NUF2030XV6, NUF2042XV6 USB Upstream Terminator with ESD Protection These devices are designed for applications requiring Line Termination, EMI Filtering and ESD Protection. They are intended for use in upstream USB ports, cellular phones, wireless equipment and computer applications. These devices offer an integrated solution in a small package (SOT−563) reducing PCB space and cost. http://onsemi.com CIRCUIT DESCRIPTION Features: • Provides USB Line Termination, Filtering and ESD Protection • Single IC Offers Cost Savings • Bidirectional EMI Filtering Prevents Noise from Entering/Leaving • • • the System Compliance with IEC61000−4−2 (Level 4) 8 kV (Contact) 15 kV (Air) ESD Ratings: Machine Model = C : Human Body Model = 3B These are Pb−Free Devices D1(0) VBUS D2(0) 6 5 4 RS Benefits: C1 RS C1 1 2 3 D1(i) GND D2(i) • SOT−563 Package Minimizes PCB Space • Integrated Circuit Increases System Reliability versus Discrete • Component Implementation TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances Typical Applications: • USB Hubs • Computer Peripherals Using USB Symbol Value Unit PD 225 mW TJ(max) 125 °C Operating Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +125 °C Lead Solder Temperature (10 second duration) TL 260 °C Steady State Power Maximum Junction Temperature Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2005 July, 2005 − Rev. 2 1 SOT−563 CASE 463A MARKING DIAGRAM MAXIMUM RATINGS (TA = 25°C) Rating 6 1 1 xx M G G xx = Specific Device Code (see table on page 5) M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Publication Order Number: NUF2030XV6/D NUF2030XV6, NUF2042XV6 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VBR @ 1 mA (V) Line Capacitance Vdc = 2.5 V f = 1 MHz (pF) (Note 1) IR @ 3.3 V (nA) VRWM (V) Min Typ Max Min Typ Max NUF2030XV6T1 5.25 5.6 6.8 8.0 − 10 NUF2042XV6T1 5.25 5.6 6.8 8.0 − 10 Device Min Typ 100 − 100 37.6 Max Min Typ Max 30 36 17.6 22 26.4 42 56.4 17.6 22 26.4 1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded. 2. For other resistance value (e.g. 33 W), please contact your local ON Semiconductor sales representative. http://onsemi.com 2 Series Resistor RS (W) NUF2030XV6, NUF2042XV6 TYPICAL CHARACTERISTICS 0 0 −10 −5 −20 −30 S41 (dB) S21 (dB) −10 −15 −20 −40 −50 −60 −25 −70 −30 1.E+06 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 FREQUENCY (Hz) 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) Figure 2. Analog Cross−Talk (NUF2030) Figure 1. Insertion Loss Characteristics (NUF2030) 0 0 −10 −5 −20 −30 S41 (dB) S21 (dB) −10 −15 −20 −40 −50 −60 −25 −70 −30 1.E+06 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 FREQUENCY (Hz) 1.E+10 Figure 4. Analog Cross−Talk (NUF2042) 80 60 70 CAPACITANCE (pF) 50 CAPACITANCE (pF) 1.E+09 FREQUENCY (Hz) Figure 3. Insertion Loss Characteristics (NUF2042) 40 30 20 10 0 1.E+08 60 50 40 30 20 10 0 1 2 3 4 0 5 0 REVERSE VOLTAGE (V) 1 2 3 4 REVERSE VOLTAGE (V) Figure 6. Typical Capacitance (NUF2042) Figure 5. Typical Capacitance (NUF2030) http://onsemi.com 3 5 NUF2030XV6, NUF2042XV6 24.5 RS = Typical 24.0 RS (W) 23.5 23.0 22.5 22.0 21.5 −20 −10 0 10 20 30 40 50 TEMPERATURE (°C) Figure 7. RS versus Temperature (NUF2030 and NUF2042) http://onsemi.com 4 60 70 NUF2030XV6, NUF2042XV6 ORDERING INFORMATION Device Marking Package Shipping † NUF2030XV6T1 30 SOT−563* 4000 / Tape & Reel NUF2030XV6T1G 30 SOT−563* 4000 / Tape & Reel NUF2042XV6T1 22 SOT−563* 4000 / Tape & Reel NUF2042XV6T1G 22 SOT−563* 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 5 NUF2030XV6, NUF2042XV6 PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A−01 ISSUE E D −X− 6 5 1 e 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 3 E −Y− DIM A b C D E e L HE HE b 65 PL 0.08 (0.003) C M X Y MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 6 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUF2030XV6/D