www.ti.com SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION FEATURES • • • • • • • • ESD Protection for RS-232 Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2 Contact Discharge – ±15-kV IEC 61000-4-2 Air-Gap Discharge Operate With 3-V to 5.5-V VCC Supply Operate up to 1 Mbit/s Low Standby Current . . . 1 µA Typ External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) Auto-Powerdown Feature Automatically Disables Drivers for Power Savings SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 DB OR PW PACKAGE (TOP VIEW) EN C1+ V+ C1− C2+ C2− V− RIN 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 FORCEOFF VCC GND DOUT FORCEON DIN INVALID ROUT APPLICATIONS • • • • • Battery-Powered, Hand-Held, and Portable Equipment PDAs and Palmtop PCs Notebooks, Sub-Notebooks, and Laptops Digital Cameras Mobile Phones and Wireless Devices DESCRIPTION/ORDERING INFORMATION The SN65C3221E and SN75C3221E consist of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). These devices provide the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs. Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the devices do not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high (valid data) if the receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than 30 µs. See Figure 5 for receiver input levels. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 ORDERING INFORMATION PACKAGE (1) TA SSOP – DB –0°C to 70°C TSSOP – PW SSOP – DB –40°C to 85°C (1) TSSOP – PW ORDERABLE PART NUMBER Reel of 2000 SN75C3221EDBR Tube of 90 SN75C3221EPW Reel of 2000 SN75C3221EPWR Reel of 2000 SN65C3221EDBR Tube of 90 SN65C3221EPW Reel of 2000 SN65C3221EPWR TOP-SIDE MARKING CA3221 CA3221 CB3221 CB3221 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLES abc EACH DRIVER (1) INPUTS DIN (1) FORCEON FORCEOFF VALID RIN RS-232 LEVEL OUTPUT DOUT DRIVER STATUS X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown disabled L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance abc EACH RECEIVER (1) INPUTS (1) 2 OUTPUT ROUT RIN EN VALID RIN RS-232 LEVEL L L X H L X L X H X Z Open L No H H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = disconnected input or connected driver off www.ti.com SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) DIN FORCEOFF FORCEON ROUT 11 13 DOUT 16 12 9 Auto-powerdown 10 8 1 INVALID RIN EN 3 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 Table 1. 1-Mbit/s RS-232 Parts DRIVER NO. RECEIVER NO. ESD SUPPLY VCC (V) FEATURE PIN/PACKAGE SN65C3221E 1 1 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN65C3232E 2 2 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP MAX3227I 1 1 ±8-kV Air-Gap, ±8-k V Contact, ±15-kV HBM 3.3 or 5 Auto powerdown plus, ready signal 16-pin SSOP SN65C3221 1 1 ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN65C3223 2 2 ±15-kV HBM 3.3 or 5 Auto powerdown, enable signal 20-pin SOIC, SSOP, TSSOP SN65C3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP SN65C3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP SN65C3238 5 3 ±15-kV HBM 3.3 or 5 Auto powerdown plus 28-pin SOIC, SSOP, TSSOP SN65C3243 3 5 ±15-kV HBM 3.3 or 5 Auto powerdown 28-pin SOIC, SSOP, TSSOP SN75C3221E 1 1 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN75C3232E 2 2 ±15-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP MAX3227C 1 1 ±8-kV Air-Gap, ±8-kV Contact, ±15-kV HBM 3.3 or 5 Auto powerdown plus, ready signal 16-pin SSOP 1 1 ±15-kV HBM 3.3 or 5 Auto powerdown 16-pin SOIC, SSOP, TSSOP SN75C3223 2 2 ±15-kV HBM 3.5 or 5 Auto powerdown, enable signal 20-pin SOIC, SSOP, TSSOP SN75C3222 2 2 ±15-kV HBM 3.3 or 5 Enable, powerdown signal 20-pin SOIC, SSOP, TSSOP SN75C3232 2 2 ±15-kV HBM 3.3 or 5 Low pin count 16-pin SOIC, SSOP, TSSOP SN75C3238 5 3 ±15-kV HBM 3.3 or 5 Auto powerdown plus 28-pin SOIC, SSOP, TSSOP SN75C3243 3 5 ±15-kV HBM 3.3 or 5 Auto powerdown 28-pin SOIC, SSOP, TSSOP PART NO. TEMPERATURE RANGE –40°C to 85°C SN75C3221 0°C to 70°C 4 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative output supply voltage range (2) V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA Package thermal impedance (3) (4) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) Driver (FORCEOFF, FORCEON, EN) –0.3 6 Receiver –25 25 Driver –13.2 13.2 –0.3 VCC + 0.3 Receiver (INVALID) DB package 82 PW package 108 –65 UNIT V V °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) See Figure 6 Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON, EN VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON, EN VI Driver and control input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage TA Operating free-air temperature (1) MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 VCC = 3.3 V VCC = 3.3 V VCC = 5 V UNIT V 2 V 2.4 0.8 V 0 5.5 V –25 25 V SN65C3221E –40 85 SN75C3221E 0 70 °C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER II ICC (1) (2) Input leakage current Supply current (TA = 25°C) TEST CONDITIONS FORCEOFF, FORCEON, EN MIN TYP (2) MAX ±0.01 ±1 µA 0.3 1 mA Auto-powerdown disabled No load, FORCEOFF and FORCEON at VCC Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 UNIT µA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 5 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 DRIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER TEST CONDITIONS MIN TYP (2) MAX VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS Short-circuit output current (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V ro Output resistance VCC, V+, and V– = 0 V, VO = ±2 V Ioff Output leakage current FORCEOFF = GND (1) (2) (3) ±0.01 300 UNIT V V ±1 µA ±0.01 ±1 µA ±35 ±60 ±35 ±90 mA Ω 10M VO = ±12 V, VCC = 3 V to 3.6 V ±25 VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 µA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER Maximum data rate (see Figure 1) TEST CONDITIONS MIN CL = 1000 pF 250 RL = 3 kΩ CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF (1) (2) (3) TYP (2) MAX kbit/s 100 18 UNIT ns 150 V/µs Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. ESD Protection TERMINAL NAME TEST CONDITIONS NO. HBM DOUT 6 13 TYP UNIT ±15 IEC 61000-4-2 Contact Discharge ±8 IEC 61000-4-2 Air-Gap Discharge ±15 kV SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 RECEIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER MIN TYP (2) VCC – 0.6 V VCC – 0.1 V TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA MAX V 0.4 VCC = 3.3 V 1.6 2.4 VCC = 5 V 1.9 2.4 VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) Ioff Output leakage current FORCEOFF = 0 V ri Input resistance VI = ±3 V to ±25 V UNIT VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.8 1.4 V V V 0.5 3 V ±0.05 ±10 µA 5 7 kΩ Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. (1) (2) Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tsk(p) Pulse skew (3) See Figure 3 50 ns (1) (2) (3) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. ESD Protection TERMINAL NAME TEST CONDITIONS NO. HBM RIN 8 TYP UNIT ±15 IEC 61000-4-2 Contact Discharge ±8 IEC 61000-4-2 Air-Gap Discharge ±15 kV 7 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 AUTO-POWERDOWN SECTION abc Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT–(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 VOH INVALID high-level output voltage IOH = –1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC MAX UNIT 2.7 V V 0.3 V VCC – 0.6 V 0.4 V Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER tvalid Propagation delay time, low- to high-level output tinvalid Propagation delay time, high- to low-level output ten Supply enable time (1) 8 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. TYP (1) UNIT 1 µs 30 µs 100 µs SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION FORCEON 3V Generator (see Note B) 3V Input RS-232 Output 50 Ω RL tTHL CL (see Note A) 3V FORCEOFF TEST CIRCUIT 0V 3V 3V Output SR(tr) tTLH −3 V −3 V 6V t THL or tTLH VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate FORCEON 3V Generator (see Note B) 3V RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPLH tPHL VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew EN = VCC 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) tPHL 50 Ω tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 9 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION 3V Input VCC 1.5 V GND S1 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output CL (see Note A) EN Generator (see Note B) 50 Ω 0.3 V tPLZ (S1 at VCC) tPZL (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 10 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION 2.7 V EN = GND 3V 0V Receiver Input 0V ROUT Generator (see Note B) 2.7 V −2.7 V −2.7 V 50 Ω −3 V tvalid tinvalid VCC Autopowerdown INVALID INVALID Output CL = 30 pF (see Note A) FORCEOFF FORCEON DIN DOUT 50% VCC 50% VCC 0V ten V+ ≈V+ Supply Voltages 0.3 V VCC 0V 0.3 V ≈V− V− TEST CIRCUIT VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High 2.7 V Indeterminate 0.3 V 0V If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† −0.3 V Indeterminate −2.7 V Valid RS-232 Level, INVALID High † Auto-powerdown disables drivers and reduces supply current to 1 µA. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 5. INVALID Propagation Delay Times and Driver Enabling Time 11 SN65C3221E, SN75C3221E 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION www.ti.com SLLS694A – NOVEMBER 2005 – REVISED DECEMBER 2005 APPLICATION INFORMATION EN 16 1 2 VCC C1+ 15 + 3 C1 + + − − V+ Autopowerdown C3(1) 4 GND − 14 13 6 C2− 7 RIN 12 C2 11 V− 10 C4 + DOUT C2+ + − CBYPASS = 0.1 µF C1− 5 − FORCEOFF 8 9 FORCEON DIN INVALID ROUT 5 kΩ (1) C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 6. Typical Operating Circuit and Capacitor Values 12 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65C3221EDB ACTIVE SSOP DB 16 SN65C3221EDBR ACTIVE SSOP DB 16 SN65C3221EPW ACTIVE TSSOP PW 16 90 SN65C3221EPWE4 ACTIVE TSSOP PW 16 90 SN65C3221EPWR ACTIVE TSSOP PW SN65C3221EPWRE4 ACTIVE TSSOP SN75C3221EDB ACTIVE SN75C3221EDBR 80 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SSOP DB 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3221EPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3221EPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3221EPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3221EPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 80 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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