SKYWORKS SKY65342-11

DATA SHEET
SKY65342-11: 450-470 MHz Front-End Module
Applications
x Tetra radio
x Remote metering
x GSM450
x WLL
SPDT
Switch
Transmit
Port
PA
Harmonic
Filter
Antenna
Port
Receive
Port
Features
x Transmit output power > +29 dBm
x High gain in transmit path = 32 dB
x High transmit/receive isolation > 30 dB
x Internal RF match and bias circuits
x Single DC supply : +3.6 V
x Small, MCM (12-pin, 8 x 8 mm) package (MSL3, 260 qC per
JEDEC J-STD-020)
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
S1346
Figure 1. SKY65342-11 Block Diagram
Description
The SKY65342-11 is a highly efficient Front-End Module (FEM)
that incorporates a transmit/receive (T/R) path and an antenna T/R
switch. The transmit path consists of a high efficiency power
amplifier (PA) followed by a harmonic filter to reject harmonic
frequencies. The PA is implemented using Skyworks highly
reliable Heterojunction Bipolar Transistor (HBT) process and is
Class AB biased to provide maximum efficiency with a low
spurious output.
A high linearity and high isolation single-pole, double-throw
(SPDT) switch is used at the common antenna interface between
the transmit and receive paths. The receive path is a low insertion
loss “through” path with input and output ports internally
matched to 50 Ω.
The SKY65342-11 FEM uses Surface Mount Technology (SMT) in
the form of a Multi-Chip Module (MCM), which allows for a highly
manufacturable, low-cost solution. The device is provided as a
compact, 12-pin 8 x 8 mm MCM. A functional block diagram is
shown in Figure 1. The pin configuration and package are shown
in Figure 2. Signal pin assignments and functional pin
descriptions are provided in Table 1.
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1
VCC1
PA_EN
VCC2
DATA SHEET • SKY65342-11 FRONT-END MODULE
12
11
10
V1
GND
2
8
V2
RX_IN
3
7
ANT
4
5
6
VREF2
9
VREF1
1
VC_BIAS
TX_RFIN
S1641
Figure 2. SKY65342-11 Pinout – 12-Pin MCM
(Top View)
Technical Description
The SKY65342-11 provides input and output amplifier stages, and
is internally matched for optimum efficiency. An active bias circuit
provides the input and output stages with excellent gain tracking
over temperature and voltage variations. The module operates
with positive DC voltages, and maintains high efficiency and good
linearity. The nominal operating voltage is 3.6 V for maximum
power, but the device can be operated at slightly lower voltages
for other mobile applications.
The input and output stages are independently supplied using the
VCC1 and VCC2 supply lines (pins 12 and 10, respectively). The
bias reference voltages for stages 1 and 2 are supplied using
common lines VREF1 and VREF2 (pins 5 and 6, respectively). The
DC control voltage that sets the bias for stages 1 and 2 is
supplied by the VC_BIAS signal, pin 4.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65342-11 are provided in Table 2. The recommended
operating conditions are specified in Table 3 and electrical
specifications are provided in Table 4.
Typical performance characteristics of the SKY65342-11 are
illustrated in Figures 3 through 7. The state of the SKY65342-11
is determined by the logic provided in Table 5.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65342-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 qC. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel Information – RF Modules,
document number 101568.
