DATA SHEET GaAs INTEGRATED CIRCUIT µPG2156TB L-BAND 4 W SINGLE CONTROL HIGH POWER SPDT SWITCH DESCRIPTION The µPG2156TB is an L-band single control SPDT GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 800 MHz to 2.5 GHz, having the low insertion loss and high linearity. FEATURES • Low insertion loss : LINS = 0.45 dB TYP. @ Vcont = +2.6 V/0 V, f = 1.0 GHz, IN-OUT1 : LINS = 0.35 dB TYP. @ Vcont = +2.6 V/0 V, f = 1.0 GHz, IN-OUT2 : LINS = 0.45 dB TYP. @ Vcont = +2.6 V/0 V, f = 2.0 GHz, IN-OUT1/2 • High power switching : Pin (0.1 dB) = 37 dBm TYP. @ Vcont = +2.6 V/0 V, f = 1.0 GHz, IN-OUT1/2 • 6-pin super minimold package (2.1 × 2.0 × 0.9 mm) APPLICATION • GSM Triple/Quad band digital cellular ORDERING INFORMATION Part Number µPG2156TB-E4 Order Number Package µPG2156TB-E4-A 6-pin super minimold (Pb-Free) Marking G4V Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2156TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10588EJ01V0DS (1st edition) Date Published December 2005 CP(K) Printed in Japan NEC Compound Semiconductor Devices, Ltd. 2005 µPG2156TB PIN CONNECTIONS (Top View) 2 3 G4V 1 (Bottom View) 6 6 1 5 5 2 4 4 3 ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Symbol Ratings Unit Supply Voltage VDD +8.0 V Control Voltage Vcont +8.0 V Input Power Pin +38 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit VDD +2.4 +2.6 +5.0 V Control Voltage (High) Vcont (H) +2.4 +2.6 +5.0 V Control Voltage (Low) Vcont (L) 0 0 +0.2 V Supply Voltage 2 Data Sheet PG10588EJ01V0DS Pin No. Pin Name 1 OUT2 2 GND 3 OUT1 4 VDD 5 IN 6 Vcont µPG2156TB ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = +2.6 V, Vcont = +2.6 V/0 V, ZO = 50 Ω, off chip DC blocking capacitors value: 56 pF, unless otherwise specified) Parameter Insertion Loss Isolation Input Return Loss Output Return Loss 0.1 dB Loss Compression Symbol Test Conditions LINS f = 0.8 to 1.0 GHz ISL RLin RLout Pin (0.1 dB) Input Power 2nd Harmonics 2f0 Pass MIN. TYP. MAX. Unit IN-OUT1 − 0.45 0.65 dB IN-OUT2 − 0.35 0.55 dB f = 1.0 to 2.0 GHz IN-OUT1/2 − 0.45 0.65 dB f = 2.0 to 2.5 GHz IN-OUT1/2 − 0.50 − dB f = 0.8 to 1.0 GHz IN-OUT1/2 21.0 23.0 − dB f = 1.0 to 2.0 GHz IN-OUT1/2 15.5 17.5 − dB f = 2.0 to 2.5 GHz IN-OUT1/2 − 16.0 − dB f = 0.8 to 1.0 GHz IN-OUT1 10 15 − dB IN-OUT2 15 20 − dB f = 1.0 to 2.0 GHz IN-OUT1/2 15 20 − dB f = 2.0 to 2.5 GHz IN-OUT1/2 − 20 − dB f = 0.8 to 1.0 GHz IN-OUT1 10 15 − dB IN-OUT2 15 20 − dB f = 1.0 to 2.0 GHz IN-OUT1/2 15 20 − dB f = 2.0 to 2.5 GHz IN-OUT1/2 − 20 − dB f = 1.0 GHz IN-OUT1/2 35 37 − dBm f = 2.0 GHz IN-OUT1/2 35 37 − dBm f = 1.0 GHz, IN-OUT1/2 65 75 − dBc IN-OUT1/2 65 70 − dBc IN-OUT1/2 65 75 − dBc IN-OUT1/2 65 75 − dBc − 1 5 µs Pin = +35 dBm f = 2.0 GHz, Pin = +33 dBm 3rd Harmonics 3f0 f = 1.0 GHz, Pin = +35 dBm f = 2.0 GHz, Pin = +33 dBm Switching Speed tsw Control Current Icont RF Non − 5 50 µA Supply Current IDD RF Non − 40 200 µA Data Sheet PG10588EJ01V0DS 3 µPG2156TB EVALUATION CIRCUIT Off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board. C2 C1 VDD G4V OUT1 C1 IN Vcont OUT2 C2 C1 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. TRUTH TABLE VDD OUT1 IN GND Vcont 4 OUT2 Vcont IN-OUT1 IN-OUT2 High OFF ON Low ON OFF Data Sheet PG10588EJ01V0DS µPG2156TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 Data Sheet PG10588EJ01V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0±0.2 1.25±0.1 5 µPG2156TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 6 Data Sheet PG10588EJ01V0DS HS350 µPG2156TB When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of December, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PG10588EJ01V0DS 7 µPG2156TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: [email protected] (sales and general) [email protected] (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504