ETC PUMA68S4000M-35

128K x 32 SRAM MODULE
PUMA 68S4000/A - 020/025/35/45
Elm Road, West Chirton, NORTH SHIELDS, Tyne & Wear
NE29 8SE, England Tel.+44 (0191) 2930500 Fax.+44 (0191) 2590997
Description
The PUMA68S4000/A is a 4Mbit CMOS High
Speed Static RAM organised as 128K x 32 in a
JEDEC 68 pin surface mount PLCC, available with
access times of 20, 25, 35, and 45ns. The output
width is user configurable as 8 , 16 or 32 bits using
four Chip Selects (CS1~4).
The device features multiple ground pins for
maximum noise immunity and TTL compatible
inputs and outputs. The PUMA 68S4000/A offers a
dramatic space saving advantage over four
standard 128Kx8 devices.
Issue 4.5 : April 2001
Features
• Fast Access Times of 20 ,25, 35 and 45 ns.
• JEDEC 68 'J' leaded plastic surface mount Substrate
• Industrial or Military Grade.
• Upgradeable footprint.
• User Configurable as 8 / 16 / 32 bit wide output.
• Operating Power
Low Power Standby
(32-BIT)
(TTL)
4.00 W (Max)
1.43 W (Max)
• Fully Static operation.
• Multiple ground pins for maximum noise immunity.
128Kx8
SRAM
128Kx8
SRAM
128Kx8
SRAM
CS1
CS2
CS3
CS4
D0-7
D8-15
D16-23
D24-31
128Kx8
SRAM
VCC
2
A9
3
A10
4
WE
A6
5
CS4
6
CS3
GND
7
8
A4
9
A5
A0-A16
OE
WE
A2
(PUMA 68 S4000A page 2)
A3
(PUMA 68 S4000A page 2)
A1
Pin Definition
NC
A0
Block Diagram
A7
A8
• Single 5V±10% Power supply.
1 68 67 66 65 64 63 62 61
D0
10
60
D16
D1
11
59
D17
D2
12
58
D18
D3
13
57
D19
D4
14
56
D20
D5
15
55
D21
D6
16
54
D22
D7
17
53
D23
GND
18
52
GND
D8
D9
19
FROM
51
D24
20
50
D25
D10
ABOVE
21
49
D11
22
48
D26
D27
PUMA 68S4000
VIEW
D12
23
47
D28
D13
24
46
D29
D14
25
45
D30
D15
26
44
D31
Address Inputs
Data Input/Output
Chip Select
Write Enable
Output Enable
No Connect
Power (+5V)
Ground
NC
NC
GND
NC
NC
NC
NC
CS2
OE
CS1
A15
A16
A14
A13
A12
Pin Functions
A11
VCC
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
A0 - A16
D0 - D31
CS1~4
WE1~4
OE
NC
VCC
GND
Package Details
Plastic 68 J-Leaded JEDEC PLCC
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
PUMA 68 S4000A Pinout and Block Diagram.
A0 ~A16
/OE
/WE4
/WE3
/WE2
/WE1
128K x 8
SRAM
128K x 8
SRAM
128K x 8
SRAM
128K x 8
SRAM
/CS1
/CS2
/CS3
/CS4
NC
A0
A1
A2
A3
A4
A5
/CS3
GND
/CS4
/WE1
A6
A7
A8
A9
A10
VCC
D0~7
D8~15
D16~23
D24~31
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
10
60
11
59
12
58
13
57
14
56
15
16
17
PUMA 68S4000A
VIEW
18
19
20
21
55
54
53
52
FROM
ABOVE
51
50
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
VCC
A11
A12
A13
A14
A15
A16
/CS1
/OE
/CS2
NC
/WE2
/WE3
/WE4
NC
GND
NC
D0
D1
D2
D3
D4
D5
D6
D7
GND
D8
D9
D10
D11
D12
D13
D14
D15
2
D16
D17
D18
D19
D20
D21
D22
D23
GND
D24
D25
D26
D27
D28
D29
D30
D31
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
DC OPERATING CONDITIONS
Absolute Maximum Ratings (1)
Parameter
Symbol
(2)
T
Voltage on any pin relative to VSS
Power Dissipation
Storage Temperature
V
PT
TSTG
Min
Typ
Max
Unit
-0.3
-65
-
7.0
4.0
150
V
W
o
C
Notes : (1) Stresses above those listed may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at those or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temperature
(Commercial)
(Industrial)
(Military)
Symbol
Min
Typ
Max
VCC
VIH
VIL
TA
TAI
TAM
4.5
2.2
-0.3
0
-40
-55
5.0
-
5.5
VCC+0.3
0.8
70
85
125
Unit
V
V
V
o
C
o
C (Suffix I)
o
C (Suffix M)
DC Electrical Characteristics (VCC=5V±10%, TA = -55oC to +125oC)
Parameter
Symbol Test Condition
Input Leakage Current
Output Leakage Current
ILI1
ILO
VIN=0V to VCC
VI/O=0V to VCC
Min Typ
max
Unit
-20
-40
-
20
40
µA
µA
Operating Supply Current(2) 32 bit ICC32
16 bit ICC16
8 bit ICC8
CS(1)=VIL, II/O=0mA, f=fmax
As above.
