NLSV8T244 8-Bit Dual-Supply NonInverting Level Translator The NLSV8T244 is a 8−bit configurable dual−supply voltage level translator. The input An and output Bn ports are designed to track two different power supply rails, VCCA and VCCB respectively. Both supply rails are configurable from 0.9 V to 4.5 V allowing universal low−voltage translation from the input An to the output Bn port. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • • • Wide VCCA and VCCB Operating Range: 0.9 V to 4.5 V High−Speed w/ Balanced Propagation Delay Inputs and Outputs have OVT Protection to 4.5 V Non−preferential VCCA and VCCB Sequencing Outputs at 3−State until Active VCC is Reached Power−Off Protection Outputs Switch to 3−State with VCCB at GND Ultra−Small Packaging: 4.0 mm x 2.0 mm UDFN20 This is a Pb−Free Device UQFN20 MU SUFFIX CASE 517AK LCM G LC = Specific Device Code M = Date Code G = Pb−Free Package 20 SOIC−20 DW SUFFIX CASE 751D Typical Applications NLSV8T244 AWLYYWWG 1 • Mobile Phones, PDAs, Other Portable Devices A WL YY WW G Important Information • ESD Protection for All Pins: HBM (Human Body Model) > 6000 V = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package TSSOP−20 DT SUFFIX CASE 948E A L Y W G SV8T 244 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2009 June, 2009 − Rev. 1 1 Publication Order Number: NLSV8T244/D NLSV8T244 VCCA VCCB OE A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6 A7 B7 A8 B8 VCCA 1 20 VCCB A1 2 19 B1 A2 3 18 B2 A3 4 17 B3 A4 5 16 B4 A5 6 15 B5 A6 7 14 B6 A7 8 13 B7 A8 9 12 B8 GND 10 11 OE (Top View) Figure 1. Logic Diagram Figure 2. Pin Assignment TRUTH TABLE PIN ASSIGNMENT Inputs Outputs PIN FUNCTION OE An Bn VCCA Input Port DC Power Supply L L L VCCB Output Port DC Power Supply L H H GND Ground H X 3−State An Input Port Bn Output Port OE Output Enable http://onsemi.com 2 NLSV8T244 MAXIMUM RATINGS Symbol VCCA, VCCB VI VC VO Rating Value DC Supply Voltage Condition Unit −0.5 to +5.5 V An −0.5 to +5.5 V OE −0.5 to +5.5 V (Power Down) Bn −0.5 to +5.5 (Active Mode) Bn −0.5 to +5.5 V (Tri−State Mode) Bn −0.5 to +5.5 V DC Input Voltage Control Input DC Output Voltage VCCA = VCCB = 0 V IIK DC Input Diode Current −20 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA IO DC Output Source/Sink Current ±50 mA ICCA, ICCB DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCCA, VCCB Parameter Bus Input Voltage VC Control Input VIO Bus Output Voltage Dt / DV Max Unit 0.9 4.5 V GND 4.5 V OE GND 4.5 V Bn GND 4.5 V (Active Mode) Bn GND VCCB V (Tri−State Mode) Bn GND 4.5 V −40 +85 °C 0 10 nS Positive DC Supply Voltage VI TA Min (Power Down Mode) Operating Temperature Range Input Transition Rise or Rate VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V http://onsemi.com 3 NLSV8T244 DC ELECTRICAL CHARACTERISTICS −405C to +855C Symbol VIH VIL VOH Parameter Test Conditions Input HIGH Voltage (An, OE) Input LOW Voltage (An, OE) Output HIGH Voltage Min Max Unit 3.6 – 4.5 0.9 – 4.5 V 2.2 − 2.7 – 3.6 2.0 − 2.3 – 2.7 1.6 − 1.4 − 2.3 0.65 * VCCA − 0.9 – 1.4 0.9 * VCCA − 0.9 – 4.5 − 0.8 2.7 – 3.6 − 0.8 2.3 – 2.7 − 0.7 1.4 − 2.3 − 0.35 * VCCA 0.9 – 1.4 − 0.1 * VCCA IOH = −100 mA; VI = VIH 0.9 – 4.5 0.9 – 4.5 VCCB – 0.2 − IOH = −0.5 mA; VI = VIH 0.9 0.9 0.75 * VCCB − IOH = −2 mA; VI = VIH 1.4 1.4 1.05 − IOH = −6 mA; VI = VIH 1.65 1.65 1.25 − 2.3 2.3 2.0 − 2.3 2.3 1.8 − 2.7 2.7 2.2 − 2.3 2.3 1.7 − IOH = −18 mA; VI = VIH Output LOW Voltage VCCB (V) 3.6 – 4.5 IOH = −12 mA; VI = VIH VOL VCCA (V) 3.0 3.0 2.4 − IOH = −24 mA; VI = VIH 3.0 3.0 2.2 − IOL = 100 mA; VI = VIL 0.9 – 4.5 0.9 – 4.5 − 0.2 IOL = 0.5 mA; VI = VIH 1.1 1.1 − 0.3 IOL = 2 mA; VI = VIH 1.4 1.4 − 0.35 IOL = 6 mA; VI = VIL 1.65 1.65 − 0.3 IOL = 12 mA; VI = VIL 2.3 2.3 − 0.4 2.7 2.7 − 0.4 2.3 2.3 − 0.6 3.0 3.0 − 0.45 IOL = 18 mA; VI = VIL IOL = 24 mA; VI = VIL V V V 3.0 3.0 − 0.6 Input Leakage Current VI = VCCA or GND 0.9 – 4.5 0.9 – 4.5 −1.0 1.0 mA IOFF Power−Off Leakage Current OE = 0 V 0 0.9 – 4.5 0.9 – 4.5 0 −1.0 −1.0 1.0 1.0 mA ICCA Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 − 4.5 − 2.0 mA ICCA + ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0, VCCA = VCCB 0.9 – 4.5 0.9 – 4.5 − 4.0 mA II DICCA Increase in ICC per Input Voltage, Other Inputs at VCCA or GND VI = VCCA – 0.6 V; VI = VCCA or GND 4.5 3.6 4.5 3.6 − 10 5.0 mA DICCB Increase in ICC per Input Voltage, Other Inputs at VCCA or GND VI = VCCA – 0.6 V; VI = VCCA or GND 4.5 3.6 4.5 3.6 − 10 5.0 mA I/O Tri−State Output Leakage Current TA = 25°C, OE = 0 V 0.9 – 4.5 0.9 – 4.5 −1.0 1.0 mA IOZ http://onsemi.com 4 NLSV8T244 TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB) −405C to +855C VCCB (V) 4.5 VCCA (V) Min 3.3 Max Min 2.8 Max Min 1.8 Max Min 0.9 Max Min Max Unit 4.5 2 2 2 2 < 1.5 μA 3.3 2 2 2 2 < 1.5 μA 2.8 <2 <1 <1 < 0.5 < 0.5 μA 1.8 <1 <1 < 0.5 < 0.5 < 0.5 μA 0.9 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 μA NOTE: Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up sequence of VCCA and VCCB will not damage the IC. AC ELECTRICAL CHARACTERISTICS −405C to +855C VCCB (V) 4.5 Symbol tPLH, tPHL (Note 1) tPZH, tPZL (Note 1) tPHZ, tPLZ (Note 1) tOSHL, tOSLH (Note 1) Min 3.3 Max Min 2.8 Max Min 1.8 Max Max Unit 2.1 2.3 nS 2.3 2.6 2.3 2.5 2.8 2.4 2.5 2.7 3.0 2.4 2.7 2.8 3.0 3.3 4.5 2.6 3.8 4.0 4.1 4.3 3.3 3.7 3.9 4.1 4.3 4.6 2.5 3.9 4.1 4.3 4.5 4.8 1.8 4.1 4.4 4.5 4.7 5.0 1.2 4.4 4.7 4.8 5.0 5.3 4.5 2.6 3.8 4.0 4.1 4.3 3.3 3.7 3.9 4.1 4.3 4.6 2.5 3.9 4.1 4.3 4.5 4.8 1.8 4.1 4.4 4.5 4.7 5.0 1.2 4.4 4.7 4.8 5.0 5.3 4.5 0.15 0.15 0.15 0.15 0.15 3.3 0.15 0.15 0.15 0.15 0.15 2.5 0.15 0.15 0.15 0.15 0.15 1.8 0.15 0.15 0.15 0.15 0.15 1.2 0.15 0.15 0.15 0.15 0.15 Parameter VCCA (V) Propagation Delay, 4.5 1.6 1.8 2.0 3.3 1.7 1.9 2.1 An to Bn 2.8 1.9 2.1 1.8 2.1 1.2 Output Enable, OE to Bn Output Disable, OE to Bn Output to Output Skew, Time Min 1.2 Max Min nS nS nS 1. Propagation delays defined per Figure 3. CAPACITANCE Symbol