C
-
1000
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 500A,
-
500
A/µs
IRRM/IDRM
Repetitive 50Hz
gate source 10V, 5Ω,
tr = 0.5µs, Tj = 125˚C
VT(TO)
rT
Threshold voltage
At Tvj = 125˚C. See note 1
-
1.05
V
On-state slope resistance
At Tvj = 125˚C. See note 1
-
0.8
mΩ
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25oC
3.0
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25oC
150
mA
VGD
Gate non-trigger voltage
VDRM = 5V, Tcase = 25oC
0.25
V
VFGM
Peak forward gate voltage
Anode positive with respect to cathode
30
V
VFGN
Peak forward gate voltage
Anode negative with respect to cathode
0.25
V
VRGM
Peak reverse gate voltage
5
V
IFGM
Peak forward gate current
Anode positive with respect to cathode
10
A
PGM
Peak gate power
See table fig. 5
100
W
PG(AV)
Mean gate power
5
W
-
-
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MP02X175 Series
15
2000
Peak half sine wave on-state current - (kA)
1500
1000
500
1.5
1.0
2.0
Instantaneous on-state voltage, VT - (V)
I2t
100
75W
50W
100
100
100
25
-
U
pp
er
lim
99
10W
5W
%
Lo
VGD
0.01
10
60
20 30 50
cycles at 50Hz
Duration
100W
Tj = 25˚C
it
2 3 45
Rth(j-hs)
Tj = 125˚C
1.0
1
0.3
Thermal Impedance - (˚C/W)
100
100
100
100
50
-
10
Fig. 4 Surge (non-repetitive) on-state current vs time
(Thyristor or diode with 50% VRRM at Tcase = 125˚C)
Tj = –40˚C
Gate trigger voltage, VGT - (V)
100
100
100
100
100
10
20
25
100
500
1ms
10ms
0.1
0.001
5
ms
Table gives pulse power PGM in watts
Pulse Pulse Frequency Hz
Width
100
400
50
µs
10
140
2.5
Fig. 3 Maximum (limit) on-state characteristics
VFGM
10
0
1
0
0.5
100
180
I2t value - (A2s x 103)
Instantaneous on-state current, IT - (A)
Measured under pulse conditions
Tj = 125˚C
w
l
er
im
it
Rth(j-c)
0.2
0.1
1%
0.1
1.0
Gate trigger current, IGT - (A)
Fig. 5 Gate characteristics
10
IFGM
0
0.001
0.01
0.1
1.0
Time - (s)
10
100
Fig. 6 Transient thermal impedance - dc
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MP02X175 Series
350
350
d.c.
300
300
250
On-state power loss per arm - (W)
On-state power loss per arm - (W)
180˚
180˚
120˚
200
90˚
60˚
150
30˚
100
250
90˚
200
60˚
100
50
0
0
50
200
250
100
150
Mean on-state current, IT(AV) - (A)
0
0
300
Fig. 7 On-state power loss per arm vs on-state current at
specified conduction angles, sine wave 50/60Hz
120
120
Maximum permissible case temperature - (˚C)
140
100
50
100
150
200
250
Mean on-state current, IT(AV) - (A)
300
Fig. 8 On-state power loss per arm vs on-state current at
specified conduction angles, square wave 50/60Hz
140
Maximum permissible case temperature - (˚C)
30˚
150
50
100
80
60
40
20
80
d.c.
60
40
20
30˚
0
0
120˚
20
40
60˚
90˚ 120˚
180˚
60 80 100 120 140 160 180 200 220 240
Mean on-state current, IT(AV) - (A)
Fig. 9 Maximum permissible case temperature vs on-state
current at specified conduction angles, sine wave 50/60Hz
30˚
60˚
90˚ 120˚
180˚
0
20 40 60 80 100 120 140 160 180 200 220 240 260 280
Mean on-state current, IT(AV) - (A)
Fig. 10 Maximum permissible case temperature vs on-state
current at specified conduction angles, square wave 50/60Hz
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MP02X175 Series
1400
Rth(hs-a) ˚C/W
1200
0.02
R- Load
Total power - (W)
1000
0.04
800
L- Load
0.08
600
0.10
0.12
0.15
400
0.20
0.30
0.40
200
0
0
20
40
60
80
100
120
0
100
Maximum ambient temperature - (˚C)
200
300
D.C. output current - (A)
400
Fig. 11 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal)
1200
Rth(hs-a) ˚C/W
1000
0.04
0.02
R & L - Load
Total power - (W)
800
0.08
0.10
600
0.12
0.15
400
0.20
0.30
200
0
0
0.40
20
40
60
80
100
120
Maximum ambient temperature - (˚C)
0
100
200
300
D.C. output current - (A)
400
Fig. 12 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal)
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MP02X175 Series
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
23
23
24
15
2 holes Ø6.5
K2
5
G2
K2 G2
2
3
24
34
12.8
1
Circuit type: HBN
G1 K1
13
K1
80
3x M6
1
2
G1
1
2
3
3
Circuit type: HBP
30
G1 K1 K2 G2
1
2
3
Circuit type: HBT
94
Nominal weight: 350g
Recommended fixings for mounting: M6 socket head cap screws
Recommended mounting torque: 6Nm (55lb.ins)
Recommended torque for electrical connections: 5Nm (44lb.ins)
Maximum torque for electrical connections: 8Nm (70lb.ins)
Module outline type code: MP02
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75˚C if full rated current is to be achieved. Power
dissipation may be calculated by use of VT(TO) and rT information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or ‘T’ slots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
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MP02X175 Series
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4478-5 Issue No. 5.0 August 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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