TI SE370C736AFZT

TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
D
D
D
D
FZ AND FN PACKAGES
(TOP VIEW)
AN2
AN1
AN0
VSS3
VCC3
VCC1
XTAL1
XTAL2/CLKIN
V CCSTBY
A7
A6
CMOS/ EEPROM/ EPROM Technologies on
a Single Device
– Mask-ROM Devices for High-Volume
Production
– One-Time-Programmable (OTP) EPROM
Devices for Low-Volume Production
– Reprogrammable-EPROM Devices for
Prototyping Purposes
Internal System Memory Configurations
– On-Chip Program Memory Versions
– ROM: 16K Bytes
– EPROM: 16K Bytes
– Data EEPROM: 256 Bytes
– Static RAM: 256 Bytes Usable as
Registers
– Standby RAM With Separate Power
Supply Pin: 256 Bytes
Flexible Operating Features
– Low-Power Modes: STANDBY and HALT
– Commercial, Industrial, and Automotive
Temperature Ranges
– Clock Options
– Divide-by-1 (2 MHz – 5 MHz SYSCLK)
Phase-Locked Loop (PLL)
– Divide-by-4 (0.5 MHz – 5 MHz SYSCLK)
– Supply Voltage (VCC) 5 V ±10%
Programmable Acquisition and Control
Timer (PACT) Module
– Input Capture on up to Six Pins, Four of
Which Can Have a Programmable
Prescaler
– One Input Capture Pin Can Drive an 8-Bit
Event Counter
– Up to Eight Timer-Driven Outputs
– Interaction Between Event Counter and
Timer Activity
– 18 Independent Interrupt Vectors
– Watchdog With Selectable Time-Out
Period
– Asynchronous Mini Serial
Communication Interface (Mini SCI)
Flexible Interrupt Handling
– Two Software-Programmable Interrupt
Levels
– Global- and Individual-Interrupt Masking
– Programmable Rising- or Falling-Edge
Detect
– Individual-Interrupt Vectors
AN3
AN4
AN5
AN6
AN7
D6/CP6
D7/CP5
D4/CP4
D5/CP1
OP1/CP3
OP2/CP2
7
6 5 4 3
2
1 44 43 42 41 40
39
8
38
9
37
10
36
11
35
12
34
13
33
14
32
15
31
16
30
29
17
18 19 20 21 22 23 24 25 26 27 28
A5
A4
A3
A2
A1
A0
MC
RESET
SPICLK
SPISOMI
SPISIMO
V SS1
SCIRXD
SCITXD
OP3
OP4
OP5
OP6
OP7
OP8
D3
INT1
D
D
D
D
D
D
Serial Peripheral Interface (SPI)
– Variable-Length High-Speed Shift
Register
– Synchronous Master / Slave Operation
Eight Channel 8-Bit Analog-to-Digital
Converter 1 (ADC1)
TMS370 Series Compatibility
– Register-to-Register Architecture
– 256 General-Purpose Registers
– 14 Powerful Addressing Modes
– Instructions Upwardly Compatible With
All TMS370 Devices
CMOS/ TTL Compatible I / O Pins / Packages
– All Peripheral Function Pins Software
Configurable for Digital I / O
– 16 Bidirectional Pins, Nine Input Pins
– 44-Pin Plastic and Ceramic Leaded Chip
Carrier (LCC) Packages
Workstation / PC-Based Development
System
– C Compiler and C Source Debugger
– Real-Time In-Circuit Emulation
– Multi-Window User Interface
– Microcontroller Programmer
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
1
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
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Pin Descriptions
44 PINS
NAME
NO.
I / O†
DESCRIPTION
A0
A1
A2
A3
A4
A5
A6
A7
34
35
36
37
38
39
40
41
D3
D4/CP4
D5/CP1
D6/CP6
D7/CP5
27
14
15
12
13
AN0/E0
AN1/E1
AN2/E2
AN3/E3
AN4/E4
AN5/E5
AN6/E6
AN7/E7
4
5
6
7
8
9
10
11
I
Port E can be programmed individually as a general-purpose digital input pin if it is not used as ADC1 analog
input or positive reference input.
INT1
28
I
External interrupt (non-maskable or maskable) / general-purpose input pin
OP1/CP3
OP2/CP2
OP3
OP4
OP5
OP6
OP7
OP8
16
17
21
22
23
24
25
26
O
PACT PWM output 1/input capture 3 (see Note 3)
PACT output pin 2/input capture 2 (see Note 3)
PACT PWM output 3
PACT PWM output 4
PACT PWM output 5
PACT PWM output 6
PACT PWM output 7
PACT PWM output 8
SCIRXD
SCITXD
19
20
I
O
PACT mini SCI data receive input pin
PACT mini SCI data transmit output pin
SPISOMI
SPISIMO
SPICLK
30
29
31
I/O
SPI slave output pin, master input pin / general-purpose bidirectional pin
SPI slave input pin, master output pin / general-purpose bidirectional pin
SPI bidirectional serial clock pin / general-purpose bidirectional pin
RESET
32
I/O
System reset bidirectional pin; as input pin, RESET initializes the microcontroller; as open-drain output,
RESET indicates that an internal failure was detected by watchdog or oscillator fault circuit.
MC
33
I
Mode control input pin; enables EEPROM write protection override (WPO) mode, also EPROM VPP
XTAL2 / CLKIN
XTAL1
43
44
I
O
Internal oscillator crystal input / External clock source input
Internal oscillator output for crystal
I/O
Port A is a general-purpose bidirectional I / O port.
I/O
Port D is a general-purpose bidirectional port. Also configurable as SYSCLK (see Note 1)
PACT input capture 4 (see Note 2)
PACT input capture 1 (see Note 2)
PACT input capture 6 (see Note 2)
PACT input capture 5 (see Note 2)
ADC1 analog input pins (AN0 – AN7) / port E digital input pins (E0 – E7)
VCC1
1
Positive supply voltage for digital logic and digital I/O pins
VSS1
18
Ground reference for digital logic and digital I/O pins
VCC3
2
ADC1 positive supply voltage and optional positive reference input
VSS3
3
ADC1 ground supply and low reference input pin
VCCSTBY
42
Positive supply voltage pin for standby RAM
† I = input, O = output
NOTES: 1. D3 can be configured as SYSCLK by appropriately programming the DPORT1 and DPORT2 registers.
2. These digital I/O buffers are connected internally to some of the PACT module’s input capture pins. This allows the microcontroller
to read the level on the input capture pin, or if the port D pin is configured as an output, to generate a capture. Be careful to leave
the port D pin configured as an input if the corresponding input capture pin is being driven by external circuitry.
3. CP2 and CP3 are connected internally to OP2 and OP1. CP2 and CP3 can be used only to capture OP2 and OP1, respectively and
not as external capture inputs.
2
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
functional block diagram
INT1
Interrupts
VCCSTBY
XTAL2/
XTAL1 CLKIN
MC
Clock Options:
Divide-By-4 or
Divide-By-1 (PLL)
Standby RAM
256 Bytes
E0-E7
or
AN0-AN7
RESET
ÏÏÏÏÏ
ÏÏÏÏÏ
ÁÁÁÁÁ
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128 BYTES
Dual Port
RAM
Port D
8
SPISOMI
SPISIMO
SPICLK
CPU
.
.
Data EEPROM
256 Bytes
Port A
VSS3
Serial
Peripheral
Interface
RAM
Register File
256 Bytes
Program Memory
ROM: 16K Bytes
EPROM: 16K Bytes
VCC3
A-to-D
Converter 1
System
Control
5
CP1
CP6
PACT
.
.
OP1
OP8
Mini SCI
SCITXD
SCIRXD
Watchdog
V CC1
V SS1
description
The TMS370C036, TMS370C736, and SE370C736 devices are members of the TMS370 family of single-chip
8-bit microcontrollers. Unless otherwise noted, the term TMS370Cx36 refers to these devices. The TMS370
family provides cost-effective real-time system control through advanced peripheral-function modules and
various on-chip memory configurations.
The TMS370Cx36 family of devices uses high-performance silicon-gate CMOS EPROM and EEPROM
technologies. Low operating power, wide operating temperature range, and noise immunity of CMOS
technology coupled with the high performance and extensive on-chip peripheral functions make the
TMS370Cx36 devices attractive for system designs for automotive electronics, industrial motors, computer
peripheral controls, telecommunications, and consumer applications.
All TMS370Cx36 devices contain the following on-chip peripheral modules:
D
D
D
Programmable acquisition and control timer (PACT)
–
Asynchronous mini SCI
–
PACT watchdog timer
Serial peripheral interface (SPI)
Eight channel, 8-bit analog-to-digital converter 1 (ADC1)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
3
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
description (continued)
Table 1 provides a memory configuration overview of the TMS370Cx36 devices.
Table 1. Memory Configurations
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PROGRAM MEMORY
(BYTES)
ROM
EPROM
DEVICE
DATA MEMORY
(BYTES)
RAM
EEPROM
44 PIN PACKAGES
TMS370C036A
16K
—
512
256
FN – PLCC
TMS370C736A
SE370C736A†
—
16K
512
256
FN – PLCC
—
16K
512
256
FZ – CLCC
† System evaluators and development are for use only in prototype environment, and their reliability has not been characterized.
The suffix letter A appended to the device names in Table 1 indicates the configuration of the devices. ROM
or EPROM devices have different configurations as indicated in Table 2. ROM devices with the suffix letter A
are configured through a programmable contact during manufacture.
Table 2. Suffix Letter Configuration
DEVICE‡
CLOCK
EPROM A
Divide-by-4 (Standard oscillator)
Enabled
ROM A
Divide by 4 or Divide-by-1
Divide by 1 (PLL)
Divide-by-4
Enabled or disabled
LOW-POWER MODE
‡ Refer to the “device numbering conventions” section for device nomenclature and to the “device part numbers” section for ordering.
The 16K bytes of mask-programmable ROM in the associated TMS370Cx36 devices are replaced in the
TMS370C736 with 16K bytes of EPROM. All other available memory and on-chip peripherals are identical. The
OTP (TMS370C736) and reprogrammable (SE370C736) devices are available.
The TMS370C736 OTP device is available in a plastic package. This microcontroller is effective to use for
immediate production updates for other members of the TMS370Cx36 family or for low-volume production runs
when the mask charge or cycle time for the low-cost mask ROM devices is not practical.
The SE370C736 has a windowed ceramic package to allow reprogramming of the program EPROM memory
during the development / prototyping phase of design. The SE370C736 device allows quick updates to
breadboards and prototype systems while iterating initial designs.
The TMS370Cx36 family provides two low-power modes (STANDBY and HALT) for applications where
low-power consumption is critical. Both modes stop all CPU activity (that is, no instructions are executed). In
the STANDBY mode, the internal oscillator, the PACT counter, and PACT’s first command / definition entry
remain active. This allows the PACT module to bring the device out of STANDBY mode. In the HALT mode, all
device activity is stopped. The device retains all RAM data and peripheral configuration bits throughout both
low-power modes.
The TMS370Cx36 features advanced register-to-register architecture that allows direct arithmetic and logical
operations without requiring an accumulator (for example, ADD R24, R47; add the contents of register 24 to
the contents of register 47 and store the result in register 47). The TMS370Cx36 family is fully
instruction-set-compatible, providing easy transition between members of the family.
The TMS370Cx36 has a PACT module that acts as a timer coprocessor by gathering timing information on input
signals and controlling output signals with little or no intervention by the CPU. The coprocessor nature of this
module allows for levels of flexibility and power not found in traditional microcontroller timers.
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
description (continued)
The TMS370Cx36 family provides the system designer with an economical, efficient solution to real-time control
applications. The PACT compact development tool (CDT) meets the challenge of efficiently developing the
software and hardware required to design the TMS370Cx36 into an ever-increasing number of complex
applications. The application source code can be written in assembly and C language, and the output code can
be generated by the linker. Precise real-time in-circuit emulation and extensive symbolic debug and analysis
tools ensure efficient software and hardware implementation as well as a reduced time-to-market cycle.
The TMS370Cx36 family together with the TMS370 PACT CDT370, BP programmer, software tools,
SE370C736 reprogrammable devices, comprehensive product documentation, and customer support provides
a complete solution to the needs of the system designer.
central processing unit (CPU)
The CPU on the TMS370Cx36 device is the high-performance 8-bit TMS370 CPU module. The ’x36 implements
an efficient register-to-register architecture that eliminates the conventional accumulator bottleneck. The
complete ’x36 instruction map is shown in Table 16.
