MPS MP4561

MP4561
1.5A, 2MHz, 55V
Step-Down Converter
The Future of Analog IC Technology
DESCRIPTION
FEATURES
The MP4561 is a high frequency step-down
switching regulator with integrated internal highside high voltage power MOSFET. It provides
1.5A output with current mode control for fast loop
response and easy compensation.
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•
•
•
•
•
•
•
•
The wide 3.8V to 55V input range accommodates
a variety of step-down applications, including
those in automotive input environment. A 12µA
shutdown mode supply current allows use in
battery-powered applications.
High power conversion efficiency over a wide
load range is achieved by scaling down the
switching frequency at light load condition to
reduce the switching and gate driving losses.
Wide 3.8V to 55V Operating Input Range
300mΩ Internal Power MOSFET
Up to 2MHz Programmable Switching
Frequency
140μA Quiescent Current
Ceramic Capacitor Stable
External Soft-Start
Up to 95% Efficiency
Output Adjustable from 0.8V to 52V
Available in 3x3mm 10-Pin QFN
APPLICATIONS
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•
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•
•
The frequency foldback helps prevent inductor
current runaway during startup and thermal
shutdown provides reliable, fault tolerant
operation.
High Voltage Power Conversion
Automotive Systems
Industrial Power Systems
Distributed Power Systems
Battery Powered Systems
All MPS parts are lead-free and adhere to the RoHS directive. For MPS green
status, please visit MPS website under Quality Assurance. “MPS” and “The
Future of Analog IC Technology” are Registered Trademarks of Monolithic
Power Systems, Inc.
By switching at 2MHz, the MP4561 is able to
prevent EMI (Electromagnetic Interference) noise
problems, such as those found in AM radio and
ADSL applications.
The MP4561 is available in small 3mm x 3mm
10-pin QFN with exposed pad package.
TYPICAL APPLICATION
C4
100nF
VIN
C1
10uF
100V
8
7
C5
10nF
SW
EN
MP4561
FB
5
C7
NS
SS
COMP
FREQ
GND
6
100
L1
10uH
1.2
D1
3
EN
VIN
BST
4
C3
470pF
C6
NS
C2
22uF
6.3V
VOUT
3.3V
VIN=12V
90
EFFICIENCY (%)
10
9
80
70
VIN=55V
60
50
40
0
0.5
1
1.5
IOUT (A)
MP4561 Rev. 1.0
11/5/2012
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1
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
ORDERING INFORMATION
Part Number*
MP4561DQ
Package
QFN10( 3x3mm)
Top Marking
9C
* For Tape & Reel, add suffix –Z (e.g. MP4561DQ–Z)
For RoHS compliant packaging, add suffix –LF (e.g. MP4561DQ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
SW
1
10
BST
SW
2
9
VIN
EN
3
8
SS
COMP
4
7
FREQ
FB
5
6
GND
EXPOSED PAD
Connect to GND Plane
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance
Supply Voltage (VIN).....................–0.3V to +60V
Switch Voltage (VSW)............ –0.5V to VIN + 0.5V
BST to SW .....................................–0.3V to +5V
All Other Pins .................................–0.3V to +5V
(2)
Continuous Power Dissipation (TA = +25°C)
............................................................. 2.5W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
3x3mm QFN10........................50 ...... 12 ... °C/W
Recommended Operating Conditions
(3)
Supply Voltage VIN ...........................3.8V to 55V
Output Voltage VOUT .........................0.8V to 52V
Operating Junct. Temp. (TJ).... –40°C to +125°C
MP4561 Rev. 1.0
11/5/2012
(4)
θJA
θJC
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-toambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)TA)/θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
ELECTRICAL CHARACTERISTICS
VIN = 12V, VEN = 2.5V, VCOMP = 1.4V, TA= +25°C, unless otherwise noted.