As above.
-
-
840
540
400
mA
mA
mA
Standby Supply Current
(TTL) ISB
CS(1)=VIH, f=fmax, VIN=VILor VIH
-
-
260
mA
Output Voltage Low
Output Voltage High
VOL
VOH
2.4
-
0.4
-
V
V
IOL = 8.0mA,VCC=Min
IOH = -4.0mA,VCC=Min
Notes: (1) CS1~4 inputs operate simultaneously for 32 bit mode, in pairs for 16 bit mode and singly for 8 bit
mode.
(2) At f=fmax address and data inputs are cycling at max frequency.
3
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
Capacitance (VCC=5V±10%,TA=25oC)
Note: Capacitance calculated, not measured.
Parameter
Symbol
Input Capacitance Address,OE,WE
Output Capacitance 8-bit mode (worst case)
Test Condition
CIN1
CI/O
min
typ
max
Unit
-
-
34
42
pF
pF
VIN =0V
VI/O=0V
AC Test Conditions
Output Load
166Ω
I/O Pin
* Input pulse levels: 0V to 3.0V
1.76V
* Input rise and fall times: 3ns
30pF
* Input and Output timing reference levels: 1.5V
* Output load: see diagram
* VCC=5V±10%
Operation Truth Table
CS1 CS2 CS3 CS4
L
H
H
H
L
H
L
L
H
H
H
L
H
L
X
H
H
L
H
H
L
H
L
H
L
H
H
L
H
L
X
H
H
H
L
H
H
L
L
H
H
L
H
H
L
L
X
H
H
H
H
L
H
L
L
H
H
H
L
H
L
L
X
H
OE
WE
X
X
X
X
X
X
X
L
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
X
SUPPLY CURRENT
ICC8
ICC8
ICC8
ICC8
ICC16
ICC16
ICC32
ICC8
ICC8
ICC8
ICC8
ICC16
ICC16
ICC32
ICC32/ICC16/ICC8
ISB,ISB1
Notes : H = VIH : L =VIL : X = VIH or VIL
4
MODE
Write D0~7
Write D8~15
Write D16~23
Write D24~31
Write D0~15
Write D16~31
Write D0~31
Read D0~7
Read D8~15
Read D16~23
Read D24~31
Read D0~15
Read D16~31
Read D0~31
D0~31 High-Z
D0~31 Standby
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
AC OPERATING CONDITIONS
Read Cycle
-020
Parameter
-025
-35
-45
Symbol
min
max
min
max
min
max
min
max
Unit
Read Cycle Time
Address Access Time
Chip Select Access Time
Output Enable to Output Valid
Output Hold from Address Change
Chip Selection to Output in Low Z
Output Enable to Output in Low Z
tRC
tAA
tACS
tOE
tOH
tCLZ
tOLZ
Chip Deselection to O/P in High Z
Output Disable to Output in High Z
tCHZ
tOHZ
20
3
3
0
0
0
20
20
10
9
8
25
3
3
0
0
0
25
25
12
10
10
35
3
3
0
0
0
35
35
15
12
12
45
3
3
0
0
0
45
45
17
15
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
Write Cycle
-020
Parameter
Write Cycle Time
Chip Selection to End of Write
Address Valid to End of Write
Address Setup Time
Write Pulse Width
Write Recovery Time
Write to Output in High Z
Data to Write Time Overlap
Data Hold from Write Time
Output active from end of write
Symbol
tWC
tCW
tAW
tAS
tWP
tWR
tWHZ
tDW
tDH
tOW
-025
-35
-45
min
max
min
max
min
max
min
max
Unit
20
15
15
0
12
0
0
10
0
3
10
-
25
20
20
0
15
0
0
12
0
3
12
-
35
25
25
0
17
0
0
15
0
3
15
-
45
35
35
0
20
0
0
15
0
3
15
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
Read Cycle Timing Waveform (1,2)
t RC
Address
t AA
OE
t OE
t OH
t OLZ
CS1~4
t ACS
Don’t
care.
t OHZ (3)
t CLZ (4,5)
Dout
Data Valid
t CHZ (3,4,5)
AC Read Characteristics Notes
(1) WE is High for Read Cycle.