The ’370Cx36 CPU architecture provides the following components:
CPU registers:
D
D
D
A stack pointer (SP) that points to the last entry in the memory stack
A status register (ST) that monitors the operation of the instructions and contains the global interrupt-enable
bits
A program counter (PC) that points to the memory location of the next instruction to be executed
A memory map that includes:
D
D
D
D
D
D
256-byte general-purpose RAM that can be used for data memory storage, program instructions, general
purpose register, or the stack
256-byte general-purpose standby RAM, which is powered through a separate VCCSTBY pin to protect the
memory against power failures on the main VCC1 pins
128-byte dual-port RAM that contains the capture registers, the circular buffer, and a command/definition
area
A peripheral file that provides access to all internal peripheral modules, system-wide control functions, and
EEPROM/ EPROM programming control
256-byte EEPROM module, that provides in-circuit programmability and data retention in power-off
conditions
16K-byte ROM or 16K-byte EPROM
CDT is a trademark of Texas Instruments Incorporated.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
5
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
Figure 1 Illustrates the CPU registers and memory blocks.
Program Counter
15
Stack Pointer (SP)
7
Legend:
C=Carry
N=Negative
Z=Zero
0
Status Register (ST)
C
N
Z
V
7
6
5
4
IE2 IE1
3
2
1
V=Overflow
IE2=Level 2 interrupts Enable
IE1=Level 1 interrupts Enable
0
RAM (Includes up to 256-Byte Registers File)
0000h
R0(A)
0001h
R1(B)
0002h
R2
0003h
R3
0
256-Byte RAM
Reserved†
128-Byte PACT Dual-Port RAM
256-Byte Standby RAM
Reserved†
Peripheral File
Reserved†
007Fh
R127
256-Byte Data EEPROM
Reserved†
0000h
00FFh
0100h
017Fh
0180h
01FFh
0200h
02FFh
0300h
0FFFh
1000h
10BFh
10C0h
1EFFh
1F00h
1FFFh
2000h
3FFFh
4000h
16K-Byte ROM/EPROM
Interrupts and Reset Vectors;
Trap Vectors
R255
00FFh
Reserved†
7F9Bh
7F9Ch
7FFFh
8000h
FFFFh
† Reserved means the address space is reserved for future expansion.
Figure 1. Programmer’s Model
stack pointer (SP)
The SP is an 8-bit CPU register. Stack operates as a last-in, first-out, read / write memory. Typically, the stack
is used to store the return address on subroutine calls as well as the ST contents during interrupt sequences.
The SP points to the last entry or top of the stack. The SP is incremented automatically before data is pushed
onto the stack and decremented after data is popped from the stack. The stack can be placed anywhere in the
on-chip RAM.
status register (ST)
The ST monitors the operation of the instructions and contains the global interrupt-enable bits. The ST includes
four status bits (condition flags) and two interrupt-enable bits.
D
D
6
The four status bits indicate the outcome of the previous instruction; conditional instructions (for example,
the conditional-jump instructions) use the status bits to determine program flow.
The two interrupt-enable bits control the two interrupt levels.
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
The ST, status-bit notation, and status-bit definitions are shown in Table 3.
Table 3. Status Registers
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ÁÁÁÁÁ
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ÁÁÁÁÁ
ÁÁÁÁÁ
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ÁÁÁÁÁ
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ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
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ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
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ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁ
7
6
5
4
3
2
1
0
C
N
Z
V
IE2
IE1
Reserved
Reserved
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
R = read, W = write, 0 = value after reset
program counter (PC)
The contents of the PC point to the memory location of the next instruction to be executed. The PC consists
of two 8-bit registers in the CPU: the program counter high (PCH) and program counter low (PCL). These
registers contain the most significant byte (MSbyte) and least significant byte (LSbyte) of a 16-bit address.
During reset, the contents of the reset vector (7FFEh, 7FFFh) are loaded into the PC. The PCH (MSbyte of the
PC) is loaded with the contents of memory location 7FFEh, and the PCL (LSbyte of the PC) is loaded with the
contents of memory location 7FFFh. Figure 2 shows this operation using an example value of 4000h as the
contents of the reset vector.
Program Counter (PC)
Memory
0000h
7FFEh
40
7FFFh
00
PCH
PCL
40
00
Figure 2. Program Counter After Reset
memory map
The TMS370Cx36 architecture is based on the Von Neuman architecture, where the program memory and data
memory share a common address space. All peripheral input / output is memory mapped in this same common
address space. As shown in Figure 3, the TMS370Cx36 provides memory-mapped RAM, ROM, EPROM, data
EEPROM, I / O pins, peripheral functions, and system-interrupt vectors.
The peripheral file contains all I / O port control, peripheral status and control, EEPROM, EPROM, and
system-wide control functions. The peripheral file is located between 1000h to 107Fh and is divided logically
into eight peripheral file frames of 16 bytes each. The eight PF frames consist of five control frames and three
reserved frames.Each on-chip peripheral is assigned to a separate frame through which peripheral control and
data information are passed.
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7
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
central processing unit (CPU) (continued)
Peripheral File Control Registers
Reserved†
1000h – 100Fh
System Control
1010h – 101Fh
Digital Port Control
1020h – 102Fh
Reserved†
SPI Peripheral Control
1030h – 103Fh
128-Byte PACT Dual-Port RAM
PACT Peripheral Control
1040h – 104Fh
0000h
256-Byte RAM
00FFh
0100h
017Fh
0180h
01FFh
0200h
02FFh
0300h
Reserved†
1050h – 105Fh
Reserved†
1060h – 106Fh
Reserved†
ADC1 Peripheral Control
1070h – 107Fh
Peripheral File
Vectors
256-Byte PACT Standby RAM
0FFFh
1000h
10BFh
10C0h
PACT Interrupt 1-18
7F9Ch – 7FBFh
Trap 15 – 0
7FC0h – 7FDFh
Reserved†
7FE0h – 7FEBh
Reserved†
1EFFh
1F00h
1FFFh
2000h
3FFFh
4000h
7F9Bh
7F9Ch
7FFFh
8000h
256-Byte Data EEPROM
ADC1
7FECh –7FEDh
Reserved†
7FEEh – 7FF5h
Serial Peripheral Interface
7FF6h – 7FF7h
Reserved†
7FF8h – 7FFBh
Interrupt 1
7FFCh – 7FFDh
Reset
7FFEh – 7FFFh
Reserved†
16K-Byte ROM/EPROM
Interrupts and Reset Vectors;
Trap and PACT Vectors
Reserved†
FFFFh
† Reserved means that the address space is reserved for future expansion.
Figure 3. TMS370Cx36 Memory Map
RAM/ register file (RF)
Locations within the RAM address space can serve as the RF, general-purpose read / write memory, program
memory, or the stack instructions. The TMS370Cx36 devices contain 256 bytes of internal RAM,
memory-mapped beginning at location 0000h (R0) and continuing through location 00FFh (R255) which is
shown in Figure 1.
The first two registers, R0 and R1, are also called register A and B, respectively. Some instructions implicitly
use register A or B; for example, the instruction LDSP (load SP) assumes that the value to be loaded into the
stack pointer is contained in register B. Registers A and B are the only registers cleared on reset.
dual-port RAM
The upper 128 bytes of the register files can be used by the PACT module to contain commands and definitions
as well as timer values. Any RAM not used by PACT can be used as an additional CPU register or as
general-purpose memory.
8
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
standby RAM module
The 256 byte standby RAM is general-purpose and powered through a separate VCCSTBY pin. The data stored
in this memory is protected against power failures on the main VCC1 pins.
The standby RAM data is saved if the power failure on the main VCC1 pins is detected externally and an external
reset is generated when VCC1 falls below 4.3 V (see Figure 4). The external reset must remain low during the
entire power failures. The falling edge of the reset signal is internally detected to set the standby RAM in
low-power HALT mode. After the next power up, the RESET pin must be pulled high to get out of the HALT mode
of the standby RAM. In halt mode, the standby RAM consumes only leakage current.
4.3 Volt
VCC1
RESET
Standby RAM Locked in Halt Mode
Figure 4. Standby RAM Locked in Halt Mode
peripheral file (PF)
The TMS370Cx36 control registers contain all the registers necessary to operate the system and peripheral
modules on the device. The instruction set includes some instructions that access the PF directly. These
instructions designate the register by the number of the PF relative to 1000h, preceded by P0 for a hexadecimal
designator or P for a decimal designator. For example, the system-control register 0 (SCCR0) is located at
address 1010h; its peripheral file hexadecimal designator is P010, and its decimal designator is P16. Table 4
lists the TMS370Cx36 PF address map.
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Table 4. TMS370Cx36 Peripheral File Address Map
ADDRESS RANGE
PERIPHERAL FILE
DESIGNATOR
1000h – 100Fh
P000 – P00F
Reserved
1010h – 101Fh
P010 – P01F
System and EPROM / EEPROM control registers
1020h – 102Fh
P020 – P02F
Digital I / O port control registers
1030h – 103Fh
P030 – P03F
SPI registers
1040h – 104Fh
P040 – P04F
PACT registers
1050h – 106Fh
P050 – P06F
Reserved
1070h – 107Fh
P070 – P07F
Analog-to-digital converter 1 registers
1080h – 10FFh
P080 – P0FF
Reserved
DESCRIPTION
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9
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
data EEPROM
The TMS370Cx36 devices, containing 256 bytes of data EEPROM, have a memory mapped beginning at
location 1F00h and continuing through location 1FFFh. Writing to the data EEPROM module is controlled by
the data EEPROM control register (DEECTL) and the write-protection register (WPR). Programming algorithm
examples are available in the TMS370 Family User’s Guide (literature number SPNU127) or the
TMS370 Family Data Manual (literature number SPNS014B). The data EEPROM features include the following:
D
D
D
Programming:
–
Bit-, byte-, and block-write / erase modes.
–
Internal charge pump circuitry. No external EEPROM programming voltage supply is needed.
–
Control register: Data EEPROM programming is controlled by the DEECTL located in the PF frame
beginning at location P01A. See Table 5.
–
In-circuit programming capability. There is no need to remove the device to program.
Write protection. Writes to the data EEPROM are disabled during the following conditions.
–
Reset. All programming of the data EEPROM module is halted.
–
Write protection active. There is one write-protect bit per 32-byte EEPROM block.
–
Low-power mode operation
Write protection can be overridden by applying 12 V to MC.
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ÁÁÁÁÁÁÁÁÁÁÁÁÁ
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Table 5. Data EEPROM and PROGRAM EPROM Control Registers Memory Map
ADDRESS
SYMBOL
P01A
DEECTL
P01B
—
P01C
EPCTLL
NAME
Data EEPROM Control Register
Reserved
Program EPROM Control Register – Low Array
program EPROM†
The TMS370C736 device contains 16K bytes of EPROM mapped, beginning at location 4 000h and continuing
through location 7FFFh as shown in Figure 3. Reading the program EPROM modules is identical to reading
other internal memory. During programming, the EPROM is controlled by the EPROM control register
(EPCTLL). The program EPROM module features include:
D
D
Programming
–
In-circuit programming capability if VPP is applied to MC
–
Control register: EPROM programming is controlled by the EPROM control register (EPCTLL) located
in the peripheral file (PF) frame at location P01C as shown in Table 5.
Write protection: Writes to the program EPROM are disabled under the following conditions:
–
Reset: All programming to the EPROM module is halted
–
Low-power modes
–
13 V not applied to MC
† Memory addresses 7FE0h through 7FEBh are reserved for Texas Instruments (TI), and addresses 7FECh through 7FFFh are reserved
for interrupt and reset vectors. Trap vectors, used with TRAP0 through TRAP15 instructions, are located between addresses 7FC0h and
7FDFh.
TI is a trademark of Texas Instruments Incorporated.
10
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
program ROM†
The program ROM consists of 16K bytes of mask programmable read-only memory. The program ROM is used
for permanent storage of data or instructions. Programming of the mask ROM is performed at the time of device
fabrication. Refer to Figure 3 for ROM memory map.
system reset
The system-reset operation ensures an orderly start-up sequence for the TMS370Cx36 CPU-based device.
There are up to three different actions that can cause a system reset to the device. Two of these actions are
generated internally, while one (RESET pin) is controlled externally. These actions are as follows:
D
D
D
PACT watchdog (WD) timer. A watchdog-generated reset occurs if an improper value is written to the WD
key register, or if the re-initialization does not occur before the watchdog timer timeout . See the TMS370
User’s Guide (literature number SPNU127) for more information.
Oscillator reset. Reset occurs when the oscillator operates outside of the recommended operating range.
See the TMS370 User’s Guide (literature number SPNU127) for more information.
External RESET pin. A low level signal can trigger an external reset. To ensure a reset, the external signal
should be held low for one SYSCLK cycle. Signals of less than one SYSCLK can generate a reset. See the
TMS370 User’s Guide (literature number SPNU127) for more information.
Once a reset source is activated, the external RESET pin is driven (active) low for a minimum of eight SYSCLK
cycles. This allows the ’x36 device to reset external system components. Additionally, if a cold start (VCC is off
for several hundred milliseconds) condition or oscillator failure occurs or the RESET pin is held low, then the
reset logic holds the device in a reset state for as long as these actions are active.
