IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4258S SFH 4259S Wesentliche Merkmale Features • • • • Infrarot LED mit hoher Ausgangsleistung Halbwinkel SFH 4258S: ± 15° Halbwinkel SFH 4259S: ± 25° Hohe Bestromung bei hohen Temperaturen möglich • Kurze Schaltzeiten • • • • Anwendungen Applications • • • • • • • • High Power Infrared LED Half angle SFH 4258S: ± 15° Half angle SFH 4259S: ± 25° High forward current allowed at high temperature • Short switching times Industrie Anwendungen Infrarotbeleuchtung für Kameras IR-Datenübertragung Sensorik industrial applications Infrared Illumination for cameras IR Data Transmission Optical sensors Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4258S Q65111A1158 ≥ 40 (typ. 100) SFH 4259S Q65111A1159 ≥ 25 (typ. 60) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2011-10-20 1 SFH 4258S, SFH 4259S Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 85 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 70 mA Stoßstrom, tp = 300 μs, D = 0 Surge current IFSM 700 mA Verlustleistung Power dissipation Ptot 245 mW 300 K/W 140 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 70 mA λpeak 860 nm Centroid-Wellenlänge der Strahlung Centroid wavelength IF = 70 mA λcentroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 70 mA Δλ 30 nm ϕ ϕ ± 15 ± 25 Grad deg. Abstrahlwinkel Half angle SFH 4258S SFH 4259S 2011-10-20 2 SFH 4258S, SFH 4259S Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 70 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 70 mA, RL = 50 Ω tr , tf 15 ns VF VF 3 (< 3.5) 4 (< 5.2) V V Sperrstrom Reverse current IR not designed for μA reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 70 mA, tp = 20 ms Φe typ 80 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 70 mA Temperature coefficient of Ie or Φe, IF = 70 mA TCI – 0.5 %/K Temperaturkoeffizient von VF, IF = 70 mA Temperature coefficient of VF, IF = 70 mA TCV –2 mV/K Temperaturkoeffizient von λ, IF = 70 mA Temperature coefficient of λ, IF = 70 mA TCλ + 0.3 nm/K Durchlassspannung Forward voltage IF = 70 mA, tp = 20 ms IF = 700 mA, tp = 100 µs 2011-10-20 3 SFH 4258S, SFH 4259S Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit SFH 4258S -U SFH 4258S -V SFH 4258S -AW Strahlstärke Radiant intensity IF = 70 mA, tp = 20 ms Ie min Ie max 40 80 63 125 100 200 mW/sr mW/sr Strahlstärke Radiant intensity IF = 700 mA, tp = 25 µs Ie typ 480 750 1200 mW/sr SFH 4259S -T SFH 4259S -U SFH 4259S -V Strahlstärke Radiant intensity IF = 70 mA, tp = 20 ms Ie min Ie max 25 50 40 80 63 125 mW/sr mW/sr Strahlstärke Radiant intensity IF = 700 mA, tp = 25 µs Ie typ 300 480 750 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) 2011-10-20 4 SFH 4258S, SFH 4259S Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) SFH 4258S 40˚ 30˚ 20˚ 10˚ OHL00021 0˚ ϕ 50˚ 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 0.8 0.6 0 0.4 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) SFH 4259S 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHL00999 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 2011-10-20 1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 5 60˚ 80˚ 100˚ 120˚ SFH 4258S, SFH 4259S Relative Spectral Emission Irel = f (λ) Ie = f (IF) Ie 70 mA Radiant Intensity Single pulse, tp = 25 μs 100 Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W 80 1.E+01 % 90 70 80 60 1.E+00 70 I e / I e(70mA) I rel 50 40 IF [mA] 50 60 40 1.E-01 30 30 1.E-02 20 20 10 10 1.E-03 1.E+00 950 925 900 875 850 825 800 775 750 725 700 0 nm Lambda 0.75 IF A IF [m A ] 100 10 1 4 VF [V] 2011-10-20 1.E+03 0 5 t tP IF T 0.60 0.55 0.50 D= 0.45 0.005 