Parameter
Feedback Voltage
Upper Switch On Resistance (5)
Upper Switch Leakage
Symbol Condition
4.5V < VIN < 55V
VFB
–40°C to +85°C
VBST – VSW = 5V
RDS(ON)
–40°C to +85°C
VEN = 0V, VSW = 0V
Current Limit
–40°C to +85°C
COMP to Current Sense
Transconductance
Error Amp Voltage Gain
Error Amp Transconductance
Error Amp Min Source current
Error Amp Min Sink current
VIN UVLO Threshold
VIN UVLO Hysteresis
Soft-Start Time (5)
Oscillator Frequency
Minimum Switch On Time (5)
Shutdown Supply Current
Quiescent Supply Current
Thermal Shutdown
Minimum Off Time
Minimum On Time
EN Up Threshold
Min
0.780
0.771
220
200
1.9
1.7
GCS
ICOMP = ±3µA
VFB = 0.7V
VFB = 0.9V
–40°C to +85°C
0V < VFB < 0.8V, CSS=10nF
RFREQ = 95kΩ
–40°C to +85°C
2.7
2.4
0.8
0.7
VEN < 0.3V
No load, VFB = 0.9V
Hysteresis = 20°C
–40°C to +85°C
–40°C to +85°C
EN Threshold Hysteresis
1.4
1.3
Typ
0.800
300
Max
0.820
0.829
395
475
1
2.5
Units
V
mΩ
μA
3.1
3.3
A
4.5
A/V
400
120
10
-10
3.0
V/V
µA/V
µA
µA
V
3.3
3.6
0.35
1.6
1
100
12
140
150
100
100
1.55
1.2
1.3
20
130
1.7
1.8
320
V
ms
MHz
ns
µA
µA
°C
ns
ns
V
mV
5) Derived from bench characterization. Not tested in production.
MP4561 Rev. 1.0
11/5/2012
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
PIN FUNCTIONS
QFN
Pin #
Name
1, 2
SW
3
EN
4
COMP
5
FB
6
GND,
Exposed Pad
7
FREQ
8
SS
9
VIN
10
BST
MP4561 Rev. 1.0
11/5/2012
Description
Switch Node. This is the output from the high-side switch. A low VF Schottky rectifier to
ground is required. The rectifier must be close to the SW pins to reduce switching spikes.
Enable Input. Pulling this pin below the specified threshold shuts the chip down. Pulling it
up above the specified threshold or leaving it floating enables the chip.
Compensation. This node is the output of the GM error amplifier. Control loop frequency
compensation is applied to this pin.
Feedback. This is the input to the error amplifier. An external resistive divider connected
between the output and GND is compared to the internal +0.8V reference to set the
regulation voltage.
Ground. It should be connected as close as possible to the output capacitor avoiding the
high current switch paths. Connect exposed pad to GND plane for optimal thermal
performance.
Switching Frequency Program Input. Connect a resistor from this pin to ground to set the
switching frequency.
Soft start programming mode. Connect a capacitor between SS and GND to set the soft
start time.
Input Supply. This supplies power to all the internal control circuitry, both BST regulators
and the high-side switch. A decoupling capacitor to ground must be placed close to this
pin to minimize switching spikes.
Bootstrap. This is the positive power supply for the internal floating high-side MOSFET
driver. Connect a bypass capacitor between this pin and SW pin.
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 12V, VOUT =3.3V, C1 = 10µF, C2 = 22µF, L1 = 10µH and TA = +25°C, unless otherwise noted.
Efficiency @VOUT=2.5V
Efficiency @VOUT=5V
100
100
90
90
Vin=12V
80
70
Vin=48V
60
IOUT=0.1A
Vin=12V
VOUT
AC Coupled
10mV/div
80
70
Vin=55V
Vsw
10V/div
60
IL
500mA/div
50
50
40
Output Voltage Ripple
L1=15uH, fs=500kHz
EFFICIENCY (%)
EFFICIENCY (%)
L1=10uH, fs=500kHz
40
0
0.5
1
1.5
0
0.5
1
OUTPUT CURRENT (A)
Output Voltage Ripple
Output Voltage Ripple
IOUT=0.75A
IOUT=1.5A
VOUT
AC Coupled
10mV/div
VOUT
AC Coupled
10mV/div
Vsw
10V/div
Vsw
10V/div
IL
500mA/div
IL
1A/div
MP4561 Rev. 1.0
11/5/2012
1.5
OUTPUT CURRENT (A)
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN = 12V, VOUT =3.3V, C1 = 10µF, C2 = 22µF, L1 = 10µH and TA = +25°C, unless otherwise noted.