After a reset, the program can check the oscillator-fault flag (OSC FLT FLAG, SCCR0.4) and the cold-start flag
(COLD START, SCCR0.7) to determine the source of the reset. A reset does not clear these flags.Table 6 lists
the reset sources. If none of the sources indicated in Table 6 caused the reset, then the RESET pin was pulled
low by the external hardware or the PACT module’s watchdog.
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Table 6. Reset Sources
ADDRESS
PF
BIT NO.
SCCR0
REGISTER
1010h
P010
7
COLD START
CONTROL BIT
Cold (power-up)
SOURCE OF RESET
SCCR0
1010h
P010
4
OSC FLT FLAG
Oscillator out of range
Once a reset is activated, the following sequence of events occurs:
1. The CPU registers are initialized: ST = 00h, SP = 01h (reset state).
2. Registers A and B are initialized to 00h (no other RAM is changed).
3. The contents of the LSbyte of the reset vector (07FFh) are read and stored in the PCL.
4. The contents of the MSbyte of the reset vector (07FEh) are read and stored in the PCH.
5. Program execution begins with an opcode fetch from the address pointed to the PC.
The reset sequence takes 20 SYSCLK cycles from the time the reset pulse is released until the first opcode
fetch. During a reset, RAM contents (except for registers A and B) remain unchanged, and the module control
register bits are initialized to their reset state.
† Memory addresses 7FE0h through 7FEBh are reserved for Texas Instruments, and addresses 7FECh through 7FFFh are reserved for
interrupt and reset vectors. Trap vectors, used with TRAP0 through TRAP15 instructions, are located between addresses 7FC0h and
7FDFh.
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11
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts
The TMS370 family software-programmable interrupt structure permits flexible on-chip and external interrupt
configurations to meet real-time interrupt-driven application requirements. The hardware interrupt structure
incorporates two priority levels as shown in Figure 5. Interrupt level 1 has a higher priority than interrupt
level 2. The two priority levels can be masked independently by the global interrupt mask bits (IE1 and IE2) of
the ST.
PACT
GROUP 3
GROUP 2
GROUP 1
Default Timer
Overflow
Cmd/Def Entry 7
Cmd/Def Entry 6
CP1 Edge
Cmd/Def Entry 5
CP2 Edge
Cmd/Def Entry 4
CP3 Edge
Cmd/Def Entry 3
CP4 Edge
Cmd/Def Entry 2
CP5 Edge
Cmd/Def Entry 1
SCI TXINT
Cmd/Def Entry 0
SCI RXINT
Circular Buffer
PACT 2 PRI
PACT 3 PRI
AD INT
ADC1
CP6 Edge
PACT 1 PRI
SPI INT
EXT INT1
CPU
INT1
SPI
NMI
AD PRI
SPI PRI
INT1 PRI
Priority
Logic
STATUS REG
IE1
IE2
Level 1 INT
Level 2 INT
Enable
Figure 5. Interrupt Control
Each system interrupt is configured independently to either the high- or low-priority chain by the application
program during system initialization. Within each interrupt chain, the interrupt priority is fixed by the position of
the system interrupt. However, since each system interrupt is selectively configured on either the high- or
low-priority-interrupt chain, the application program can elevate any system interrupt to the highest priority.
Arbitration between the two priority levels is performed within the CPU. Arbitration within each of the priority
12
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts (continued)
chains is performed within the peripheral modules to support interrupt expansion for future modules. Pending
interrupts are serviced upon completion of current instruction execution, depending on their interrupt mask and
priority conditions.
The TMS370Cx36 has 21 hardware system interrupts (plus RESET) as shown in Table 7. Each system interrupt
has a dedicated vector located in program memory through which control is passed to the interrupt service
routines. A system interrupt may have multiple interrupt sources. All of the interrupt sources are individually
maskable by local interrupt enable control bits in the associated peripheral file. Each interrupt source FLAG bit
is individually readable for software polling or for determining which interrupt source generated the associated
system interrupt.
Twenty of the system interrupts are generated by on-chip peripheral functions, and one external interrupt is
supported. Software configuration of the external interrupts is performed through the INT1 control register in
peripheral file frame 1. Each external interrupt is individually software configurable for input polarity (rising or
falling edge) for ease of system interface. External interrupt INT1 is software configurable as either a maskable
or non-maskable interrupt. When INT1 is configured as non-maskable, it cannot be masked by the individualor global-enable mask bits. The INT1 NMI bit is protected during non-privileged operation and, therefore, should
be configured during the initialization sequence following reset. To maximize pin flexibility, external interrupt
INT1 can be software configured as a general-purpose input pin if the interrupt function is not required.
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13
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
interrupts (continued)
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Table 7. Hardware System Interrupts
INTERRUPT
SOURCE
INTERRUPT
FLAG
OSC FLT FLG
SYSTEM
INTERRUPT
VECTOR
ADDRESS
MODULE
PRIORITY†
RESET†
7FFEh, 7FFFh
1
PRIORITY
IN
GROUP
RESET
External RESET
Watchdog Overflow
Oscillator Fault
COLD START
(No Flag)
OSC FLT FLAG
INT1
External Interrupt 1
INT1 FLAG
INT1‡
7FFCh, 7FFDh
2
SPI
SPI RX/TX Complete
SPI INT FLAG
SPIINT
7FF6h, 7FF7h
3
PACT Circular Buffer
Buffer Half/Full
Interrupt Flag
BUFINT
7FB0h, 7FB1h
1
PACT CP6 Event
CP6 INT FLAG
CP6INT
7FB2h, 7FB3h
2
PACT CP5 Event
CP5 INT FLAG
CP5INT
7FB4h, 7FB5h
3
PACT CP4 Event
CP4 INT FLAG
CP4INT
7FB6h, 7FB7h
PACT CP3 Event
CP3 INT FLAG
CP3INT
7FB8h, 7FB9h
PACT CP2 Event
CP2 INT FLAG
CP2INT
7FBAh, 7FBBh
6
PACT CP1 Event
CP1 INT FLAG
CP1INT
7FBCh, 7FBDh
7
Default Timer
Overflow
DEFTIM OVRFL INT
FLAG
POVRL
INT
7FBEh, 7FBFh
8
PACT SCI Rx Int
PACT RX RDY
PRXINT
7F9Eh, 7F9Fh
PACT SCI Tx Int
PACT TX RDY
PTXINT
7F9Ch, 7F9Dh
PACT Cmd/Def Entry 0
CMD/DEF INT 0 FLAG
CDINT 0
7FA0h, 7FA1h
1
PACT Cmd/Def Entry 1
CMD/DEF INT 1 FLAG
CDINT 1
7FA2h, 7FA3h
2
PACT Cmd/Def Entry 2
CMD/DEF INT 2 FLAG
CDINT 2
7FA4h, 7FA5h
3
PACT Cmd/Def Entry 3
CMD/DEF INT 3 FLAG
CDINT 3
7FA6h, 7FA7h
PACT Cmd/Def Entry 4
CMD/DEF INT 4 FLAG
CDINT 4
7FA8h, 7FA9h
PACT Cmd/Def Entry 5
CMD/DEF INT 5 FLAG
CDINT 5
7FAAh, 7FABh
6
PACT Cmd/Def Entry 6
CMD/DEF INT 6 FLAG
CDINT 6
7FACh, 7FADh
7
PACT Cmd/Def Entry 7
CMD/DEF INT 7 FLAG
CDINT 7
7FAEh, 7FAFh
ADINT
7FECh, 7FEDh
PACT (Group 1)
PACT (Group 2)
PACT (Group 3)
ADC1
ADC1 Conversion Complete
AD INT FLAG
† Relative priority within an interrupt level
‡ Release microcontroller from STANDBY and HALT low-power modes
4
5
6
4
5
1
2
4
5
8
7
privileged operation and EEPROM write protection override
The TMS370Cx36 family is designed with significant flexibility to enable the designer to software-configure the
system and peripherals to meet the requirements of a variety of applications. The nonprivileged mode of
operation ensures the integrity of the system configuration, once it is defined for an application. Following a
hardware reset, the TMS370Cx36 operates in the privileged mode, where all peripheral file registers have
unrestricted read / write access, and the application program configures the system during the initialization
sequence following reset. As the last step of system initialization, the PRIVILEGE DISABLE bit (SCCR2.0) is
set to 1 to enter the nonprivileged mode, disabling write operations to specific configuration-control bits within
the PF. Table 8 lists the control bits shown in the table which are write-protected during the nonprivileged mode
and must be configured by software prior to exiting the privileged mode.
14
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
privileged operation and EEPROM write protection override (continued)
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Table 8. Privilege Bits
REGISTER†
NAME
LOCATION
CONTROL BIT
SCCRO
P010.5
P010.6
PF AUTO WAIT
OSC POWER
SCCR1
P011.2
P011.4
MEMORY DISABLE
AUTOWAIT DISABLE
SCCR2
P012.0
P012.1
P012.3
P012.4
P012.6
P012.7
PRIVILEGE DISABLE
INT1 NMI
CPU STEST
BUS STEST
PWRDWN / IDLE
HALT / STANDBY
SPIPRI
P03F.5
P03F.6
P03F.7
SPI ESPEN
SPI PRIORITY
SPI STEST
PACTSCR
P040.0
P040.1
P040.2
P040.3
P040.4
PACT PRESCALE SELECT 0
PACT PRESCALE SELECT 1
PACT PRESCALE SELECT 2
PACT PRESCALE SELECT 3
FAST MODE SELECT
PACTPRI
P04F.0
P04F.1
P04F.2
P04F.3
P04F.4
P04F.5
P04F.7
PACT WD PRESCALE SELECT 0
PACT WD PRESCALE SELECT 1
PACT MODE SELECT
PACT GROUP 3 PRIORITY
PACT GROUP 2 PRIORITY
PACT GROUP 1 PRIORITY
PACT STEST
ADPRI
P07F.5
P07F.6
P07F.7
AD ESPEN
AD PRIORITY
AD STEST
† The privilege bits are shown in a bold typeface and shaded areas in the
system configuration registers section of Table 10.
low-power and IDLE modes
The TMS370Cx36 devices have two low-power modes (STANDBY and HALT) and an IDLE mode. For
mask-ROM devices, low-power modes can be disabled permanently through a programmable contact when
the mask is manufactured.
The STANDBY and HALT low-power modes significantly reduce power consumption by reducing or stopping
the activity of the various on-chip peripherals when processing is not required. Each of the low-power modes
is entered by executing the IDLE instruction when the PWRDWN / IDLE bit in SCCR2 has been set to 1. The
HALT / STANDBY bit in SCCR2 controls the low-power mode selection.
In the STANDBY mode (HALT / STANDBY = 0), all CPU activity and most peripheral module activity is stopped;
however, the oscillator, internal clocks, the PACT counter, and the first PACT command entry remain active in
all modules. System processing is suspended until a qualified interrupt (hardware RESET or external interrupt
on INT1) is detected.
In the HALT mode (HALT / STANDBY = 1), the TMS370Cx36 is placed in its lowest power consumption mode.
The oscillator and internal clocks are stopped, causing all internal activity to be halted. System activity is
suspended until a qualified interrupt (hardware RESET or external interrupt on the INT1) is detected. The
power-down mode-selection bits are summarized in Table 9.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
15
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
low-power and IDLE modes (continued)
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Table 9. Low-Power / Idle Control Bits
POWER-DOWN CONTROL BITS
MODE SELECTED
PWRDWN / IDLE
(SCCR2.6)
HALT / STANDBY
(SCCR2.7)
1
0
STANDBY
1
1
HALT
0
X†
IDLE
† X = Don’t care
When low-power modes are disabled through a programmable contact in the mask-ROM devices, writing to the
SCCR2.6-7 bits is ignored. In addition, if an IDLE instruction is executed when low-power modes are disabled
through a programmable contact, the device always enters the IDLE mode.
To provide a method for always exiting low-power modes for mask-ROM devices, INT1 is enabled automatically
as a nonmaskable interrupt (NMI) during low-power modes when the hard watchdog mode is selected. This
means that the NMI is generated always, regardless of the interrupt enable flags.
The following information is preserved throughout both the STANDBY and HALT modes: RAM (register file),
CPU registers (SP, PC, and ST), I / O pin direction and output data, and status registers of all on-chip peripheral
functions. Since all CPU instruction processing is stopped during the STANDBY and HALT modes, the clocking
of the WD timer is inhibited.
clock modules
The ’x36 family provides two clock options that are referred to as divide-by-1 (phase-locked loop) and
divide-by-4 (standard oscillator). Both the divide-by-1 and divide-by-4 options are configurable during the
manufacturing process of a TMS370 microcontroller. The ’x36 masked-ROM devices offer both options to meet
system engineering requirements. Only one of the two clock options is allowed on each ROM device. The ’736A
EPROM has only the divide-by-4.
