OKI Semiconductor MR27V402E FEDR27V402E-01-03 Issue Date: Jan. 15, 2004 262,144–Word × 16–Bit or 524,288–Word × 8–Bit One Time PROM GENERAL DESCRIPTION The MR27V402E is a 4 Mbit One Time Programmable Read-Only Memory that can be electrically switched between 262,144-word × 16-bit and 524,288-word × 8-bit by the state of the BYTE pin. The MR27V402E supports high speed asynchronous read operation using a single 3.3V power supply. FEATURES · 262,144-word × 16-bit/524,288-word × 8-bit electrically switchable configuration · +3.3 V power supply · Access time 80 nS MAX · Operating current 30 mA MAX · Standby current 50 µA MAX · Input/Output TTL compatible · Three-state output · Packages: 40-pin plastic DIP (DIP40-P-600-2.54) (MR27V402ERP) 40-pin plastic SOP (SOP40-P-525-1.27-K) (MR27V402EMP) 44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K) (MR27V402ETP) 42-pin plastic SOJ (SOJ42-P-400-1.27) (MR27V402EJA) 1/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP PIN CONFIGURATION (TOP VIEW) NC 1 44 NC NC 1 42 NC NC 2 43 NC A17 1 40 A8 A17 2 41 A8 A17 3 42 A8 A7 2 39 A9 A7 3 40 A9 A7 4 41 A9 A6 3 38 A10 A6 4 39 A10 A6 5 40 A10 A5 4 37 A11 A5 5 38 A11 A5 6 39 A11 A4 5 36 A12 A4 6 37 A12 A4 7 38 A12 A3 6 35 A13 A3 7 36 A13 A3 8 37 A13 A2 7 34 A14 A2 8 35 A14 A2 9 36 A14 A1 8 33 A15 A1 9 34 A15 A1 10 35 A15 A0 9 32 A16 A0 10 33 A16 A0 11 34 A16 CE 10 31 BYTE/VPP CE 11 32 BYTE/VPP CE 12 33 BYTE/VPP VSS 11 30 VSS 31 VSS VSS 13 32 VSS OE 12 29 D15/A–1 OE 13 30 D15/A–1 OE 14 31 D15/A–1 D0 13 28 D7 D0 14 29 D7 D0 15 30 D7 D8 14 27 D14 D8 15 28 D14 D8 16 29 D14 D1 15 26 D6 D1 16 27 D6 D1 17 28 D6 D9 16 25 D13 D9 17 26 D13 D9 18 27 D13 D2 17 24 D5 D2 18 25 D5 D2 19 26 D5 D10 18 D3 19 D11 20 23 D12 22 D4 21 VCC VSS 12 D10 19 24 D12 D3 20 23 D4 D11 21 22 VCC D3 21 D11 22 42-pin SOJ 40-pin DIP or SOP Pin name 25 D12 24 D4 23 VCC 44-pin TSOP(II) Functions D15/A–1 Data output / Address input A0 to A17 Address input D0 to D14 Data output CE Chip enable OE Output enable BYTE/VPP D10 20 Mode switch / Program power supply voltage VCC Power supply voltage VSS GND NC Non connection 2/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP BLOCK DIAGRAM A–1 × 8/× 16 Switch BYTE/VPP CE OE PGM Row Decoder OE Memory Cell Matrix 262,144 × 16-Bit or 524,288 × 8-Bit Multiplexer Column Decoder Address Buffer A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 CE Output Buffer D0 D2 D1 D4 D3 D6 D5 D8 D7 D10 D9 D12 D11 D14 D13 D15 In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. FUNCTION TABLE CE OE BYTE Read (16-Bit) L L H Read (8-Bit) L L L Output disable L H Mode Standby H ∗ Program L H Program inhibit H H Program verify H L H L VCC D0 to D7 D8 to D14 D15/A–1 DOUT DOUT 3.3 V H Hi–Z Hi–Z Hi–Z L L/H ∗ ∗ DIN 9.75 V 4.0 V Hi–Z DOUT ∗: Don’t Care (H or L) 3/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ABSOLUTE MAXIMUM RATINGS Parameter Symbol Operating temperature under bias Condition Ta Storage temperature — Tstg Input voltage VI Output voltage VO Power supply voltage VCC Program power supply voltage VPP Power dissipation per package PD relative to VSS Value Unit 0 to 70 °C –55 to 125 °C –0.5 to VCC+0.5 V –0.5 to VCC+0.5 V –0.5 to 5 V –0.5 to 11.5 V 1.0 W — RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol VCC power supply voltage VCC VPP power supply voltage VPP Input “H” level VIH Input “L” level VIL Condition VCC = 3.0 to 3.6 V Min. Typ. Max. Unit 3.0 — 3.6 V –0.5 — VCC+0.5 V 2.2 — VCC+0.5∗ V –0.5∗∗ — 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. ∗∗ : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns. 4/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.3 V ±0.3 V, Ta = 0 to 70°C) parameter Input leakage current Symbol Condition Min. Typ. Max. Unit ILI VI = 0 to VCC — — 10 µA ILO VO = 0 to VCC — — 10 µA VCC power supply current ICCSC CE = VCC — — 50 µA (Standby) ICCST CE = VIH — — 1 mΑ ICCA CE = VIL, OE = VIH tc = 80 ns — — 30 mA VPP power supply current IPP VPP = VCC — — 10 µA Input “H” level VIH — 2.2 — VCC+0.5∗ V Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH IOH = –400 µA 2.4 — — V Output “L” level VOL IOL = 2.1 mA — — 0.4 V Output leakage current VCC power supply current (Read) Voltage is relative to VSS. ∗ : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. ∗∗ : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns. AC Characteristics (VCC = 3.3 V ±0.3 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit tC — 80 — ns tACC CE = OE = VIL — 80 ns CE access time tCE OE = VIL — 80 ns OE access time tOE CE = VIL — 40 ns tCHZ OE = VIL 0 30 ns tOHZ CE = VIL 0 25 ns tOH CE = OE = VIL 0 — ns Address cycle time Address access time Output disable time Output hold time Measurement conditions Input signal level-------------------------------- 0 V/3 V Input timing reference level ------------------ 0.8 V/2.0 V Output load -------------------------------------- 50 pF Output timing reference level---------------- 0.8 V/2.0 V 2.08 V 800Ω Output 50 pF (Including scope and jig) 5/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Timing Chart (Read Cycle) 16-Bit Read Mode (BYTE = VIH) tC tC Address tOH tACC tCE CE tOE tCHZ tOH OE tOHZ tACC Valid Data D0 to D15 Valid Data Hi-Z Hi-Z 8-Bit Read Mode (BYTE = VIL) tC tC Address tOH tACC tCE CE tOE tCHZ tOH OE tOHZ tACC Valid Data D0 to D7 Hi-Z Valid Data Hi-Z 6/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION) DC Characteristics (Ta = 25°C ±5°C) Parameter Symbol Condition Min. Typ. Max. Unit ILI VI = VCC+0.5 V — — 10 µA VPP power supply current (Program) IPP2 CE = VIL — — 50 mA VCC power supply current ICC — — — 50 mA Input “H” level VIH — 3.0 — VCC+0.5 V Input leakage current Input “L” level VIL — –0.5 — 0.8 V Output “H” level VOH IOH = –400 µA 2.4 — — V Output “L” level VOL IOL = 2.1 mA — — 0.45 V Program voltage VPP — 9.5 9.75 10.0 V VCC power supply voltage VCC — 3.9 4.0 4.1 V Voltage is relative to VSS. AC Characteristics (VCC = 4.0 V ±0.1 V, BYTE/VPP = 9.75 V ±0.25 V, Ta = 25°C ±5°C) Symbol Condition Min. Typ. Max. Unit Address set-up time Parameter tAS — 100 — — ns OE set-up time tOES — 2 — — µs Data set-up time tDS — 100 — — ns Address hold time tAH — 2 — — µs Data hold time tDH — 100 — — ns Output float delay time from OE tOHZ — 0 — 100 ns VPP voltage set-up time tVS — 2 — — µs Program pulse width tPW — 9 10 11 µs Data valid from OE tOE — — — 100 ns Address hold from OE high tAOH — 0 — — ns Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as following condition call the preprogrammed codes on device outputs. (VCC = 3.3 V ±0.3 V, CE = VIL, OE = VIL, BYTE/VPP = VIH, Ta = 25°C ±5°C) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 ∗ A10 A11 A12 A13 A14 A15 A16 A17 DATA 0 1 0 1 0 1 0 1 0 VH 0 1 0 1 0 1 0 0 FF00 1 0 1 0 1 0 1 0 1 VH∗ 1 0 1 0 1 0 1 1 00FF Other conditions FFFF ∗: VH = 8 V ±0.25 V 7/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Consecutive Programming Waveforms A0 to A17 tAS tAH CE tPW High OE tDH tDS Din D0 to D15 Din tVS BYTE/Vpp Consecutive Program Verify Waveforms A0 to A17 High CE tACC tAHO OE tOE D0 to D15 BYTE/Vpp tOHZ Dout Dout 9.75 V 8/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Program and Program Verify Cycle Waveforms A0 to A17 tAS tAHO CE tPW tOES OE tOHZ tDH tDS tOE tOHZ Dout Din D0 to D15 9.75 V BYTE/Vpp Pin Capacitance (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Input CIN1 BYTE/VPP CIN2 Output COUT Condition VI = 0 V VO = 0 V Min. Typ. Max. — — 8 (10) — — 60 — — 10 (12) Unit pF ( ) : DIP only 9/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Programming/Verify Flow Chart Programming Verify Start Start Pin Check Pin Check NG Bad Insertion NG Bad Insertion PASS PASS Address = First Location Address = First Location VCC = 4.0 V VCC = 3.0 V/VPP = 3.0 V VPP = 9.75 V NG Verify PASS Program 10 µs VCC = 3.6 V/VPP = 3.6 V Increment Address NO Last Address? NG Verify YES PASS Address = First Location Device Passed Device Failed X=0 NG Verify(One Word) X = X+1 PASS Increment Address NO YES Last Address? X = 2? YES NO VCC = 3.0 V/VPP = 3.0 V Verify Program 10 µs NG PASS Device Passed Device Failed 10/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP PACKAGE DIMENSIONS (Unit: mm) DIP40-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 6.10 TYP. 2/Dec. 11, 1996 11/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) SOJ42-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.86 TYP. 5/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) TSOP(2)44-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.54 TYP. 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 13/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) SOP40-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.27 TYP. 3/Oct. 21, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 14/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP REVISION HISTORY Page Previous Current Edition Edition Document No. Date FEDR27V402E-01-02 Sep. 2001 – – FEDR27V402E-01-03 Jan. 15, 2004 1, 2 1, 2, 12 Description Final edition 2 Added 42SOJ package. 15/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 16/16