0.01 0.40 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 6 40 60 80 100 Permissible Pulse Handling Capability IF = f (τ), TA = 85 °C, duty cycle D = parameter OHF04490 D = TP 20 TA [°C] Permissible Pulse Handling Capability IF = f (τ), TA = 25 °, duty cycle D = parameter 1000 3 1.E+02 IF [mA] Forward Current IF = f (VF) Single pulse, tp = 100 μs 2 0 1.E+01 0.75 IF A OHF04491 t D = TP tP IF T 0.60 0.55 0.50 D= 0.45 0.005 0.01 0.40 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4258S, SFH 4259S Maßzeichnung Package Outlines SFH 4258S 3.8 (0.150) max. 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 1.7 (0.067) 2.1 (0.083) 0.9 (0.035) 0.8 (0.031) 0.6 (0.024) 0.7 (0.028) 1.1 (0.043) 1 Package marking 0.18 (0.007) ø2.55 (0.100) ø2.60 (0.102) 0.1 (0.004) typ 0.5 (0.020) 3.7 (0.146) 3.3 (0.130) 3.4 (0.134) 3.0 (0.118) 2 4˚±1 4 (2.4) (0.095) 3 0.6 (0.024) 0.4 (0.016) 0.13 (0.005) GPLY6127 3.5 (0.138) max. SFH 4259S 2.1 (0.083) 1.7 (0.067) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.9 (0.035) 0.7 (0.028) 2.1 (0.083) 1.1 (0.043) 1 Package marking 0.18 (0.007) ø2.55 (0.100) ø2.60 (0.102) 0.1 (0.004) typ 0.5 (0.020) 3.7 (0.146) 3.3 (0.130) 3.4 (0.134) 3.0 (0.118) 2 4˚±1 4 (2.4) (0.095) 3 0.6 (0.024) 0.4 (0.016) 0.13 (0.005) GPLY6128 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Power TOPLED® mit Linse, klarer Verguss / Power TOPLED® with lens, clear resin Anschlussbelegung pin configuration 2011-10-20 1 = Kathode / cathode 2/3/4 = Anode / anode 7 SFH 4258S, SFH 4259S Empfohlenes Lötpaddesign Recommended Solder Pad Design Reflow Löten Reflow Soldering Padgeometrie für verbesserte Wärmeableitung 3.3 (0.130) Paddesign for improved heat dissipation 3.3 (0.130) 2.3 (0.091) 11.1 (0.437) 1.5 (0.059) 1.1 (0.043) 3.7 (0.146) 0.8 (0.031) 0.7 (0.028) Cu Fläche / <_ 16 mm 2 per pad Cu-area Lötstoplack Solder resist Empfohlenes Lötpaddesign Recommended Solder Pad Design OHFP3021 Wellenlöten TTW TTW Soldering 2 (0.079) 6.1 (0.240) Bewegungsrichtung der Platine PCB-direction 1 (0.039) 2 (0.079) 2 (0.079) 3 (0.118) 6 (0.236) 2.8 (0.110) 2.8 (0.110) 0.5 (0.020) Cu Fläche / > 16 mm 2 per pad Cu-area Padgeometrie für verbesserte Wärmeableitung Lötstoplack Solder resist Paddesign for improved heat dissipation 2011-10-20 8 OHPY3040 SFH 4258S, SFH 4259S Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020D.01) (acc. to J-STD-020D.01) OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 50 0 100 150 200 250 s 300 t Profileigenschaften Profile Feature Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) ) Aufheizrate zum Vorwärmen* / Ramp-up rate to preheat*) Zeit ts von TSmin bis TSmax / Time ts from TSmin to TSmax Aufheizrate zur Spitzentemperatur*) / Ramp-up rate to peak*) Empfehlung / Recommendation Grenzwerte / Max. Ratings 2K/s 3K/s 100 s min. 60 s max. 120 s 2K/s 3K/s 25 °C to 150 °C 150 °C to 200 °C 180 °C to TP Liquidustemperatur TL / Liquidus temperature TL 217 °C Zeit tL über TL / Time tL above TL 80 s max. 100 s Spitzentemperatur TP / Peak temperature TP 245 °C max. 250 °C Verweilzeit tP innerhalb des spezifizierten Spitzentemperaturbereichs TP - 5 K / Time tP within the specified peak temperature range TP - 5 K 20 s min. 10 s max. 30 s Abkühlrate*) / Ramp-down rate*) 3K/s 4 K / s maximum TP to 100 °C Zeitspanne von 25 °C bis zur Spitzentemperatur / Time from 25 °C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung ΔT/Δt: Δt max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation ΔT/Δt: Δt max. 5 s; fulfillment for the whole T-range 2011-10-20 9 SFH 4258S, SFH 4259S Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2011-10-20 10