The divide-by-1 clock module option provides the capability for reduced electromagnetic interference (EMI) with
no added cost.
The divide-by-1 provides a one-to-one match of the external resonator frequency (CLKIN) to the internal system
clock (SYSCLK) frequency, whereas the divide-by-4 produces a SYSCLK which is one-fourth the frequency of
the external resonator. Inside of the divide-by-1 module, the frequency of the external resonator is multiplied
by four, and the clock module then divides the resulting signal by four to provide the four-phased internal system
clock signals. The resulting SYSCLK is equal to the resonator frequency. These are formulated as follows:
frequency
+ external resonator
+ CLKIN
4
4
external resonator frequency
4
Divide-by-1 option : SYSCLK +
+ CLKIN
4
Divide-by-4 option : SYSCLK
The main advantage of choosing a divide-by-1 oscillator is the reduced EMI. The harmonics of low-speed
resonators extend through fewer of the emissions spectrum than the harmonics of faster resonators. The
divide-by-1 provides the capability of reducing the resonator speed by four times, and this results in a steeper
decay of emissions produced by the oscillator.
16
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
system configuration registers
Table 10 contains system-configuration and control functions and registers for controlling EEPROM
programming. The privileged bits are shown in a bold typeface and shaded areas.
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Table 10. Peripheral File Frame 1: System-Configuration Registers
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
P010
COLD
START
OSC
POWER
PF AUTO
WAIT
OSC FLT
FLAG
MC PIN
WPO
MC PIN
DATA
—
µP / µC
MODE
SCCR0
P011
—
—
—
AUTO
WAIT
DISABLE
—
MEMORY
DISABLE
—
—
SCCR1
P012
HALT /
STANDBY
PWRDWN /
IDLE
—
BUS
STEST
CPU
STEST
—
INT1
NMI
PRIVILEGE
DISABLE
SCCR2
—
INT1
POLARITY
INT1
PRIORITY
INT1
ENABLE
—
AP
W1W0
EXE
DEECTL
—
—
W0
EXE
EPCTLL
P013
to
P016
P017
Reserved
INT1
FLAG
INT1
PIN DATA
—
—
P018
Reserved
P019
Reserved
P01A
BUSY
—
—
—
P01B
P01C
P01D
P01E
P01F
REG
INT1
Reserved
BUSY
VPPS
—
—
Reserved
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
17
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
digital port control registers
Peripheral file frame 2 contains the digital I/O pin configuration and control registers. Table 11 shows the specific
addresses, registers, and control bits within this peripheral file frame. Table 12 shows the port configuration
register setup.
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Table 11. Peripheral File Frame 2: Digital Port-Control Registers
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
P020
Reserved
APORT1
P021
Port A Control Register 2 (must be 0)
APORT2
P022
Port A Data
P023
Port A Direction
P024
to
P02B
Reserved
ADATA
ADIR
P02C
Port D Control Register 1 (must be 0)
—
—
—
DPORT1
P02D
Port D Control Register 2 (must be 0)†
—
—
—
DPORT2
P02E
Port D Data
—
—
—
DDATA
P02F
Port D Direction
—
—
—
DDIR
† To configure pin D3 as SYSCLK, set port D control register 2 = 08h.
Table 12. Port Configuration Register Setup
PORT
PIN
abcd
00q1
abcd
00y0
A
0–7
Data out q
Data In y
D
3–7
Data out q
Data In y
a = Port x Control Register 1
b = Port x Control Register 2
c = Data
d = Direction
serial peripheral interface
The SPI is a high-speed synchronous serial I/O port that allows a serial bit stream of programmed length (one
to eight bits) to be shifted into and out of the device at a programmable bit transfer rate. The SPI normally is
used for communications between the microcontroller and external peripherals or another microcontroller.
Typical applications include external I/O or peripheral expansion by way of devices such as shift registers,
display drivers, and A/D converters. Multi-device communications are supported by the master/slave operation
of the SPI. The SPI module features include the following:
D
D
18
Three external pins
–
SPISOMI: SPI slave output/master input pin or general-purpose bidirectional I/O pin
–
SPISIMO: SPI slave input/master output pin or general-purpose bidirectional I/O pin
–
SPICLK: SPI serial clock pin or general-purpose bidirectional I/O pin
Two operational modes: Master and slave
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
serial peripheral interface (continued)
D
Baud rate: Eight different programmable rates
–
Maximum baud rate in master mode: 2.5M bps at 5-MHz SYSCLK
SPI BAUD RATE
+ SYSCLK
2 2
b
where b=bit rate in SPICCR.5-3 (range 0–7)
–
Maximum baud rate in slave mode: 625K bps at 5-MHz SYSCLK
for maximum slave SPI BAUD RATE < SYSCLK / 8
D
D
D
D
Data word format: one to eight data bits
Simultaneous receiver and transmitter operations (transmit function can be disabled in software)
Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
Seven SPI module control registers located in control register frame beginning at address P030h
The SPI module-control registers are listed in Table 13.
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Table 13. SPI Module-Control Register Memory Map
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
P030
SPI SW
RESET
CLOCK
POLARITY
SPI BIT
RATE2
SPI BIT
RATE1
SPI BIT
RATE0
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
SPICCR
P031
RECEIVER
OVERRUN
SPI INT
FLAG
—
—
—
MASTER/
SLAVE
TALK
SPI INT
ENA
SPICTL
RCVD3
RCVD2
RCVD1
RCVD0
SPIBUF
SDAT2
SDAT1
SDAT0
SPIDAT
P032
to
P036
P037
Reserved
RCVD7
RCVD6
RCVD5
RCVD4
SDAT7
SDAT6
SDAT5
SDAT4
P038
P039
REG
RESERVED
P03A
to
P03C
SDAT3
Reserved
P03D
—
—
—
—
SPICLK
DATA IN
SPICLK
DATA OUT
SPICLK
FUNCTION
SPICLK
DATA DIR
SPIPC1
P03E
SPISIMO
DATA IN
SPISIMO
DATA OUT
SPISIMO
FUNCTION
SPISIMO
DATA DIR
SPISOMI
DATA IN
SPISOMI
DATA OUT
SPISOMI
FUNCTION
SPISOMI
DATA DIR
SPIPC2
P03F
SPI
STEST
SPI
PRIORITY
SPI
ESPEN
—
—
—
—
—
SPIPRI
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
serial peripheral interface (continued)
The SPI block diagram is illustrated in Figure 6.
SPIBUF.7-0
RECEIVER
OVER RUN
SPIBUF Buffer
Register
SPICTL.7
SPIPRI.6
8
SPI INT FLAG
0
SPICTL.0
Level 1 INT
1
SPICTL.6
Level 2 INT
SPIINT ENA
SPIPC2.7-4
SPIDAT
Data Register
SPIDAT.7-0
SPISIMO
SPICTL.1
SPIPC2.3-0
TALK
SPISOMI
State Control
MASTER/SLAVE†
SPI CHAR
SPICCR.2-0
2
System
Clock
1
SPICTL.2
0
SPIPC1.3-0
SPICCR.6
SPICCR.5-3
5
4
SPICLK
CLOCK POLARITY
3
SPI BIT RATE
† The block diagram is shown in slave mode.
Figure 6. SPI Block Diagram
programmable acquisition and control timer (PACT) module
Traditionally, timers in microcontrollers provide limited capture and compare functions consuming significant
CPU processing power and leading to inaccurate timings due to interrupt latencies. The programmable
acquisition and control timer (PACT) acts as a coprocessor combining configurable capture and compare
features, within a flexible dual-port RAM, able to run real-time tasks with little or no CPU intervention. The PACT
structure allows concatenation of tasks, thus enabling the CPU to perform data manipulation while the PACT
module both captures and outputs real-time-related information. Since all the PACT control information is held
within the dual-port Ram, the CPU can access these parameters quickly.
To use the PACT, the user must set up three distinct areas of memory. The first is the dual-port RAM, which
contains the capture area, the commands, and the timer definitions. The second is the peripheral frame. The
third is an area near the end of the program memory which holds the interrupt vectors of PACT.
20
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TMS370Cx36
8-BIT MICROCONTROLLER
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programmable acquisition and control timer (PACT) module (continued)
The PACT module features include the following:
D
D
Input-capture functions on up to six input pins (CP1 to CP6), depending on the mode selected:
–
Mode A: CP1–2 are dedicated capture, CP3–6 are circular buffer capture, and CP6 is also an event pin.
–
Mode B: CP1–4 are dedicated capture, CP5–6 are circular buffer capture, and CP6 is also an event pin.
Multiple timer-driven outputs on eight pins (OP1 to OP8)
–
Standard compare command: set or clear an output pin whenever the timer/counter is equal to a certain
value
–
Virtual timers: enable variations of the PWM’s period and provides periodic interrupts to the processor.
–
Double event-compare command: comparisons of the 8-bit event counter with two event-compare
values and the actions that can be performed are based on each value:
–
–
–
D
D
D
D
D
D
D
–
Event-compare 1 matching the event counter: sets or resets the selected output pin (OP1–OP8),
generates interrupt, and generates a 32-bit capture into the circular buffer.
–
Event-compare 2 matching the event counter: sets or resets the selected output pin (OP1–OP8),
generates interrupt, generates a 32-bit capture into the circular buffer, and resets the 20-bit default
timer.
Offset timer definition-time from last event:
–
Generates an interrupt when the maximum event count is reached
–
Stores the 16-bit virtual timer in the circular buffer on each event
–
Stores the 20-bit default timer and 8-bit event counter in the circular buffer when the maximum
event count is reached
–
Resets the 20-bit hardware default timer when the maximum event count is reached.
Conditional-compare command has a timer-compare value and an event-compare value.
–
Generates an interrupt when the event-compare value equals the event counter and the
timer-compare value equals the last defined timer
–
Sets or clears one of the seven output pins (OP1–OP7) when the event compare value equals the
event counter and the timer-compare value equals the last defined timer
Baud rate timer definition: runs the mini-serial communications port built into the PACT module.
Configurable timer overflow rates
One 8-bit event counter driven by CP6
Up to 20-bit timer capability
Interaction between event counter and timer activity
Register-based organization allowing direct access to timer parameters by the CPU
18 independent interrupt vectors with two priority levels
Integrated, configurable watchdog with selectable time-out period
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
programmable acquisition and control timer (PACT) module (continued)
D
Mini-serial communications interface works as a simplified full duplex universal asychronous
receiver / transmitter (UART) with independent setup of baud rate for receive and transmit lines.
–
Asynchronous communications mode
Asynchronous Baud
+ (Max Virtual Timer Value) 1
(4)
(PACT Resolution)
–2
where PACT Resolution = SYSCLK × Prescale Value
PACT block diagram
The PACT module block diagram is illustrated in Figure 7.
PACT PRESCALED CLOCK
20-Bit Timer / Counter
Prescale
8-Bit Event Counter
Watchdog Timer
CP1
Dedicated Capture Register 1
CP2
Dedicated Capture Register 2
Reset
Dedicated Capture Register 3
CP3
CP4
CP5
CP6
Dedicated Capture Register 4
3-Bit Prescaler
Circular Buffer
(32–Bit Captures)
MODE
EVENT ONLY
Command / Definition Area
Command Analyzer
and
Output Controller
Outputs
Int Level 1
Int Level 2
Mini SCI
SCIRXD
Figure 7. PACT Block diagram
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SCITXD
OPT1
OPT2
OPT3
OPT4
OPT5
OPT6
OPT7
OPT8
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
PACT control registers
The PACT module is controlled and accessed through registers in peripheral frame 4. These registers are listed
in Table 14. The bits in shaded boxes are privileged mode bits; that is, they can be written to only in the privileged
mode.
