Page No. : 1/11 RS7300 600mA Adjustable & Fixed Voltage LDO Linear Regulator General Description The RS7300 series is a low‐dropout linear regulator that operates in the input voltage range from +2.4V to +7.0V and delivers 600mA output current. The RS7300 is available in two types, fixed output voltage type and adjustable output voltage type. The fixed output voltage type is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other options 1.0V, 1.2V, 1.5V, 1.8V, 2.0V, 2.85V, 3.0V, 3.3V, 3.6V and 5.0V are available by special order only. The output voltage range of the adjustable type is from 1.25V to 5V. The RS7300 (ADJ type) consists of a 1.25V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection and thermal shutdown protection. The RS7300 (Fixed type) consists of a 0.95V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection and thermal shutdown protection. The RS7300 series devices are available in SOT‐ 223, SOT‐89 and SOT‐23 packages. Features Applications ◎ Operating Voltage Range：+2.4V to +7.0V ◎ Output Voltages：+1.0V to +5.0V (0.1V Step) (Fixed), +1.25V to +5.0V (ADJ Type) ◎ Dropout Voltage：500mV@600mA (Fixed) ◎ Fast Response in Power‐on (Fixed Voltage Only) ◎ Low Current Consumption：60μA (Typ.) ◎ ±2% Output Voltage Accuracy (special ±1% highly accurate), VOUT≧1.8V ◎ Low ESR Capacitor Compatible ◎ High Ripple Rejection：55dB (Typ.) ◎ Output Current Limit Protection：1.0A (Typ.) ◎ Short Circuit Protection：200mA (Typ.) ◎ Thermal Overload Shutdown Protection ◎ SOT‐223, SOT‐89 and SOT‐23 Packages ◎ RoHS Compliant and 100% Lead (Pb)‐Free and Green (Halogen Free with Commercial Standard) ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Battery‐Powered Equipments Graphic Card, Peripheral Card PCMCIA & New Card Mini PCI & PCI‐Express Cards Digital Still Camera CDMA/GSM Cellular Handsets Laptop, Palmtops, Notebook Computers Portable Information Application Application Circuits DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 2/11 This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Pin Assignments SOT‐23 SOT‐89 SOT‐223 PACKAGE SOT‐23 PIN 1 2 3 SYMBOL VIN VOUT GND/ADJ DESCRIPTION Regulator Input Pin Regulator Output Pin Ground Pin or ADJ Pin PIN 1 2 3 SYMBOL GND/ADJ VIN VOUT DESCRIPTION Ground Pin or ADJ Pin Regulator Input Pin Regulator Output Pin PIN 1 2 3 SYMBOL VOUT GND/ADJ VIN DESCRIPTION Regulator Output Pin Ground Pin or ADJ Pin Regulator Input Pin PACKAGE SOT‐89 PACKAGE SOT‐223 Ordering Information DEVICE RS7300‐XX YY Z DEVICE CODE XX is nominal output voltage (for example, AD=ADJ, 15 = 1.5V, 33 = 3.3V, 285 = 2.85V). YY is package designator : N : SOT‐23 M : SOT‐89 SJ : SOT‐223 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 3/11 Block Diagram Absolute Maximum Ratings Parameter Input Voltage VIN to GND Output Current Limit, I(LIMIT) Junction Temperature Thermal Resistance Power Dissipation Symbol VIN ILIMIT TJ SOT‐89 SOT‐223 SOT‐23 SOT‐89 SOT‐223 SOT‐23 Operating Ambient Temperature Storage Temperature Lead Temperature (soldering, 10sec) θJA PD TOPR TSTG ‐ Ratings 9.0 1.0 +155 180 155 260 550 900 400 ‐40 ~ +85 ‐55~+150 +260 Units V A o C o C/W mW o C C o C o NOTES： 1 The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is 100°C. 2 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device reliability. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 4/11 Electrical Characteristics (TA=25°C, VIN=5.0V unless otherwise specified) Symbol VIN Parameter Input Voltage Conditions Min. Typ. Max. Unit ‐ 2.4 ‐ 7.0 V ‐2% +2% V VIN=VOUT+1.0V, IOUT=1mA, VOUT≧1.8V Fixed VIN=VOUT+1.0V, IOUT=1mA, VOUT＜1.8V, Type ‐35 +35 mV VIN＞2.4V VOUT VOUT Output Voltage ‐2% +2% V VIN=VOUT+1.2V, IOUT=1mA, VOUT≧1.8V ADJ VIN=VOUT+1.2V, IOUT=1mA, VOUT＜1.8V, Type ‐50 +50 mV VIN＞2.4V IMAX Output Current (see NOTE) 600 ‐ ‐ mA VOUT+1.0V≦VIN≦7.0V, VOUT≧2.4V IOUT=100mA, VOUT>3.0V ‐ 100 ‐ Dropout Voltage (Fixed Type) mV VDROP IOUT=600mA, VOUT>3.0V ‐ 500 ‐ ‐ 900 ‐ Dropout Voltage (ADJ Type) IOUT=600mA, VOUT>3.0V ‐ 0.2 0.3 VOUT+1.0V≦VIN≦7V, IOUT=1mA (Fixed Type) ΔVLINE Line Regulation %/V ‐ ‐ 0.2 VOUT+1.2V≦VIN≦5V, IOUT=1mA, VIN≧2.8V ΔVLOAD Load Regulation ‐ 0.01 0.02 %/mA VIN=VOUT+1V, 1mA≦IOUT≦600mA IQ Ground Pin Current ILOAD=0mA to 600mA, VIN=VOUT+1.0V ‐ 60 ‐ uA IADJ ADJ Pin Current ILOAD=0mA to 600mA, VIN=VOUT+1.0V ‐ 60 ‐ uA PSRR Ripple Rejection IOUT=30mA, F=1KHz, COUT=3.3uF ‐ 55 ‐ dB eN Output Noise IOUT=100mA , F=1KHz, COUT=3.3uF ‐ 40 ‐ uV(rms) o TSD Thermal Shutdown Temperature ‐ ‐ 150 ‐ C o THYS Thermal Shutdown Hysteresis ‐ ‐ 20 ‐ C NOTE：Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 5/11 Detail Description The RS7300 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output current up to 600mA. Adjustable output voltage and other mask options for special output voltages are also available. As illustrated in function block diagram, it consists of a 1.25V bandgap (Fixed voltage type is 0.95V) reference, an error amplifier, a P‐channel pass transistor and an internal feedback voltage divider. The