NLSV22T244 Dual 2-Bit Dual-Supply Non-Inverting Level Translator The NLSV22T244 is a dual 2−bit configurable dual−supply bus buffer level translator. The input ports A and the output ports B are designed to track two different power supply rails VCCA and VCCB. Both supply rails are configurable from 1.6 V to 3.6 V allowing universal low−voltage translations from the input port A to the output B port. Features • • • • • • • • 1 PIN ASSIGNMENT OE • Mobile Phones, PDAs, Other Portable Devices VCCB VCCA 1 IN_A1 11 VCCB 2 10 OUT_B1 IN_A2 3 9 OUT_B2 OUT_A3 4 8 IN_B3 OUT_A4 5 7 IN_B4 OUT_B1 IN _A2 12 6 GND (Top View) OUT_B2 OE VCCB ORDERING INFORMATION VCCA Device NLSV22T244MUTAG IN _B3 OUT_A3 IN _B4 OUT_A4 OE OE WEMG G WE = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Typical Applications IN _A1 MARKING DIAGRAM UQFN12 MU SUFFIX CASE 523AE Wide VCCA and VCCB Operating Range: 1.6 V to 3.6 V High−Speed w/ Balanced Propagation Delay Inputs and Outputs have OVT Protection to 5.5 V Non−preferential VCCA and VCCB Sequencing Outputs at 3−State until Active VCC is reached Power−Off Protection Ultra−Small packaging: 1.7mm x 2.0 mm UQFN−12 This is a Pb−Free Device VCCA http://onsemi.com Package Shipping† UQFN12 3000 (Pb−Free) / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. GND Figure 1. Logic Diagram © Semiconductor Components Industries, LLC, 2009 June, 2009 − Rev. 3 1 Publication Order Number: NLSV22T244/D NLSV22T244 Module B (2.8V) 2.8V USB D+ USB D− VCCB VCCB VCCA VCCA IN_B3 OUT_A3 IN_B4 OUT_A4 1.8V USB Rx_D+ USB Rx_D− OE 1.8V OE Tx/Rx Module A (1.8V) NLU1G50 Tx/Rx OE OUT_B1 IN_A1 OUT_B2 IN_A2 VCCB USB Tx_D+ USB Tx_D− VCCA OE = High, Module B Transmits, Module A Receives = B → A OE = Low, Module A Transmits, Module B Receives = A → B Figure 2. Typical Application Bi−Directional to Uni−Directional Logic Level Translator http://onsemi.com 2 Uni−Directional I/O Ports Bi−Directional I/O Port NLSV22T244 NLSV22T244 PIN ASSIGNMENT Pin Function Inputs VCCA A DC Power Supply VCCB B DC Power Supply GND Ground IN_A1, IN_A2, IN_B3, IN_B4 Inputs OUT_B1, OUT_B2, OUT_A3, OUT_A4 OE IN_B3, IN_B4 OUT_B1, OUT_B2 OUT_A3 OUT_A4 H X L 3−State L L H H L X L 3−State L Outputs OE Outputs IN_A1 IN_A2 H Output Enable H MAXIMUM RATINGS Symbol VCCA, VCCB VI VC VO Rating Value DC Supply Voltage DC Input Voltage IN_Xn Control Input OE DC Output Voltage Condition Unit −0.5 to +5.5 V −0.5 to +5.5 V −0.5 to +5.5 V (Power Down) OUT_Xn −0.5 to +5.5 (Active Mode) OUT_Xn −0.5 to +5.5 (Tri−State Mode) OUT_Xn −0.5 to +5.5 VCCA = VCCB = 0 V IIK DC Input Diode Current −20 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA IO DC Output Source/Sink Current ±50 mA ICCA, ICCB DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol VCCA, VCCB Parameter Positive DC Supply Voltage VI Bus Input Voltage VC Control Input VIO Bus Output Voltage TA Dt / DV Min Max Unit 1.6 3.6 V GND 3.6 V OE GND 3.6 V (Power Down Mode) OUT_Xn GND 3.6 V (Active Mode) OUT_Xn GND 3.6 V (Tri−State Mode) OUT_Xn GND 3.6 V −40 +85 °C 0 10 nS Operating Temperature Range Input Transition Rise or Rate VI, from 30% to 70% of VCC; VCC = 3.3 V ±0.3 V http://onsemi.com 3 NLSV22T244 DC ELECTRICAL CHARACTERISTICS −405C to +855C Symbol VIH Parameter Test Conditions Input HIGH Voltage VCCA (V) VCCB (V) Min Max Unit 2.7 − 3.6 1.6 − 3.6 2.0 − V 1.6 − 0.65 * VCCA − − 0.8 − 0.7 2.3 − 2.7 1.4 − 2.3 VIL Input LOW Voltage 2.7 − 3.6 1.6 − 3.6 2.3 − 2.7 1.6 − 2.3 VOH Output HIGH Voltage IOH = −100 mA; VI = VIH − 0.35 * VCCA 1.6 − 3.6 1.6 − 3.6 VCCB − 0.2 − 1.6 1.6 1.25 − 2.3 2.3 2.0 − 2.3 2.3 1.8 − 2.7 2.7 2.2 − 2.3 2.3 1.7 − 3.0 3.0 2.4 − IOH = −6 mA; VI = VIH IOH = −12 mA; VI = VIH IOH = −18 mA; VI = VIH VOL Output LOW Voltage IOH = −24 mA; VI = VIH 3.0 3.0 2.2 − IOL = 100 mA; VI = VIL 1.6 − 3.6 1.6 − 3.6 − 0.2 IOL = 6 mA; VI = VIL 1.6 1.6 − 0.3 IOL = 12 mA; VI = VIL 2.3 2.3 − 0.4 2.7 2.7 − 0.4 2.3 2.3 − 0.6 3.0 3.0 − 0.5 IOL = 18 mA; VI = VIL IOL = 24 mA; VI = VIL V V V 3.0 3.0 − 0.6 Input Leakage Current VI = VCCA or GND 1.6 − 3.6 1.6 − 3.6 −1.0 +1.0 mA IOZ I/O Tri−State Output Leakage Current TA = 25°C, OE = GND 1.6 − 3.6 1.6 − 3.6 − 2.0 mA ICCA Quiescent Supply Current VI = VCCA or GND; IO = 0 1.6 − 3.6 1.6 − 3.6 − 2.0 mA ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0 1.6 − 3.6 1.6 − 3.6 − 2.0 mA ICCA + ICCB Quiescent Supply Current VI = VCCA or GND; IO = 0 1.6 − 3.6 1.6 − 3.6 − 4.0 mA II TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB) −405C to +855C VCCB (V) 3.6 NOTE: Max Min 1.6 Max Unit 3.6 2 2 2 mA 2.8 <1 <1 < 0.5 mA 1.6 <1 <1 < 0.5 mA VCCA (V) Min 2.8 Max Min Connect ground before applying supply voltage VCCA or VCCB. This device is designed with the feature that the power−up sequence of VCCA and VCCB will not damage the IC. http://onsemi.com 4 NLSV22T244 AC ELECTRICAL CHARACTERISTICS −405C to +855C VCCB (V) 3.6 Symbol Parameter tPLH, tPHL Propagation Delay, An to Bn tPZH, tPZL Output Enable, OE to OUT_Xn tPHZ, tPLZ Output Disable, OE to OUT_Xn tOSHL, tOSLH Output−to−Output Skew, Data−to−Output VCCA (V) Min 2.8 Max Min 1.6 Max Min Max Unit nS 3.6 3.4 3.6 3.8 2.8 3.6 3.8 4.0 1.6 3.9 4.0 4.5 3.6 5.8 6.0 6.2 2.8 6.0 6.2 6.4 1.6 8.2 8.4 8.6 3.6 5.8 6.0 6.2 2.8 6.0 6.2 6.4 1.6 8.2 8.4 8.6 3.6 0.15 0.15 0.15 2.8 0.15 0.15 0.15 1.6 0.15 0.15 0.15 nS nS nS 1. Propagation delays defined per Figure 3. CAPACITANCE Symbol Parameter Test Conditions Typ (Note 2) Unit CIN Control Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 3.5 pF CI/O I/O Pin Input Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA/B 5.0 pF CPD Power Dissipation Capacitance VCCA = VCCB = 3.3 V, VI = 0 V or VCCA, f = 10 MHz 10 pF 2. Typical values are at TA = +25°C. 3. CPD is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from: ICC(operating) ^ CPD x VCC x fIN x NSW where ICC = ICCA + ICCB and NSW = total number of outputs switching. VCC Pulse Generator RL DUT CL RL Figure 3. AC (Propagation Delay) Test Circuit Test Switch tPLH, tPHL OPEN tPLZ, tPZL VCCO x 2 at VCCB = 3.0 V − 3.6 mV, 2.3 V − 2.7 V, 1.6 V − 1.95 V tPHZ, tPZH GND CL = 15 pF or equivalent (includes probe and jig capacitance) RL = 2 kW or equivalent ZOUT of pulse generator = 50 W http://onsemi.com 5 VCCO x 2 OPEN GND NLSV22T244 VIH Input (An) Vm Vm tPLH tPHL Output (Bn) Vm 0V VOH Vm VOL Waveform 1 − Propagation Delays tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VIH OEn Vm Vm tPZH Output (Bn) tPHZ Vm 0V VOH VY ≈0V tPZL Output (Bn) tPLZ Vm ≈ VCC VX VOL Waveform 2 − Output Enable and Disable Times tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 4. AC (Propagation Delay) Test Circuit Waveforms VCC Symbol 3.0 V – 3.6 V VmA VCCA/2 VmB VCCB/2 VX VOL x 0.1 VY VOH x 0.9 http://onsemi.com 6 NLSV22T244 0.7 In_Ax or In_Bx 0.6 ICCA OR ICCB (mA) 0.5 0.4 0.3 0.2 0.1 0.0 −0.1 0 0.5 1 1.5 2 2.5 3 Vin, INPUT VOLTAGE (V) Figure 5. Delta ICC Increase in ICC per Input Voltage, Other Inputs at VCCA / VCCB or GND http://onsemi.com 7 3.5 NLSV22T244 PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE−01 ISSUE A ÉÉ ÉÉ ÉÉ D PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B L1 DETAIL A E NOTE 5 TOP VIEW DIM A A1 A3 b D E e K L L1 L2 DETAIL B A 0.05 C 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE K 5 7 DETAIL A MOUNTING FOOTPRINT SOLDERMASK DEFINED e 1 12X DETAIL B OPTIONAL CONSTRUCTION MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF 11 L 2.00 12X L2 BOTTOM VIEW b 0.10 M C A B 0.05 M C 1 NOTE 3 0.32 2.30 0.40 PITCH 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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