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ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
Table 14. PACT Control Registers
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
P040
DEFTIM
OVRFL
INT ENA
DEFTIM
OVRFL
INT FLAG
CMD/DEF
AREA ENA
FAST
MODE
SELECT
PACT
PRESCALE
SELECT3
PACT
PRESCALE
SELECT2
PACT
PRESCALE
SELECT1
PACT
PRESCALE
SELECT0
PACTSCR
P041
CMD/DEF
AREA
INT ENA
—
CMD/DEF
AREA
START BIT 5
CMD/DEF
AREA
START BIT 4
CMD/DEF
AREA
START BIT 3
CMD/DEF
AREA
START BIT 2
—
—
CDSTART
P042
—
CMD/DEF
AREA
END BIT 6
CMD/DEF
AREA
END BIT 5
CMD/DEF
AREA
END BIT 4
CMD/DEF
AREA
END BIT 3
CMD/DEF
AREA END
BIT 2
—
—
CDEND
P043
1
1
BUFFER
POINTER
BIT 5
BUFFER
POINTER
BIT 4
BUFFER
POINTER
BIT 3
BUFFER
POINTER
BIT 2
BUFFER
POINTER
BIT 1
—
BUFPTR
P044
REG
Reserved
P045
PACT
RXRDY
PACT
TXRDY
PACT
PARITY
PACT FE
PACT SCI
RX INT ENA
PACT SCI
TX INT ENA
—
PACT SCI
SW RESET
SCICTLP
P046
PACT
RXDT7
PACT
RXDT6
PACT
RXDT5
PACT
RXDT4
PACT
RXDT3
PACT
RXDT2
PACT
RXDT1
PACT
RXDT0
RXBUFP
P047
PACT
TXDT7
PACT
TXDT6
PACT
TXDT5
PACT
TXDT4
PACT
TXDT3
PACT
TXDT2
PACT
TXDT1
PACT
TXDT0
TXBUFP
P048
PACT OP8
STATE
PACT OP7
STATE
PACT OP6
STATE
PACT OP5
STATE
PACT OP4
STATE
PACT OP3
STATE
PACT OP2
STATE
PACT OP1
STATE
PSTATE
P049
CMD/DEF
INT 7 FLAG
CMD/DEF
INT 6 FLAG
CMD/DEF
INT 5 FLAG
CMD/DEF
INT 4 FLAG
CMD/DEF
INT 3 FLAG
CMD/DEF
INT 2 FLAG
CMD/DEF
INT 1 FLAG
CMD/DEF
INT 0 FLAG
CDFLAGS
P04A
CP2 INT
ENA
CP2 INT
FLAG
CP2 CAPT
RISING
EDGE
CP2 CAPT
FALLING
EDGE
CP1 INT
ENA
CP1 INT
FLAG
CP1 CAPT
RISING
EDGE
CP1 CAPT
FALLING
EDGE
CPCTL1
P04B
CP4 INT
ENA
CP4 INT
FLAG
CP4 CAPT
RISING
EDGE
CP4 CAPT
FALLING
EDGE
CP3 INT
ENA
CP3 INT
FLAG
CP3 CAPT
RISING
EDGE
CP3 CAPT
FALLING
EDGE
CPCTL2
P04C
CP6 INT
ENA
CP6 INT
FLAG
CP6 CAPT
RISING
EDGE
CP6 CAPT
FALLING
EDGE
CP5 INT
ENA
CP5 INT
FLAG
CP5 CAPT
RISING
EDGE
CP5 CAPT
FALLING
EDGE
CPCTL3
P04D
BUFFER
HALF/FULL
INT ENA
BUFFER
HALF/FULL
INT FLAG
INPUT
CAPT
PRESCALE
SELECT 3
INPUT
CAPT
PRESCALE
SELECT 2
INPUT
CAPT
PRESCALE
SELECT 1
CP6 EVENT
ONLY
EVENT
COUNTER
SW RESET
OP/ SET/CLR
SELECT
CPPRE
PACT
SUSPEND
PACT
GROUP 1
PRIORITY
PACT
MODE
SELECT
PACT WD
PRESCALE
SELECT 1
PACT WD
PRESCALE
SELECT 0
P04E
P04F
WATCHDOG REST KEY
PACT
STEST
PACT
GROUP 2
PRIORITY
POST OFFICE BOX 1443
PACT
GROUP 3
PRIORITY
WDRST
• HOUSTON, TEXAS 77251–1443
PACTPRI
23
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
analog-to-digital converter 1 module
The analog-to-digital converter 1 (ADC1) module is an 8-bit, successive approximation converter with internal
sample-and-hold circuitry. The module has four multiplexed analog input channels that allow the processor to
convert the voltage levels from up to eight different sources. The ADC1 module features include the following:
D
D
D
D
D
Minimum conversion time: 32.8 µs at 5-MHz SYSCLK
Ten external pins:
–
Eight analog-input channels (AN0 – AN7), any of which can be software-configured as digital inputs
(E0– E7) when not needed as analog channels
–
AN1– AN7 also can be configured as positive-input voltage reference.
–
VCC3: ADC1 module high-voltage reference input
–
VSS3: ADC1 module low-voltage reference input
The ADDATA register, which contains the digital result of the last ADC1 conversion.
ADC1 operations can be accomplished through either interrupt-driven or polled algorithms.
Six ADC1 module control registers located in the control-register frame beginning at address 1070h
The ADC1 module control registers are listed in Table 15.
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
Table 15. ADC1 Module Control Register Memory Map
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
P070
CONVERT
START
SAMPLE
START
REF VOLT
SELECT2
REF VOLT
SELECT1
REF VOLT
SELECT0
AD INPUT
SELECT2
AD INPUT
SELECT1
AD INPUT
SELECT0
ADCTL
P071
—
—
—
—
—
AD READY
AD INT
FLAG
AD INT
ENA
ADSTAT
P072
A/D Conversion Data Register
P073
to
P07C
RESERVED
P07D
Port E Data Input Register
P07E
Port E Input Enable Register
P07F
24
AD STEST
AD
PRIORITY
AD ESPEN
—
POST OFFICE BOX 1443
—
REG
ADDATA
ADIN
ADENA
—
• HOUSTON, TEXAS 77251–1443
—
—
ADPRI
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
analog-to-digital converter 1 module (continued)
The ADC1 module block diagram is illustrated in Figure 8.
Port E Input
ENA 0
ADENA.0
Port E Data
AN 0
ADIN.0
0
SAMPLE
START
CONVERT
START
ADCTL.2 – 0
ADCTL.6
ADCTL.7
2
1
AN0
Port E Input
ENA 1
ADENA.1
Port E Data
AN 1
AD INPUT SELECT
ADIN.1
AN1
Port E Input
ENA 2
ADENA.2
Port E Data
AN 2
ADIN.2
AN2
Port E Input
ENA 3
ADENA.3
Port E Data
AN 3
ADIN.3
ADDATA.7 – 0
AN3
Port E Input
ENA 4
ADENA.4
A/D
Port E Data
AN 4
A-to-D
Conversion
Data Register
ADIN.4
AN4
Port E Input
ENA 5
ADENA.5
AD READY
Port E Data
AN 5
ADSTAT.2
ADIN.5
AD PRIORITY
AN5
Port E Input
ENA 6
ADENA.6
ADIN.6
AN6
Port E Input
ENA 7
ADENA.7
ADPRI.6
Port E Data
AN 6
0 Level 1 INT
1 Level 2 INT
5
4
3
ADCTL.5 – 3
Port E Data
AN 7
REF VOLTS SELECT
AD INT FLAG
ADSTAT.1
ADIN.7
AN7
ADSTAT.0
VCC3
AD INT ENA
VSS3
Figure 8. ADC1 Block Diagram
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
25
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
instruction set overview
Table 16 provides an opcode to instruction cross reference of all 73 instructions and 274 opcodes of the
‘370Cx36 instruction set. The numbers at the top of this table represent the most significant nibble (MSN) of
the opcode while the numbers at the left side of the table represent the least significant nibble (LSN). The
instruction of these two opcode nibbles contains the mnemonic, operands, and byte / cycle particular to that
opcode.
For example, the opcode B5h points to the CLR A instruction. This instruction contains one byte and executes
in eight SYSCLK cycles.
26
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
Table 16. TMS370 Family Opcode/Instruction Map†
MSN
0
2
3
4
5
6
7
8
INCW
#ra,Rd
3/11
MOV
Ps,A
2/8
0
JMP
#ra
2/7
1
JN
ra
2/5
2
JZ
ra
2/5
MOV
Rs,A
2/7
MOV
#n,A
2/6
MOV
Rs,B
2/7
MOV
Rs,Rd
3/9
MOV
#n,B
2/6
MOV
B,A
1/8
MOV
#n,Rd
3/8
3
JC
ra
2/5
AND
Rs,A
2/7
AND
#n,A
2/6
AND
Rs,B
2/7
AND
Rs,Rd
3/9
AND
#n,B
2/6
AND
B,A
1/8
AND
#n,Rd
3/8
AND
A,Pd
2/9
4
JP
ra
2/5
OR
Rs,A
2/7
OR
#n,A
2/6
OR
Rs,B
2/7
OR
Rs,Rd
3/9
OR
#n,B
2/6
OR
B,A
1/8
OR
#n,Rd
3/8
5
JPZ
ra
2/5
XOR
Rs,A
2/7
XOR
#n,A
2/6
XOR
Rs,B
2/7
XOR
Rs,Rd
3/9
XOR
#n,B
2/6
XOR
B,A
1/8
6
JNZ
ra
2/5
BTJO
Rs,A,ra
3/9
BTJO
#n,A,ra
3/8
BTJO
Rs,B,ra
3/9
BTJO
Rs,Rd,ra
4/11
BTJO
#n,B,ra
3/8
7
JNC
ra
2/5
BTJZ
Rs.,A,ra
3/9
BTJZ
#n,A,ra
3/8
BTJZ
Rs,B,ra
3/9
BTJZ
Rs,Rd,ra
4/11
8
JV
ra
2/5
ADD
Rs,A
2/7
ADD
#n,A
2/6
ADD
Rs,B
2/7
9
JL
ra
2/5
ADC
Rs,A
2/7
ADC
#n,A
2/6
A
JLE
ra
2/5
SUB
Rs,A
2/7
B
JHS
ra
2/5
SBB
Rs,A
2/7
MOV
A,Pd
2/8
MOV
B,Pd
2/8
MOV
Rs,Pd
3/10
9
A
B
C
D
E
F
CLRC /
TST A
1/9
MOV
A,B
1/9
MOV
A,Rd
2/7
TRAP
15
1/14
LDST
n
2/6
MOV
B,Rd
2/7
TRAP
14
1/14
MOV
#ra[SP],A
2/7
MOV
Ps,B
2/7
MOV
Ps,Rd
3/10
DEC
A
1/8
DEC
B
1/8
DEC
Rd
2/6
TRAP
13
1/14
MOV
A,*ra[SP]
2/7
AND
B,Pd
2/9
AND
#n,Pd
3/10
INC
A
1/8
INC
B
1/8
INC
Rd
2/6
TRAP
12
1/14
CMP
*n[SP],A
2/8
OR
A,Pd
2/9
OR
B,Pd
2/9
OR
#n,Pd
3/10
INV
A
1/8
INV
B
1/8
INV
Rd
2/6
TRAP
11
1/14
extend
inst,2
opcodes
XOR
#n,Rd
3/8
XOR
A,Pd
2/9
XOR
B,Pd
2/9
XOR
#n,Pd
3/10
CLR
A
1/8
CLR
B
1/8
CLR
Rn
2/6
TRAP
10
1/14
BTJO
B,A,ra
2/10
BTJO
#n,Rd,ra
4/10
BTJO
A,Pd,ra
3/11
BTJO
B,Pd,ra
3/10
BTJO
#n,Pd,ra
4/11
XCHB
A
1/10
XCHB A /
TST B
1/10
XCHB
Rn
2/8
TRAP
9
1/14
IDLE
BTJZ
#n,B,ra
3/8
BTJZ
B,A,ra
2/10
BTJZ
#n,Rd,ra
4/10
BTJZ
A,Pd,ra
3/10
BTJZ
B,Pd,ra
3/10
BTJZ
#n,Pd,ra
4/11
SWAP
A
1/11
SWAP
B
1/11
SWAP
Rn
2/9
TRAP
8
1/14
MOV
#n,Pd
3/10
ADD
Rs,Rd
3/9
ADD
#n,B
2/6
ADD
B,A
1/8
ADD
#n,Rd
3/8
MOVW
#16,Rd
4/13
MOVW
Rs,Rd
3/12
MOVW
#16[B],Rpd
4/15
PUSH
A
1/9
PUSH
B
1/9
PUSH
Rd
2/7
TRAP
7
1/14
SETC
ADC
Rs,B
2/7
ADC
Rs,Rd
3/9
ADC
#n,B
2/6
ADC
B,A
1/8
ADC
#n,Rd
3/8
JMPL
lab
3/9
JMPL
*Rp
2/8
JMPL
*lab[B]
3/11
POP
A
1/9
POP
B
1/9
POP
Rd
2/7
TRAP
6
1/14
RTS
SUB
#n,A
2/6
SUB
Rs,B
2/7
SUB
Rs,Rd
3/9
SUB
#n,B
2/6
SUB
B,A
1/8
SUB
#n,Rd
3/8
MOV
& lab,A
3/10
MOV
*Rp,A
2/9
MOV
*lab[B],A
3/12
DJNZ
A,#ra
2/10
DJNZ
B,#ra
2/10
DJNZ
Rd,#ra
3/8
TRAP
5
1/14
RTI
1/12
SBB
#n,A
2/6
SBB
Rs,B
2/7
SBB
Rs,Rd
3/9
SBB
#n,B
2/6
SBB
B,A
1/8
SBB
#n,Rd
3/8
MOV
A, & lab
3/10
MOV
A, *Rp
2/9
MOV
A,*lab[B]
3/12
COMPL
A
1/8
COMPL
B
1/8
COMPL
Rd
2/6
TRAP
4
1/14
PUSH
ST
1/8
1/6
1/7
1/9
27
TMS370Cx36
8-BIT MICROCONTROLLER
† All conditional jumps (opcodes 01-0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ
instructions have a relative address as the last operand.