Parameter Test Conditions Typ (Note 2) Unit CIN Control Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 3.5 pF CI/O I/O Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 5.0 pF CPD Power Dissipation Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz 20 pF 2. Typical values are at TA = +25°C. 3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from: ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching. http://onsemi.com 5 NLSV8T244 VCC Pulse Generator RL DUT CL VCCO x 2 OPEN GND RL Figure 3. AC (Propagation Delay) Test Circuit Test Switch tPLH, tPHL OPEN tPLZ, tPZL VCCO x 2 tPHZ, tPZH GND CL = 15 pF or equivalent (includes probe and jig capacitance) RL = 2 kW or equivalent ZOUT of pulse generator = 50 W VIH Input (An) Vm Vm tPHL tPLH Output (Bn) Vm 0V VOH Vm VOL Waveform 1 − Propagation Delays tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VIH OEn Vm Vm tPZH 0V tPHZ Output (Bn) VOH VY Vm ≈0V tPZL tPLZ ≈ VCC Vm Output (Bn) VX VOL Waveform 2 − Output Enable and Disable Times tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 4. AC (Propagation Delay) Test Circuit Waveforms VCC Symbol 3.0 V – 4.5 V 2.3 V − 2.7 V 1.65 V − 1.95 V 1.4 V − 1.6 V 0.9 V − 1.3 V VmA VCCA/2 VCCA/2 VCCA/2 VCCA/2 VCCA/2 VmB VCCB/2 VCCB/2 VCCB/2 VCCB/2 VCCB/2 VX VOL x 0.1 VOL x 0.1 VOL x 0.1 VOL x 0.1 VOL x 0.1 VY VOH x 0.9 VOH x 0.9 VOH x 0.9 VOH x 0.9 VOH x 0.9 http://onsemi.com 6 NLSV8T244 ORDERING INFORMATION Package Shipping† NLSV8T244MUTAG UQFN20 (Pb−Free) 3000 / Tape & Reel NLSV8T244DTR2G TSSOP−20 (Pb−Free) 2500 / Tape & Reel NLSV8T244DWR2G SOIC−20 (Pb−Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NLSV8T244 PACKAGE DIMENSIONS UDFN20 4x2, 0.4P CASE 517AK−01 ISSUE O A B D 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. L1 0.15 C E PIN 1 REFERENCE DETAIL A NOTE 5 2X 0.15 C TOP VIEW (A3) 0.10 C DIM A A1 A3 b D E e L L1 L2 A 20X 0.08 C SIDE VIEW A1 DETAIL A 1 C 19X SEATING PLANE L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 4.00 BSC 2.00 BSC 0.40 BSC 0.50 0.60 0.00 0.03 0.60 0.70 10 MOUNTING FOOTPRINT SOLDERMASK DEFINED (L2) 19X 20X 20 e e/2 BOTTOM VIEW 0.78 0.22 11 20X b 0.10 M C A B 0.05 M C 2.30 NOTE 3 0.88 1 0.40 PITCH DIMENSIONS: MILLIMETERS http://onsemi.com 8 NLSV8T244 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C 20X 0.15 (0.006) T U 2X L K REF 0.10 (0.004) S L/2 20 M T U S V ÍÍÍ ÍÍÍ ÍÍÍ K K1 S J J1 11 B SECTION N−N −U− PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C G D H DETAIL E 0.100 (0.004) −T− SEATING DIM A B C D F G H J J1 K K1 L M PLANE SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 9 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NLSV8T244 PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE G A 20 q X 45 _ E h H M 10X 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B B 0.25 M T A S B S L A 18X e A1 SEATING PLANE C T DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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