SEMTECH SD15C

SD05C THRU SD24C
Single Line TVS Diode for ESD
Protection in Portable Electronics
PRELIMINARY
PROTECTION PRODUCTS
Description
Features
u 350 Watts peak pulse power (tp = 8/20µs)
u Transient protection for data lines to
The SDxxC TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as
cell phones, notebook computers, and PDA’s. They
offer superior electrical characteristics such as lower
clamping voltage and no device degradation when
compared to MLVs. The SDxxC series TVS diodes are
designed to protect sensitive semiconductor components from damage or upset due to electrostatic
discharge (ESD) and other voltage induced transient
events.
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u
The SDxxC is in a SOD-323 package and will protect
one bidirectional line. They are available with working
voltages of 5 - 24 volts. These devices will fit on the
same PCB pad area as an 0805 MLV device. They give
the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it
may be “sprinkled” around the board in applications
where board space is at a premium.
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20µs)
Small package for use in portable electronics
Suitable replacement for MLV’s in ESD protection
applications
Protects one I/O or power line
Low clamping voltage
Working voltages: 5V, 12V, 15V, 24V
Low leakage current
Solid-state silicon avalanche technology
Mechanical Characteristics
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They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge).
EIAJ SOD-323 package
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel per EIA 481
Applications
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Cell Phone Handsets and Accessories
Microprocessor based equipment
Personal Digital Assistants (PDA’s)
Notebooks, Desktops, & Servers
Portable Instrumentation
Pagers
Peripherals
Schematic & PIN Configuration
1
2
SOD-323 (Top View)
Revision 9/2000
1
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SD05C THRU SD24C
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbo l
Value
Units
Peak Pulse Pow er (tp = 8/20µs)
Pp k
350
Watts
Peak Pulse Current (tp = 8/20µs)
I PP
24
A
ESD Voltage (HBM Waveform p er IEC 61000-4-2)
V PP
30
kV
Lead Soldering Temp erature
TL
260 (10 sec.)
°C
Op erating Temp erature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temp erature
Electrical Characteristics
SD05C T VS fo r 5V Line s
Par ame te r
Symbo l
Co nd itio ns
Minimum
Typ ical
Maximum
Units
5
V
Reverse Stand-Off Voltage
V RWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
10
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
9.8
V
Clamp ing Voltage
VC
IPP = 24A, tp = 8/20µs
14.5
V
Junction Cap acitance
Cj
V R = 0V, f = 1MHz
200
pF
Symbo l
Co nd itio ns
Maximum
Units
12
V
6
V
SD12C T VS fo r 12V Line s
Par ame te r
Minimum
Typ ical
Reverse Stand-Off Voltage
V RWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 12V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
19
V
Clamp ing Voltage
VC
IPP = 15A, tp = 8/20µs
24
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
100
pF
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SD05C THRU SD24C
PRELIMINARY
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SD15C T VS fo r 15V Line s
Par ame te r
Symbo l
Co nd itio ns
Minimum
Typ ical
Maximum
Units
15
V
Reverse Stand-Off Voltage
V RWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 15V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
24
V
Clamp ing Voltage
VC
IPP = 12A, tp = 8/20µs
29
V
Junction Cap acitance
Cj
V R = 0V, f = 1MHz
75
pF
Symbo l
Co nd itio ns
Maximum
Units
24
V
16.7
V
SD24C T VS fo r 24V Line s
Par ame te r
Minimum
Typ ical
Reverse Stand-Off Voltage
V RWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 24V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µs
40
V
Clamp ing Voltage
VC
IPP = 8A, tp = 8/20µs
44
V
Junction Cap acitance
Cj
VR = 0V, f = 1MHz
50
pF
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SD05C THRU SD24C
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
100
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
110
1
0.1
90
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
0
1000
25
Pulse Duration - tp (µ s)
Pulse Waveform
75
100
125
150
Clamping Voltage vs. Peak Pulse Current
110
30
90
80
70
e
60
Clamping Voltage - Vc (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
100
Percent of IPP
50
Ambient Temperature - TA (oC)
-t
50
40
td = IPP/2
30
20
10
Waveform
Parameters:
tr = 8µs
td = 20µs
25
SD12C
20
15
SD05C
10
5
0
0
5
10
15
20
25
30
0
Time (µs)
0
5
10
15
20
25
30
Peak Pulse Current -Ipp (A)
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SD05C THRU SD24C
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Device Schematic & Pin Configuration
The SDxxC TVS diodes are designed to protect one
data, I/O, or power supply line. The device is designed
to replace multi-layer varistors (MLVs) in portable
applications. It is easily implemented on existing 0805
MLV pads and is only slightly larger than 0603 MLV
pads. The device is bidirectional and may be used on
lines where the signal polarity is above and below
ground. The device is symmetrical, so there is no
cathode band.
Size Comparison to 0805 MLV
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
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Place the TVS near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the TVS and
the protected line.
The ESD transient return path to ground should
be kept as short as possible.
Place a TVS & decoupling capacitor between
power and ground of components that may be
vulnerable to electrostatic discharges to the
ground plane.
Minimize all conductive loops including power
and ground loops.
Use multilayer boards when possible.
Minimize interconnecting line lengths
Never run critical signals near board edges.
Fill unused portions of the PCB with ground
plane.
SOD-323
Component Placement Comparison
0805 MLV on
0805 Solder Pad
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0805 MLV
Note: Nominal dimensions in inches
5
SOD-323 on 0805
MLV Pad
SOD-323 on Recommended
(SOD-323) Solder Pad
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SD05C THRU SD24C
PROTECTION PRODUCTS
Outline Drawing - SOD-323
Land Pattern - SOD-323
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SD05C THRU SD24C
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
Par t Numbe r
Mar king
Co d e
SD05C
5/5
SD12C
6/6
SD15C
7/7
SD24C
8/8
Ordering Information
P ar t
Numbe r
Wo r king
Vo ltage
Qty p e r
Reel
R e e l Size
SD05C.TC
5V
3,000
7”
SD05C.TG
5V
10,000
13”
SD12C.TC
12V
3,000
7”
SD12C.TG
12V
10,000
13”
SD15C.TC
15V
3,000
7”
SD15C.TG
15V
10,000
13”
SD24C.TC
24V
3,000
7”
SD24C.TG
24V
10,000
13”
Contact Information
Semtech Corporation
Protection Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804
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