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
L
S
N
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
C
JNV
ra
2/5
MPY
Rs,A
2/46
MPY
#n,A
2/45
MPY
Rs,B
2/46
MPY
Rs,Rd
3/48
MPY
#n,B
2/45
MPY
B,A
1/47
MPY
#n,Rs
3/47
BR
lab
3/9
BR
*Rp
2/8
BR
*lab[B]
3/11
RR
A
1/8
RR
B
1/8
RR
Rd
2/6
TRAP
3
1/14
POP
ST
1/8
JGE
ra
2/5
CMP
Rs,A
2/7
CMP
#n,A
2/6
CMP
Rs,B
2/7
CMP
Rs,Rd
3/9
CMP
#n,B
2/6
CMP
B,A
1/8
CMP
#n,Rd
3/8
CMP
& lab,A
3/11
CMP
*Rp,A
2/10
CMP
*lab[B],A
3/13
RRC
A
1/8
RRC
B
1/8
RRC
Rd
2/6
TRAP
2
1/14
LDSP
D
DAC
Rs,A
2/9
DAC
#n,A
2/8
DAC
Rs,B
2/9
DAC
Rs,Rd
3/11
DAC
#n,B
2/8
DAC
B,A
1/10
DAC
#n,Rd
3/10
CALL
lab
3/13
CALL
*Rp
2/12
CALL
*lab[B]
3/15
RL
A
1/8
RL
B
1/8
RL
Rd
2/6
TRAP
1
1/14
STSP
E
JG
ra
2/5
DSB
Rs,A
2/9
DSB
#n,A
2/8
DSB
Rs,B
2/9
DSB
Rs,Rd
3/11
DSB
#n,B
2/8
DSB
B,A
1/10
DSB
#n,Rd
3/10
CALLR
lab
3/15
CALLR
*Rp
2/14
CALLR
*lab[B]
3/17
RLC
A
1/8
RLC
B
1/8
RLC
Rd
2/6
TRAP
0
1/14
NOP
F
JLO
ra
2/5
F4
8
MOVW
*n[Rn]
4/15
DIV
Rn.A
3/14-63
F4
9
JMPL
*n[Rn]
4/16
F4
A
MOV
*n[Rn],A
4/17
F4
B
MOV
A,*n[Rn]
4/16
F4
C
BR
*n[Rn]
4/16
F4
D
CMP
*n[Rn],A
4/18
F4
E
CALL
*n[Rn]
4/20
F4
F
CALLR
*n[Rn]
4/22
L
S
N
Second byte of two-byte instructions (F4xx):
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
Legend:
*
= Indirect addressing operand prefix
& = Direct addressing operand prefix
# = immediate operand
#16 = immediate 16-bit number
lab = 16-label
n = immediate
i
di t 8-bit
8 bit number
b
Pd = Peripheral register containing destination type
Pn = Peripheral register
Ps = Peripheral
Peri heral register containing source byte
ra = Relative address
Rd = Register containing destination type
Rn = Register file
Rp = Register pair
Rpd = Destination register pair
Rps = Source Register pair
Rs = Register containing source byte
1/7
1/8
1/7
† All conditional jumps (opcodes 01-0F), BTJO, BTJZ, and DJNZ instructions use two additional cycles if the branch is taken. The BTJO, BTJZ, and DJNZ instructions
have a relative address as the last operand.
Template Release Date: 7–11–94
1
TMS370Cx36
8-BIT MICROCONTROLLER
MSN
0
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
28
Table 16. TMS370 Family Opcode/Instruction Map† (Continued)
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
development system support
The TMS370 family development support tools include an assembler, a C-compiler, a linker, CDT and an
EEPROM/ UVEPROM programmer.
D
D
D
Assembler/ linker (Part No. TMDS3740850–02 for PC)
–
Includes extensive macro capability
–
Provides high-speed operation
–
Includes format conversion utilities for popular formats
ANSI C Compiler (Part No. TMDS3740855–02 for PC, Part No. TMDS3740555–09 for HP700, Sun-3
or Sun-4)
–
Generate assembly code for the TMS370 that can be inspected easily
–
Improves code execution speed and reduces code size with optional optimizer pass
–
Enables direct reference the TMS370’s port registers by using a naming convention
–
Provides flexibility in specifying the storage for data objects
–
Interfaces C functions and assembly functions easily
–
Includes assembler and linker
CDT370 (Compact Development Tool) PACT real-time in-circuit emulation
–
Base (Part Number EDSCDT37P – for PC, requires cable)
–
D
Cable for 44-pin PLCC (Part No. EDSTRG44PLCC36)
–
EEPROM and EPROM programming support
–
Allows inspection and modification of memory locations
–
Includes compatibility to upload / download program and data memory
–
Execute programs and software routines
–
Includes 1 024-sample trace buffer
–
Includes single-step executable instructions
–
Uses software breakpoints to halt program execution at selected address
Microcontroller programmer
–
Base (Part No. TMDS3760500A – for PC, requires programmer head)
–
–
Single unit head for 44-pin PLCC (Part No. TMDS3780512A)
PC-based, window / function-key-oriented user interface for ease of use and rapid learning environment
HP700 is a trademark of Hewlett Packard, Incorporated.
Sun-3 and Sun-4 are trademarks of Sun Microsystems, Incorporated.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
29
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
device numbering conventions
Figure 9 illustrates the numbering and symbol nomenclature for the TMS370Cx36 family.
TMS 370 C 7 36 A FN T
Prefix: TMS = Standard prefix for fully qualified devices
SE = System evaluator (window EPROM) that is used for
prototyping purpose.
Family:
Technology:
Program Memory Types:
Device Type:
Memory Size:
Temperature Ranges:
Packages:
ROM and EPROM Option:
370 = TMS370 8-Bit Microcontroller Family
C = CMOS
0 = Mask ROM
7 = EPROM
36 = x36 device containing the following modules:
– Analog-to-Digital Converter 1
– Serial Peripheral Interface
– Programmable Acquisition and
Control Timer (PACT)
6 = 16K bytes
A = –40°C to 85°C
L =
0°C to 70°C
T = –40°C to 105°C
FN = Plastic Leaded Chip Carrier
FZ = Ceramic Leaded Chip Carrier
A = For ROM device, the watchdog timer can be configured
as one of the three different mask options:
– A standard watchdog or
– A hard watchdog or
– A simple watchdog
The clock can be either:
– Divide-by-4 clock or
– Divide-by-1 (PLL) clock
The low-power modes can be either:
– Enabled or
– Disabled
A = For EPROM device, a standard watchdog, a divide-by4 clock, and low-power modes are enabled
Figure 9. TMS370Cx36 Family Nomenclature
30
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
device part numbers
Table 17 provides a listing of all the ’x36 devices available. The device part number nomenclature is designed
to assist ordering. Upon ordering, the customer must specify not only the device part number, but also the clock
and watchdog timer options desired. Each device can have only one of the three possible watchdog timer
options and one of the two clock options. The options to be specified pertain solely to orders involving ROM
devices.
Table 17. Device Part Numbers
DEVICE PART NUMBERS
FOR 44 PINS (LCC)
TMS370C036AFNA
TMS370C036AFNL
TMS370C036AFNT
TMS370C736AFNT
SE370C736AFZT†
† System evaluators are for use in prototype environment, and their
reliability has not been characterized.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
31
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
new code release form
Figure 10 shows a sample of the new code release form.
NEW CODE RELEASE FORM
TEXAS INSTRUMENTS
TMS370 MICROCONTROLLER PRODUCTS
DATE:
To release a new customer algorithm to TI incorporated into a TMS370 family microcontroller, complete this form and submit with the following information:
1. A ROM description in object form on Floppy Disk, Modem XFR, or EPROM (Verification file will be returned via same media)
2. An attached specification if not using TI standard specification as incorporated in TI’s applicable device data book.
Company Name:
Street Address:
Street Address:
City:
Contact Mr./Ms.:
Phone: (
State
Zip
)
Ext.:
Customer Purchase Order Number:
Customer Print Number *Yes:
#
No:
(Std. spec to be followed)
*If Yes: Customer must provide ”print” to TI w/NCRF for approval before ROM
code processing starts.
Customer Part Number:
Customer Application:
TMS370 Device:
TI Customer ROM Number:
(provided by Texas Instruments)
CONTACT OPTIONS FOR THE ’A’ VERSION TMS370 MICROCONTROLLERS
OSCILLATOR FREQUENCY
MIN
TYP
MAX
[] External Drive (CLKIN)
[] Crystal
[] Ceramic Resonator
[] Supply Voltage MIN:
(std range: 4.5V to 5.5V)
Low Power Modes
[] Enabled
[] Disabled
Watchdog counter
[] Standard
[] Hard Enabled
[] Simple Counter
Clock Type
[] Standard (/4)
[] PLL (/1)
NOTE:
Non ’A’ version ROM devices of the TMS370 microcontrollers will have the
“Low-power modes Enabled”, “Divide-by-4” Clock, and “Standard” Watchdog
options. See the TMS370 Family User’s Guide (literature number SPNU127)
or the TMS370 Family Data Manual (literature number SPNS014B).
MAX:
TEMPERATURE RANGE
[] ’L’:
0° to 70°C (standard)
[] ’A’:
–40° to 85°C
[] ’T’:
–40° to 105°C
PACKAGE TYPE
[] ’N’ 28-pin PDIP
[] “FN” 44-pin PLCC
[] “FN” 28-pin PLCC
[] “FN” 68-pin PLCC
[] “N” 40-pin PDIP
[] “NM” 64-pin PSDIP
[] “NJ” 40-pin PSDIP (formerly known as N2)
SYMBOLIZATION
BUS EXPANSION
[] TI standard symbolization
[] TI standard w/customer part number
[] Customer symbolization
(per attached spec, subject to approval)
[] YES
[] NO
NON-STANDARD SPECIFICATIONS:
ALL NON-STANDARDS SPECIFICATIONS MUST BE APPROVED BY THE TI ENGINEERING STAFF: If the customer requires expedited production material
(i.e., product which must be started in process prior to prototype approval and full production release) and non-standard spec issues are not resolved to the
satisfaction of both the customer and TI in time for a scheduled shipment, the specification parameters in question will be processed/tested to the standard
TI spec. Any such devices which are shipped without conformance to a mutually approved spec, will be identified by a ’P’ in the symbolization preceding the
TI part number.
RELEASE AUTHORIZATION:
This document, including any referenced attachments, is and will be the controlling document for all orders placed for this TI custom device. Any changes must
be in writing and mutually agreed to by both the customer and TI. The prototype cycletime commences when this document is signed off and the verification
code is approved by the customer.
1. Customer:
Date:
2. TI: Field Sales:
Marketing:
Prod. Eng.:
Proto. Release:
Figure 10. Sample New Code Release Form
32
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation
ÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
ÁÁÁÁÁ
ÁÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
ÁÁÁÁÁ
ÁÁÁÁ
Á
ÁÁÁÁ
ÁÁÁ
Á
ÁÁÁÁÁ
ÁÁÁÁ
Á
ÁÁÁ
ÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
Á
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁ
Á
ÁÁ
ÁÁÁÁ
ÁÁÁ
Table 18 is a collection of all the peripheral file frames used in the ’Cx36 (provided for a quick reference).
