OSRAM SFH4253

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (850 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4253
Wesentliche Merkmale
Features
• Infrarot LED mit hoher Ausgangsleistung
• Kurze Schaltzeiten
• High Power Infrared LED
• Short switching times
Anwendungen
Applications
• Infrarotbeleuchtung für Kameras
• IR-Datenübertragung
• Sensorik
• Infrared Illumination for cameras
• IR Data Transmission
• Optical sensors
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4253
Q65110A6657
≥ 4 (typ. 11)
1)
gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
2009-08-25
1
SFH 4253
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg
– 40 … + 100
°C
Sperrspannung
Reverse voltage
VR
5
V
Vorwärtsgleichstrom
Forward current
IF
70
mA
Stoßstrom, tp = 100 μs, D = 0
Surge current
IFSM
700
mA
Verlustleistung
Power dissipation
Ptot
140
mW
500
K/W
280
K/W
Wärmewiderstand Sperrschicht - Umgebung bei RthJA
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
RthJS
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 70 mA
λpeak
860
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 70 mA
λcentroid
850
nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 70 mA
Δλ
42
nm
Abstrahlwinkel
Half angle
ϕ
± 60
Grad
deg.
Aktive Chipfläche
Active chip area
A
0.04
mm2
2009-08-25
2
SFH 4253
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L×B
L×W
0.2 × 0.2
mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 70 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 70 mA, RL = 50 Ω
tr , tf
10
ns
VF
VF
1.6 (< 2.0)
2.4 (< 3.0)
V
V
Sperrstrom
Reverse current
IR
not designed for μA
reverse
operation
Gesamtstrahlungsfluss
Total radiant flux
IF = 70 mA, tp = 20 ms
Φe typ
33
mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 70 mA
Temperature coefficient of Ie or Φe,
IF = 70 mA
TCI
– 0.5
%/K
Temperaturkoeffizient von VF, IF = 70mA
Temperature coefficient of VF, IF = 70 mA
TCV
– 0.7
mV/K
Temperaturkoeffizient von λ, IF = 70 mA
Temperature coefficient of λ, IF = 70 mA
TCλ
+ 0.3
nm/K
Durchlassspannung
Forward voltage
IF = 70 mA, tp = 20 ms
IF = 500 mA, tp = 100 µs
2009-08-25
3
SFH 4253
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol
Werte
Values
SFH 4253-P
SFH 4253-Q
Einheit
Unit
SFH 4253-R
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
4
8
6.3
12.5
10
20
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 500 mA, tp = 25 µs
Ie typ
23
36
55
mW/sr
1)
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
40˚
30˚
20˚
10˚
0˚
ϕ
50˚
OHL01660
1.0
0.8
0.6
60˚
0.4
70˚
0.2
80˚
0
90˚
100˚
1.0
2009-08-25
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
4
100˚
120˚
SFH 4253
Relative Spectral Emission
Irel = f (λ)
Ie
= f (IF)
Radiant Intensity
Ie 70 mA
Single pulse, tp = 25 μs
OHF04135
100
I rel
OHF03825
101
Ie
%
IF
I e (70 mA)
80
Max. Permissible Forward Current
IF = f (TA), RthJA = 500 K/W
100
OHF03732
80
mA
70
60
5
50
60
10-1
40
5
40
30
10-2
20
20
5
10
0
700
750
800
10-3 0
10
nm 950
850
5 10 1
5 10 2
λ
IF
OHF03826
IF
10-1
t
D = TP
0.4
5
0.3
10-3
0.2
5
tP
IF
T
D=
0.5
0.4
0.3
0.2
0.1
0.1
0.5
1
1.5
2
2.5 V 3
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
VF
2009-08-25
IF
0.7
A
0.6
0.005
0.01
0.02
0.05
0.1
0.2
0.3
0.5
1
-2
0
40
60
80
100 ˚C 120
Permissible Pulse Handling
Capability IF = f (τ), TA = 85 °C,
duty cycle D = parameter
OHF03733
0.7
A
0.5
5
10-4
20
TA
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
0.6
10
0
IF
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
100
A
0
mA 10 3
tp
5
OHF03824
t
tP
D = TP
IF
T
D=
0.005
0.01
0.02
0.05
0.1
0.2
0.3
0.5
1
0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp
SFH 4253
Maßzeichnung
Package Outlines
2.1 (0.083)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
1.7 (0.067)
0.1 (0.004) (typ.)
3.7 (0.146)
3.3 (0.130) 4˚±1
(2.4) (0.095)
3.4 (0.134)
3.0 (0.118)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
A
Cathode marking
0.5 (0.020)
1.1 (0.043)
C
0.18 (0.007)
0.12 (0.005)
0.6 (0.024)
0.4 (0.016)
GPLY6724
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package
TOPLED®, klarer Verguss / TOPLED®, clear resin
Anschlussbelegung
Pin configuration
siehe Zeichnung
see drawing
2009-08-25
6
SFH 4253
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
1.5 (0.059)
4.5 (0.177)
2.6 (0.102)
Padgeometrie für
verbesserte Wärmeableitung
Lötstopplack
Solder resist
Paddesign for
improved heat dissipation
Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2
OHLPY970
Maße in mm (inch) / Dimensions in mm (inch).
2009-08-25
7
SFH 4253
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
255 ˚C
240 ˚C
T 250
˚C
260 ˚C +0
-5 ˚C
245 ˚C ±5 ˚C
˚C
235 ˚C +5
-0 ˚C
217 ˚C
10 s min
200
30 s max
Ramp Down
6 K/s (max)
150
100 s max
120 s max
100
Ramp Up
3 K/s (max)
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
300
C
T
10 s
250
Normalkurve
standard curve
235 C ... 260 C
Grenzkurven
limit curves
2. Welle
2. wave
200
1. Welle
1. wave
150
ca 200 K/s
2 K/s
5 K/s
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
0
0
50
100
150
200
t
2009-08-25
8
s
250
SFH 4253
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2009-08-25
9
Mouser Electronics
Related Product Links
720-SFH4253-Z - Osram Opto Semiconductor SFH 4253-Z