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Table 1. SKY65342-11 Signal Descriptions
Pin #
Name
Description
Pin #
7
Name
ANT
Description
1
TX_RFIN
Transmit RF input
Antenna
2
GND
Ground
8
V2
Switch control
3
RX_IN
Receive RF input
9
V1
Switch control
4
VC_BIAS
+3.6 V DC supply
10
VCC2
+3.6 V DC supply
5
VREF1
+3.6 V DC supply
11
PA_EN
PA enable (on = 2.5-3.6 V, off = 0-0.2 V)
6
VREF2
+3.6 V DC supply
12
VCC1
+3.6 V DC supply
Table 2. SKY65342-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
4
V
Supply voltage (VCC1, VCC2, VREF1, VREF2,
VC_BIAS)
VCC
Input power
PIN
+5
dBm
Supply current
ICC
850
mA
Case operating temperature
TC
–40
+85
qC
Storage temperature
TST
–65
Junction temperature
TJ
+125
qC
+150
qC
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65342-11 Recommended Operating Conditions
Parameter
Minimum
Typical
Maximum
Units
VCC
3.0
3.6
4.0
V
Case operating temperature
TC
–40
+85
qC
Storage temperature
TST
–55
+125
qC
Supply voltage (VCC1, VCC2, VREF1, VREF2,
VC_BIAS)
Symbol
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Table 4. SKY65342-11 Electrical Specifications (Note 1)
(Frequency = 460 MHz, VCC1 = VCC2 = VREF1 = VREF2 = VC_BIAS = 3.6 V, TC = +25 °C, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Operating frequency range
f
Transmit path small signal gain
G
CW, PIN = –30 dBm
Transmit saturated output power
PSAT
Transmit path Noise Figure
NF
Transmit path harmonics (2nd to 6th)
Power Added Efficiency
PAE
Receive path insertion loss
RX_LOSS
Transmit/receive path isolation
ISOL
Min
Typical
450
Max
Units
470
MHz
30
34.6
dB
CW, PIN = 0 dBm
+28.5
+29.1
dBm
CW, PIN = 0 dBm
53
CW, PIN = 0 dBm
31
5.5
27
%
1.0
33
dB
dB
Input return loss
S11
15
17
dB
Output return loss
S22
10
15
dB
Quiescent current
IQ
No RF
85
110
mA
650
720
mA
Operating current
IOP
POUT = +29 dBm
Leakage current
ILEAK
No RF input, module in
standby mode
Maximum VSWR for stable operation
VSWRMAX
CW
6:1
2
μA
8:1
–
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated
temperatures may reduce reliability of the device.
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4
dB
dBc
34
0.6
CW
6.5
60
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DATA SHEET • SKY65342-11 FRONT-END MODULE
36
34
Gain (dB)
32
30
28
+25 oC
+85 oC
–40 oC
26
24
22
0
+5
+10
+15
+20
+25
+30
+35
POUT (dBm)
S1643
Transmit Path Small Signal Gain (dB)
Figure 3. Gain vs Output Power Over Temperature @ 460 MHz
(VCC = 3.6 V)
35.5
35.3
35.1
34.9
34.7
34.5
+25 oC
+85 oC
–40 oC
34.3
34.1
33.9
33.7
33.5
450
460
470
Frequency (MHz)
S1644
Figure 4. Transmit Path Small Signal Gain vs Frequency Over Temperature
(VCC = 3.6 V)
800
Operating Current (mA)
700
600
500
400
300
+25 oC
+85 oC
–40 oC
200
100
0
0
+5
+10
+15
+20
POUT (dBm)
+25
+30
+35
S1645
Figure 5. Operating Current vs Output Power Over Temperature @ 460 MHz
(VCC = 3.6 V)
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Harmonic Suppression (dBc)
90
85
80
75
70
65
60
55
50
F2
F3
F4
F5
F6
F7
F8
F9
F10
Harmonic Order
S1646
Figure 6. Harmonics Level @ 460 MHz
(VCC = 3.6 V)
Receive Path insertion Loss (dB)
–0.53
–0.54
–0.55
–0.56
–0.57
–0.58
+25 oC
+85 oC
–40 oC
–0.59
–0.60
–0.61
450
460
470
Frequency (MHz)
S1647
Figure 7. Receive Path Insertion Loss vs Frequency Over Temperature
(VCC = 3.6 V)
Table 5. SKY65342-11 FEM Switch Control Logic
Mode
V1 Signal (Pin 9)
V2 Signal (Pin 8)
Transmit
1
0
Receive
0
1
Note:
Logic level 0: 0 V to 0.5 V
Logic level 1: 2.0 V to VCC
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Evaluation Board Description
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required.
The SKY65342-11 Evaluation Board is used to test the
performance of the SKY65342-11 FEM. The Evaluation Board
schematic diagram is shown in Figure 8. An assembly drawing for
the Evaluation Board is shown in Figure 9 and the layer detail is
provided in Figure 10. The layer detail physical characteristics are
noted in Figure 11. Table 6 provides the Bill of Materials (BOM)
list for Evaluation Board components.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Circuit Design Considerations
Package Dimensions
The following design considerations are general in nature and
must be followed regadless of final use or configuration:
VCC1
12
J2
SMA
1
TX_RFIN
2
GND
PA Enable
11
PA_EN
DC Supply 1
2. The ground pad of the SKY65342-11 has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
10
VCC2
1. Paths to ground should be made as short as possible.
DC Supply 2
The phone board layout footprint for the SKY65342-11 is shown
in Figure 12. Package dimensions for the 12-pin MCM are shown
in Figure 13, and tape and reel dimensions are provided in
Figure 14.