Strart up
Strart up
Strart up
IOUT=0.1A,C5=10nF
IOUT=0.75A,C5=10nF
IOUT=1.5A,C5=10nF
VEN
2V/div
VEN
2V/div
VEN
2V/div
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
IL
1A/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
2A/div
4ms/div
4ms/div
4ms/div
Shut down
Shut down
Shut down
IOUT=0.1A
IOUT=0.75A
IOUT=1.5A
VEN
2V/div
VEN
2V/div
VEN
2V/div
VOUT
2V/div
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
IL
1A/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
2A/div
1ms/div
Short Circuit Entry
Short Circuit Steady State
Short Circuit Recovery
IOUT=0.1A to short
VOUT
2V/div
IOUT=short to 0A
VOUT
2V/div
VOUT
2V/div
Vsw
10V/div
Vsw
10V/div
Vsw
10V/div
IL
1A/div
IL
1A/div
IL
1A/div
MP4561 Rev. 1.0
11/5/2012
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
BLOCK DIAGRAM
VIN
REFERENCE
UVLO
EN
INTERNAL
REGULATORS
ISW
-+
BST
LOGIC
SW
--
FB
COMP
SS
0V8
+
OSCILLATOR
COMP
GND
FREQ
Figure 1—Functional Block Diagram
OPERATION
The MP4561 is a programmable frequency,
non-synchronous, step-down switching regulator
with an integrated high-side high voltage power
MOSFET. It provides a single highly efficient
solution with current mode control for fast loop
response and easy compensation. It features a
wide input voltage range, external soft-start
control for start-up ramp-up flexibility, and
precision current limiting. Its very low operational
quiescent current makes it suitable for battery
powered applications.
PWM Control Mode
At moderate to high output current, the MP4561
operates in a fixed frequency, peak current
control mode to regulate the output voltage. A
PWM cycle is initiated by the internal clock. The
power MOSFET is turned on and remains on
until its current reaches the value set by the
COMP voltage. When the power switch is off, it
remains off for at least 100ns before the next
cycle starts. If, in one PWM period, the current in
MP4561 Rev. 1.0
11/5/2012
the power MOSFET does not reach the COMP
set current value, the power MOSFET remains
on, saving a turn-off operation.
Pulse Skipping Mode
Under light load condition the switching
frequency stretches down zero to reduce the
switching loss and driving loss.
Error Amplifier
The error amplifier compares the FB pin voltage
with the internal reference (REF) and outputs a
current proportional to the difference between the
two. This output current is then used to charge
the external compensation network to form the
COMP voltage, which is used to control the
power MOSFET current.
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
During operation, the minimum COMP voltage is
clamped to 0.9V and its maximum is clamped to
2.0V. COMP is internally pulled down to GND in
shutdown mode. COMP should not be pulled up
beyond 2.6V.
Internal Regulator
Most of the internal circuitries are powered from
the 2.6V internal regulator. This regulator takes
the VIN input and operates in the full VIN range.
When VIN is greater than 3.0V, the output of the
regulator is in full regulation. When VIN is lower
than 3.0V, the output decreases.
Enable Control
The MP4561 has a dedicated enable control pin
(EN). With high enough input voltage, the chip
can be enabled and disabled by EN which has
positive logic. Its falling threshold is a precision
1.2V, and its rising threshold is 1.5V (300mV
higher).
When floating, EN is pulled up to about 3.0V by
an internal 1µA current source so it is enabled.
To pull it down, 1µA current capability is needed.
When EN is pulled down below 1.2V, the chip is
put into the lowest shutdown current mode.
When EN is higher than zero but lower than its
rising threshold, the chip is still in shutdown
mode but the shutdown current increases slightly.
Under-Voltage Lockout (UVLO)
Under-voltage lockout (UVLO) is implemented to
protect the chip from operating at insufficient
supply voltage. The UVLO rising threshold is
about 3.0V while its falling threshold is a
consistent 2.6V.
Thermal Shutdown
Thermal shutdown is implemented to prevent the
chip from operating at exceedingly high
temperatures. When the silicon die temperature
is higher than its upper threshold, it shuts down
the whole chip. When the temperature is lower
than its lower threshold, the chip is enabled again.
