PRELIMINARY DATA SHEET Solid State Relay OCMOS FET PS7241E-1B 4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET DESCRIPTION The PS7241E-1B is an optically coupled element that combines a GaAs infrared LED on the input side with a normally close MOS FET on the output side to realize an excellent cost performance. The small, thin package and high sensitivity of this element makes it ideal for battery-driven mobile devices, and its small offset voltage at power-on and good linearity also make it suitable for controlling micro analog signals. FEATURES PIN CONNECTION (Top View) • Small and thin package (4-pin SOP, Height = 2.1 mm) • 1 channel type (1 b output) • Designed for AC/DC switching line changer 4 3 • Low offset voltage 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET • Ordering number of taping product: PS7241E-1B-E3, E4, F3, F4 • Pb-Free product • UL awaiting approval • BSI awaiting approval 1 2 APPLICATIONS • Laptop PC, PDA • Modem card • Telephone, FAX • Measurement equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10552EJ01V0DS (1st edition) Date Published February 2005 CP(K) Printed in Japan © NEC Compound Semiconductor Devices, Ltd. 2005 PS7241E-1B PACKAGE DIMENSIONS (UNIT: mm) 4.0±0.5 0.05+0.08 –0.05 2.05+0.08 –0.05 0.15+0.10 –0.05 7.0±0.3 4.4 2 0.5±0.3 2.54 0.40+0.10 –0.05 0.25 M Preliminary Data Sheet PN10552EJ01V0DS PS7241E-1B ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification Pb-Free PS7241E-1B PS7241E-1B-A PS7241E-1B-E3 PS7241E-1B-E3-A PS7241E-1B-E4 PS7241E-1B-E4-A PS7241E-1B-F3 PS7241E-1B-F3-A PS7241E-1B-F4 PS7241E-1B-F4-A *2 Magazine case 100 pcs UL and BSI Embossed Tape 900 pcs/reel awaiting approval *1 PS7241E-1B Embossed Tape 3 500 cs/reel *1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Diode Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A Break Down Voltage VL 400 V Continuous Load Current Power Dissipation Peak Forward Current MOS FET *1 IL 120 mA Pulse Load Current (AC/DC Connection) ILP 240 mA Power Dissipation PD 300 mW BV 1 500 Vr.m.s. Total Power Dissipation PT 350 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C *2 Isolation Voltage *3 *1 PW = 100 µs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 °C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. Preliminary Data Sheet PN10552EJ01V0DS 3 PS7241E-1B RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 3 10 20 mA LED Off Voltage VF 0 0.5 V ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Symbol Conditions MIN. TYP. MAX. Unit 1.2 1.4 V Forward Voltage VF IF = 10 mA Reverse Current IR VR = 5 V 5.0 µA Off-state Leakage ILoff IF = 10 mA, VD = 400 V 1.0 µA Output Capacitance Cout IF = 10 mA, VD = 0 V, f = 1 MHz LED Off-state Current IFoff IL = 120 mA On-state Resistance Ron1 IF = 0 mA, IL = 10 mA Current Coupled 206 pF 3.0 mA 22 35 Ω Ron2 IF = 0 mA, IL = 120 mA, t ≤ 10 ms 17 24 *1 ton IF = 10 mA, VO = 5 V, RL = 500 Ω, 0.07 0.2 *1 toff PW ≥ 10 ms 1.0 3.0 Turn-on Time Turn-off Time Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz 10 ms Ω 9 0.5 pF *1 Test Circuit for Switching Time IF Pulse Input VL Input 50% 0 VO = 5 V Input monitor 90% VO monitor Output Rin RL 10% toff 4 Preliminary Data Sheet PN10552EJ01V0DS ton PS7241E-1B TAPING SPECIFICATIONS (in millimeters) 1.55±0.1 2.9 MAX. 7.4±0.1 5.5±0.05 1.5+0.1 –0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS7241E-1B-E3 PS7241E-1B-E4 Outline and Dimensions (Reel) 2.0±0.5 φ 60 +1 –0 R 1.0 φ 180+0 –1.5 2.0±0.5 φ13.0±0.2 φ 21.0±0.8 13.5±1.0 17.5±1.0 Packing: 900 pcs/reel Preliminary Data Sheet PN10552EJ01V0DS 11.9 to 15.4 Outer edge of flange 5 PS7241E-1B 1.55±0.1 2.9 MAX. 12.0±0.2 5.5±0.05 1.5+0.1 –0 7.4±0.1 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 4.6±0.1 2.4±0.1 0.3 8.0±0.1 Tape Direction PS7241E-1B-F4 PS7241E-1B-F3 Outline and Dimensions (Reel) φ 21.0±0.8 φ 100±1.0 R 1.0 φ 13.0±0.2 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 13.5±1.0 17.5±1.0 Packing: 3 500 pcs/reel 6 Preliminary Data Sheet PN10552EJ01V0DS 11.9 to 15.4 Outer edge of flange PS7241E-1B RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Preliminary Data Sheet PN10552EJ01V0DS 7 PS7241E-1B When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. 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"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 8 Preliminary Data Sheet PN10552EJ01V0DS PS7241E-1B Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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