bandgap reference for adjustable voltage type is connected to the error amplifier, which compares this reference with the feedback voltage and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass transistor gate is pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is too high, the pass transistor gate is pulled up to decrease the output voltage. The output voltage is feed back through an internal resistive divider (or external resistive divider for adjustable output voltage type) connected to VOUT pin. Additional blocks include an output current limiter, thermal sensor, and shutdown logic. Internal P‐channel Pass Transistor The RS7300 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7300 does not suffer from these problems and consumes only 60μA (Typ.) of current consumption under heavy loads as well as in dropout conditions. Output Voltage Selection For fixed voltage type of RS7300, the output voltage is preset at an internally trimmed voltage. The first two digits of part number suffix identify the output voltage (see Ordering Information). For example, the RS7300‐33 has a preset 3.3V output voltage. For adjustable voltage type of RS7300, the output voltage is set by comparing the feedback voltage at adjust terminal to the internal bandgap reference voltage. The reference voltage VREF is 1.25V. The output voltage is given by the equation: VOUT=VREF x (1+R2/R1)+IADJ x R2 Current Limit The RS7300 also includes a fold back current limiter. It monitors and controls the pass transistor’s gate voltage, estimates the output current, and limits the output current within 1.0A. Thermal Overload Protection Thermal overload protection limits total power dissipation in the RS7300. When the junction temperature exceeds TJ=+150°C, a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor on again after the junction temperature cools down by 20°C, resulting in a pulsed output during continuous thermal overload conditions. Thermal overload protection is designed to protect the RS7300 in the event of fault conditions. For continuous operation, the absolute maximum operating junction temperature rating of TJ=+125°C should not be exceeded. Operating Region and Power Dissipation Maximum power dissipation of the RS7300 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P = IOUT x (VIN‐VOUT). The resulting maximum power dissipation is: (TJ − TA) (TJ − TA ) PMAX = = θJC + θCA θJA Where (TJ‐TA) is the temperature difference between the RS7300 die junction and the surrounding air, θJC is the thermal resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN, VOUT, and GND pins. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 6/11 If the RS7300 uses a SOT‐89 package and this package is mounted on a double sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting θJA is 155°C/W. Based on the maximum operating junction temperature 125°C with an ambient of 25°C, the maximum power dissipation will be: PMAX = (TJ − TA) (125 − 25 ) = = 0.65 W θJC + θCA 155 Thermal characteristics were measured using a double sided board with 1”x2” square inches of copper area connected to the GND pin for “heat spreading”. Dropout Voltage A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7300 use a P‐channel MOSFET pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance RDS(ON) multiplied by the load current. VDROPOUT = VIN −VOUT = RDS (ON ) × IOUT DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 7/11 SOT‐23 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 8/11 SOT‐89 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the tab. D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. E. Thermal pad contour optional within these dimensions. F. Falls within JEDEC TO‐243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 9/11 SOT‐223 Dimension NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO‐261 variation AA. DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 10/11 Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Figure 1: Temperature profile tP Critical Zone TL to TP TP Ramp-up TL tL Temperature Tsmax Tsmin tS Preheat 25 Ramp-down t 25oC to Peak Time Profile Feature Average ramp‐up rate (TL to TP) Sn‐Pb Eutectic Assembly o <3 C/sec Preheat Pb‐Free Assembly <3oC/sec ‐ Temperature Min (Tsmin) 100oC 150oC ‐ Temperature Max (Tsmax) 150oC 200oC 60~120 sec 60~180 sec ‐ Time (min to max) (ts) Tsmax to TL ‐ Ramp‐up Rate o <3 C/sec <3 C/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) o 217oC 183 C 60~150 sec Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp‐down Rate Time 25oC to Peak Temperature o o o 60~150 sec 240 C +0/‐5 C 260oC +0/‐5oC 10~30 sec 20~40 sec <6oC/sec <6oC/sec <6 minutes <8 minutes Peak temperature Dipping time 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb‐Free devices. o o 245 C ±5 C o o 260 C +0/‐5 C 5sec ±1sec 5sec ±1sec DS‐RS7300‐14 September, 2009 www.Orister.com Page No. : 11/11 Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. DS‐RS7300‐14 September, 2009 www.Orister.com