Floating Driver and Bootstrap Charging
The floating power MOSFET driver is powered by
an external bootstrap capacitor. This floating
driver has its own UVLO protection. This UVLO’s
rising threshold is 2.5V with a hysteresis of
300mV. The driver’s UVLO is soft-start related. In
case the bootstrap voltage hits its UVLO, the
soft-start circuit is reset. To prevent noise, there
MP4561 Rev. 1.0
11/5/2012
is 20µs delay before the reset action. When
bootstrap UVLO is gone, the reset is off and then
soft-start process resumes.
The bootstrap capacitor is charged and regulated
to about 4V by the dedicated internal bootstrap
regulator. When the voltage between the BST
and SW nodes is lower than its regulation, a
PMOS pass transistor connected from VIN to
BST is turned on. The charging current path is
from VIN, BST and then to SW. External circuit
should provide enough voltage headroom to
facilitate the charging.
As long as VIN is sufficiently higher than SW, the
bootstrap capacitor can be charged. When the
power MOSFET is ON, VIN is about equal to SW
so the bootstrap capacitor cannot be charged.
When the external diode is on, the difference
between VIN and SW is largest, thus making it
the best period to charge. When there is no
current in the inductor, SW equals the output
voltage VOUT so the difference between VIN and
VOUT can be used to charge the bootstrap
capacitor.
At higher duty cycle operation condition, the time
period available to the bootstrap charging is less
so the bootstrap capacitor may not be sufficiently
charged.
In case the internal circuit does not have
sufficient voltage and the bootstrap capacitor is
not charged, extra external circuitry can be used
to ensure the bootstrap voltage is in the normal
operational region. Refer to External Bootstrap
Diode in Application section.
The DC quiescent current of the floating driver is
about 20µA. Make sure the bleeding current at
the SW node is higher than this value, such that:
IO +
VO
> 20μA
(R1 + R 2)
Current Comparator and Current Limit
The power MOSFET current is accurately sensed
via a current sense MOSFET. It is then fed to the
high speed current comparator for the current
mode control purpose. The current comparator
takes this sensed current as one of its inputs.
When the power MOSFET is turned on, the
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
comparator is first blanked till the end of the turnon transition to avoid noise issues. The
comparator then compares the power switch
current with the COMP voltage. When thesensed
current is higher than the COMP voltage, the
comparator output is low, turning off the power
MOSFET. The cycle-by-cycle maximum current
of the internal power MOSFET is internally
limited.
Short Circuit Protection
When the output is shorted to the ground, the
switching frequency is folded back and the
current limit is reduced to lower the short circuit
current. When the voltage of FB is at zero, the
current limit is reduced to about 50% of its full
current limit. When FB voltage is higher than
0.4V, current limit reaches 100%.
In short circuit FB voltage is low, the SS is pulled
down by FB and SS is about 100mV above FB.
In case the short circuit is removed, the output
voltage will recover at the SS pace. When FB is
high enough, the frequency and current limit
return to normal values.
ground. The value of RFREQ can be calculated
from:
RFREQ (kΩ) =
To get fSW=500kHz, RFREQ=195kΩ.
Soft-Start
The soft-start is implemented to prevent the
converter output voltage from overshooting
during startup and short circuit recovery phases.
Internally the soft-start voltage VSS is the voltage
at SS pin offset by a voltage of about 1V. VSS is
applied on the error amplifier in parallel with the
internal reference voltage REF. The error
amplifier is controlled by VSS or REF whichever
is lower. So when VSS ramps up from 0 to high,
the controller tries to regulate FB from zero to
REF at the VSS ramp-up pace.
There is a 5μA current source pulling up SS pin.
Given the soft-start capacitor CSS, the soft-start
time is about the time CSS voltage changes 0.8V.
So the soft-start time can be computed as:
t SS =
Startup and Shutdown
If both VIN and EN are higher than their
appropriate thresholds, the chip starts. The
reference block starts first, generating stable
reference voltage and currents, and then the
internal regulator is enabled. The regulator
provides stable supply for the remaining circuits.
Three events can shut down the chip: EN low,
VIN low and thermal shutdown. In the shutdown
procedure, power MOSFET is turned off first to
avoid any fault triggering. The COMP voltage and
the internal supply rail are then pulled down.
Programmable Oscillator
The MP4561 oscillating frequency is set by an
external resistor, RFREQ from the FREQ pin to
MP4561 Rev. 1.0
11/5/2012
CSS × 0.8 V
5μA
Soft-start Time vs.