(2) All read cycle timing is referenced from the last valid address to the first transition address.
(3) tCHZ and tOHZ are defined as the time at which the outputs achieve open circuit conditions and are not
referenced to output voltage levels.
(4) At any given temperature and voltage condition, tCHZ (max) is less than tCLZ (min) both for a given module
and from module to module.
(5) These parameters are sampled and not 100% tested.
Write Cycle No.1 Timing Waveform(1,4)
tWC
Address
t WR(7)
OE
t AS(6)
t AW
t CW
CS1~4
Don’t
Care
WE
t OHZ(3,9)
t OW
t WP(2)
High-Z
Dout
t DW
Din
High-Z
t DH
Data Valid
6
(8)
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
Write Cycle No.2 Timing Waveform (1,5)
tWC
Address
t AS(6)
t WR(7)
t CW
CS1~4
t AW
t WP(2)
WE
tOH
t WHZ(3,9)
t OW
High-Z
Dout
t DW
Din
(8)
(4)
Don’t
Care
t DH
High-Z
Data Valid
AC Write Characteristics Notes
(1) All write cycle timing is referenced from the last valid address to the first transition address.
(2) All writes occur during the overlap of CS1~4 and WE low.
(3) If OE, CS1~4, and WE are in the Read mode during this period, the I/O pins are low impedance state.
Inputs of opposite phase to the output must not be applied because bus contention can occur.
(4) Dout is the Read data of the new address.
(5) OE is continuously low.
(6) Address is valid prior to or coincident with CS1~4 and WE low, too avoid inadvertant writes.
(7) CS1~4 or WE must be high during address transitions.
(8) When CS1~4 are low : I/O pins are in the output state. Input signals of opposite phase leading to the
output should not be applied.
(9) Defined as the time at which the outputs achieve open circuit conditions and are not referenced to
output voltage levels. These parameters are sampled and not 100% tested.
7
PUMA 68S4000/A - 020/025/35/45
Package Information
ISSUE 4.5 : April 2001
Dimensions in mm(inches)
Plastic 68 Pin JEDEC Surface mount PLCC
25.27 (0.995) sq.
5.08
(0.200) max
25.02 (0.985) sq.
0.10 (0.004)
23.11 (0.910)
0.46
(0.018) typ.
24.13 (0.950)
1.27
(0.050) typ.
0.90 (0.035) typ.
Ordering Information
PUMA 68S4000/AM - 020
Speed
020
025
35
45
=
=
=
=
20ns
25ns
35ns
45ns
Temperature range
Blank
I
M
=
=
=
Commercial Temperature
Industrial Temperature
Military Temperature
/WE Option
Blank
A
=
=
Single/WE
/WE1~4
S4000
=
128K x 32 SRAM
configurable as 256K x 16
and 512K x 8
PUMA 68
=
68 pin "J" Leaded PLCC
Memory Organisation
Package
Note :
Although this data is believed to be accurate the information contained herein is not intended to and does not create any
warranty of merchantibility or fitness for aparticular purpose.
Our products are subject to a constant process of development. Data may be changed without notice.
Products are not authorised for use as critical components in life support devices without the express written approval
of a company director.
8
PUMA 68S4000/A - 020/025/35/45
ISSUE 4.5 : April 2001
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking
as specified below.
If baking is required, devices may be baked for :A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
Temp. exceeding 183OC
Peak Temperature
Time within 5OC of peak
Ramp down
6OC/sec max.
150 secs. max.
225OC
20 secs max.
6OC/sec max.
Vapour Phase -
Ramp up rate
Peak Temperature
Time within 5OC of peak
Ramp down
6OC/sec max.
215 - 219OC
60 secs max.
6OC/sec max.
The above conditions must not be exceeded.
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
9