V1
SKY65342-11
V2
9
8
Switch Logic
Switch Logic
J4
SMA
VREF2
5
6
7
Voltage Reference 2
Voltage Bias
4
ANT
VREF1
RX_IN
Voltage Reference 1
3
VC_BIAS
J3
SMA
S1642
Figure 8. SKY65342-11 Evaluation Board Schematic
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DATA SHEET • SKY65342-11 FRONT-END MODULE
S1520
Figure 9. SKY65342-11 Evaluation Board Assembly Drawing
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S1349
Figure 10. SKY65342-11 Evaluation Board Layer Detail
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Cross Section
Name Thickness (mm) Material
Tmask
0.010
Solder Resist
L1
0.035
Cu, 1 oz.
Dielectric
0.300
Rogers 4003
L2
0.035
Cu, 1 oz
Dielectric
0.100
FR4
L3
0.035
Cu, 1 oz
Dielectric
0.300
FR4
L4
0.035
Cu, 1 oz
Bmask
0.010
Solder resist
S1366
Figure 11. Layer Detail Physical Characteristics
Table 6. SKY65342-11 Evaluation Board Bill of Materials
Component
J2, J3, J4
Quantity
3
Size
Value
Vendor
Part Number
615R54-021
SC1, SC2, SC3, SC4
4
92196A052
Backframe
1
1056-101
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DATA SHEET • SKY65342-11 FRONT-END MODULE
8.685
Stencil aperture 60-80% of
module/pkg solder mask area
2X 1.65
12X 0.81
12X 1.043
2X 1.91
CL
8.685
Component
Outline
CL
Stencil Aperture
Top View
8.685
6X 0.81
Pin 12
8.785
Pin 12
1.65 Typ
1.65
∅5.080 Solder
12X 1.143
Mask Opening
11X 1.043
Pin 1
Pin 1
12X 0.91
CL
CL
8.685
8.785
1.91 Typ
1.91 Typ
0.25
Thermal Via Array ∅0.3 mm on 1.0 mm pitch.
Additional vias in common ground pad
will improve thermal performance.
NOTE: It is recommended that thermal vias
should be filled with 30-35 μm Cu plating.
CL
Metallization
Top View
CL
Component
Outline
Component
Outline
Solder Mask Opening
Top View
S1357
All measurements are in millimeters
Figure 12. SKY65342-11 Phone Board Layout Footprint
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8.385
6x 4.093
DATA SHEET • SKY65342-11 FRONT-END MODULE
B
Pin 1
Indicator
C
0.3
Solder Mask Opening
0.15
Metal Pad
Pin 1 Indicator
(3.4)
Pin 12
Top
(2.7)
0
8.385
Pin 1
A
4x 1.91
6x 4.093
0.05 A B C
0
0.1
12x SMT Pad
5.08
Solder Mask Opening
4x 1.65
A
1.35 ± 0.1
0.15 A B C
0.15 A B C
Side View
Top View
0.793 ± 0.1
Bottom View
(0.1)
Metal Pad Edge
0.81 ± 0.05
Detail A
3x - This rotation
3x - Rotated 180o
o
3x - Rotated 90o
3x - Rotated 90
Dimensioning and tolerancing according to ASME Y14.5M-1994.
All measurements are in millimeters
S1354
Figure 13. SKY65342-11 12-Pin MCM Package Dimensions
12.00 ± 0.10
∅1.50± 0.10
Pin #1
5o Max
8.88 ± 0.10
A
4.00 ± 0.10
2.00 ± 0.10
B
1.75 ± 0.10
A
7.50 ± 0.10
16.00 +0.30/–0.10
2.14 ± 0.10
B
B
∅1.50 ± 0.25
8o Max
8.89 ± 0.10
A
Notes:
1. Carrier tape: black conductive poly carbonate or polystyrene.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 13.3 mm width.
4. All measurements are in millimeters.
S1252
Figure 14. SKY65342-11 Tape and Reel Dimensions
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DATA SHEET • SKY65342-11 FRONT-END MODULE
Ordering Information
Model Name
SKY65342-11 450-470 MHz Front-End Module
Manufacturing Part Number
SKY65342-11 (Pb-free package)
Evaluation Kit Part Number
TW17-D315-003
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