Soft-start Capacitance
35
30
SS TIME (ms)
While the internal supply rail is up, an internal
timer holds the power MOSFET OFF for about
50µs to blank the startup glitches. When the
external soft-start block is enabled, it first holds
its SS output low to ensure the remaining circuits
are ready and then slowly ramps up at a rate
proportional to the size of the external CSS
capacitor.
100000
−5
fS (k Hz)
25
20
15
10
5
0
5
55
105
155
205
SS CAPACITANCE (nF)
Figure 2—Recommend SS time vs.
SS Capacitance
Figure 2 shows the soft-start time with different
external soft-start capacitance. The typical softstart capacitance is recommended from 5.6nF to
220nF.
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
APPLICATION INFORMATION
COMPONENT SELECTION
Setting the Output Voltage
The output voltage is set using a resistive voltage
divider from the output voltage to FB pin. The
voltage divider divides the output voltage down to
the feedback voltage by the ratio:
VFB =VOUT ×
R2
R1+R2
⎛
⎞
VOUT
V
× ⎜1 − OUT ⎟⎟
2 × fS × L1 ⎜⎝
VIN ⎠
Where ILOAD is the load current.
Table 1 lists a number of suitable inductors from
various manufacturers. The choice of which style
inductor to use mainly depends on the price vs.
size requirements and any EMI requirement.
Output Rectifier Diode
The output rectifier diode supplies the current to
the inductor when the high-side switch is off. To
reduce losses due to the diode forward voltage
and recovery times, use a Schottky diode.
Thus the output voltage is:
VOUT =VFB ×
ILP = ILOAD +
R1+R2
R2
For example, the value for R2 can be 10kΩ. With
this value, R1 can be determined by:
R1=12.5 × (VOUT -0.8)(kΩ)
For example, for a 3.3V output voltage, R2 is
10kΩ, and R1 is 31.6kΩ.
Choose a diode whose maximum reverse voltage
rating is greater than the maximum input voltage,
and whose current rating is greater than the
maximum load current. Table 2 lists example
Schottky diodes and manufacturers.
Inductor
The inductor is required to supply constant
current to the output load while being driven by
the switched input voltage. A larger value
inductor will result in less ripple current that will
result in lower output ripple voltage. However, the
larger value inductor will have a larger physical
size, higher series resistance, and/or lower
saturation current.
A good rule for determining the inductance to use
is to allow the peak-to-peak ripple current in the
inductor to be approximately 30% of the
maximum switch current limit. Also, make sure
that the peak inductor current is below the
maximum switch current limit. The inductance
value can be calculated by:
L1=
VOUT
fs × ΔIL
× (1-
VOUT
VIN
)
Where VOUT is the output voltage, VIN is the input
voltage, fS is the switching frequency, and ∆IL is
the peak-to-peak inductor ripple current.
Choose an inductor that will not saturate under
the maximum inductor peak current. The peak
inductor current can be calculated by:
MP4561 Rev. 1.0
11/5/2012
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MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
Table 1—Inductor Selection Guide
Inductance
(µH)
Max DCR
(Ω)
Current Rating
(A)
Dimensions
L x W x H (mm3)
7447789004
4.7
0.033
2.9
7.3x7.3x3.2
744066100
10
0.035
3.6
10x10x3.8
744771115
15
0.025
3.75
12x12x6
744771122
22
0.031
3.37
12x12x6
Part Number
Wurth Electronics
TDK
RLF7030T-4R7
4.7
0.031
3.4
7.3x6.8x3.2
SLF10145T-100
10
0.0364
3
10.1x10.1x4.5
SLF12565T-150M4R2
15
0.0237
4.2
12.5x12.5x6.5
SLF12565T-220M3R5
22
0.0316
3.5
12.5x12.5x6.5
FDV0630-4R7M
4.7
0.049
3.3
7.7x7x3
919AS-100M
10
0.0265
4.3
10.3x10.3x4.5
919AS-160M
16
0.0492
3.3
10.3x10.3x4.5
919AS-220M
22
0.0776
3
10.3x10.3x4.5
Toko
Table 2—Diode Selection Guide
Diodes
Voltage/
Current
Rating
Manufacturer
B290-13-F
90V, 2A
Diodes Inc.
B380-13-F
80V, 3A
Diodes Inc.