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
System Configuration Registers
P010
COLD
START
OSC
POWER
PF AUTO
WAIT
OSC FLT
FLAG
MC PIN
WPO
MC PIN
DATA
—
µP / µC
MODE
SCCR0
P011
—
—
—
AUTO
WAIT
DISABLE
—
MEMORY
DISABLE
—
—
SCCR1
P012
HALT /
STANDBY
PWRDWN /
IDLE
—
BUS
STEST
CPU
STEST
—
INT1
NMI
PRIVILEGE
DISABLE
SCCR2
—
INT1
POLARITY
INT1
PRIORITY
INT1
ENABLE
—
AP
W1W0
EXE
DEECTL
—
—
W0
EXE
EPCTLL
P013
to
P016
P017
Reserved
INT1
FLAG
INT1
PIN DATA
—
—
P018
Reserved
P019
P01A
BUSY
—
—
—
P01B
P01C
INT1
Reserved
BUSY
VPPS
—
—
P01D
P01E
P01F
Reserved
Digital Port Control Registers
P020
Reserved
APORT1
P021
Port A Control Register 2 (must be 0)
APORT2
P022
Port A Data
P023
Port A Direction
P024
to
P02B
Reserved
ADATA
ADIR
P02C
Port D Control Register 1 (must be 0)
—
—
—
DPORT1
P02D
0)†
—
—
—
DPORT2
P02E
Port D Control Register 2 (must be
Port D Data
—
—
—
DDATA
P02F
Port D Direction
—
—
—
DDIR
SPI Module Control Register Memory Map
P030
SPI SW
RESET
CLOCK
POLARITY
SPI BIT
RATE2
SPI BIT
RATE1
SPI BIT
RATE0
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
SPICCR
P031
RECEIVER
OVERRUN
SPI INT
FLAG
—
—
—
MASTER/
SLAVE
TALK
SPI INT
ENA
SPICTL
RCVD3
RCVD2
RCVD1
RCVD0
SPIBUF
SDAT2
SDAT1
SDAT0
SPIDAT
P032
to
P036
P037
Reserved
RCVD7
RCVD6
RCVD5
RCVD4
P038
P039
Reserved
SDAT7
SDAT6
SDAT5
SDAT4
SDAT3
† To configure D3 as SYSCLK, set port D register 2 = 08h.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
33
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation (Continued)
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PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
SPI Module Control Register Memory Map (Continued)
P03A
to
P03C
Reserved
P03D
—
—
—
—
SPICLK
DATA IN
SPICLK
DATA OUT
SPICLK
FUNCTION
SPICLK
DATA DIR
SPIPC1
P03E
SPISIMO
DATA IN
SPISIMO
DATA OUT
SPISIMO
FUNCTION
SPISIMO
DATA DIR
SPISOMI
DATA IN
SPISOMI
DATA OUT
SPISOMI
FUNCTION
SPISOMI
DATA DIR
SPIPC2
P03F
SPI
STEST
SPI
PRIORITY
SPI
ESPEN
—
—
—
—
—
SPIPRI
PACT Module Register Memory Map
P040
DEFTIM
OVRFL
INT ENA
DEFTIM
OVRFL
INT FLAG
CMD/DEF
AREA ENA
FAST
MODE
SELECT
PACT
PRESCALE
SELECT3
PACT
PRESCALE
SELECT2
PACT
PRESCALE
SELECT1
PACT
PRESCALE
SELECT0
PACTSCR
P041
CMD/DEF
AREA
INT ENA
—
CMD/DEF
AREA
START
BIT 5
CMD/DEF
AREA
START
BIT 4
CMD/DEF
AREA
START
BIT 3
CMD/DEF
AREA
START
BIT 2
—
—
CDSTART
P042
—
CMD/DEF
AREA
END BIT 6
CMD/DEF
AREA
END BIT 5
CMD/DEF
AREA
END BIT 4
CMD/DEF
AREA
END BIT 3
CMD/DEF
AREA END
BIT 2
—
—
CDEND
P043
1
1
BUFFER
POINTER
BIT 5
BUFFER
POINTER
BIT 4
BUFFER
POINTER
BIT 3
BUFFER
POINTER
BIT 2
BUFFER
POINTER
BIT 1
—
BUFPTR
P045
PACT
RXRDY
PACT
TXRDY
PACT
PARITY
PACT FE
PACT SCI
RX INT ENA
PACT SCI
TX INT ENA
—
PACT SCI SW
RESET
SCICTLP
P046
PACT
RXDT7
PACT
RXDT6
PACT
RXDT5
PACT
RXDT4
PACT
RXDT3
PACT
RXDT2
PACT
RXDT1
PACT RXDT0
RXBUFP
P047
PACT
TXDT7
PACT
TXDT6
PACT
TXDT5
PACT
TXDT4
PACT
TXDT3
PACT
TXDT2
PACT
TXDT1
PACT TXDT0
TXBUFP
P048
PACT OP8
STATE
PACT OP7
STATE
PACT OP6
STATE
PACT OP5
STATE
PACT OP4
STATE
PACT OP3
STATE
PACT OP2
STATE
PACT OP1
STATE
PSTATE
P049
CMD/DEF
INT 7 FLAG
CMD/DEF
INT 6 FLAG
CMD/DEF
INT 5 FLAG
CMD/DEF
INT 4 FLAG
CMD/DEF
INT 3 FLAG
CMD/DEF
INT 2 FLAG
CMD/DEF
INT 1 FLAG
CMD/DEF
INT 0 FLAG
CDFLAGS
P04A
CP2 INT
ENA
CP2 INT
FLAG
CP2 CAPT
RISING
EDGE
CP2 CAPT
FALLING
EDGE
CP1 INT
ENA
CP1 INT
FLAG
CP1 CAPT
RISING
EDGE
CP1 CAPT
FALLING
EDGE
CPCTL1
P04B
CP4 INT
ENA
CP4 INT
FLAG
CP4 CAPT
RISING
EDGE
CP4 CAPT
FALLING
EDGE
CP3 INT
ENA
CP3 INT
FLAG
CP3 CAPT
RISING
EDGE
CP3 CAPT
FALLING
EDGE
CPCTL2
P04C
CP6 INT
ENA
CP6 INT
FLAG
CP6 CAPT
RISING
EDGE
CP6 CAPT
FALLING
EDGE
CP5 INT
ENA
CP5 INT
FLAG
CP5 CAPT
RISING
EDGE
CP5 CAPT
FALLING
EDGE
CPCTL3
P04D
BUFFER
HALF/FULL
INT ENA
BUFFER
HALF/FULL
INT FLAG
INPUT
CAPT
PRESCALE
SELECT 3
INPUT
CAPT
PRESCALE
SELECT 2
INPUT
CAPT
PRESCALE
SELECT 1
CP6 EVENT
ONLY
EVENT
COUNTER
SW RESET
OP/ SET/CLR
SELECT
CPPRE
P044
34
Reserved
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
Table 18. Peripheral File Frame Compilation (Continued)
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ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
PF
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
PACT WD
PRESCALE
SELECT 1
PACT WD
PRESCALE
SELECT 0
REG
PACT Module Register Memory Map (Continued)
P04E
P04F
WATCHDOG RESET KEY
PACT
STEST
PACT
SUSPEND
PACT
GROUP 1
PRIORITY
PACT
GROUP 2
PRIORITY
PACT
GROUP 3
PRIORITY
WDRST
PACT
MODE
SELECT
PACTPRI
ADC1 Module Control Register Memory Map
P070
CONVERT
START
SAMPLE
START
REF VOLT
SELECT2
REF VOLT
SELECT1
REF VOLT
SELECT0
AD INPUT
SELECT2
AD INPUT
SELECT1
AD INPUT
SELECT0
ADCTL
P071
—
—
—
—
—
AD READY
AD INT
FLAG
AD INT ENA
ADSTAT
P072
ADC1 Conversion Data Register
P073
to
P07C
RESERVED
P07D
Port E Data Input Register
P07E
Port E Input Enable Register
P07F
AD STEST
AD
PRIORITY
AD ESPEN
—
POST OFFICE BOX 1443
—
ADDATA
ADIN
ADENA
—
• HOUSTON, TEXAS 77251–1443
—
—
ADPRI
35
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range,VCC1 (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 7 V
Input voltage range, All pins except MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to7 V
MC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 14 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Continuous output current per buffer, IO (VO = 0 to VCC)) (see Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA
Maximum ICC current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 mA
Maximum ISS current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 170 mA
Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
Operating free-air temperature, TA: L version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
T version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 105°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 4. Unless otherwise noted, all voltage values are with respect to VSS1.
5. Electrical characteristics are specified with all output buffers loaded with specified IO current. Exceeding the specified IO current in
any buffer can affect the levels on other buffers.
recommended operating conditions
VCC1
VCCSTBY
Supply voltage (see Note 4)
RAM data-retention supply voltage (see Note 6)
Analog supply voltage (see Note 4)
VIL
Low level input voltage
Low-level
Analog supply ground
All pins except MC
MC, normal operation
All pins except MC, XTAL2 / CLKIN, and
RESET
MC (mode control) voltage
Operating free-air temperature
V
5.5
V
5.5
5
5.5
V
0
0.3
V
VSS1
VSS1
0.8
V
0.3
V
2
VCC1
0.7 VCC1
VCC1
VCC1
11.7
12
13
13
13.2
13.5
L version
VSS1
0
A version
– 40
85
T version
– 40
105
POST OFFICE BOX 1443
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V
4.5
NOTES: 4. Unless otherwise noted, all voltage values are with respect to VSS1.
6. RESET must be externally activated when VCC1 or SYSCLK is not within the recommended operating range.
36
5.5
UNIT
– 0.3
RESET
EPROM programming voltage (VPP)
5
3
0.8 VCC1
Microcomputer
TA
5.5
XTAL2 / CLKIN
EEPROM write protect override (WPO)
VMC
MAX
5
4.5
Standby RAM data retention supply voltage (see Note 6)
Hi h l
High-level
l input
i
t voltage
lt
NOM
4.5
3
Standby RAM supply voltage
VCC3
VSS3
VIH
MIN
V
V
0.3
70
°C
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOL
VOH
TEST CONDITIONS
Low-level output voltage
High-level
High
level out
output
ut voltage
IOL = 1.4 mA
All outputs
except PACT
outputs
IOH = – 50 µA
0.9 VCC1
IOH = – 50 µA
IOH = – 2 mA
0.7 VCC1
PACT outputs
All outputs
II
MAX
0.4
UNIT
V
V
2.4
10
µA
0.3 V < VI < VCC1 – 0.3 V
50
µA
VCC1–0.3 < VI < VCC1+0.3 V
VCC1 +0.3 V < VI < 13 V
10
µA
650
µA
I / O pins
0 V <VI < VCC1
± 10
VOL = 0.4 V
VOH = 0.9 VCC1
IOL
Low-level output current
All outputs
IOH
High level output current
High-level
All outputs
ICC1
TYP
0 V ≤ VI ≤ 0.3 V
MC
Input current
MIN
All outputs
Supply current (operating mode)
OSC POWER bit = 0
VOH = 2.4 V
See Notes 7 and 8
SYSCLK = 5 MHz
Supply current (STANDBY mode)
OSC POWER bit = 0
Supply current (HALT mode)
1.4
µA
mA
– 50
µA
–2
mA
36
45
mA
See Notes 7 and 8
SYSCLK = 5 MHz
7
12
mA
See Notes 7 and 8
XTAL2/CLKIN < 0.2 V
5
30
µA
SYSCLK = 5 MHz
1
1.5
mA
VCCSTBY = 4.5 V
NOTES: 7. Single chip mode, ports configured as inputs or outputs with no load. All inputs ≤ 0.2 V or ≥ VCC1 – 0.2V.
8. XTAL2/CLKIN is driven with an external square wave signal with 50% duty cycle and rise and fall times less than 10 ns. Current
can be higher with a crystal oscillator. At 5-MHz SYSCLK, this extra current = 0.01 mA x (total load capacitance + crystal capacitance
in pF).
ICCSTBY
Standby RAM supply current (operating mode OSC
POWER bit = 0)
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37
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
XTAL2/CLKIN
C1
(see Note A)
XTAL1
Crystal/Ceramic
Resonator
(see Note B)
XTAL2/CLKIN
XTAL1
C3
(see Note A)
C2
(see Note A)
External
Clock Signal
NOTES: A. The values of C1 and C2 are typically 15 pF and C3 value is typically 50 pF. See the manufacturer’s recommendations for ceramic
resonators.
B. The crystal/ceramic resonator frequency is four times the reciprocal of the system clock period.
Figure 11. Recommended Crystal/Clock Connections
Load Voltage
1.2 kΩ
VO
20 pF
Case 1: VO = VOH = 2.4 V; Load Voltage = 0 V
Case 2: VO = VOL = 0.4 V; Load Voltage = 2.1 V
NOTE A: All measurements are made with the pin loading as shown unless otherwise noted. All measurements are made with XTAL2/CLKIN
driven by an external square wave signal with a 50% duty cycle and rise and fall times less than 10 ns unless otherwise stated.
Figure 12. Typical Output Load Circuit (See Note A)
VCC
VCC
300 Ω
Pin Data
30 Ω
Output
Enable
I/O
6 kΩ
INT1
20 Ω
20 Ω
GND
GND
Figure 13. Typical Buffer Circuitry
38
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols have been created in accordance with JEDEC Standard 100. In order to shorten the
symbols, some of the pin names and other related terminology have been abbreviated as follows:
AR
B
CI
M
S
Array
Byte
XTAL2/CLKIN
Master mode
Slave mode
SC
SIMO
SOMI
SPC
SYSCLK
SPISIMO
SPISOMI
SPICLK
su
v
w
setup time
valid time
pulse duration (width)
Lowercase subscripts and their meanings are:
c
d
f
r
cycle time (period)
delay time
fall time
rise time
The following additional letters are used with these meanings:
H
L
V
High
Low
Valid
All timings are measured between high and low measurement points as indicated in Figure 14 and Figure 15.