CMSH2-100M
100V, 2A
Central Semi
CMSH3-100MA
100V, 3A
Central Semi
Input Capacitor
The input current to the step-down converter is
discontinuous, therefore a capacitor is required to
supply the AC current to the step-down converter
while maintaining the DC input voltage. Use low
ESR capacitors for the best performance.
Ceramic capacitors are preferred, but tantalum or
low-ESR electrolytic capacitors may also suffice.
For simplification, choose the input capacitor with
RMS current rating greater than half of the
maximum load current. The input capacitor (C1)
can be electrolytic, tantalum or ceramic.
When using electrolytic or tantalum capacitors, a
small, high quality ceramic capacitor, i.e. 0.1μF,
should be placed as close to the IC as possible.
When using ceramic capacitors, make sure that
they have enough capacitance to provide
sufficient charge to prevent excessive voltage
ripple at input. The input voltage ripple caused by
capacitance can be estimated by:
ΔVIN =
MP4561 Rev. 1.0
11/5/2012
⎛
ILOAD
V
V ⎞
× OUT × ⎜ 1 − OUT ⎟
fS × C1 VIN ⎝
VIN ⎠
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11
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
Output Capacitor
The output capacitor (C2) is required to maintain
the DC output voltage. Ceramic, tantalum, or low
ESR electrolytic capacitors are recommended.
Low ESR capacitors are preferred to keep the
output voltage ripple low. The output voltage
ripple can be estimated by:
ΔVOUT =
VOUT ⎛ VOUT
× ⎜1 −
fS × L ⎝
VIN
⎞
⎞ ⎛
1
⎟
⎟ × ⎜ RESR +
8 × fS × C2 ⎠
⎠ ⎝
Where L is the inductor value and RESR is the
equivalent series resistance (ESR) value of the
output capacitor.
In the case of ceramic capacitors, the impedance
at the switching frequency is dominated by the
capacitance. The output voltage ripple is mainly
caused by the capacitance. For simplification, the
output voltage ripple can be estimated by:
ΔVOUT =
⎛ V ⎞
VOUT
× ⎜ 1 − OUT ⎟
2
8 × fS × L × C2 ⎝
VIN ⎠
In the case of tantalum or electrolytic capacitors,
the ESR dominates the impedance at the
switching frequency. For simplification, the output
ripple can be approximated to:
ΔVOUT =
VOUT ⎛
V
× ⎜ 1 − OUT
fS × L ⎝
VIN
⎞
⎟ × RESR
⎠
The characteristics of the output capacitor also
affect the stability of the regulation system. The
MP4561 can be optimized for a wide range of
capacitance and ESR values.
Compensation Components
MP4561 employs current mode control for easy
compensation and fast transient response. The
system stability and transient response are
controlled through the COMP pin. COMP pin is
the output of the internal error amplifier. A series
capacitor-resistor combination sets a pole-zero
combination to control the characteristics of the
control system. The DC gain of the voltage
feedback loop is given by:
A VDC = RLOAD × GCS × A VEA ×
MP4561 Rev. 1.0
11/5/2012
Where AVEA is the error amplifier voltage gain,
is
the
current
sense
400V/V;
GCS
transconductance, 4.5A/V; RLOAD is the load
resistor value.
The system has two poles of importance. One is
due to the compensation capacitor (C3), the
output resistor of error amplifier. The other is due
to the output capacitor and the load resistor.
These poles are located at:
fP1 =
GEA
2 π× C3 × A VEA
fP2 =
1
2π × C2 × RLOAD
Where,
GEA
is
the
transconductance, 120μA/V.
error
amplifier
The system has one zero of importance, due to
the compensation capacitor (C3) and the
compensation resistor (R3). This zero is located
at:
fZ1 =
1
2 π× C3 × R 3
The system may have another zero of
importance, if the output capacitor has a large
capacitance and/or a high ESR value. The zero,
due to the ESR and capacitance of the output
capacitor, is located at:
fESR =
1
2π × C2 × RESR
In this case, a third pole set by the compensation
capacitor (C6) and the compensation resistor (R3)
is used to compensate the effect of the ESR zero
on the loop gain. This pole is located at:
fP 3 =
1
2 π× C 6 × R 3
VFB
VOUT
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12
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
The goal of compensation design is to shape the
converter transfer function to get a desired loop
gain. The system crossover frequency where the
feedback loop has the unity gain is important.
Lower crossover frequencies result in slower line
and load transient responses, while higher
crossover frequencies could cause system
unstable. A good rule of thumb is to set the
crossover frequency to approximately one-tenth
of the switching frequency. To optimize the
compensation components for conditions, the
following procedure can be used.
Table 3—Compensation Values for Typical
Output Voltage/Capacitor Combinations
VOUT
(V)
L (µH)
C2
(µF)
R3
(kΩ)
C3
(pF)
C7
(pF)
1.8
4.7
47
62
1000
47
2.5
4.7 - 6.8
22
36
680
None
3.3
6.8 -10
22
51
470
None
5
15 - 22
33
82
680
None
12
10
33
40.2
330
2
1. Choose the compensation resistor (R3) to set
the desired crossover frequency. Determine the
R3 value by the following equation:
R3 =
2 π× C 2 × fC VOUT
×
GEA × GCS
VFB
Where fC is the desired crossover frequency.
2. Choose the compensation capacitor (C3) to
achieve the desired phase margin. For
applications with typical inductor values, setting
the compensation zero, fZ1, below one forth of the
crossover frequency provides sufficient phase
margin. Determine the C3 value by the following
equation:
C3 >
4
2 π× R 3 × fC
f
1
< S
2π × C2 × RESR 2
If this is the case, then add the second
compensation capacitor (C6) to set the pole fP3 at
the location of the ESR zero. Determine the C6
value by the equation:
C6 =
C 2 × RESR
R3
High Frequency Operation
The switching frequency of MP4561 can be
programmed up to 2MHz by an external resistor.
The minimum on time of MP4561 is about 100ns
(typ). Pulse skipping operation can be seen more
easily at higher switching frequency due to the
minimum on time.
Since the internal bootstrap circuitry has higher
impedance, which may not be adequate to
charge the bootstrap capacitor during each
(1-D)×Ts charging period, an external bootstrap
charging diode is strongly recommended if the
switching frequency is about 2MHz (see External
Bootstrap
Diode
section
for
detailed
implementation information).
With higher switching frequencies, the inductive
reactance (XL) of capacitor comes to dominate,
so that the ESL of input/output capacitor
determines the input/output ripple voltage at
higher switching frequency. As a result of that,
high frequency ceramic capacitor is strongly
recommended as input decoupling capacitor and
output filtering capacitor for such high frequency
operation.
Layout becomes more important when the device
switches at higher frequency. It is essential to
place the input decoupling capacitor, catch diode
and the MP4561 (VIN pin, SW pin and PGND) as
close as possible, with traces that are very short
and fairly wide. This can help to greatly reduce
the voltage spike on SW node, and lower the EMI
noise level as well.
3. Determine if the second compensation
capacitor (C6) is required. It is required if the
ESR zero of the output capacitor is located at
less than half of the switching frequency, or the
following relationship is valid:
MP4561 Rev. 1.0
11/5/2012
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13
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
Try to run the feedback trace as far from the
inductor and noisy power traces as possible. It is
often a good idea to run the feedback trace on
the side of the PCB opposite of the inductor with
a ground plane separating the two.
The compensation components should be placed
closed to the MP4561. Do not place the
compensation components close to or under high
dv/dt SW node, or inside the high di/dt power
loop. If you have to do so, the proper ground
plane must be in place to isolate them.
Switching loss is expected to be increased at
high switching frequency. To help to improve the
thermal conduction, a grid of thermal vias can be
created right under the exposed pad. It is
recommended that they be small (15mil barrel
diameter) so that the hole is essentially filled up
during the plating process, thus aiding
conduction to the other side. Too large a hole
can cause ‘solder wicking’ problems during the
reflow soldering process. The pitch (distance
between the centers) of several such thermal
vias in an area is typically 40mil.
At no load or light load, the converter may
operate in pulse skipping mode in order to
maintain the output voltage in regulation. Thus
there is less time to refresh the BST voltage. In
order to have enough gate voltage under such
operating conditions, the difference of (VIN –
VOUT) should be greater than 3V. For example,
if the VOUT is set to 3.3V, the VIN needs to be
higher than 3.3V+3V=6.3V to maintain enough
BS voltage at no load or light load. To meet this
requirement, EN pin can be used to program the
input UVLO voltage to Vout+3V.