0.8 VCC V (High)
2 V (High)
0.8 V (Low)
0.8 V (Low)
Figure 14. XTAL2/CLKIN Measurement Points
POST OFFICE BOX 1443
Figure 15. General Measurement Points
• HOUSTON, TEXAS 77251–1443
39
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
external clocking requirements for clock divided by 4 (see Note 9 and Figure 16)
NO.
1
2
3
4
PARAMETER
MIN
MAX
20
UNIT
tw(Cl)
tr(Cl)
Pulse duration, XTAL2/CLKIN (see Note 10)
Rise time, XTAL2/CLKIN
30
ns
tf(CI)
td(CIH-SCL)
Fall time, XTAL2/CLKIN
30
ns
CLKIN
Crystal operating frequency
Delay time, XTAL2/CLKIN rise to SYSCLK fall
ns
100
ns
20
MHz
2
SYSCLK
Internal system clock operating frequency†
0.5
5
MHz
† SYSCLK = CLKIN/4
NOTES: 9. For VIL and VIH, refer to recommended operating conditions.
10. This pulse may be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an
XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.
1
XTAL2/CLKIN
2
3
4
SYSCLK
Figure 16. External Clock Timing for Divide-by-4
external clocking requirements for clock divided by 1 (PLL) (see Note 9 and Figure 17)
NO.
1
2
3
4
PARAMETER
MIN
MAX
20
UNIT
tw(Cl)
tr(Cl)
Pulse duration, XTAL2/CLKIN (see Note 10)
Rise time, XTAL2/CLKIN
30
ns
tf(CI)
td(CIH-SCH)
Fall time, XTAL2/CLKIN
30
ns
100
ns
CLKIN
Crystal operating frequency
2
5
SYSCLK
Internal system clock operating frequency‡
2
5
Delay time, XTAL2/CLKIN rise to SYSCLK rise
ns
MHz
MHz
‡ SYSCLK = CLKIN/1
NOTES: 9. For VIL and VIH, refer to recommended operating conditions.
10. This pulse can be either a high pulse, as illustrated below, which extends from the earliest valid high to the final valid high in an
XTAL2/CLKIN cycle or a low pulse, which extends from the earliest valid low to the final valid low in an XTAL2/CLKIN cycle.
1
XTAL2/CLKIN
2
3
SYSCLK
Figure 17. External Clock Timing for Divide-by-1
40
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4
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
switching characteristics and timing requirements (see Note 11 and Figure 18)
NO.
PARAMETER
MIN
MAX
Divide by 4
200
2000
Divide by 1
200
500
5
tc
Cycle time,
time SYSCLK (system clock)
6
tw(SCL)
tw(SCH)
Pulse duration, SYSCLK low
0.5 tc–20
Pulse duration, SYSCLK high
0.5 tc
7
UNIT
ns
0.5 tc
ns
0.5 tc + 20
ns
NOTE 11: tc = system clock cycle time = 1 / SYSCLK
5
7
6
SYSCLK
Figure 18. SYSCLK Timing
general purpose output signal switching time requirements (see Figure 19)
MIN
tr
tf
TYP
MAX
UNIT
Rise time
30
ns
Fall time
30
ns
tr
tf
Figure 19. Signal Switching Timing
recommended EEPROM timing requirements for programming
MIN
tw(PGM)B
tw(PGM)AR
MAX
UNIT
Pulse duration, programming signal to ensure valid data is stored (byte mode)
10
ms
Pulse duration, programming signal to ensure valid data is stored (array mode)
20
ms
recommended EPROM operating conditions for programming
VCC
VPP
Supply voltage
IPP
Supply current at MC pin during programming (VPP = 13 V)
SYSCLK
Supply voltage at MC pin
System clock
MIN
TYP
MAX
4.75
5.5
6
V
13
13.2
13.5
V
30
50
Divide by 4
0.5
5
Divide by 1
2
5
UNIT
mA
MHz
recommended EPROM timing requirements for programming
tw(EPGM)
Pulse duration, programming signal (see Note 12)
NOTE 12: Programming pulse is active when both EXE (EPCTL.0) and VPPS (EPCTL.6) are set.
POST OFFICE BOX 1443
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MIN
TYP
MAX
0.40
0.50
3
UNIT
ms
41
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
SPI master mode external timing characteristics and requirements (see Note 11 and Figure 20)
NO.
38
MIN
tc(SPC)M
tw(SPCL)M
Cycle time, SPICLK
tw(SPCH)M
td(SPCL-SIMOV)M
Pulse duration, SPICLK high
Valid time, SPISIMO data valid after SPICLK high (polarity =1)
43
tv(SPCH-SIMO)M
tsu(SOMI-SPCH)M
44
tv(SPCH-SOMI)M
39
40
41
42
2tc
tc – 45
Pulse duration, SPICLK low
tc – 55
– 65
Delay time, SPISIMO valid after SPICLK low (polarity = 1)
Setup time, SPISOMI to SPICLK high (polarity = 1)
tw(SPCH) – 50
0.25 tc + 150
Valid time, SPISOMI data valid after SPICLK high
(polarity = 1)
0
NOTE 11: tc = system clock cycle time = 1 / SYSCLK
38
40
39
SPICLK
41
42
Data Valid
SPISIMO
43
44
SPISOMI
Data Valid
† The diagram is for polarity = 1. SPICLK is inverted when polarity = 0.
Figure 20. SPI Master External Timing†
42
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MAX
UNIT
256tc
ns
0.5tc(SPC)+45
0.5tc(SPC)+45
ns
50
ns
ns
ns
ns
ns
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
SPI slave mode external timing characteristics and requirements (see Note 11 and Figure 21)
NO.
45
46
47
48
49
50
MIN
tc(SPC)S
tw(SPCL)S
Cycle time, SPICLK
Pulse duration, SPICLK low
8tc
4tc – 45
tw(SPCH)S
td(SPCL-SOMIV)S
Pulse duration, SPICLK high
4tc – 45
tv(SPCH-SOMI)S
tsu(SIMO-SPCH)S
Valid time, SPISOMI data valid after SPICLK high (polarity =1)
Delay time, SPISOMI valid after SPICLK low (polarity = 1)
Setup time, SPISIMO to SPICLK high (polarity = 1)
51
tv(SPCH-SIMO)S
Valid time, SPISIMO data after SPICLK high (polarity = 1)
NOTE 11: tc = system clock cycle time = 1 / SYSCLK
MAX
UNIT
ns
0.5tc(SPC)S+45
0.5tc(SPC)S+45
3.25tc + 130
ns
ns
ns
tw(SPCH)S
0
ns
3tC + 100
ns
ns
45
47
46
SPICLK
48
49
Data Valid
SPISIMO
50
51
SPISOMI
Data Valid
† The diagram is for polarity = 1. SPICLK is inverted when polarity = 0.
Figure 21. SPI Slave External Timing†
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43
TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
ADC1 converter
The ADC1 converter has a separate power bus for its analog circuitry. These pins are referred to as VCC3 and
VSS3 . The purpose is to enhance ADC1 performance by preventing digital switching noise of the logic circuitry
that can be present on VSS1 and VCC1 from coupling into the ADC1 analog stage. All ADC1 specifications are
given with respect to VSS3 unless otherwise noted.
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-bits (256 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Yes
Output conversion mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 00h to FFh (00 for VI ≤ VSS3 ≤; FF for VI ≤ Vref)
Conversion time (excluding sample time) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 tc
recommended operating conditions
VCC3
Analog supply voltage
VSS3
Vref
Analog ground
MIN
NOM
MAX
4.5
5
5.5
VCC1–0.3
VSS1–0.3
Non-VCC3 reference†
Analog input for conversion
2.5
UNIT
VCC1+0.3
VSS1+0.3
VCC3
VSS3
† Vref must be stable, within ± 1/2 LSB of the required resolution, during the entire conversion time.
VCC3 + 0.1
Vref
V
V
V
V
operating characteristics over recommended ranges operating conditions
PARAMETER
MIN
Absolute accuracy‡
Analog supply current
II
Iref
Input current, AN0 – AN7
Zreff
UNIT
± 1.5
LSB
± 0.9
LSB
Converting
2
mA
Nonconverting
5
µA
0 V ≤ VI ≤ 5.5 V
2
µA
VCC3 = 5.5 V
VCC3 = 5.5 V
Differential/integral linearity error‡§
ICC3
MAX
Vref = 5.1 V
Vref = 5.1 V
Input charge current
Source impedance of Vreff
1
mA
SYSCLK ≤ 3 MHz
24
kΩ
3 MHz < SYSCLK ≤ 5 MHz
10
kΩ
‡ Absolute resolution = 20 mV. At Vref = 5 V, this is one LSB. As Vref decreases, LSB size decreases; therefore, the absolute accuracy and
differential/integral linearity errors in terms of LSBs increase.
§ Excluding quantization error of 1/2 LSB
44
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TMS370Cx36
8-BIT MICROCONTROLLER
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ADC1 converter (continued)
The ADC1 module allows complete freedom in design of the sources for the analog inputs. The period of the
sample time is user-defined so that the high-impedance can be accommodated without penalty to the
low-impedance sources. The sample period begins when the SAMPLE START bit of the ADC1 control register
(ADCTL.6) is set to 1. The end of the signal sample period occurs when the conversion bit (CONVERT START,
ADCTL.7) is set to 1. After a hold time, the converter will reset the SAMPLE START and CONVERT START bits,
signaling that a conversion has started and that the analog signal can be removed.
analog timing requirements (see Figure 22)
MIN
tsu(S)
th(AN)
Setup time, analog to sample command
MAX
0
Hold time, analog input from start of conversion
UNIT
ns
18tc
1
ns
tw(S)
Pulse duration, sample time per kilo-Ω of source impedance†
µs / kΩ
† The value given is valid for a signal with a source impedance > 1 kΩ. If the source impedance is < 1 kΩ, use a minimum sampling time of 1µs.
Analog Stable
Analog In
tsu(S)
Sample Start
th(AN)
tw(S)
Convert Start
Figure 22. Analog Timing
Table 19 is designed to aid the user in referencing a device part number to a mechanical drawing. The table
shows a cross-reference of the device part number to the TMS370 generic package name and the associated
mechanical drawing by drawing number and name.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Table 19. TMS370Cx36 Family Package Type and Mechanical Cross-Reference
PKG TYPE
(mil pin spacing)
PKG TYPE NO. AND
MECHANICAL NAME
TMS370 GENERIC NAME
DEVICE PART NUMBERS
FN – 44 pin
(50-mil pin spacing)
PLASTIC LEADED CHIP CARRIER
(PLCC)
FN(S-PQCC-J**) PLASTIC J-LEADED
CHIP CARRIER
TMS370C036AFNA
TMS370C036AFNL
TMS370C036AFNT
TMS370C736AFNT
FZ – 44 pin
(50-mil pin spacing)
CERAMIC LEADED CHIP CARRIER
(CLCC)
FZ(S-CQCC-J**) J-LEADED CERAMIC
CHIP CARRIER
SE370C736AFZT†
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
MECHANICAL DATA
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D1 / E1
D/E
D2 / E2
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
46
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TMS370Cx36
8-BIT MICROCONTROLLER
SPNS039B – JANUARY 1996 – REVISED FEBRUARY 1997
MECHANICAL DATA
FZ (S-CQCC-J**)
J-LEADED CERAMIC CHIP CARRIER
28 LEAD SHOWN
0.040 (1,02)
45°
Seating Plane
0.180 (4,57)
A
0.155 (3,94)
0.140 (3,55)
B
4
0.120 (3,05)
1
26
25
5
A
B
0.050 (1,27)
C
(at Seating
Plane)
0.032 (0,81)
0.026 (0,66)
0.020 (0,51)
0.014 (0,36)
19
11
18
12
0.025 (0,64) R TYP
0.040 (1,02) MIN
0.120 (3,05)
0.090 (2,29)
B
A
C
JEDEC
NO. OF
OUTLINE
PINS**
MIN
MAX
MIN
MAX
MIN
MAX
MO-087AA
28
0.485
(12,32)
0.495
(12,57)
0.430
(10,92)
0.455
(11,56)
0.410
(10,41)
0.430
(10,92)
MO-087AB
44
0.685
(17,40)
0.695
(17,65)
0.630
(16,00)
0.655
(16,64)
0.610
(15,49)
0.630
(16,00)
MO-087AC
52
0.785
(19,94)
0.795
(20,19)
0.730
(18,54)
0.765
(19,43)
0.680
(17,28)
0.740
(18,79)
MO-087AD
68
0.985
(25,02)
0.995
(25,27)
0.930
(23,62)
0.955
(24,26)
0.910
(23,11)
0.930
(23,62)
4040219 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
47
PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
SE370C736AFZT
OBSOLETE
JLCC
FZ
44
TBD
Call TI
Call TI
TMS370C736AFNT
OBSOLETE
PLCC
FN
44
TBD
Call TI
Call TI
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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