External Bootstrap Diode
An external bootstrap diode may enhance the
efficiency of the regulator. In below cases, an
external BST diode is recommended from the 5V
to BST pin:
z
There is a 5V rail available in the system;
z
VIN is no greater than 5V;
z
VOUT is between 3.3V and 5V;
This diode is also recommended for high duty
cycle operation (when VOUT / VIN > 65%)
applications.
The bootstrap diode can be a low cost one such
as IN4148 or BAT54.
5V
BST
MP4561
SW
Figure 3—External Bootstrap Diode
MP4561 Rev. 1.0
11/5/2012
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14
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
TYPICAL APPLICATION CIRCUITS
C4
100nF
VIN
VIN
C1
10uF
100V
L1
4.7uH
BST
SW
D1
EN
EN
C7
47pF
C2
47uF
6.3V
VOUT
1.8V
FB
MP4561
SS
COMP
FREQ
C5
10nF
C3
1nF
GND
C6
NS
Figure 4—1.8V Output Typical Application Schematic
C4
100nF
10
VIN
9
C1
10uF
100V
8
7
C5
10nF
SW
L1
15uH
1.2
D1
3
EN
VIN
BST
EN
MP4561
FB
C7
NS
C2
33uF
6.3V
VOUT
5V
5
SS
COMP
FREQ
GND
6
4
C3
680pF
C6
NS
Figure 5—5V Output Typical Application Schematic
MP4561 Rev. 1.0
11/5/2012
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15
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
PCB Layout Guide
2)
Bypass ceramic capacitors are suggested
to be put close to the VIN Pin.
PCB layout is very important to achieve stable
operation. It is highly recommended to duplicate
EVB layout for optimum performance.
3)
Ensure all feedback connections are short
and direct. Place the feedback resistors
and compensation components as close to
the chip as possible.
4)
Route SW away from sensitive analog
areas such as FB.
5)
Connect IN, SW, and especially GND
respectively to a large copper area to cool
the chip to improve thermal performance
and long-term reliability.
If change is necessary, please follow these
guidelines and take Figure 6 for reference.
1)
Keep the path of switching current short
and minimize the loop area formed by Input
cap, high-side MOSFET and external
switching diode.
C4
VIN
VIN
C1
BST
L1
VOUT
SW
D1
R5
EN
EN
R4
MP4561
FB
R1
R2
SS
COMP
FREQ
GND
C5
C2
R6
C3
R3
MP4561 Typical Application Circuit
GND
R5
R4
C3
FB
COMP
En
SW
SW
5
4
3
2
1
R1
R2
R3
L1
SW
C4
8
9
SS
Vin
10 BST
7 FREQ
6 GND
D1
R6
C5
C2
C1
Vin
GND
TOP Layer
GND
Vo
Bottom Layer
Figure 6―MP4561DQ Typical Application Circuit and PCB Layout Guide
MP4561 Rev. 1.0
11/5/2012
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16
MP4561 – 1.5A, 2MHz, 55V STEP-DOWN CONVERTER
PACKAGE INFORMATION
3mm x 3mm QFN10 (EXPOSED PAD)
2.90
3.10
0.30
0.50
PIN 1 ID
MARKING
0.18
0.30
2.90
3.10
PIN 1 ID
INDEX AREA
1.45
1.75
PIN 1 ID
SEE DETAIL A
10
1
2.25
2.55
0.50
BSC
5
6
TOP VIEW
BOTTOM VIEW
PIN 1 ID OPTION A
R0.20 TYP.
PIN 1 ID OPTION B
R0.20 TYP.
0.80
1.00
0.20 REF
0.00
0.05
SIDE VIEW
DETAIL A
NOTE:
2.90
0.70
1) ALL DIMENSIONS ARE IN MILLIMETERS.
2) EXPOSED PADDLE SIZE DOES NOT INCLUDE MOLD FLASH.
3) LEAD COPLANARITY SHALL BE 0.10 MILLIMETER MAX.
4) DRAWING CONFORMS TO JEDEC MO-229, VARIATION VEED-5.
5) DRAWING IS NOT TO SCALE.
1.70
0.25
2.50
0.50
RECOMMENDED LAND PATTERN
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
MP4561 Rev. 1.0
11/5/2012
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© 2012 MPS. All Rights Reserved.
17